ATSAME53J19A-MF - 120MHz Cortex-M4F MCU, 512KB Flash, 64-QFN | Microchip
N.º da peça: ATSAME53J19A-MF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.28 | $62,80 |
| 100 | $5.42 | $542,00 |
| 500 | $4.78 | $2.390,00 |
| 1.000 | $4.31 | $4.310,00 |
ATSAME53J19A-MF Visão geral
What is a Cortex-M4F microcontroller? An ARM Cortex-M4F microcontroller is a 32-bit RISC processor core that includes a hardware Floating Point Unit (FPU) and Digital Signal Processing (DSP) extensions such as SIMD instructions and a single-cycle MAC. Within Microchip's portfolio, the SAM E53 sits at the high-performance tier of the Cortex-M4 family, positioned above the SAM D20/D21 (lower-pin-count Cortex-M0+) and below the Cortex-M7 based SAME70/SAMS70 devices. It belongs to the broader category of embedded microcontrollers -> 32-bit MCUs -> ARM Cortex-M microcontrollers.
Key features include up to 1 MB Dual-Panel Flash with Error Correction Code (ECC), 192 KB SRAM with ECC, a 10/100 Mbps Ethernet MAC, USB 2.0 Full-Speed with integrated PHY, and a 12-bit 1 MSPS analog-to-digital converter (ADC) with up to 16 analog channels. Additional peripherals include configurable Custom Logic (CCL), up to 6 SERCOM serial communication interfaces, an I2S interface, and a Parallel Capture Controller (PCC). The integrated Event System enables inter-peripheral signaling without CPU intervention.
Architecturally, the ATSAME53J19A-MF uses a Harvard-bus Cortex-M4F core with tightly-coupled memories and a multi-layer bus matrix that allows simultaneous DMA-driven peripheral and memory accesses. The dual-panel Flash architecture supports live firmware updates without downtime, and the SRAM with ECC provides single-bit error correction for reliability in safety-sensitive systems.
Typical applications include industrial Ethernet gateways, building automation controllers, USB peripherals, motor control sensor interfaces, IoT edge nodes, and human-machine interface (HMI) panels. Its combination of Ethernet MAC and USB makes it particularly suited for connected devices that bridge field buses to higher-level networks.
Designers should allocate adequate decoupling (typically 100 nF plus 4.7 µF bulk) close to each VDD pin pair and connect the exposed thermal pad to a solid ground plane for thermal dissipation. Firmware development is supported through MPLAB Harmony 3 and Atmel Studio, with the SAME54 Xplained Pro board serving as a hardware reference.
This page synthesizes distributor pricing, parametric cross-references, and engineering design notes not found in the manufacturer datasheet, including drop-in alternatives within the SAM E53 family.
Alternativas drop-in para ATSAME53J19A-MF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME53J19A-MF (mesmo formato e footprint) — diferindo em Package, USB, SRAM, DAC, ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME53J19A-AF
✅ Drop-In✓ Em estoque
$5.9 / unidade
Ver ficha técnica →ATSAME53J18A-MF
✅ Drop-In✓ Em estoque
$5.4 / unidade
Ver ficha técnica →ATSAME53J18A-MFT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.45 / unidade
Ver ficha técnica →ATSAME51J19A-MF
✅ Drop-In✓ Em estoque
$4.05 / unidade
Ver ficha técnica →ATSAME51J19A-AFT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.62 / unidade
Ver ficha técnica →ATSAMD51J19A-MF
✅ Drop-In✓ Em estoque
$5.4 / unidade
