PIC18F66K40-I/MR - 64KB Flash 8-bit MCU 64-VQFN | Microchip
N.º da peça: PIC18F66K40-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.0862 | $4,09 |
| 10 | $3.85 | $38,50 |
| 100 | $3.45 | $345,00 |
| 500 | $3.05 | $1.525,00 |
| 1.000 | $2.68 | $2.680,00 |
PIC18F66K40-I/MR Visão geral
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), working memory (RAM), and integrated peripherals. The PIC18F family sits in Microchip's 8-bit portfolio, balancing computational performance with low power consumption. The K40 sub-family adds XLP technology, enabling nanoWatt sleep currents for battery-powered designs.
Key features include 64KB Flash program memory, 4KB RAM, 1KB EEPROM, 64MHz operation, up to 12-bit ADC, multiple communication peripherals (UART, SPI, I2C), Core Independent Peripherals such as Configurable Logic Cells (CLC), Complementary Waveform Generator (CWG), and Windowed Watchdog Timer (WWDT). The device operates from 2.3V to 5.5V, with some variants supporting 1.8V minimum for low-voltage applications.
The PIC18F66K40 uses a RISC Harvard-architecture CPU with a 16-bit instruction word and 8-bit data path. Its CIPs (Core Independent Peripherals) allow hardware-based state machines without CPU intervention, reducing firmware complexity and enabling deterministic real-time behavior. The 64-VQFN package integrates a thermal pad for improved heat dissipation in space-constrained designs.
Typical applications include industrial control, IoT sensor nodes, consumer electronics, automotive body controllers, home automation, and low-power wireless sensor hubs. The XLP feature set makes it especially suitable for battery-backed or energy-harvesting designs.
Design consideration: Use the MPLAB X IDE with XC8 compiler. Ensure decoupling capacitors (100nF + 10uF) are placed close to VDD pins, and connect the exposed thermal pad to a ground plane for thermal management.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone, providing unique value for engineers selecting the PIC18F66K40-I/MR.
Alternativas drop-in para PIC18F66K40-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC18F66K40-I/MR (mesmo formato e footprint) — diferindo em Package, ADC, Core Architecture, Core Independent Peripherals, I/O Pins.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC18F65K40-I/MR
✅ Drop-In✓ Em estoque
$2.3 / unidade
Ver ficha técnica →PIC18LF66K40-I/MR
✅ Drop-In✓ Em estoque
$2.81 / unidade
Ver ficha técnica →PIC18F66K40-I/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
PIC18F66K40-E/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.18 / unidade
Ver ficha técnica →PIC18F66K40T-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.46 / unidade
Ver ficha técnica →PIC18F66K40-I/MR Classificações máximas e características elétricas
| Core Architecture | PIC18 8-bit RISC |
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz |
| Operating Voltage | 2.3 V to 5.5 V |
| I/O Pins | 60 (approx.) |
| Encapsulamento | 64-pin VQFN (9x9 mm) with exposed thermal pad |
| Temperature Range (Industrial) | -40C to +85C |
| Tipo de montagem | Surface Mount |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Status RoHS | Compliant |
| Core Independent Peripherals | CLC, CWG, WWDT, CRC, DSM, NCO |
Configuração de pinos do PIC18F66K40-I/MR
| Pino 1 | RA0 — GPIO / analog input |
| Pino 2 | RA1 — GPIO / analog input |
| Pino 3 | RA2 — GPIO / analog input |
| Pino 4 | RA3 — GPIO / analog input |
| Pino 5 | RA4 — GPIO / analog input |
| Pino 6 | RA5 — GPIO / analog input |
| Pino 7 | RA6 — GPIO / analog input |
| Pino 8 | RA7 — GPIO / analog input |
| Pino 9 | VSS — Ground |
| Pino 10 | VDD — Positive supply voltage |
| Pino 11 | RB0 — GPIO / interrupt-on-change |
| Pino 12 | RB1 — GPIO / interrupt-on-change |
| Pino 13 | RB2 — GPIO / interrupt-on-change |
| Pino 14 | RB3 — GPIO / interrupt-on-change |
| Pino 15 | RB4 — GPIO / interrupt-on-change |
| Pino 16 | RB5 — GPIO / interrupt-on-change |
| Pino 17 | RB6 — GPIO / interrupt-on-change / ICD PGC |
| Pino 18 | RB7 — GPIO / interrupt-on-change / ICD PGD |
| Pino 19 | RC0 — GPIO / analog input |
| Pino 20 | RC1 — GPIO / analog input |
| Pino 21 | RC2 — GPIO / analog input |
| Pino 22 | RC3 — GPIO / analog input |
