ATSAME53J18A-MF - 120MHz Cortex-M4F MCU, 256KB Flash | Microchip
부품 번호: ATSAME53J18A-MF ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.95 | $7.95 |
| 10 | $7.45 | $74.50 |
| 100 | $6.78 | $678.00 |
| 500 | $6.05 | $3,025.00 |
| 1,000 | $5.4 | $5,400.00 |
ATSAME53J18A-MF 개요
What is a Cortex-M4F microcontroller? An ARM Cortex-M4F MCU is a low-power 32-bit microcontroller core with hardware single-precision floating-point and DSP instructions, designed for deterministic real-time embedded control. The Cortex-M4F sits within the broader ARM Cortex-M family (Cortex-M0/M0+/M3/M4/M7) and is widely used in motor control, industrial automation, audio processing, and connected sensor nodes where floating-point math and signal processing are needed.
Key features of the ATSAME53J18A-MF include a 120 MHz core, 256 KB dual-panel Flash with ECC, 128 KB SRAM, a 12-bit 1 MSPS ADC, two 12-bit DACs, multiple SERCOM (serial communication) interfaces configurable as UART/SPI/I2C, an on-chip 10/100 Ethernet MAC with IEEE 1588 PTP support, USB 2.0 Full-Speed, CAN-FD, and an integrated PTC (Peripheral Touch Controller) for capacitive touch sensing. The 64-QFN package exposes up to 51 GPIO lines for peripheral expansion.
Architecture-wise, the ATSAME53J18A-MF uses a Harvard-bus Cortex-M4F core with a tightly coupled 4 KB instruction cache, single-cycle MAC, and a Memory Protection Unit (MPU). The dual-panel Flash with ECC and SRAM with ECC enhance functional safety, making the part suitable for IEC 60730 class-B aware designs. The Event System, SERCOM, and configurable logic peripherals allow flexible pin-mapping and event-driven response without CPU overhead.
Typical applications include industrial Ethernet gateways, building automation controllers, USB-to-UART/CAN bridges, capacitive touch human-machine interfaces (HMIs), low-end motor control, and connected sensor nodes with Ethernet or USB connectivity. The wide operating temperature range and integrated peripherals reduce external component count for these designs.
When designing with the ATSAME53J18A-MF, ensure that the 64-QFN exposed pad is soldered to a sufficient ground copper pour for thermal dissipation and signal integrity, and that decoupling capacitors are placed close to each VDD pin. Programming is supported through SWD or the Atmel/Microchip bootloader, and development can be done in Microchip Studio (ASF) or MPLAB X with the Harmony 3 framework.
드롭인 대체품: ATSAME53J18A-MF — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAME53J18A-MF (동일 폼 팩터 및 풋프린트) — 차이점: SRAM, USB, Operating Temperature, Package, ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAME53J19A-MF
✅ 드롭인✓ 재고 있음
$4.31 / 개
데이터시트 보기 →ATSAME51J19A-MF
✅ 드롭인✓ 재고 있음
$4.05 / 개
데이터시트 보기 →ATSAME51J18A-AF
✅ 드롭인✓ 재고 있음
$3.85 / 개
데이터시트 보기 →ATSAME51J20A-MU
✅ 드롭인✓ 재고 있음
$7.65 / 개
데이터시트 보기 →ATSAME53J18A-MFT
✅ 드롭인✓ 재고 있음
$7.45 / 개
데이터시트 보기 →ATSAME53J18A-MF 최대 정격 & 전기적 특성
| Core Architecture | ARM Cortex-M4F (32-bit) |
| 최대 클록 주파수 | 120 MHz |
| FPU | Single-precision IEEE 754 |
| DSP Instructions | Yes (SIMD, MAC) |
| Flash Memory | 256 KB (256K x 8) with ECC |
| SRAM | 128 KB with ECC |
| Operating Voltage | 3.3 V typical (1.62 V to 3.6 V) |
| Package Type | 64-pin QFN with exposed thermal pad (9x9 mm) |
