ATSAME51N19A-AF - 120MHz Cortex-M4F MCU 512KB Flash TQFP-100
N.º da peça: ATSAME51N19A-AF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.79 | $7,79 |
| 10 | $7.25 | $72,50 |
| 100 | $6.55 | $655,00 |
| 500 | $6.05 | $3.025,00 |
| 1.000 | $5.55 | $5.550,00 |
ATSAME51N19A-AF Visão geral
A microcontroller (MCU) is a single-chip computer integrating a CPU core, memory (Flash and SRAM), and programmable peripherals. The Cortex-M4F is an ARM 32-bit core with DSP and single-precision floating point acceleration; it sits above Cortex-M0/M3 in the ARMv7-M family hierarchy and below Cortex-M7. Microchip's SAM E51 series is part of the broader SAM family of Cortex-M based microcontrollers (SAMD/SAME/SAMS/SAML), targeting industrial and general-purpose use cases with rich connectivity and analog peripherals.
Key features of the ATSAME51N19A-AF include up to 120 MHz CPU clock with FPU/DSP, 512 KB Dual-Panel Flash, 192 KB SRAM, full-speed USB 2.0 with embedded PHY, CAN-FD, up to 6 SERCOM (configurable USART/SPI/I2C/LIN), 12-bit 1 MSPS ADC with up to 32 channels, two 12-bit DACs, and a capacitive touch (PTC) peripheral. The device operates from 2.7 V to 5.5 V and offers an extended industrial temperature range of -40 C to +125 C. An on-chip Event System and SleepWalking peripherals enable ultra-low-power operation in battery-powered designs.
Typical applications include industrial PLCs, motor drives (BLDC/PMSM FOC), building automation controllers, smart energy metering, IoT gateways, and human-machine interface (HMI) panels. The combination of CAN-FD and USB makes it a strong candidate for industrial nodes bridging factory-floor networks to host systems, while the 1 MSPS ADC and 12-bit DACs simplify precision analog front-ends.
When designing with the ATSAME51N19A-AF, ensure decoupling capacitance (typically 100 nF per VDD pin plus a 4.7 uF bulk) is placed within 3 mm of the supply pins. The 100-pin TQFP package (14x14 mm) leaves sufficient copper area on most 2- or 4-layer boards for the reference thermal envelope. For firmware development, Microchip's MPLAB X IDE with MHC (MPLAB Harmony Configurator) generates the clock tree and peripheral initialization, while Atmel START remains a legacy option.
This page consolidates distributor stock and lead-time signals, drop-in same-package alternatives, and practical design guidance beyond the manufacturer datasheet to support sourcing, second-source qualification, and schematic design reviews.
Alternativas drop-in para ATSAME51N19A-AF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME51N19A-AF (mesmo formato e footprint) — diferindo em USB, Operating Temperature, SRAM, CAN, DAC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME51N20A-AF
✅ Drop-In✓ Em estoque
$6.55 / unidade
Ver ficha técnica →ATSAME51J19A-AF
✅ Drop-In✓ Em estoque
$3.85 / unidade
Ver ficha técnica →ATSAME51G19A-AF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME51J18A-AF
✅ Drop-In✓ Em estoque
$3.85 / unidade
Ver ficha técnica →ATSAMD51N19A-AF
✅ Drop-In✓ Em estoque
$5.41 / unidade
Ver ficha técnica →ATSAMD51N20A-AF
✅ Drop-In✓ Em estoque
$6.84 / unidade