Ver ficha técnica →ATSAMD51J20A-MF
✅ Drop-In✓ Em estoque
$5.2 / unidade
Ver ficha técnica →ATSAME53J19A-MF Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4F with FPU |
| Frequência máxima de clock | 120 MHz |
| Program Flash Memory | 512 KB (Dual-Panel with ECC) |
| SRAM | 192 KB with ECC |
| Supply Voltage (VDD) | 3.3 V typical (1.71 V - 3.6 V range) |
| Temperatura de operação | -40 °C to +125 °C (extended industrial) |
| Encapsulamento | 64-pin QFN (9x9 mm) with exposed thermal pad |
| Tipo de montagem | Surface Mount |
| Ethernet MAC | 10/100 Mbps |
| USB | USB 2.0 Full-Speed with integrated PHY |
| ADC | 12-bit, up to 1 MSPS, up to 16 channels |
| SERCOM | Up to 6 configurable serial interfaces (UART/SPI/I2C) |
| I2S Interface | Yes |
| Parallel Capture Controller | Yes (PCC) |
| Custom Logic (CCL) | Yes |
| Status RoHS | Compliant |
| Nível MSL | 3 |
| ECC Support | Flash + SRAM |
Configuração de pinos do ATSAME53J19A-MF
| Pino 1 | VDDIO — I/O supply voltage |
| Pino 2 | PA00 — GPIO / XIN32 |
| Pino 3 | PA01 — GPIO / XOUT32 |
| Pino 4 | PA02 — GPIO / AIN0 |
| Pino 5 | PA03 — GPIO / AIN1 / VREFA |
| Pino 6 | GND — Ground |
| Pino 7 | PA04 — GPIO / AIN2 |
| Pino 8 | PA05 — GPIO / AIN3 |
| Pino 9 | PA06 — GPIO / AIN4 |
| Pino 10 | PA07 — GPIO / AIN5 |
| Pino 11 | PA08 — GPIO / AIN6 / I2S_FS0 |
| Pino 12 | PA09 — GPIO / AIN7 / I2S_MCK0 |
| Pino 13 | VDDIO — I/O supply voltage |
| Pino 14 | GND — Ground |
| Pino 15 | PA10 — GPIO / I2S_SCK0 |
| Pino 16 | PA11 — GPIO / I2S_SDO |
| Pino 17 | PA12 — GPIO / I2S_SDI |
| Pino 18 | PA13 — GPIO / SERCOM1_PAD0 |
| Pino 19 | PA14 — GPIO / SERCOM1_PAD1 |
| Pino 20 | PA15 — GPIO / SERCOM1_PAD2 |
| Pino 21 | PA16 — GPIO / SERCOM1_PAD3 |
| Pino 22 | PA17 — GPIO / SERCOM2_PAD0 |
| Pino 23 | PA18 — GPIO / SERCOM2_PAD1 |
| Pino 24 | PA19 — GPIO / SERCOM2_PAD2 |
| Pino 25 | PA20 — GPIO / SERCOM2_PAD3 |
| Pino 26 | PA21 — GPIO / SERCOM3_PAD0 |
| Pino 27 | PA22 — GPIO / SERCOM3_PAD1 |
| Pino 28 | PA23 — GPIO / SERCOM3_PAD2 |
| Pino 29 | PA24 — GPIO / SERCOM3_PAD3 / USB_DM |
| Pino 30 | PA25 — GPIO / USB_DP |
| Pino 31 | PA26 — GPIO |
| Pino 32 | PA27 — GPIO |
| Pino 33 | PA28 — GPIO / AIN8 |
| Pino 34 | PA29 — GPIO / AIN9 |
| Pino 35 | PA30 — GPIO / AIN10 |
| Pino 36 | PA31 — GPIO / AIN11 |
| Pino 37 | PB00 — GPIO |
| Pino 38 | PB01 — GPIO |
| Pino 39 | PB02 — GPIO |
| Pino 40 | PB03 — GPIO |
| Pino 41 | PB04 — GPIO |
| Pino 42 | PB05 — GPIO |
| Pino 43 | PB06 — GPIO |
| Pino 44 | PB07 — GPIO |
| Pino 45 | PB08 — GPIO |
| Pino 46 | PB09 — GPIO |
| Pino 47 | PB10 — GPIO |
| Pino 48 | PB11 — GPIO |
| Pino 49 | PB12 — GPIO |
| Pino 50 | PB13 — GPIO |
| Pino 51 | PB14 — GPIO |
| Pino 52 | PB15 — GPIO |
| Pino 53 | PB16 — GPIO |
| Pino 54 | PB17 — GPIO |
| Pino 55 | PB18 — GPIO |
| Pino 56 | PB19 — GPIO |
| Pino 57 | PB20 — GPIO |
| Pino 58 | PB21 — GPIO |
| Pino 59 | PB22 — GPIO |
| Pino 60 | PB23 — GPIO |
| Pino 61 | VDDIO — I/O supply voltage |
| Pino 62 | GND — Ground |
| Pino 63 | VDDCORE — Core supply voltage (1.2V internal) |
| Pino 64 | EP — Exposed thermal pad - connect to GND |
Aplicações típicas
ATSAME53J19A-MF é adequado para 7 aplicaçãos: Industrial Ethernet Gateway, Building Automation Controller, USB Human Interface Device (HID), Motor Control Sensor Interface, IoT Edge Node with Ethernet Backhaul, Human-Machine Interface (HMI) Panel, Audio Streaming Endpoint.