| 실장 유형 | Surface Mount |
| Ethernet MAC | 10/100 Mbps with IEEE 1588 PTP |
| USB | USB 2.0 Full-Speed Device/Host |
| CAN | CAN-FD |
| ADC | 12-bit, up to 1 MSPS |
| DAC | 2x 12-bit |
| GPIO Count | Up to 51 |
| Peripheral Touch Controller (PTC) | Yes (capacitive touch) |
| 동작 온도 | -40C to +125C (extended) |
| RoHS 상태 | Compliant |
ATSAME53J18A-MF 핀 구성
| 핀 1 | PA00 — General-purpose I/O / XIN32 (32.768 kHz crystal input) |
| 핀 2 | PA01 — General-purpose I/O / XOUT32 |
| 핀 3 | PA02 — General-purpose I/O / AIN0 (ADC input) |
| 핀 4 | PA03 — General-purpose I/O / AIN1 / VREFA |
| 핀 5 | VDDIO — Digital I/O supply (1.62 V to 3.6 V) |
| 핀 6 | GND — Ground |
| 핀 7 | PA04 — General-purpose I/O / AIN2 |
| 핀 8 | PA05 — General-purpose I/O / AIN3 |
| 핀 9 | PA06 — General-purpose I/O / AIN4 |
| 핀 10 | PA07 — General-purpose I/O / AIN5 |
| 핀 11 | PA08 — General-purpose I/O / I2C SDA |
| 핀 12 | PA09 — General-purpose I/O / I2C SCL |
| 핀 13 | PA10 — General-purpose I/O / UART RX |
| 핀 14 | PA11 — General-purpose I/O / UART TX |
| 핀 15 | VDDIO — Digital I/O supply |
| 핀 16 | GND — Ground |
| 핀 17 | PB10 — General-purpose I/O |
| 핀 18 | PB11 — General-purpose I/O |
| 핀 19 | PB12 — General-purpose I/O |
| 핀 20 | PB13 — General-purpose I/O |
| 핀 21 | PB14 — General-purpose I/O |
| 핀 22 | PB15 — General-purpose I/O |
| 핀 23 | PC05 — General-purpose I/O |
| 핀 24 | PC06 — General-purpose I/O |
| 핀 25 | PC07 — General-purpose I/O |
| 핀 26 | PC08 — General-purpose I/O |
| 핀 27 | PC09 — General-purpose I/O |
| 핀 28 | PC10 — General-purpose I/O |
| 핀 29 | PC11 — General-purpose I/O |
| 핀 30 | PC13 — General-purpose I/O |
| 핀 31 | PC14 — General-purpose I/O |
| 핀 32 | PC15 — General-purpose I/O |
| 핀 33 | VDDIO — Digital I/O supply |
| 핀 34 | GND — Ground |
| 핀 35 | PD00 — General-purpose I/O |
| 핀 36 | PD01 — General-purpose I/O |
| 핀 37 | PD02 — General-purpose I/O |
| 핀 38 | PD03 — General-purpose I/O |
| 핀 39 | PD04 — General-purpose I/O |
| 핀 40 | PD05 — General-purpose I/O |
| 핀 41 | PD06 — General-purpose I/O / USB DP |
| 핀 42 | PD07 — General-purpose I/O / USB DM |
| 핀 43 | PD08 — General-purpose I/O |
| 핀 44 | PD09 — General-purpose I/O |
| 핀 45 | PD10 — General-purpose I/O |
| 핀 46 | PD11 — General-purpose I/O |
| 핀 47 | PD12 — General-purpose I/O |
| 핀 48 | PB00 — General-purpose I/O |
| 핀 49 | PB01 — General-purpose I/O |
| 핀 50 | PB02 — General-purpose I/O / AIN10 |
| 핀 51 | PB03 — General-purpose I/O / AIN11 |
| 핀 52 | PB04 — General-purpose I/O / AIN12 |
| 핀 53 | PB05 — General-purpose I/O / AIN13 |
| 핀 54 | VBAT — Battery backup domain supply |
| 핀 55 | GND — Ground |
| 핀 56 | VDDIO — Digital I/O supply |
| 핀 57 | RESETn — Active-low reset input |
| 핀 58 | SWDIO — Serial Wire Debug I/O |
| 핀 59 | SWCLK — Serial Wire Debug clock |
| 핀 60 | GND — Ground |
| 핀 61 | VDDCORE — Internal core voltage regulator output (decoupling) |
| 핀 62 | VDDIN — Voltage regulator input (1.62 V to 3.6 V) |
| 핀 63 | GND — Ground |
| 핀 64 | EP — Exposed thermal pad (must be soldered to ground plane) |
일반적인 애플리케이션
ATSAME53J18A-MF 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateway, Capacitive Touch HMI, USB-to-CAN Bridge, Building Automation Controller, Low-End Motor Control, Connected IoT Sensor Node.