Ver ficha técnica →ATSAME51N19A-AF Classificações máximas e características elétricas
| Manufacturer | Microchip Technology |
| Series | SAM E51 |
| Core | ARM Cortex-M4F (32-bit, FPU + DSP) |
| Maximum CPU Clock | 120 MHz |
| Flash Memory | 512 KB (Dual Panel) |
| SRAM | 192 KB |
| Operating Voltage (VDD) | 2.7 V to 5.5 V |
| Temperatura de operação | -40 C to +125 C (Extended Industrial) |
| Encapsulamento | 100-pin TQFP (14x14 mm) |
| Tipo de montagem | Surface Mount |
| USB | USB 2.0 Full-Speed with embedded PHY |
| CAN | CAN-FD |
| SERCOM / Comms | Up to 6 SERCOM (USART/SPI/I2C/LIN configurable) |
| ADC | 12-bit, up to 1 MSPS, up to 32 channels |
| DAC | 2 x 12-bit |
| Touch Peripheral (PTC) | Yes (capacitive touch) |
| FPU | Single-precision IEEE 754 |
| Status RoHS | Compliant |
Configuração de pinos do ATSAME51N19A-AF
| Pino 1 | PA00 — General-purpose I/O / SERCOM pad |
| Pino 2 | PA01 — General-purpose I/O / SERCOM pad |
| Pino 3 | PA02 — General-purpose I/O / analog / SERCOM pad |
| Pino 4 | PA04 — General-purpose I/O / analog / SERCOM pad |
| Pino 5 | PA05 — General-purpose I/O / analog / SERCOM pad |
| Pino 6 | PA06 — General-purpose I/O / analog / SERCOM pad |
| Pino 7 | PA07 — General-purpose I/O / analog / SERCOM pad |
| Pino 8 | VDD — Digital supply voltage |
| Pino 9 | GND — Ground |
| Pino 10 | PA08 — General-purpose I/O / SERCOM pad |
| Pino 11 | PA09 — General-purpose I/O / SERCOM pad |
| Pino 12 | PA10 — General-purpose I/O / SERCOM pad |
| Pino 13 | PA11 — General-purpose I/O / SERCOM pad |
| Pino 14 | VSS — Ground |
| Pino 15 | PA12 — General-purpose I/O / SERCOM pad |
| Pino 16 | PA13 — General-purpose I/O / SERCOM pad |
| Pino 17 | PA14 — General-purpose I/O / SERCOM pad |
| Pino 18 | PA15 — General-purpose I/O / SERCOM pad |
| Pino 19 | PA16 — General-purpose I/O / SERCOM pad |
| Pino 20 | PA17 — General-purpose I/O / SERCOM pad |
| Pino 21 | PA18 — General-purpose I/O / SERCOM pad |
| Pino 22 | PA19 — General-purpose I/O / SERCOM pad |
| Pino 23 | PA20 — General-purpose I/O / SERCOM pad |
| Pino 24 | PA21 — General-purpose I/O / SERCOM pad |
| Pino 25 | PA22 — General-purpose I/O / SERCOM pad |
| Pino 26 | PA23 — General-purpose I/O / SERCOM pad |
| Pino 27 | PA24 — General-purpose I/O / SERCOM pad |
| Pino 28 | PA25 — General-purpose I/O / SERCOM pad |
| Pino 29 | PB00 — General-purpose I/O / analog / SERCOM pad |
| Pino 30 | PB01 — General-purpose I/O / analog / SERCOM pad |
| Pino 31 | PB02 — General-purpose I/O / analog / SERCOM pad |
| Pino 32 | PB03 — General-purpose I/O / analog / SERCOM pad |
| Pino 33 | PB04 — General-purpose I/O / analog / SERCOM pad |
| Pino 34 | PB05 — General-purpose I/O / analog / SERCOM pad |
| Pino 35 | PB06 — General-purpose I/O / analog / SERCOM pad |
| Pino 36 | PB07 — General-purpose I/O / analog / SERCOM pad |
| Pino 37 | PB08 — General-purpose I/O / SERCOM pad |
| Pino 38 | PB09 — General-purpose I/O / SERCOM pad |
| Pino 39 | PB10 — General-purpose I/O / SERCOM pad |
| Pino 40 | PB11 — General-purpose I/O / SERCOM pad |
| Pino 41 | PB12 — General-purpose I/O / SERCOM pad |
| Pino 42 | PB13 — General-purpose I/O / SERCOM pad |
| Pino 43 | PB14 — General-purpose I/O / SERCOM pad |