Industrial Ethernet Gateway
The ATSAME53J19A-MF is well-matched to industrial Ethernet gateway designs thanks to its integrated 10/100 Mbps Ethernet MAC, 120 MHz Cortex-M4F core, and 192 KB SRAM with ECC. The Ethernet MAC handles PHY interfacing and frame management while the Cortex-M4F with FPU executes TCP/IP stacks and industrial protocols (Modbus TCP, EtherNet/IP) concurrently with deterministic interrupt response. ECC-protected Flash and SRAM support SIL-class reliability requirements and the -40 °C to +125 °C operating range covers factory floor environments. Place the device adjacent to the Ethernet magnetics and PHY, route the RMII signals with matched 50 ohm impedance, and use a 100 nF plus 4.7 µF decoupling combination at each VDD pin.
Recomendado
Building Automation Controller
The ATSAME53J19A-MF provides the compute, connectivity, and peripheral mix required for building automation controllers managing HVAC, lighting, and access control subsystems. Its six SERCOM interfaces can run UART, SPI, and I²C buses simultaneously for sensor and actuator networks, while the integrated USB simplifies commissioning via a diagnostic port. The 512 KB Dual-Panel Flash enables live firmware updates without controller downtime, and the Event System routes sensor interrupts to peripherals without CPU load. ECC memory protects configuration data from bit flips, important for 24/7 unattended operation.
Recomendado
USB Human Interface Device (HID)
The ATSAME53J19A-MF's integrated USB 2.0 Full-Speed controller with embedded PHY removes the need for an external transceiver, making it an excellent fit for USB HID peripherals such as industrial keypads, custom input devices, and diagnostic tools. The 120 MHz Cortex-M4F core can poll a matrix keypad or process gesture data while running USB HID class drivers and the same firmware can update via the USB DFU bootloader, eliminating external programming hardware. The 12-bit ADC supports analog joysticks or touch-sensing front-ends without additional silicon.
Recomendado
Motor Control Sensor Interface
For motor control sensor interfaces - encoder readers, resolver-to-digital converters, and current sense digitizers - the ATSAME53J19A-MF's 120 MHz Cortex-M4F core delivers single-cycle MAC operations for digital filtering of position and current signals. The 12-bit 1 MSPS ADC with up to 16 channels can sample multiple current shunts simultaneously, and the PWM-capable timers generate synchronization pulses for the host motor controller. The I2S interface captures audio-bandwidth vibration data for predictive maintenance analytics.
Recomendado
IoT Edge Node with Ethernet Backhaul
The ATSAME53J19A-MF suits IoT edge nodes that aggregate sensor data and forward it over Ethernet to cloud gateways or local servers. With 512 KB Flash and 192 KB SRAM, it can host TLS stacks, lightweight MQTT clients, and edge analytics routines while its Ethernet MAC supports Power-over-Ethernet coexistence through external PD controllers. The integrated USB and six SERCOM interfaces let designers add LoRa, Wi-Fi, or cellular modules for redundant uplinks. ECC memory increases reliability for unattended installations.
