AT25DF081A-SH-B - 8Mbit SPI NOR Flash 100MHz | Renesas
MPN: AT25DF081A-SH-B ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.18 | $1.18 |
| 10 | $1.05 | $10.50 |
| 100 | $0.92 | $92.00 |
| 500 | $0.78 | $390.00 |
| 1,000 | $0.67 | $670.00 |
| 3,000 | $0.58 | $1,740.00 |
AT25DF081A-SH-B Overview
A NOR Flash is a non-volatile memory that executes code in-place (XIP) with random byte-level read access and long-term data retention, sitting in the memory hierarchy between EPROM/EEPROM and NAND Flash. Compared with NAND Flash, NOR provides faster random reads and higher reliability for code storage, while compared with serial EEPROM it offers vastly higher density at lower cost per bit, making it ideal for boot images, firmware, and configuration data in embedded systems.
Key features of the AT25DF081A-SH-B include a flexible uniform erase architecture (4-Kbyte block, 32-Kbyte and 64-Kbyte blocks), three Security Register pages for unique device identification, JEDEC-standard SFDP (Serial Flash Discoverable Parameters) read support, and configurable write protection. The device supports page program of up to 256 bytes and offers typical endurance of 100,000 erase/program cycles per sector with >20-year data retention. It is designed for 3 V systems in which program code is shadowed from Flash into embedded or external RAM for execution.
The architecture combines a SPI/dual-SPI serial interface with hardware-controlled block protection (BP0-BP2) and a 256-byte page programming buffer. Status and configuration registers are accessible via dedicated read/write instructions, and a hold pin and write-protect pin allow shared-bus operation. The part uses industry-standard command set compatible with other Adesto/Atmel/Renesas SPI NOR Flash families for software portability.
Typical applications include IoT endpoint firmware storage, industrial sensor data logging, networking equipment boot Flash, automotive infotainment auxiliary storage, consumer device configuration memory, and medical instrument firmware. The wide -40C to +85C range and small 8-SOIC footprint also suit space-constrained outdoor and industrial deployments where reliability over temperature matters.
When designing with this device, ensure that CS, SCK, SI, SO, WP, and HOLD are routed with matched trace lengths and a 10k pull-up on CS to prevent spurious selection. Add a 0.1 uF decoupling capacitor close to VCC and observe tVCS minimum of 50 ns before the first clock edge after CS falls.
This page synthesizes distributor pricing, drop-in alternatives in the same 8-SOIC package, and practical SPI bus design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for AT25DF081A-SH-B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with AT25DF081A-SH-B (same form factor and footprint) — differing in Memory Type, Operating Temperature, Package, Supply Voltage (VCC), Maximum Clock Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
AT25DF081A-SSH-B
✅ Drop-In📋 Reference alternative (not in catalog)
AT25DF081A-MH-B
✅ Drop-In📋 Reference alternative (not in catalog)
AT25DF081A-SH-T
✅ Drop-In📋 Reference alternative (not in catalog)
W25Q81DVSSIG
✅ Drop-In📋 Reference alternative (not in catalog)
MX25L8006EM2I-12G
✅ Drop-In📋 Reference alternative (not in catalog)
IS25LP080D-JBLE
✅ Drop-In📋 Reference alternative (not in catalog)
GD25Q80ESIGR
✅ Drop-In📋 Reference alternative (not in catalog)
AT25DF081A-SH-B Maximum Ratings & Electrical Characteristics
| Memory Type | Serial NOR Flash |
| Memory Density | 8 Mbit (1 Mbyte) |
| Memory Organization | 4K x 256 bytes |
| Interface | SPI (Single/Dual), Mode 0 and Mode 3 |
| Maximum Clock Frequency | 100 MHz |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Operating Temperature | -40C to +85C |
| Package | 8-SOIC (SOIC-W, 208 mil) |
| Sector / Block Erase Sizes | 4 KB / 32 KB / 64 KB uniform |
| Page Program Size | 1 to 256 bytes |
| Endurance | 100,000 erase/program cycles per sector |
| Data Retention | >20 years |
| Security Registers | Three 256-byte Security Register pages |
| SFDP Support | Yes (JEDEC 216 standard) |
| Write Protection | Hardware WP pin plus BP0-BP2 status-register bits |
| RoHS Status | Compliant |
AT25DF081A-SH-B Pin Configuration
| Pin 1 | CS — Chip Select, active low |
| Pin 2 | SO — Serial Data Out (MISO) |
| Pin 3 | WP — Write Protect, active low |
| Pin 4 | GND — Ground reference |
| Pin 5 | SI — Serial Data In (MOSI) |
| Pin 6 | SCK — Serial Clock Input |
| Pin 7 | HOLD — Hold, active low, pauses serial transfer |
| Pin 8 | VCC — Power Supply, 2.7 V to 3.6 V |
Typical Applications
AT25DF081A-SH-B is suitable for 7 applications: Industrial IoT Sensor Data Logging, Embedded Boot Firmware Storage, Networking Equipment Boot Flash, Automotive Infotainment Auxiliary Storage, Medical Instrument Firmware, Consumer Device Configuration Memory, Test and Measurement Datalogging.
