ATSAME53J18A-MF - 120MHz Cortex-M4F MCU, 256KB Flash | Microchip
N.º da peça: ATSAME53J18A-MF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.95 | $7,95 |
| 10 | $7.45 | $74,50 |
| 100 | $6.78 | $678,00 |
| 500 | $6.05 | $3.025,00 |
| 1.000 | $5.4 | $5.400,00 |
ATSAME53J18A-MF Visão geral
What is a Cortex-M4F microcontroller? An ARM Cortex-M4F MCU is a low-power 32-bit microcontroller core with hardware single-precision floating-point and DSP instructions, designed for deterministic real-time embedded control. The Cortex-M4F sits within the broader ARM Cortex-M family (Cortex-M0/M0+/M3/M4/M7) and is widely used in motor control, industrial automation, audio processing, and connected sensor nodes where floating-point math and signal processing are needed.
Key features of the ATSAME53J18A-MF include a 120 MHz core, 256 KB dual-panel Flash with ECC, 128 KB SRAM, a 12-bit 1 MSPS ADC, two 12-bit DACs, multiple SERCOM (serial communication) interfaces configurable as UART/SPI/I2C, an on-chip 10/100 Ethernet MAC with IEEE 1588 PTP support, USB 2.0 Full-Speed, CAN-FD, and an integrated PTC (Peripheral Touch Controller) for capacitive touch sensing. The 64-QFN package exposes up to 51 GPIO lines for peripheral expansion.
Architecture-wise, the ATSAME53J18A-MF uses a Harvard-bus Cortex-M4F core with a tightly coupled 4 KB instruction cache, single-cycle MAC, and a Memory Protection Unit (MPU). The dual-panel Flash with ECC and SRAM with ECC enhance functional safety, making the part suitable for IEC 60730 class-B aware designs. The Event System, SERCOM, and configurable logic peripherals allow flexible pin-mapping and event-driven response without CPU overhead.
Typical applications include industrial Ethernet gateways, building automation controllers, USB-to-UART/CAN bridges, capacitive touch human-machine interfaces (HMIs), low-end motor control, and connected sensor nodes with Ethernet or USB connectivity. The wide operating temperature range and integrated peripherals reduce external component count for these designs.
When designing with the ATSAME53J18A-MF, ensure that the 64-QFN exposed pad is soldered to a sufficient ground copper pour for thermal dissipation and signal integrity, and that decoupling capacitors are placed close to each VDD pin. Programming is supported through SWD or the Atmel/Microchip bootloader, and development can be done in Microchip Studio (ASF) or MPLAB X with the Harmony 3 framework.
Alternativas drop-in para ATSAME53J18A-MF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME53J18A-MF (mesmo formato e footprint) — diferindo em SRAM, USB, Operating Temperature, Package, ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME53J19A-MF
✅ Drop-In✓ Em estoque
$4.31 / unidade
Ver ficha técnica →ATSAME51J19A-MF
✅ Drop-In✓ Em estoque
$4.05 / unidade
Ver ficha técnica →ATSAME51J18A-AF
✅ Drop-In✓ Em estoque
$3.85 / unidade
Ver ficha técnica →ATSAME51J20A-MU
✅ Drop-In✓ Em estoque
$7.65 / unidade
Ver ficha técnica →ATSAME53J18A-MFT
✅ Drop-In✓ Em estoque
$7.45 / unidade
Ver ficha técnica →ATSAME53J18A-MF Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4F (32-bit) |
| Frequência máxima de clock | 120 MHz |
| FPU | Single-precision IEEE 754 |
| DSP Instructions | Yes (SIMD, MAC) |
| Flash Memory | 256 KB (256K x 8) with ECC |
| SRAM | 128 KB with ECC |
| Operating Voltage | 3.3 V typical (1.62 V to 3.6 V) |
| Package Type | 64-pin QFN with exposed thermal pad (9x9 mm) |