| Pino 44 | PB15 — General-purpose I/O / SERCOM pad |
| Pino 45 | VDD — Digital supply voltage |
| Pino 46 | GND — Ground |
| Pino 47 | PC00 — General-purpose I/O / SERCOM pad |
| Pino 48 | PC01 — General-purpose I/O / SERCOM pad |
| Pino 49 | PC02 — General-purpose I/O / SERCOM pad |
| Pino 50 | PC03 — General-purpose I/O / SERCOM pad |
| Pino 51 | PC04 — General-purpose I/O / SERCOM pad |
| Pino 52 | PC05 — General-purpose I/O / SERCOM pad |
| Pino 53 | PC06 — General-purpose I/O / SERCOM pad |
| Pino 54 | PC07 — General-purpose I/O / SERCOM pad |
| Pino 55 | PC08 — General-purpose I/O / SERCOM pad |
| Pino 56 | PC09 — General-purpose I/O / SERCOM pad |
| Pino 57 | PC10 — General-purpose I/O / SERCOM pad |
| Pino 58 | PC11 — General-purpose I/O / SERCOM pad |
| Pino 59 | PC12 — General-purpose I/O / SERCOM pad |
| Pino 60 | PC13 — General-purpose I/O / SERCOM pad |
| Pino 61 | PC14 — General-purpose I/O / SERCOM pad |
| Pino 62 | PC15 — General-purpose I/O / SERCOM pad |
| Pino 63 | PC16 — General-purpose I/O / SERCOM pad |
| Pino 64 | PC17 — General-purpose I/O / SERCOM pad |
| Pino 65 | PC18 — General-purpose I/O / SERCOM pad |
| Pino 66 | PC19 — General-purpose I/O / SERCOM pad |
| Pino 67 | PC20 — General-purpose I/O / SERCOM pad |
| Pino 68 | PC21 — General-purpose I/O / SERCOM pad |
| Pino 69 | PC22 — General-purpose I/O / SERCOM pad |
| Pino 70 | PC23 — General-purpose I/O / SERCOM pad |
| Pino 71 | PC24 — General-purpose I/O / SERCOM pad |
| Pino 72 | PC25 — General-purpose I/O / SERCOM pad |
| Pino 73 | PC26 — General-purpose I/O / SERCOM pad |
| Pino 74 | PC27 — General-purpose I/O / SERCOM pad |
| Pino 75 | PC28 — General-purpose I/O / SERCOM pad |
| Pino 76 | VDD — Digital supply voltage |
| Pino 77 | GND — Ground |
| Pino 78 | PD00 — General-purpose I/O / SERCOM pad |
| Pino 79 | PD01 — General-purpose I/O / SERCOM pad |
| Pino 80 | PD02 — General-purpose I/O / SERCOM pad |
| Pino 81 | PD03 — General-purpose I/O / SERCOM pad |
| Pino 82 | PD04 — General-purpose I/O / SERCOM pad |
| Pino 83 | PD05 — General-purpose I/O / SERCOM pad |
| Pino 84 | PD06 — General-purpose I/O / SERCOM pad |
| Pino 85 | PD07 — General-purpose I/O / SERCOM pad |
| Pino 86 | PD08 — General-purpose I/O / SERCOM pad |
| Pino 87 | PD09 — General-purpose I/O / SERCOM pad |
| Pino 88 | PD10 — General-purpose I/O / SERCOM pad |
| Pino 89 | PD11 — General-purpose I/O / SERCOM pad |
| Pino 90 | PD12 — General-purpose I/O / SERCOM pad |
| Pino 91 | VSS — Ground |
| Pino 92 | VDDIO — I/O supply voltage |
| Pino 93 | NRST — External reset (active low) |
| Pino 94 | SWDIO — Serial Wire Debug I/O |
| Pino 95 | SWCLK — Serial Wire Debug clock |
| Pino 96 | VBUS — USB VBUS sense |
| Pino 97 | DM — USB D- data line |
| Pino 98 | DP — USB D+ data line |
| Pino 99 | VDD — Digital supply voltage |
| Pino 100 | GND — Ground |
Aplicações típicas
ATSAME51N19A-AF é adequado para 6 aplicaçãos: Industrial PLC and Automation Controller, BLDC / PMSM Motor Drive (FOC), Building Automation and HVAC Controller, Smart Energy Meter / Power Monitor, IoT Gateway / Sensor Hub, Human-Machine Interface (HMI) Panel.
