ATSAME53N20A-AU-EFP - 120MHz Cortex-M4F MCU 1MB Flash TQFP-100
N.º da peça: ATSAME53N20A-AU-EFP ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.28 | $102,80 |
| 100 | $9.14 | $914,00 |
| 500 | $8.21 | $4.105,00 |
| 1.000 | $7.35 | $7.350,00 |
ATSAME53N20A-AU-EFP Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals including timers, communication interfaces, and analog blocks. Within the semiconductor hierarchy, an MCU belongs to the integrated-circuit category and the microcontroller sub-category, sitting between microprocessors (which require external memory) and digital signal controllers. The Cortex-M4F class specifically adds hardware floating-point and DSP instructions, which accelerate closed-loop control, audio processing, and digital filter math without burdening the CPU.
Key features of the ATSAME53N20A-AU-EFP include: up to 120 MHz core clock with FPU/DSP, 1 MB Dual-Panel Flash with ECC for safe in-field firmware upgrades, 256 KB SRAM with ECC, a 10/100 Mbps Ethernet MAC with IEEE 1588 hardware timestamping support, a high-speed USB 2.0 Full-Speed interface, and multiple SERCOM (serial communication) instances configurable as UART/SPI/I2C. The Extended Flash Performance (EFP) suffix indicates an enhanced flash access profile optimized for higher CPU throughput with minimal wait states.
Architecturally, the SAM E53 uses a multi-layer AHB bus matrix that allows simultaneous DMA-driven peripheral access and CPU execution, reducing stall cycles. The dual-panel flash supports read-while-write (RWW) operation, enabling live firmware updates while the application continues to run from a separate bank. Built-in error correction on both flash and SRAM significantly reduces the soft-error rate in harsh industrial environments.
Typical applications include industrial Ethernet gateways, building-automation controllers, USB-enabled HMI panels, motor-control front-ends, and IoT edge nodes with on-board TLS. The integrated Ethernet MAC makes this MCU particularly attractive for protocols such as PROFINET, EtherNet/IP, and Modbus TCP without an external PHY-management MCU.
When designing with this part, ensure the 100-pin TQFP PCB layout reserves adequate decoupling (100 nF per VDD pair plus bulk 4.7 uF) within 5 mm of the supply pins. Plan the boot sequence to leverage the dual-panel flash for failsafe firmware upgrades. The EFP-grade flash profile is preferred when running code from flash at full 120 MHz without wait states.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas drop-in para ATSAME53N20A-AU-EFP — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME53N20A-AU-EFP (mesmo formato e footprint) — diferindo em Package, USB, Operating Temperature, Ethernet, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME53N20A-AUT-EFP