| Tipo de montagem | Surface Mount |
| Ethernet MAC | 10/100 Mbps with IEEE 1588 PTP |
| USB | USB 2.0 Full-Speed Device/Host |
| CAN | CAN-FD |
| ADC | 12-bit, up to 1 MSPS |
| DAC | 2x 12-bit |
| GPIO Count | Up to 51 |
| Peripheral Touch Controller (PTC) | Yes (capacitive touch) |
| Temperatura de operação | -40C to +125C (extended) |
| Status RoHS | Compliant |
Configuração de pinos do ATSAME53J18A-MF
| Pino 1 | PA00 — General-purpose I/O / XIN32 (32.768 kHz crystal input) |
| Pino 2 | PA01 — General-purpose I/O / XOUT32 |
| Pino 3 | PA02 — General-purpose I/O / AIN0 (ADC input) |
| Pino 4 | PA03 — General-purpose I/O / AIN1 / VREFA |
| Pino 5 | VDDIO — Digital I/O supply (1.62 V to 3.6 V) |
| Pino 6 | GND — Ground |
| Pino 7 | PA04 — General-purpose I/O / AIN2 |
| Pino 8 | PA05 — General-purpose I/O / AIN3 |
| Pino 9 | PA06 — General-purpose I/O / AIN4 |
| Pino 10 | PA07 — General-purpose I/O / AIN5 |
| Pino 11 | PA08 — General-purpose I/O / I2C SDA |
| Pino 12 | PA09 — General-purpose I/O / I2C SCL |
| Pino 13 | PA10 — General-purpose I/O / UART RX |
| Pino 14 | PA11 — General-purpose I/O / UART TX |
| Pino 15 | VDDIO — Digital I/O supply |
| Pino 16 | GND — Ground |
| Pino 17 | PB10 — General-purpose I/O |
| Pino 18 | PB11 — General-purpose I/O |
| Pino 19 | PB12 — General-purpose I/O |
| Pino 20 | PB13 — General-purpose I/O |
| Pino 21 | PB14 — General-purpose I/O |
| Pino 22 | PB15 — General-purpose I/O |
| Pino 23 | PC05 — General-purpose I/O |
| Pino 24 | PC06 — General-purpose I/O |
| Pino 25 | PC07 — General-purpose I/O |
| Pino 26 | PC08 — General-purpose I/O |
| Pino 27 | PC09 — General-purpose I/O |
| Pino 28 | PC10 — General-purpose I/O |
| Pino 29 | PC11 — General-purpose I/O |
| Pino 30 | PC13 — General-purpose I/O |
| Pino 31 | PC14 — General-purpose I/O |
| Pino 32 | PC15 — General-purpose I/O |
| Pino 33 | VDDIO — Digital I/O supply |
| Pino 34 | GND — Ground |
| Pino 35 | PD00 — General-purpose I/O |
| Pino 36 | PD01 — General-purpose I/O |
| Pino 37 | PD02 — General-purpose I/O |
| Pino 38 | PD03 — General-purpose I/O |
| Pino 39 | PD04 — General-purpose I/O |
| Pino 40 | PD05 — General-purpose I/O |
| Pino 41 | PD06 — General-purpose I/O / USB DP |
| Pino 42 | PD07 — General-purpose I/O / USB DM |
| Pino 43 | PD08 — General-purpose I/O |
| Pino 44 | PD09 — General-purpose I/O |
| Pino 45 | PD10 — General-purpose I/O |
| Pino 46 | PD11 — General-purpose I/O |
| Pino 47 | PD12 — General-purpose I/O |
| Pino 48 | PB00 — General-purpose I/O |
| Pino 49 | PB01 — General-purpose I/O |
| Pino 50 | PB02 — General-purpose I/O / AIN10 |
| Pino 51 | PB03 — General-purpose I/O / AIN11 |
| Pino 52 | PB04 — General-purpose I/O / AIN12 |
| Pino 53 | PB05 — General-purpose I/O / AIN13 |
| Pino 54 | VBAT — Battery backup domain supply |
| Pino 55 | GND — Ground |
| Pino 56 | VDDIO — Digital I/O supply |
| Pino 57 | RESETn — Active-low reset input |
| Pino 58 | SWDIO — Serial Wire Debug I/O |
| Pino 59 | SWCLK — Serial Wire Debug clock |
| Pino 60 | GND — Ground |
| Pino 61 | VDDCORE — Internal core voltage regulator output (decoupling) |
| Pino 62 | VDDIN — Voltage regulator input (1.62 V to 3.6 V) |
| Pino 63 | GND — Ground |
| Pino 64 | EP — Exposed thermal pad (must be soldered to ground plane) |
Aplicações típicas
ATSAME53J18A-MF é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, Capacitive Touch HMI, USB-to-CAN Bridge, Building Automation Controller, Low-End Motor Control, Connected IoT Sensor Node.
