ATSAMD51N19A-AF - 120MHz Cortex-M4F MCU, 512KB Flash | Microchip
N.º da peça: ATSAMD51N19A-AF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.58 | $75,80 |
| 100 | $6.74 | $674,00 |
| 500 | $6.05 | $3.025,00 |
| 1.000 | $5.41 | $5.410,00 |
ATSAMD51N19A-AF Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals around a common bus. Within the embedded semiconductor taxonomy, MCUs sit below microprocessors (which require external memory) and above basic ASICs in capability. The SAM D51 family is positioned as a high-performance general-purpose MCU, using the ARM Cortex-M4F core with single-precision FPU to accelerate DSP and floating-point control loops. ECC-protected Flash and SRAM target safety-critical and industrial applications where soft-error reliability matters.
Key features of the ATSAMD51N19A-AF include 120 MHz core clock with DSP extensions, 512 KB dual-panel Flash, up to 192 KB SRAM, six SERCOM modules configurable as UART/SPI/I2C, one full-speed USB 2.0 device/host, up to 12-bit 1 MSPS ADC with up to 16 channels, dual 12-bit DACs, four TC capture/compare/PWM channels, and a True Random Number Generator. The device supports 1.62V-3.6V supply and an extended industrial temperature range of -40C to +125C.
Architecturally, the ATSAMD51N19A-AF uses a 5-stage pipeline ARM Cortex-M4F core with single-precision FPU, MPU, and CoreSight debug. The dual-panel Flash allows simultaneous read/write, enabling live firmware updates without CPU stalls. The peripheral event system enables deterministic inter-peripheral signaling without CPU intervention, critical for motor control and power conversion applications.
Typical applications include industrial control (PLC I/O modules, motor drives), IoT edge nodes with secure TLS acceleration, USB peripherals (HID, CDC, composite), human-machine interfaces (HMI) with TFT touch control, audio processing with on-chip DAC, and portable instrumentation. The integrated crypto engine also suits secure-boot and OTA update designs.
When designing with the ATSAMD51N19A-AF, ensure decoupling follows the datasheet reference layout with 100 nF caps at each supply pin and a bulk 4.7 uF cap near the package. The TC and ADC reference grounds must be tied to a low-impedance analog ground plane. Verify the extended temperature option (-AF suffix) matches your application's thermal envelope.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing comparison-ready data for sourcing decisions.
Alternativas drop-in para ATSAMD51N19A-AF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAMD51N19A-AF (mesmo formato e footprint) — diferindo em USB, DAC, Operating Temperature, Package, ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAMD51N19A-AFT
✅ Drop-In✓ Em estoque
$4.8 / unidade
Ver ficha técnica →ATSAMD51J20A-MF
✅ Drop-In✓ Em estoque
$5.2 / unidade
Ver ficha técnica →ATSAMD51J20A-MFT
✅ Drop-In✓ Em estoque
$5.1 / unidade
Ver ficha técnica →ATSAMD51J19A-MF
✅ Drop-In✓ Em estoque
$5.4 / unidade
Ver ficha técnica →ATSAMD51J18A-AU-EFP
✅ Drop-In✓ Em estoque
$3.95 / unidade
Ver ficha técnica →ATSAMD51G19A-MFT
✅ Drop-In✓ Em estoque
$4.02 / unidade
Ver ficha técnica →ATSAMD51N19A-AF Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4F with FPU |
| Maximum CPU Frequency | 120 MHz |
| Program Flash Memory | 512 KB (dual-panel, with ECC) |
| SRAM | 192 KB (with ECC) |
| Encapsulamento | 100-pin TQFP (14x14 mm) |
| Operating Voltage | 1.62 V to 3.6 V |