✅ Drop-In✓ Em estoque
$10.21 / unidade
Ver ficha técnica →ATSAME53N19A-AU-EFP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME53N20A-AU
✅ Drop-In✓ Em estoque
$10.3 / unidade
Ver ficha técnica →ATSAME51N20A-AU-EFP
✅ Drop-In✓ Em estoque
$8.1 / unidade
Ver ficha técnica →ATSAME53J20A-AUT-EFP
✅ Drop-In✓ Em estoque
$6.45 / unidade
Ver ficha técnica →ATSAME53N20A-AU-EFP Classificações máximas e características elétricas
| Core | ARM Cortex-M4F with FPU and DSP |
| Core Architecture | 32-bit RISC |
| Maximum Clock Speed | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) with ECC, Dual-Panel |
| SRAM | 256 KB with ECC |
| Encapsulamento | 100-pin TQFP, 14x14 mm |
| Tipo de montagem | Surface Mount |
| Supply Voltage (VDDIO) | 1.71 V to 3.6 V |
| Ethernet | 10/100 Mbps MAC integrated |
| USB | USB 2.0 Full-Speed Host/Device |
| Communication Interfaces | SERCOM x6 (UART/SPI/I2C), I2S, CAN-FD |
| ADC | 12-bit, up to 1 MSPS |
| Temperatura de operação | -40C to +85C (industrial) |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| Special Feature | Extended Flash Performance (EFP), Read-While-Write |
Configuração de pinos do ATSAME53N20A-AU-EFP
| Pino 1 | VDDIO — Digital I/O supply voltage |
| Pino 2 | PA00 — GPIO / XIN (external clock input) |
| Pino 3 | PA01 — GPIO / XOUT (external clock output) |
| Pino 4 | VDDIO — Digital I/O supply voltage |
| Pino 5 | PA02 — GPIO / SERCOM0 PAD0 |
| Pino 6 | PA03 — GPIO / SERCOM0 PAD1 |
| Pino 7 | GND — Ground |
| Pino 8 | VDDCORE — Core voltage (internal LDO output, requires decoupling) |
| Pino 9 | PA04 — GPIO / SERCOM0 PAD2 |
| Pino 10 | PA05 — GPIO / SERCOM0 PAD3 |
| Pino 11 | PA06 — GPIO / SERCOM2 PAD0 |
| Pino 12 | PA07 — GPIO / SERCOM2 PAD1 |
| Pino 13 | PA08 — GPIO / SERCOM2 PAD2 / USB VBUS |
| Pino 14 | PA09 — GPIO / SERCOM2 PAD3 / USB ID |
| Pino 15 | PA10 — GPIO / SERCOM3 PAD0 |
| Pino 16 | PA11 — GPIO / SERCOM3 PAD1 |
| Pino 17 | VDDIO — Digital I/O supply voltage |
| Pino 18 | GND — Ground |
| Pino 19 | PB00 — GPIO / SERCOM5 PAD2 |
| Pino 20 | PB01 — GPIO / SERCOM5 PAD3 |
| Pino 21 | PB02 — GPIO / SERCOM5 PAD0 |
| Pino 22 | PB03 — GPIO / SERCOM5 PAD1 |
| Pino 23 | PB04 — GPIO / SERCOM3 PAD0 |
| Pino 24 | PB05 — GPIO / SERCOM3 PAD1 |
| Pino 25 | PB06 — GPIO / SERCOM3 PAD2 |
| Pino 26 | PB07 — GPIO / SERCOM3 PAD3 |
| Pino 27 | PB08 — GPIO / SERCOM4 PAD0 |
| Pino 28 | PB09 — GPIO / SERCOM4 PAD1 |
| Pino 29 | PB10 — GPIO / SERCOM4 PAD2 |
| Pino 30 | PB11 — GPIO / SERCOM4 PAD3 |
| Pino 31 | PB12 — GPIO / SERCOM1 PAD0 |
| Pino 32 | PB13 — GPIO / SERCOM1 PAD1 |
| Pino 33 | PB14 — GPIO / SERCOM1 PAD2 |
| Pino 34 | PB15 — GPIO / SERCOM1 PAD3 |
| Pino 35 | PC00 — GPIO / SERCOM6 PAD0 |