Industrial Ethernet Gateway
The ATSAME53J18A-MF fits industrial Ethernet gateways because it integrates a 10/100 Ethernet MAC with hardware IEEE 1588 PTP timestamping alongside a 120 MHz Cortex-M4F core capable of running lwIP or uIP TCP/IP stacks within its 128 KB SRAM. Engineers can implement Modbus-TCP, EtherNet/IP, or PROFINET slave stacks while the FPU accelerates real-time data pre-processing. The on-chip USB 2.0 Full-Speed and CAN-FD further simplify gateway-to-sensor and gateway-to-actuator bridging. Compared with discrete MCU + external Ethernet PHY designs, the integrated MAC reduces BOM and PCB area while keeping deterministic latency for time-critical protocols.
Recomendado
Capacitive Touch HMI
The ATSAME53J18A-MF supports capacitive touch human-machine interfaces through its integrated Peripheral Touch Controller (PTC), which provides hardware-driven acquisition for up to 256 touch channels and supports Microchip's water-tolerant QTouch libraries. The 120 MHz Cortex-M4F core executes touch processing, gesture recognition, and display refresh with single-cycle MAC performance, while 256 KB Flash holds both the touch library and application UI code. The 64-QFN package offers up to 51 GPIO for sensor routing, and the dual 12-bit DAC can drive audio feedback for button-press cues. Designers can replace discrete touch ICs and reduce total BOM cost while gaining field firmware-upgrade flexibility over USB.
Recomendado
USB-to-CAN Bridge
The ATSAME53J18A-MF serves well as a USB-to-CAN bridge because it integrates both USB 2.0 Full-Speed device/host with on-chip PHY and a CAN-FD controller, eliminating the need for an external USB transceiver or CAN controller. The 120 MHz Cortex-M4F executes USB HID/CDC class drivers and CAN-FD frame handling concurrently within its 128 KB SRAM, while 256 KB Flash holds the bridging firmware. Hardware-accelerated DMA moves USB and CAN traffic with minimal CPU overhead, achieving sustained throughput above the 1 Mbps classic CAN limit and into the 5 Mbps CAN-FD range.
Recomendado
Building Automation Controller
The ATSAME53J18A-MF fits building automation controllers (HVAC, lighting, access) by combining Cortex-M4F performance for control loops with Ethernet for BACnet/Modbus-TCP connectivity, USB for local configuration, and CAN-FD for inter-controller wiring. The 12-bit 1 MSPS ADC captures analog sensor inputs (temperature, humidity, light), while the dual 12-bit DAC generates analog control outputs for valves and dimmers. Flash with ECC and SRAM with ECC support IEC 60730 class-B aware firmware designs, and the extended -40C to +125C temperature range suits indoor equipment closets and outdoor enclosures alike.
Recomendado
Low-End Motor Control
The ATSAME53J18A-MF drives low-end BLDC, PMSM, and stepper motors using its Cortex-M4F core with hardware MAC for field-oriented control (FOC) math, and the on-chip 12-bit DAC for set-point generation alongside PWM timers for three-phase inverter switching. The extended -40C to +125C operating range supports industrial and appliance motor applications, and the 64-QFN exposed pad provides adequate thermal dissipation for the 100 mA-scale operation. Engineers can implement sensorless FOC, or use the on-chip PTC for capacitive touch speed dials replacing mechanical potentiometers.