| Pino 23 | RC4 — GPIO / analog input |
| Pino 24 | RC5 — GPIO / analog input |
| Pino 25 | RC6 — GPIO / analog input |
| Pino 26 | RC7 — GPIO / analog input |
| Pino 27 | VSS — Ground |
| Pino 28 | VDD — Positive supply voltage |
| Pino 29 | RD0 — GPIO |
| Pino 30 | RD1 — GPIO |
| Pino 31 | RD2 — GPIO |
| Pino 32 | RD3 — GPIO |
| Pino 33 | RD4 — GPIO |
| Pino 34 | RD5 — GPIO |
| Pino 35 | RD6 — GPIO |
| Pino 36 | RD7 — GPIO |
| Pino 37 | RE0 — GPIO |
| Pino 38 | RE1 — GPIO |
| Pino 39 | RE2 — GPIO |
| Pino 40 | RE3 — GPIO |
| Pino 41 | VSS — Ground |
| Pino 42 | VDD — Positive supply voltage |
| Pino 43 | RF0 — GPIO / analog input |
| Pino 44 | RF1 — GPIO / analog input |
| Pino 45 | RF2 — GPIO / analog input |
| Pino 46 | RF3 — GPIO / analog input |
| Pino 47 | RF4 — GPIO / analog input |
| Pino 48 | RF5 — GPIO / analog input |
| Pino 49 | RF6 — GPIO / analog input |
| Pino 50 | RF7 — GPIO / analog input |
| Pino 51 | RG0 — GPIO |
| Pino 52 | RG1 — GPIO |
| Pino 53 | RG2 — GPIO |
| Pino 54 | RG3 — GPIO |
| Pino 55 | RG4 — GPIO |
| Pino 56 | RG5 — GPIO |
| Pino 57 | RG6 — GPIO |
| Pino 58 | RG7 — GPIO |
| Pino 59 | VSS — Ground |
| Pino 60 | VDD — Positive supply voltage |
| Pino 61 | RH0 — GPIO / analog input |
| Pino 62 | RH1 — GPIO / analog input |
| Pino 63 | RH2 — GPIO / analog input |
| Pino 64 | RH3 — GPIO / analog input |
Aplicações típicas
PIC18F66K40-I/MR é adequado para 7 aplicaçãos: Industrial Sensor Interface, IoT Edge Sensor Node, Consumer Home Appliance Control, Automotive Body Control Module, Medical Monitoring Device, Smart Energy Meter, HMI Touch Interface.
Industrial Sensor Interface
The PIC18F66K40-I/MR excels in industrial sensor interface applications due to its 12-bit ADC, multiple communication peripherals (UART/SPI/I2C), and XLP low-power features. With 64KB Flash and 4KB RAM, it can run MODBUS RTU protocol stacks while managing multiple analog and digital sensors. The 64-pin VQFN package provides ample I/O for connecting to temperature, pressure, and flow sensors simultaneously, while the extended industrial temperature range (-40C to +85C) ensures reliable operation in factory environments.
Recomendado
IoT Edge Sensor Node
For battery-powered IoT edge devices, the PIC18F66K40-I/MR's XLP technology delivers nanoWatt sleep currents, enabling multi-year battery life. Its 64KB Flash accommodates LoRaWAN or BLE firmware stacks, while the 4KB RAM handles sensor buffering and encryption. The 2.3V-5.5V operating range supports direct connection to Li-ion or 3.3V regulated supplies. CIPs (CLC, WWDT) provide hardware-based sensor monitoring without waking the CPU, dramatically reducing average power consumption.
Recomendado
Consumer Home Appliance Control
The PIC18F66K40-I/MR is ideal for consumer home appliance control boards including washing machines, microwave ovens, and HVAC controllers. Its 64KB Flash stores user interface state machines and fault logs, while the CWG peripheral drives motor control PWM signals directly. The integrated CRC and WWDT peripherals provide functional safety features required by IEC 60730 household appliance standards, and the 64-VQFN package fits compact PCB layouts behind control panels.
Recomendado
Automotive Body Control Module
For non-safety-critical automotive body electronics (interior lighting, seat controls, door modules), the PIC18F66K40-I/MR provides robust peripheral integration. Its multiple PWM outputs drive LED drivers and small motors, while LIN-compatible UART interfaces connect to body networks. Although this part is industrial-grade (-40C to +85C), the extended variant supports +125C operation. The 64KB Flash comfortably hosts CAN/LIN protocol stacks plus application logic.
Recomendado
Medical Monitoring Device
The PIC18F66K40-I/MR suits portable medical monitoring devices such as pulse oximeters, glucose meters, and digital thermometers. Its low-power XLP features extend battery life in handheld applications, while the 12-bit ADC provides sufficient resolution for biosignal acquisition. The 4KB RAM accommodates signal buffering and display refresh. Although not medical-grade qualified, it serves well in consumer health devices where IEC 60601 is not required.