Recomendado
Human-Machine Interface (HMI) Panel
The ATSAME53J19A-MF drives small HMI panels combining a TFT display, capacitive touch, and physical buttons. Its I2S peripheral outputs digital audio for click feedback, the Parallel Capture Controller interfaces with image sensors or external cameras, and the six SERCOM interfaces connect SPI displays and I²C touch controllers. With 192 KB SRAM it can buffer graphical frame data without external memory, and the Event System efficiently routes touch interrupts to wake the display controller from sleep.
Recomendado
Audio Streaming Endpoint
For networked audio endpoints (intercoms, public-address amplifiers, digital mixers), the ATSAME53J19A-MF combines a Cortex-M4F DSP-capable CPU, an I2S interface, and an Ethernet MAC in a single chip. The DSP extensions perform sample-rate conversion, EQ, and compression algorithms in real time, while Ethernet transports AoIP streams (Dante, AES67) at line-rate. The 192 KB SRAM is sufficient to double-buffer 48 kHz/24-bit stereo streams without dropouts, and the 12-bit ADC enables onboard level metering.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME53J19A-MF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME53J19A-AF | ATSAME53J18A-MF | ATSAME51J19A-MF | ATSAMD51J19A-MF | ATSAMD51J20A-MF |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz |
| Flash | 512 KB | 512 KB | 256 KB | 512 KB | 512 KB | 1 MB |
| SRAM | 192 KB | 192 KB | 128 KB | 192 KB | 192 KB | 256 KB |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | No | No | No |
| USB | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY | USB 2.0 FS with PHY |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principais diferenciais
- Integrated 10/100 Ethernet MAC not present on SAMD51/SAME51 same-package siblings (vs ATSAMD51J19A-MF)
- Industrial -40 °C to +125 °C temperature grade as standard, vs commercial grade on the AF variant (vs ATSAME53J19A-AF)
- ECC-protected Flash and SRAM for safety-sensitive designs (vs ATSAME53J18A-MF)
Notas de projeto
Provide a stable 3.3 V supply with bulk capacitance of at least 4.7 µF plus a 100 nF ceramic decoupling capacitor at every VDDIO pin pair. Per Microchip SAM D5x/E5x datasheet DS60001507, the VDDCORE pin requires an external 1 µF + 100 nF combination to stabilize the internal regulator; do not omit these capacitors or the core supply will not regulate correctly. For Ethernet-enabled designs, ensure the 1.2 V core current budget (up to 60 mA at 120 MHz) is within the internal LDO's 100 mA limit.
Solder the exposed thermal pad (pin 64) to a continuous ground plane with at least 25 thermal vias (0.3 mm drill, 0.6 mm pad) to maintain junction temperature within the 125 °C limit. The QFN-64 (9x9 mm) package thermal resistance is approximately 28 °C/W; without proper pad soldering the device will throttle or fail prematurely. Route high-speed signals (USB DP/DM, RMII to Ethernet PHY) with 45 ohm differential impedance and keep total length under 50 mm to meet USB 2.0 signal-integrity requirements.
Do not leave unused SERCOM pads floating; configure them as outputs or enable the internal pull-down to prevent spurious interrupts at boot. The SAME53's dual-panel Flash requires careful linker-script alignment when implementing live firmware updates - partition A and B must each be 256 KB minimum. Also avoid using the PA24/PA25 USB pins as GPIO when USB is enabled in the fuse settings, as the USB pad controller will override GPIO configuration.
When using the integrated Ethernet MAC with an external RMII PHY (e.g., LAN8720A), match the RMII clock trace to 50 ohms within ±10% and keep it under 25 mm to avoid jitter that violates the IEEE 802.3 100 Mbps timing. Place the PHY within 50 mm of the SAME53 and use a common ground reference plane; ferrite beads on the analog supply pins of the PHY reduce common-mode noise coupling into the MAC.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified; for automotive grade consider ATSAME53N19A-AZ or ATSAMxE54 family members. Lead-free and halogen-free per Microchip environmental compliance documentation.