Recomendado
Connected IoT Sensor Node
The ATSAME53J18A-MF powers connected IoT sensor nodes by aggregating analog sensor data through its 12-bit 1 MSPS ADC, processing with the Cortex-M4F DSP instructions, and forwarding via Ethernet or USB. SERCOM peripherals configurable as UART/SPI/I2C connect to radios, sensors, and EEPROMs, while the 256 KB Flash and 128 KB SRAM hold MQTT-SN or CoAP clients. Hardware ECC on Flash and SRAM improves data integrity in long-life deployments, and the wide operating voltage range (1.62 V to 3.6 V) supports direct battery or energy-harvester supply without an external LDO.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME53J18A-MF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME53J19A-MF | ATSAME51J19A-MF | ATSAME51J18A-AF | ATSAME51J20A-MU | ATSAME53J18A-MFT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash Memory | 256 KB | 512 KB | 512 KB | 256 KB | 1 MB | 256 KB |
| SRAM | 128 KB | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB |
| Ethernet MAC | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | Not present | Not present | Not present | 10/100 + IEEE 1588 |
| USB 2.0 FS | Yes (device/host) | Yes (device/host) | Yes (device/host, SAM E51) | Yes (device/host) | Yes (device/host) | Yes (device/host) |
| CAN-FD | Yes | Yes | No | No | No | Yes |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C (industrial) | -40C to +125C | -40C to +125C |
Principais diferenciais
- Integrated 10/100 Ethernet MAC with hardware IEEE 1588 PTP (vs ATSAME51J18A-AF)
- Dual 12-bit DAC plus CAN-FD for industrial protocols (vs ATSAME51J20A-MU)
- Peripheral Touch Controller (PTC) with up to 256 touch channels (vs ATSAME51J19A-MF)
Notas de projeto
The 64-QFN package relies on its exposed thermal pad (pin 64) for heat dissipation. Per the Microchip SAM E53 datasheet, thermal resistance (theta_JA) on a standard JEDEC 4-layer test board is approximately 28 C/W. For an MCU drawing 100 mA at 3.3 V (330 mW), this yields a 9C rise above ambient - well within the 125C limit - but applications that drive many GPIO simultaneously at high toggle rates should allocate at least 4 vias (0.3 mm drill, 0.6 mm pad) under the EP to a 1 oz ground copper pour.
Place a 100 nF decoupling capacitor within 2 mm of each VDDIO pin (pins 5, 15, 33, 56) and a single 10 uF bulk capacitor near the VDDIN pin (pin 62). The internal LDO on pin 61 (VDDCORE) requires a 1 uF ceramic capacitor with ESR below 50 milliohm. Keep analog and digital supply traces separated, and short the VDDANA plane to VDDIO with a ferrite bead if analog accuracy below 1 LSB on the ADC is required.
Route the SWDIO/SWDCLK pair (pins 58/59) with ground return, no stubs, and keep traces under 50 mm to avoid debug connectivity failures. The 32.768 kHz crystal traces on PA00/PA01 should be guarded by a ground ring and isolated from high-speed signals. USB DP/DM differential pair (PD06/PD07, pins 41/42) requires 90 ohm differential impedance with no splits in the underlying ground plane.
Do not leave the RESETn pin floating; tie it to VDDIO through a 10 kohm resistor and provide a tactile or supervisory reset button for field recovery. The NVMCTRL row-write and page-erase commands lock the Flash for several ms - during which no code executes from the same bank; place non-time-critical data in a different Flash bank or use the dual-bank mode to keep executing while erasing.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial/extended temperature grade -40C to +125C. Not AEC-Q100 automotive qualified; choose ATSAME53J18A-AF automotive variant for automotive designs.