Industrial IoT Sensor Data Logging
The AT25DF081A-SH-B is well suited for industrial IoT sensor nodes that require persistent local storage of timestamped telemetry. Its 8 Mbit (1 Mbyte) capacity holds roughly 30,000 sample records at 32 bytes each, while the 100,000-cycle sector endurance and >20-year retention support years of field-deployed logging without maintenance. The 2.7-3.6 V supply matches 3.3 V battery and bus-powered designs. SPI bus at up to 100 MHz keeps host MCU bandwidth available for sensor sampling; the HOLD and WP pins let the Flash share the bus with other peripherals. Compared with NAND Flash, the NOR architecture provides instantaneous random read access, simplifying on-device event indexing without external RAM caches.
Recommended
Embedded Boot Firmware Storage
As a code-shadow target, the AT25DF081A-SH-B holds bootloaders and application images for 32-bit MCUs that lack sufficient internal Flash. Execute-in-place (XIP) reads at 12.5 MB/s single-IO are fast enough to feed Cortex-M4 instruction streams without wait states on a 100 MHz SPI. The 4 KB uniform block erase fits well with MCU bootloader sector layouts, and SFDP discovery lets the bootloader auto-detect the part. The hardware WP pin plus BP0-BP2 status bits provide defense-in-depth against accidental overwrites of the golden image. Industrial -40C to +85C rating suits outdoor and factory-floor deployments.
Recommended
Networking Equipment Boot Flash
In routers, switches, and small-cell base stations the AT25DF081A-SH-B stores bootloader, U-Boot/uImage, and runtime configuration. Its 8 Mbit density covers 1 MB of compressed kernel plus overlay files comfortably. The dual-IO SPI mode doubles read throughput to 25 MB/s, useful when SoCs need to load compressed kernel images quickly. Hardware HOLD lets the Flash share the SPI bus with an Ethernet controller or other peripherals without contention. JEDEC SFDP simplifies firmware updates across hardware revisions. Compliance with industrial -40C to +85C temperature range meets the inside-the-cabinet thermal envelope of carrier-grade gear.
Recommended
Automotive Infotainment Auxiliary Storage
Beyond the main MCU Flash, automotive head units and cluster displays often need auxiliary NOR storage for boot splash images, navigation tiles, and configuration backup. The AT25DF081A-SH-B's wide operating temperature and industrial-grade endurance suit under-dash and cabin thermal environments. SPI interface connects directly to the infotainment SoC's SPI controller, allowing the OS to read graphics tiles without DMA overhead. The three on-chip Security Register pages provide per-unit UUID and tamper-evident counters for warranty and anti-counterfeit use. AEC-Q100 is not specified for this part, so it is positioned as auxiliary rather than primary safety storage.
Recommended
Medical Instrument Firmware
Patient monitors, infusion pumps, and portable diagnostic devices benefit from the AT25DF081A-SH-B's deterministic read latency, broad operating temperature, and 100,000-cycle endurance. The 8 Mbit density is sufficient for the firmware image, calibration constants, and last-30-days of patient session records. Hardware WP allows the firmware sector to be locked at production, supporting IEC 62304 risk-control requirements. SFDP enables a single bootloader image across multiple device variants that use the same Flash. Long >20-year data retention ensures calibration data survives extended shelf storage and field service intervals.
Recommended
Consumer Device Configuration Memory
Smart speakers, smart-home hubs, and connected appliances use the AT25DF081A-SH-B as configuration, Wi-Fi credential, and OTA-staging storage. The small 8-SOIC 208 mil footprint fits constrained enclosures, and the 2.7-3.6 V supply aligns with 3.3 V LDO rails common in cost-sensitive consumer designs. Sector erase in 4 KB uniform blocks enables in-place OTA updates without erasing the entire device, supporting A/B firmware schemes. The HOLD and WP pins permit the Flash to share a single SPI bus with the Wi-Fi/BLE radio without bus conflicts during deep-sleep wake-up. SFDP makes production SKU unification easy across regional variants.