| Temperatura de operação | -40C to +125C (extended) |
| ADC | 12-bit, up to 1 MSPS |
| DAC | Dual 12-bit |
| USB | USB 2.0 Full-Speed device/host |
| SERCOM Modules | 6 (configurable UART/SPI/I2C) |
| Crypto Engine | AES, SHA, TRNG |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Nível MSL | 3 (168 hours) |
Configuração de pinos do ATSAMD51N19A-AF
| Pino 1 | VDDIO — Digital I/O supply voltage |
| Pino 2 | PA00 — I/O line A00 (GPIO, analog) |
| Pino 3 | PA01 — I/O line A01 (GPIO, analog) |
| Pino 4 | PA02 — I/O line A02 (GPIO, analog) |
| Pino 5 | PA03 — I/O line A03 (GPIO, analog) |
| Pino 6 | GND — Ground |
| Pino 7 | PA04 — I/O line A04 (GPIO, analog) |
| Pino 8 | PA05 — I/O line A05 (GPIO, analog) |
| Pino 9 | PA06 — I/O line A06 (GPIO, analog) |
| Pino 10 | PA07 — I/O line A07 (GPIO, analog) |
| Pino 11 | VDDIO — Digital I/O supply voltage |
| Pino 12 | PA08 — SERCOM0/PAD0 or GPIO |
| Pino 13 | PA09 — SERCOM0/PAD1 or GPIO |
| Pino 14 | PA10 — SERCOM0/PAD2 or GPIO |
| Pino 15 | PA11 — SERCOM0/PAD3 or GPIO |
| Pino 16 | PA12 — SERCOM1/PAD0 or GPIO |
| Pino 17 | PA13 — SERCOM1/PAD1 or GPIO |
| Pino 18 | PA14 — SERCOM1/PAD2 or GPIO |
| Pino 19 | PA15 — SERCOM1/PAD3 or GPIO |
| Pino 20 | GND — Ground |
| Pino 21 | PA16 — SERCOM2/PAD0 or GPIO |
| Pino 22 | PA17 — SERCOM2/PAD1 or GPIO |
| Pino 23 | PA18 — SERCOM2/PAD2 or GPIO |
| Pino 24 | PA19 — SERCOM2/PAD3 or GPIO |
| Pino 25 | PA20 — SERCOM3/PAD0 or GPIO |
| Pino 26 | PA21 — SERCOM3/PAD1 or GPIO |
| Pino 27 | PA22 — SERCOM3/PAD2 or GPIO |
| Pino 28 | PA23 — SERCOM3/PAD3 or GPIO |
| Pino 29 | PA24 — USB DP or GPIO |
| Pino 30 | PA25 — USB DM or GPIO |
| Pino 31 | VDDIO — Digital I/O supply voltage |
| Pino 32 | GND — Ground |
| Pino 33 | PB00 — I/O line B00 (GPIO, analog) |
| Pino 34 | PB01 — I/O line B01 (GPIO, analog) |
| Pino 35 | PB02 — SERCOM4/PAD0 or GPIO |
| Pino 36 | PB03 — SERCOM4/PAD1 or GPIO |
| Pino 37 | PB04 — SERCOM4/PAD2 or GPIO |
| Pino 38 | PB05 — SERCOM4/PAD3 or GPIO |
| Pino 39 | PB06 — SERCOM5/PAD0 or GPIO |
| Pino 40 | PB07 — SERCOM5/PAD1 or GPIO |
| Pino 41 | PB08 — SERCOM5/PAD2 or GPIO |
| Pino 42 | PB09 — SERCOM5/PAD3 or GPIO |
| Pino 43 | GND — Ground |
| Pino 44 | PB10 — I/O line B10 (GPIO, analog) |
| Pino 45 | PB11 — I/O line B11 (GPIO, analog) |
| Pino 46 | PB12 — TC0/WO0 or GPIO |
| Pino 47 | PB13 — TC0/WO1 or GPIO |
| Pino 48 | PB14 — TC1/WO0 or GPIO |
| Pino 49 | PB15 — TC1/WO1 or GPIO |
| Pino 50 | PB16 — TC2/WO0 or GPIO |
| Pino 51 | PB17 — TC2/WO1 or GPIO |
| Pino 52 | VDDIO — Digital I/O supply voltage |
| Pino 53 | PB18 — I/O line B18 (GPIO, analog) |
| Pino 54 | PB19 — I/O line B19 (GPIO, analog) |
| Pino 55 | PB20 — I/O line B20 (GPIO, analog) |
| Pino 56 | PB21 — I/O line B21 (GPIO, analog) |
| Pino 57 | PB22 — I/O line B22 (GPIO, analog) |
| Pino 58 | PB23 — I/O line B23 (GPIO, analog) |
| Pino 59 | PB24 — I/O line B24 (GPIO, analog) |
| Pino 60 | PB25 — I/O line B25 (GPIO, analog) |
| Pino 61 | PC00 — I/O line C00 (GPIO, analog) |
| Pino 62 | PC01 — I/O line C01 (GPIO, analog) |
| Pino 63 | PC02 — I/O line C02 (GPIO, analog) |
| Pino 64 | PC03 — I/O line C03 (GPIO, analog) |
| Pino 65 | VDDCORE — Core voltage output (LDO) |
| Pino 66 | GND — Ground |
| Pino 67 | VDDIN — Main voltage regulator input |
| Pino 68 | PC04 — I/O line C04 (GPIO, analog) |
| Pino 69 | PC05 — I/O line C05 (GPIO, analog) |
| Pino 70 | PC06 — I/O line C06 (GPIO, analog) |
| Pino 71 | PC07 — I/O line C07 (GPIO, analog) |