Industrial Ethernet Gateway
The ATSAME53J18A-MF fits industrial Ethernet gateways because it integrates a 10/100 Ethernet MAC with hardware IEEE 1588 PTP timestamping alongside a 120 MHz Cortex-M4F core capable of running lwIP or uIP TCP/IP stacks within its 128 KB SRAM. Engineers can implement Modbus-TCP, EtherNet/IP, or PROFINET slave stacks while the FPU accelerates real-time data pre-processing. The on-chip USB 2.0 Full-Speed and CAN-FD further simplify gateway-to-sensor and gateway-to-actuator bridging. Compared with discrete MCU + external Ethernet PHY designs, the integrated MAC reduces BOM and PCB area while keeping deterministic latency for time-critical protocols.
추천
Capacitive Touch HMI
The ATSAME53J18A-MF supports capacitive touch human-machine interfaces through its integrated Peripheral Touch Controller (PTC), which provides hardware-driven acquisition for up to 256 touch channels and supports Microchip's water-tolerant QTouch libraries. The 120 MHz Cortex-M4F core executes touch processing, gesture recognition, and display refresh with single-cycle MAC performance, while 256 KB Flash holds both the touch library and application UI code. The 64-QFN package offers up to 51 GPIO for sensor routing, and the dual 12-bit DAC can drive audio feedback for button-press cues. Designers can replace discrete touch ICs and reduce total BOM cost while gaining field firmware-upgrade flexibility over USB.
추천
USB-to-CAN Bridge
The ATSAME53J18A-MF serves well as a USB-to-CAN bridge because it integrates both USB 2.0 Full-Speed device/host with on-chip PHY and a CAN-FD controller, eliminating the need for an external USB transceiver or CAN controller. The 120 MHz Cortex-M4F executes USB HID/CDC class drivers and CAN-FD frame handling concurrently within its 128 KB SRAM, while 256 KB Flash holds the bridging firmware. Hardware-accelerated DMA moves USB and CAN traffic with minimal CPU overhead, achieving sustained throughput above the 1 Mbps classic CAN limit and into the 5 Mbps CAN-FD range.
추천
Building Automation Controller
The ATSAME53J18A-MF fits building automation controllers (HVAC, lighting, access) by combining Cortex-M4F performance for control loops with Ethernet for BACnet/Modbus-TCP connectivity, USB for local configuration, and CAN-FD for inter-controller wiring. The 12-bit 1 MSPS ADC captures analog sensor inputs (temperature, humidity, light), while the dual 12-bit DAC generates analog control outputs for valves and dimmers. Flash with ECC and SRAM with ECC support IEC 60730 class-B aware firmware designs, and the extended -40C to +125C temperature range suits indoor equipment closets and outdoor enclosures alike.
추천
Low-End Motor Control
The ATSAME53J18A-MF drives low-end BLDC, PMSM, and stepper motors using its Cortex-M4F core with hardware MAC for field-oriented control (FOC) math, and the on-chip 12-bit DAC for set-point generation alongside PWM timers for three-phase inverter switching. The extended -40C to +125C operating range supports industrial and appliance motor applications, and the 64-QFN exposed pad provides adequate thermal dissipation for the 100 mA-scale operation. Engineers can implement sensorless FOC, or use the on-chip PTC for capacitive touch speed dials replacing mechanical potentiometers.