Recomendado
Smart Energy Meter
For smart electricity, water, or gas meters, the PIC18F66K40-I/MR combines the computational power needed for energy calculation algorithms with the low-power features required for battery-backed metering. Its 64KB Flash stores metering firmware and calibration constants in EEPROM, while the 12-bit ADC measures sensor outputs from current transformers or flow sensors. The MSSP peripheral supports SPI-based metrology ICs, and the RTC capability enables time-of-use billing functions.
Recomendado
HMI Touch Interface
The PIC18F66K40-I/MR powers small HMI (Human-Machine Interface) panels with TFT displays and touch buttons in industrial equipment. Its 64KB Flash hosts display drivers and menu state machines, while the CLC peripherals implement capacitive touch sensing without CPU load. The 64-pin VQFN package provides sufficient I/O for display parallel interfaces and multiple input buttons, and the 64MHz speed enables smooth screen updates without flicker.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC18F66K40-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC18F65K40-I/MR | PIC18LF66K40-I/MR | PIC18F66K40-I/PT | PIC18F66K40-E/MR | PIC18F66K40T-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-TQFP (10x10) - different footprint | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 32 KB (-50%) | 64 KB (same) | 64 KB (same) | 64 KB (same) | 64 KB (same) |
| RAM | 4 KB | 2 KB (-50%) | 4 KB (same) | 4 KB (same) | 4 KB (same) | 4 KB (same) |
| Maximum Frequency | 64 MHz | 64 MHz (same) | 64 MHz (same) | 64 MHz (same) | 64 MHz (same) | 64 MHz (same) |
| Operating Voltage | 2.3V to 5.5V | 2.3V to 5.5V (same) | 1.8V to 3.6V (lower min) | 2.3V to 5.5V (same) | 2.3V to 5.5V (same) | 2.3V to 5.5V (same) |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C (same) | -40C to +85C (same) | -40C to +85C (same) | -40C to +125C (Extended) | -40C to +85C (same) |
| Core Independent Peripherals | CLC, CWG, WWDT, CRC, DSM, NCO | Same CIP set | Same CIP set | Same CIP set | Same CIP set | Same CIP set |
Principais diferenciais
- Higher Flash density than PIC18F65K40 (vs PIC18F65K40-I/MR)
- Standard voltage range vs low-voltage LF variant (vs PIC18LF66K40-I/MR)
- Compact VQFN footprint with thermal pad (vs PIC18F66K40-I/PT (TQFP package))
Notas de projeto
The PIC18F66K40-I/MR has multiple VDD/VSS pin pairs that must all be connected to ensure proper operation. Place a 100nF ceramic decoupling capacitor close to each VDD pin and a bulk 10uF capacitor near the IC. Use a ground plane for the VSS connections to minimize noise. In XLP sleep modes, current consumption drops to nanoAmpere levels - ensure no floating inputs and configure unused pins as outputs to minimize leakage.
The 64-VQFN package features an exposed thermal pad (EP) on the underside that MUST be soldered to the PCB ground plane for proper thermal dissipation. Without proper EP soldering, junction temperature can rise significantly under high I/O switching loads. Use thermal vias in a 3x3 grid pattern beneath the EP to conduct heat to inner PCB layers. The 9x9 mm VQFN provides better thermal performance than equivalent TQFP packages.
Route the ICSP (In-Circuit Serial Programming) pins RB6/PGC and RB7/PGD as short, direct traces to the programming connector header to avoid programming failures. Keep analog signals (ADC inputs, VREF+) routed away from high-frequency digital lines (PWM, clock outputs) to minimize crosstalk. The 0.65mm pitch of the VQFN package requires fine-pitch PCB manufacturing (4/4 mil trace/space minimum recommended).
Common pitfalls when using the PIC18F66K40-I/MR: (1) Forgetting to configure the CONFIG words in source code - the device will not operate correctly with default configuration; (2) Not enabling the WDT or WWDT during development, causing firmware hangs to be undetectable; (3) Using the internal oscillator without calibration - the HFINTOSC can vary ±5% across temperature; (4) Driving LED or relay loads directly from GPIO pins without current-limiting resistors or driver transistors.
For optimal EMI performance, place the MCU crystal or external clock components within 5mm of the OSC1/OSC2 pins. Use a guard ring around the crystal traces connected to ground. If using the internal HFINTOSC, no external crystal is required but the PLL configuration must follow the datasheet guidance to achieve 64MHz operation. Keep switching regulator components away from the MCU analog sections to prevent conducted noise on ADC readings.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose automotive-grade PIC18 variants for vehicle applications. Lead-free and halogen-free packaging.