Recommended
Test and Measurement Datalogging
Bench-top oscilloscopes, signal analyzers, and field instrumentation benefit from the AT25DF081A-SH-B's deterministic random read access and uniform 4 KB erase. Measurement buffers and screen-capture data can be streamed directly from the host DSP/MCU to the Flash via SPI at 100 MHz without external DRAM staging. The wide -40C to +85C operating range suits portable instruments used in unconditioned field environments. The three Security Register pages provide per-instrument calibration certificate storage, supporting NIST-traceable test setups. JEDEC SFDP simplifies instrument firmware portability across Flash generations.
Recommended
Recommended Products Summary
Engineering reference data for AT25DF081A-SH-B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AT25DF081A-SSH-B | AT25DF081A-SH-T | W25Q81DVSSIG | MX25L8006EM2I-12G | IS25LP080D-JBLE | GD25Q80ESIGR |
|---|---|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Winbond | Macronix | ISSI | GigaDevice |
| Package | SOIC-W 8 (208 mil) | SOIC-8 (150 mil) - narrower footprint | SOIC-W 8 (208 mil) - same as SH-B | SOIC-8 (208 mil) - same | SOIC-8 (208 mil) - same | SOIC-8 (208 mil) - same | SOIC-8 (208 mil) - same |
| Density | 8 Mbit (1 Mbyte) | 8 Mbit - identical | 8 Mbit - identical | 8 Mbit - identical | 8 Mbit - identical | 8 Mbit - identical | 8 Mbit - identical |
| Maximum SPI Clock | 100 MHz | 100 MHz - identical | 100 MHz - identical | 104 MHz | 86 MHz | 133 MHz | 104 MHz |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V - identical | 2.7 V to 3.6 V - identical | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C - identical | -40C to +85C - identical | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Sector Erase Size | 4 KB uniform | 4 KB uniform - identical | 4 KB uniform - identical | 4 KB sector + 32/64 KB block | 4 KB sector + 32/64 KB block | 4 KB uniform | 4 KB uniform |
| SFDP Support | Yes (JEDEC 216) | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Wide-body 208 mil SOIC for higher assembly yield (vs AT25DF081A-SSH-B)
- Higher maximum SPI clock than Macronix alternative (vs MX25L8006EM2I-12G)
- Three on-chip Security Register pages for UUID storage (vs W25Q81DVSSIG)
Design Notes
Route CS, SCK, SI, SO, WP, and HOLD as a matched-length bus to within 5 mm. Place a 0.1 uF decoupling capacitor within 3 mm of VCC (pin 8), and a 10 kohm pull-up on CS to VCC so the Flash powers up deselected. Avoid routing SPI signals under switching power inductors or near clock traces to prevent coupling of switching noise into the Flash's sensitive analog read path.
At 100 MHz SPI clock, the SO output rise time of approximately 2-3 ns creates transmission-line behavior on traces longer than about 25 mm. Use a 33 ohm series damping resistor near the Flash's SO pin to damp reflections, and add a small ground-return via adjacent to each SPI signal via. The HOLD and WP pins have internal pull-ups but still benefit from external 10 kohm pull-ups in noisy industrial environments.
Do not attempt a sector erase while VCC is below 2.7 V or above 3.6 V - this may produce incomplete erases and cause subsequent programming failures. Ensure tVCS minimum of 50 ns from VCC stable to first CS falling edge after power-up. When using SFDP discovery, verify the SFDP signature 0x50444653 ('SFDP') before trusting any parameter - some early bootloaders mistakenly interpret SFDP as standard JEDEC ID.
Page-program operations draw up to 15 mA peak at 3.3 V; sector erase up to 25 mA peak. Ensure the 3.3 V rail can sustain this inrush without sagging below 2.7 V. Add a 4.7 uF bulk capacitor near the Flash if multiple devices share the rail. Typical standby current is 15 uA and deep power-down current is 2 uA, so sleep-mode firmware should use the Deep Power-Down (0xB9) command to maximize battery life.
Compliance Information
AT25DF081A-SH-B is RoHS compliant per Renesas product page. Not AEC-Q100 qualified - for safety-critical automotive functions, use the AEC-Q100 qualified AT25SF081B-SHF-T instead. Lead-free and halogen-free per the SOIC-W 208 mil MSL-2 package qualification.