추천
Connected IoT Sensor Node
The ATSAME53J18A-MF powers connected IoT sensor nodes by aggregating analog sensor data through its 12-bit 1 MSPS ADC, processing with the Cortex-M4F DSP instructions, and forwarding via Ethernet or USB. SERCOM peripherals configurable as UART/SPI/I2C connect to radios, sensors, and EEPROMs, while the 256 KB Flash and 128 KB SRAM hold MQTT-SN or CoAP clients. Hardware ECC on Flash and SRAM improves data integrity in long-life deployments, and the wide operating voltage range (1.62 V to 3.6 V) supports direct battery or energy-harvester supply without an external LDO.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAME53J18A-MF — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAME53J19A-MF | ATSAME51J19A-MF | ATSAME51J18A-AF | ATSAME51J20A-MU | ATSAME53J18A-MFT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same | QFN-64 (9x9 mm) - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash Memory | 256 KB | 512 KB | 512 KB | 256 KB | 1 MB | 256 KB |
| SRAM | 128 KB | 256 KB | 256 KB | 128 KB | 256 KB | 128 KB |
| Ethernet MAC | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | Not present | Not present | Not present | 10/100 + IEEE 1588 |
| USB 2.0 FS | Yes (device/host) | Yes (device/host) | Yes (device/host, SAM E51) | Yes (device/host) | Yes (device/host) | Yes (device/host) |
| CAN-FD | Yes | Yes | No | No | No | Yes |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C (industrial) | -40C to +125C | -40C to +125C |
주요 차별점
- Integrated 10/100 Ethernet MAC with hardware IEEE 1588 PTP (vs ATSAME51J18A-AF)
- Dual 12-bit DAC plus CAN-FD for industrial protocols (vs ATSAME51J20A-MU)
- Peripheral Touch Controller (PTC) with up to 256 touch channels (vs ATSAME51J19A-MF)
설계 노트
The 64-QFN package relies on its exposed thermal pad (pin 64) for heat dissipation. Per the Microchip SAM E53 datasheet, thermal resistance (theta_JA) on a standard JEDEC 4-layer test board is approximately 28 C/W. For an MCU drawing 100 mA at 3.3 V (330 mW), this yields a 9C rise above ambient - well within the 125C limit - but applications that drive many GPIO simultaneously at high toggle rates should allocate at least 4 vias (0.3 mm drill, 0.6 mm pad) under the EP to a 1 oz ground copper pour.
Place a 100 nF decoupling capacitor within 2 mm of each VDDIO pin (pins 5, 15, 33, 56) and a single 10 uF bulk capacitor near the VDDIN pin (pin 62). The internal LDO on pin 61 (VDDCORE) requires a 1 uF ceramic capacitor with ESR below 50 milliohm. Keep analog and digital supply traces separated, and short the VDDANA plane to VDDIO with a ferrite bead if analog accuracy below 1 LSB on the ADC is required.
Route the SWDIO/SWDCLK pair (pins 58/59) with ground return, no stubs, and keep traces under 50 mm to avoid debug connectivity failures. The 32.768 kHz crystal traces on PA00/PA01 should be guarded by a ground ring and isolated from high-speed signals. USB DP/DM differential pair (PD06/PD07, pins 41/42) requires 90 ohm differential impedance with no splits in the underlying ground plane.
Do not leave the RESETn pin floating; tie it to VDDIO through a 10 kohm resistor and provide a tactile or supervisory reset button for field recovery. The NVMCTRL row-write and page-erase commands lock the Flash for several ms - during which no code executes from the same bank; place non-time-critical data in a different Flash bank or use the dual-bank mode to keep executing while erasing.
규정 준수 정보
RoHS compliant per Microchip product page. Industrial/extended temperature grade -40C to +125C. Not AEC-Q100 automotive qualified; choose ATSAME53J18A-AF automotive variant for automotive designs.