Industrial PLC and Automation Controller
The ATSAME51N19A-AF is well matched to industrial PLC and automation controllers thanks to its 120 MHz Cortex-M4F core with FPU/DSP, CAN-FD interface, and up to 6 configurable SERCOM channels for SPI/I2C/UART sensor and actuator buses. With 512 KB of dual-panel Flash and 192 KB SRAM, the MCU can host IEC 60840 task scheduling, run a real-time OS, and buffer fieldbus telemetry. The 2.7 V to 5.5 V supply range matches 24 V-rail-derived industrial power rails after regulation, and the -40 C to +125 C extended industrial temperature range supports cabinet and unconditioned shop-floor deployments. Consider pairing with the ADM3251E isolated CAN transceiver and a 100 Mbps Ethernet MAC companion for plant-network bridging.
Recomendado
BLDC / PMSM Motor Drive (FOC)
The ATSAME51N19A-AF targets sensorless or encoder-based BLDC and PMSM motor drives, where the Cortex-M4F with single-precision FPU accelerates Park/Clarke/PMSM math for field-oriented control (FOC). The 12-bit 1 MSPS ADC samples back-EMF and phase currents with deterministic timing, while the 100-pin TQFP exposes PWM timers and quadrature encoder inputs for six-step trapezoidal commutation. Operating from a single 3.3 V or 5 V rail with 120 MHz headroom, the MCU closes the current loop in under a microsecond, leaving enough margin for housekeeping and CAN-FD telemetry. Reference motor-control libraries and Motor Control Application Notes from Microchip accelerate development.
Recomendado
Building Automation and HVAC Controller
The ATSAME51N19A-AF fits building automation and HVAC controllers that integrate Modbus/CAN-FD field networks, capacitive touch keypads, and low-power sleep modes. The Peripheral Touch Controller (PTC) enables robust glass-front-panel touch interfaces without external ICs, while SERCOM channels drive RS-485 transceivers and sensor I2C buses. With 192 KB SRAM the MCU can run a real-time scheduler plus a TLS stack for secure cloud updates, and SleepWalking peripherals reduce idle current below 50 uA/MHz for battery-backed thermostat designs. The wide 2.7 V to 5.5 V input tolerates HVAC bus power directly.
Recomendado
Smart Energy Meter / Power Monitor
For smart energy meters and power-quality monitors, the ATSAME51N19A-AF provides the simultaneous-sampling ADC needed for multi-phase voltage and current acquisition and the Cortex-M4F DSP extensions accelerate FFT-based harmonic analysis. USB Full-Speed eases local data export to service tools, while CAN-FD or SERCOM-modulated RS-485 supports AMI/AMR backhaul. The 512 KB Flash holds a metering application plus calibration tables, and the 192 KB SRAM buffers waveform snapshots between transmissions. The extended industrial temperature range is suitable for outdoor cabinet installations.
Recomendado
IoT Gateway / Sensor Hub
The ATSAME51N19A-AF is a strong fit for IoT gateways and sensor hubs that aggregate Modbus, CAN, I2C sensor, and SPI device streams before forwarding over USB or Ethernet MAC add-on. The 120 MHz FPU supports on-device edge analytics (FFT, anomaly detection) while SERCOMM swarms aggregate dozens of sensors concurrently. With USB device capability and ample Flash for OTA staging, the MCU is the local intelligence in industrial IoT nodes where Linux-class gateways are overkill. The wide VDD range and SleepWalking peripherals keep average power low for solar/battery field deployments.