| Pino 72 | PC08 — SERCOM6/PAD0 or GPIO |
| Pino 73 | PC09 — SERCOM6/PAD1 or GPIO |
| Pino 74 | PC10 — SERCOM6/PAD2 or GPIO |
| Pino 75 | PC11 — SERCOM6/PAD3 or GPIO |
| Pino 76 | PC12 — SERCOM7/PAD0 or GPIO |
| Pino 77 | PC13 — SERCOM7/PAD1 or GPIO |
| Pino 78 | PC14 — SERCOM7/PAD2 or GPIO |
| Pino 79 | PC15 — SERCOM7/PAD3 or GPIO |
| Pino 80 | GND — Ground |
| Pino 81 | PC16 — I/O line C16 (GPIO, analog) |
| Pino 82 | PC17 — I/O line C17 (GPIO, analog) |
| Pino 83 | PC18 — I/O line C18 (GPIO, analog) |
| Pino 84 | PC19 — I/O line C19 (GPIO, analog) |
| Pino 85 | PC20 — I/O line C20 (GPIO, analog) |
| Pino 86 | PC21 — I/O line C21 (GPIO, analog) |
| Pino 87 | PC22 — I/O line C22 (GPIO, analog) |
| Pino 88 | PC23 — I/O line C23 (GPIO, analog) |
| Pino 89 | PD00 — I/O line D00 (GPIO, analog) |
| Pino 90 | PD01 — I/O line D01 (GPIO, analog) |
| Pino 91 | PD02 — I/O line D02 (GPIO, analog) |
| Pino 92 | PD03 — I/O line D03 (GPIO, analog) |
| Pino 93 | PD04 — I/O line D04 (GPIO, analog) |
| Pino 94 | PD05 — I/O line D05 (GPIO, analog) |
| Pino 95 | PD06 — I/O line D06 (GPIO, analog) |
| Pino 96 | PD07 — I/O line D07 (GPIO, analog) |
| Pino 97 | PD08 — I/O line D08 (GPIO, analog) |
| Pino 98 | PD09 — I/O line D09 (GPIO, analog) |
| Pino 99 | RESET_N — Active-low reset input |
| Pino 100 | VDDIO — Digital I/O supply voltage |
Aplicações típicas
ATSAMD51N19A-AF é adequado para 6 aplicaçãos: Industrial Control (PLC I/O Modules, Motor Drives), IoT Edge Nodes with TLS Acceleration, USB Peripherals (HID, CDC, Composite), Human-Machine Interfaces (HMI) with TFT Touch, Audio Processing with On-Chip DAC, Portable Instrumentation and Data Loggers.
Industrial Control (PLC I/O Modules, Motor Drives)
The ATSAMD51N19A-AF fits industrial PLC and motor-drive applications thanks to its 120 MHz Cortex-M4F core, hardware FPU for field-oriented control, and 192 KB SRAM for control-loop buffers. Its six SERCOM modules can drive UART to operator panels, SPI to gate drivers, and I2C to sensor chains simultaneously. The 12-bit 1 MSPS ADC samples current and voltage feedback accurately, while dual 12-bit DACs generate analog reference signals. Extended -40C to +125C temperature range tolerates factory-floor thermal stress. The integrated crypto engine supports signed firmware for functional-safety designs.
Recomendado
IoT Edge Nodes with TLS Acceleration
The ATSAMD51N19A-AF suits secure IoT edge nodes because the on-chip crypto engine accelerates AES-128/256 and SHA-2, offloading TLS handshakes from the CPU. The USB 2.0 Full-Speed interface enables direct tethering to gateways, while SERCOM ports interface LoRa, Wi-Fi, or BLE modules. 192 KB SRAM hosts TLS session buffers and MQTT payload queues without external memory. The dual-panel Flash supports secure over-the-air firmware updates. Operating from 1.62V to 3.6V permits direct Li-ion battery connection.
Recomendado
USB Peripherals (HID, CDC, Composite)
The ATSAMD51N19A-AF is ideal for USB peripherals due to its integrated USB 2.0 Full-Speed controller with on-chip transceiver. The Microchip ASF and MPLAB Harmony stacks provide ready-to-use HID, CDC, MSD, and composite class drivers. Cortex-M4F at 120 MHz handles protocol stack and application logic without external MCU support. 512 KB Flash stores composite descriptor tables plus application code. The 100-pin TQFP gives ample I/O for buttons, LEDs, and downstream SPI peripherals in human-interface devices.