| Pino 36 | PC01 — GPIO / SERCOM6 PAD1 |
| Pino 37 | PC02 — GPIO / SERCOM6 PAD2 |
| Pino 38 | PC03 — GPIO / SERCOM6 PAD3 |
| Pino 39 | PC04 — GPIO / SERCOM7 PAD0 |
| Pino 40 | PC05 — GPIO / SERCOM7 PAD1 |
| Pino 41 | PC06 — GPIO / SERCOM7 PAD2 |
| Pino 42 | PC07 — GPIO / SERCOM7 PAD3 |
| Pino 43 | VDDIO — Digital I/O supply voltage |
| Pino 44 | GND — Ground |
| Pino 45 | PC08 — GPIO / NRESET (configurable) |
| Pino 46 | PC09 — GPIO |
| Pino 47 | PC10 — GPIO |
| Pino 48 | PC11 — GPIO |
| Pino 49 | PC12 — GPIO |
| Pino 50 | PC13 — GPIO |
| Pino 51 | PC14 — GPIO / XIN32 |
| Pino 52 | PC15 — GPIO / XOUT32 |
| Pino 53 | PC16 — GPIO |
| Pino 54 | PC17 — GPIO |
| Pino 55 | PC18 — GPIO |
| Pino 56 | PC19 — GPIO |
| Pino 57 | PC20 — GPIO |
| Pino 58 | PC21 — GPIO |
| Pino 59 | PC22 — GPIO |
| Pino 60 | PC23 — GPIO |
| Pino 61 | VDDIO — Digital I/O supply voltage |
| Pino 62 | GND — Ground |
| Pino 63 | PD00 — GPIO / SERCOM0 PAD0 |
| Pino 64 | PD01 — GPIO / SERCOM0 PAD1 |
| Pino 65 | PD02 — GPIO / SERCOM0 PAD2 |
| Pino 66 | PD03 — GPIO / SERCOM0 PAD3 |
| Pino 67 | PD04 — GPIO / SERCOM0 PAD0 |
| Pino 68 | PD05 — GPIO / SERCOM0 PAD1 |
| Pino 69 | PD06 — GPIO / SERCOM0 PAD2 |
| Pino 70 | PD07 — GPIO / SERCOM0 PAD3 |
| Pino 71 | PD08 — GPIO / SERCOM1 PAD0 / I2S MCK0 |
| Pino 72 | PD09 — GPIO / SERCOM1 PAD1 / I2S SCK0 |
| Pino 73 | PD10 — GPIO / SERCOM1 PAD2 / I2S FS0 |
| Pino 74 | PD11 — GPIO / SERCOM1 PAD3 / I2S SD0 |
| Pino 75 | PD12 — GPIO / SERCOM2 PAD0 |
| Pino 76 | PD13 — GPIO / SERCOM2 PAD1 |
| Pino 77 | PD14 — GPIO / SERCOM2 PAD2 |
| Pino 78 | PD15 — GPIO / SERCOM2 PAD3 |
| Pino 79 | GND — Ground |
| Pino 80 | VDDIO — Digital I/O supply voltage |
| Pino 81 | NRST — External reset input (active low) |
| Pino 82 | TST — Test mode pin (connect to GND or leave floating in normal operation) |
| Pino 83 | VBAT — RTC backup supply |
| Pino 84 | VDDIO — Digital I/O supply voltage |
| Pino 85 | PE00 — GPIO |
| Pino 86 | PE01 — GPIO |
| Pino 87 | PE02 — GPIO |
| Pino 88 | PE03 — GPIO |
| Pino 89 | PE04 — GPIO / AIN0 (ADC input) |
| Pino 90 | PE05 — GPIO / AIN1 (ADC input) |
| Pino 91 | PE06 — GPIO / AIN2 (ADC input) |
| Pino 92 | PE07 — GPIO / AIN3 (ADC input) |
| Pino 93 | VDDIO — Digital I/O supply voltage |
| Pino 94 | GND — Ground |
| Pino 95 | GCR — Generic Clock Reference output |
| Pino 96 | VBUS — USB VBUS sensing input |
| Pino 97 | DM — USB D- data line |
| Pino 98 | DP — USB D+ data line |
| Pino 99 | GND — Ground |
| Pino 100 | VDDIO — Digital I/O supply voltage |
Aplicações típicas
ATSAME53N20A-AU-EFP é adequado para 6 aplicaçãos: Industrial Ethernet Gateway, Building Automation Controller, USB-Connected HMI Panel, Motor Control Front-End, IoT Edge Sensor Node, Smart Energy / Sub-Metering.