Recomendado
Human-Machine Interface (HMI) Panel
The ATSAME51N19A-AF drives small HMI panels where the Cortex-M4F renders graphics to an SPI/parallel TFT LCD, reads capacitive touch via the on-chip PTC, and exchanges data with a host PLC over CAN-FD or USB. The 12-bit DACs generate contrast/backlight bias voltages, while SERCOM channels drive UART/RS-485 to subordinate devices. With 512 KB Flash the MCU stores fonts, icons, and a lightweight GUI library (e.g., LVGL) without external memory. The TQFP-100 package exposes enough GPIO for direct TFT interfacing at small QVGA resolutions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME51N19A-AF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME51N20A-AF | ATSAME51J19A-AF | ATSAME51G19A-AF | ATSAME51J18A-AF | ATSAMD51N19A-AF | ATSAMD51N20A-AF |
|---|---|---|---|---|---|---|---|
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| CAN-FD | Yes | Yes | Yes | Yes | Yes | No (SAMD51 lacks CAN-FD) | No (SAMD51 lacks CAN-FD) |
| USB Full-Speed | Yes (embedded PHY) | Yes (embedded PHY) | Yes (embedded PHY) | Yes (embedded PHY) | Yes (embedded PHY) | Yes (embedded PHY) | Yes (embedded PHY) |
| Operating Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Operating Temperature | -40 C to +125 C (Extended Industrial) | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
Principais diferenciais
- Balanced Flash-to-RAM ratio for industrial control with CAN-FD (vs ATSAME51J19A-AF)
- Extended industrial temperature range in TQFP-100 (vs ATSAME51G19A-AF)
- CAN-FD support versus the SAMD51 family (vs ATSAMD51N19A-AF)
- USB Full-Speed with embedded PHY (vs ATSAME54 family (LQFP-64))
Notas de projeto
Decouple each VDD pin with a 100 nF X7R ceramic placed within 3 mm of the IC. Add a single 4.7 uF X5R bulk capacitor shared by the digital supply rails and a 1 uF on the analog AVDD pin. The wide 2.7 V to 5.5 V input allows direct connection to a regulated 3.3 V rail; for 5 V systems confirm headroom against the 5.5 V absolute maximum. Place a ferrite bead between the digital and analog supplies to reduce ADC reference switching noise.
The 100-pin TQFP (14x14 mm) has 0.5 mm pitch pads and a center thermal pad must be soldered for thermal and electrical performance. Use a 4-layer PCB with a continuous ground plane directly under the device to minimize return-path inductance for the SERCOM and USB signals. Keep the 12-bit ADC traces short and isolated from PWM outputs; add a ground guard ring around the ADC input traces to suppress crosstalk from the high-current motor pins.
Do not float the NRST pin: tie it to VDD through a 10 kohm pull-up and a 1 nF to 10 nF capacitor to ground for a clean power-on-reset. The SWDIO and SWCLK pins must be pulled high in application or released via the Microchip debugger; failure to release SWDIO can block firmware updates. The USB DM/DP lines require 27 ohm to 33 ohm series resistors and a 1 uF VBUS decoupling capacitor per the USB 2.0 Full-Speed specification. For CAN-FD, ensure the transceiver TXD pin is configured as push-pull and the CANRX pin is sampled at least once per bit time.
Estimated: at 120 MHz CPU clock, typical core current is approximately 10 mA to 15 mA per Microchip SAM E51 datasheet estimates, yielding about 0.05 W at 3.3 V. The TQFP-100 has a theta_JA around 60 C/W on a 2-layer JEDEC test board, giving a junction temperature rise of 3 C over ambient - well below the 125 C limit even without a thermal pad. For designs operating in enclosed industrial cabinets with elevated ambient, add a small copper flood under the exposed pad and stitch vias to the opposite ground plane.
Informações de conformidade
RoHS and lead-free per Microchip product page; not AEC-Q100 qualified - the SAM E51 family targets industrial, not automotive, applications.