Recomendado
Human-Machine Interfaces (HMI) with TFT Touch
The ATSAMD51N19A-AF drives TFT-LCD HMI panels with its high-speed SERCOM channels connecting to SPI-based display controllers. The Cortex-M4F core renders graphics via lightweight LVGL or emWin stacks in 192 KB SRAM. 12-bit ADC reads resistive touch coordinates accurately. The crypto engine secures HMI passwords and operator credentials. Extended temperature range supports outdoor kiosk and industrial panel deployments. Multiple TC channels generate PWM backlight dimming and buzzer tones.
Recomendado
Audio Processing with On-Chip DAC
The ATSAMD51N19A-AF delivers up to 16-bit audio quality through its dual 12-bit DACs at 1 MSPS, sufficient for voice prompts, alert tones, and simple waveform synthesis. Cortex-M4F DSP extensions accelerate FFT and biquad filtering in real time. SERCOM channels drive external I2S codecs for higher-fidelity paths. 192 KB SRAM buffers multi-second audio chunks without external memory. The USB Full-Speed interface streams 16 kHz audio to host PCs.
Recomendado
Portable Instrumentation and Data Loggers
The ATSAMD51N19A-AF fits portable instruments because its Cortex-M4F core processes sensor data, the 12-bit ADC digitizes multiple channels at 1 MSPS, and 192 KB SRAM stores acquisition buffers. USB Full-Speed enables real-time data streaming to a host PC. The 1.62V-3.6V supply range supports direct Li-ion battery operation with no external LDO. The crypto engine secures proprietary measurement data on removable media via SD-card interface.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAMD51N19A-AF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAMD51N19A-AFT | ATSAMD51J20A-MF | ATSAMD51J19A-MF | ATSAMD51J18A-AU | ATSAMD51G19A-MFT |
|---|---|---|---|---|---|---|
| Package | TQFP-100 (14x14 mm) | TQFP-100 (14x14 mm) - same | LQFP-100 - same footprint family | QFN-64 (not pin-compatible) | LQFP-100 - same footprint family | QFN-48 (not pin-compatible) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 512 KB | 512 KB | 1024 KB | 512 KB | 256 KB | 512 KB |
| SRAM | 192 KB | 192 KB | 256 KB | 192 KB | 128 KB | 192 KB |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +125C |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Crypto Engine | AES, SHA, TRNG | AES, SHA, TRNG | AES, SHA, TRNG | AES, SHA, TRNG | AES, SHA, TRNG | AES, SHA, TRNG |
Principais diferenciais
- Highest memory density in TQFP-100 SAM D51 family at 512 KB Flash + 192 KB SRAM (vs ATSAMD51J18A-AU)
- Extended -40C to +125C industrial temperature range (vs ATSAMD51J18A-AU)
- Tray packaging optimized for prototyping and low-volume assembly (vs ATSAMD51N19A-AFT)
Notas de projeto
Place a 100 nF decoupling capacitor within 2 mm of every VDDIO and VDDIN pin, plus one bulk 4.7 uF ceramic near the package. The internal LDO that generates VDDCORE requires a 1 uF low-ESR output cap on the VDDCORE pin. Routing the analog supply AVVDD through a ferrite bead from VDDIN isolates ADC noise; failure to do this can couple switching noise into ADC measurements and reduce effective ENOB.
The TQFP-100 package has a theta_JA around 50 C/W on a standard 4-layer JEDEC test board. At full CPU load running 120 MHz with all peripherals active, typical dissipation is around 200 mW, yielding a 10C rise above ambient. For industrial -40C to +125C operation, ensure ambient does not push junction above 125C. Wide copper pours beneath exposed pads and on inner layers reduce theta_JA to around 30 C/W.
The ATSAMD51N19A-AF pinout follows the SAM D51 family convention with PAxx/ PBxx/ PCxx/ PDxx ports grouped together and SERCOM alternate functions color-mapped in the datasheet. Maintain continuous ground plane under the MCU to provide low-impedance return paths for SERCOM and USB signals. Route USB DP/DM as a 90 ohm differential pair with length matching within 2 mm. Place the 32.768 kHz crystal within 5 mm of the XIN32/XOUT32 pins to minimize parasitic capacitance.
Do not skip configuring the NVMCTRL peripheral to enable dual-panel Flash and ECC; if left at default single-panel mode, write performance is reduced and ECC errors trigger unwanted NMI. To use USB, the VBUS pin must see 5V through a 10k pull-up divider, and the UDIV clock must be sourced from DFLL or PLL - not from the untrimmed 48 MHz RC. The crypto engine requires the ICache and DMA to be enabled to reach its AES throughput targets.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for automotive ASIL designs, contact Microchip about ATSAME54/ATSAMV71 AEC-Q100 variants. MSL-3 moisture sensitivity level per JEDEC J-STD-020.