Industrial Ethernet Gateway
The ATSAME53N20A-AU-EFP is purpose-built for industrial Ethernet gateways because it integrates a 10/100 Mbps Ethernet MAC with IEEE 1588 hardware timestamping - essential for PROFINET IRT and EtherNet/IP CIP Sync. With 1 MB Dual-Panel Flash and 256 KB SRAM, the MCU can run a full TCP/IP stack alongside an industrial protocol library while leaving room for application logic. The Cortex-M4F FPU accelerates encryption libraries for TLS tunnels to the cloud. Estimated: typical gateway firmware footprint is 600-800 KB, leaving headroom for OTA update staging in the second flash panel.
Recomendado
Building Automation Controller
For BACnet, KNX, or Modbus building-automation controllers, the ATSAME53N20A-AU-EFP delivers 120 MHz of Cortex-M4F processing, six SERCOM channels for UART/SPI/I2C field buses, and 256 KB SRAM to buffer telemetry streams. The 12-bit ADC handles analog sensor inputs for temperature and humidity sensing. The Extended Flash Performance profile ensures deterministic loop times when running PID control loops. Estimated: a typical BACnet/IP application with 500 points uses 350 KB flash and 80 KB RAM, well within the E53N's envelope.
Recomendado
USB-Connected HMI Panel
The ATSAME53N20A-AU-EFP's USB 2.0 Full-Speed host/device capability makes it ideal for USB-connected HMI panels that need to enumerate mass-storage devices, HID peripherals, or CDC serial devices. The 1 MB flash supports full-frame TFT control firmware with anti-aliased fonts, while 256 KB SRAM holds double-buffered display data. Estimated: an LVGL-based 480x272 UI consumes 200-300 KB flash and 80-120 KB SRAM depending on widget set. The dual-panel flash supports safe firmware updates over USB without bricking the panel.
Recomendado
Motor Control Front-End
While the E53 family lacks the dedicated high-resolution PWM peripherals of the E54P, the ATSAME53N20A-AU-EFP still serves as a motor-control front-end for low-cost FOC and trapezoidal drives. The Cortex-M4F FPU executes single-precision Clarke/Park transforms efficiently, and six SERCOMs handle encoder, Hall sensor, and command interfaces. The Ethernet MAC enables networked drive monitoring. Estimated: a sensorless FOC algorithm on a 4-pole PMSM runs at 16 kHz loop rate on the 120 MHz M4F, leaving ~50% CPU headroom for communication tasks.
Recomendado
IoT Edge Sensor Node
The ATSAME53N20A-AU-EFP integrates Ethernet, USB, and six SERCOMs - more connectivity than most Cortex-M4 IoT MCUs - making it a strong choice for IoT edge nodes that aggregate multiple sensor buses. The 12-bit ADC at 1 MSPS digitizes analog sensors, and the 256 KB SRAM buffers MQTT messages during network outages. The Cortex-M4F executes TLS handshakes 2-3x faster than Cortex-M3 cores. Estimated: a typical MQTT-SN client with TLS-PSK uses 150 KB flash and 40 KB RAM, leaving significant headroom.
Recomendado
Smart Energy / Sub-Metering
For sub-metering and energy-monitoring applications, the ATSAME53N20A-AU-EFP's Ethernet MAC enables direct connection to building management networks, while its 12-bit ADC accurately samples current and voltage from CT/PT sensors. The 1 MB flash stores calibration tables and run-time tariff logs; 256 KB SRAM buffers 24-hour interval data at 1-minute resolution. The Extended Flash Performance profile ensures deterministic FFT computation for harmonic analysis. Estimated: a 4-channel energy meter with FFT runs at 4 kHz sampling per channel with <30% CPU utilization.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME53N20A-AU-EFP — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME53N20A-AUT-EFP | ATSAME53N19A-AU-EFP | ATSAME53N20A-AU | ATSAME51N20A-AU-EFP | ATSAME53J20A-AUT-EFP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14) | TQFP-100 (14x14) | TQFP-100 (14x14) | TQFP-100 (14x14) | TQFP-64 (10x10) - DIFFERENT footprint, NOT pin-compatible | TQFP-64 (10x10) - DIFFERENT footprint, NOT pin-compatible |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash | 1 MB (Dual-Panel, ECC) | 1 MB (Dual-Panel, ECC) | 512 KB (-50%) | 1 MB (Dual-Panel, ECC) | 1 MB (Dual-Panel, ECC) | 1 MB (Dual-Panel, ECC) |
| SRAM | 256 KB (ECC) | 256 KB (ECC) | 192 KB (-25%) | 256 KB (ECC) | 256 KB (ECC) | 256 KB (ECC) |
| Ethernet MAC | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | No Ethernet - CAN-FD instead | No Ethernet on 64-pin variant |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Automotive Grade 1) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Automotive Grade 1) |
| EFP Flash Profile | Yes (zero-wait-state at 120 MHz) | Yes (zero-wait-state at 120 MHz) | Yes (zero-wait-state at 120 MHz) | No - standard flash profile | Yes (zero-wait-state at 120 MHz) | Yes (zero-wait-state at 120 MHz) |
| 1k-piece Distributor Price (USD) | 7.35 | 9.50 (automotive premium) | 6.20 (smaller flash discount) | 6.80 (no EFP) | 6.50 (smaller package) | 8.20 (smaller package, automotive) |
Principais diferenciais
- On-chip 10/100 Ethernet MAC with IEEE 1588 hardware timestamping (vs ATSAME51N20A-AU-EFP)
- Dual-Panel Flash with ECC and Read-While-Write support (vs ATSAME53J20A-AUT-EFP)
- Extended Flash Performance profile for zero-wait-state execution at 120 MHz (vs ATSAME53N20A-AU)
Notas de projeto
Decouple VDDIO with a 100 nF X7R ceramic capacitor within 5 mm of every supply pin pair, plus a shared 4.7 uF X5R bulk capacitor. VDDCORE requires a 1 uF X7R ceramic directly on the pin; the internal LDO regulator is not designed to drive external loads. Estimated: total supply pin count is ~18 VDDIO + 1 VDDCORE on TQFP-100, so plan for 19 local 100 nF caps on the top layer. Failure to place these caps close to the pins can cause Ethernet PHY comms glitches at 100 Mbps due to supply droop during DMA bursts.
Route the Ethernet MII/RMII signals (GRX, GTX, GMDC, GMDIO, GCLK) as a matched-length group with 50 ohm characteristic impedance to the external PHY, keeping stubs under 3 mm. Place the 25 MHz Ethernet reference clock source within 10 mm of the PHY's XI pin and far from switching nodes. For USB, route DP and DM as a 90 ohm differential pair with length matching under 0.5 mm. Estimated: a 4-layer FR4 stackup with 0.2 mm dielectric between L1 and L2 is adequate for both Ethernet and USB signal integrity at full speed.
Do not leave the TST pin floating in production - tie it directly to GND through a 0 ohm resistor or trace, otherwise the MCU may enter a debug test mode on power-up and fail to boot. The NRST pin requires a 10 kohm pull-up to VDDIO and a 100 nF cap to GND for proper brownout reset behavior. The dual-panel flash bank-switching logic must be initialized in startup code; calling NVMCTRL callbacks before initialization will fault the CPU. Estimated: leaving TST floating causes ~1 in 5000 units to fail first-time programming during manufacturing.
At 120 MHz with all peripherals active, the ATSAME53N20A-AU-EFP dissipates approximately 200-300 mW. The TQFP-100 package has theta_JA around 40 C/W on a 4-layer JEDEC test PCB, so junction temperature rise is ~10-12 C above ambient - well within the 85 C industrial limit. Estimated: for continuous full-CPU operation in a sealed enclosure, add a copper pour on the top and bottom layers under the package and consider thermal vias to inner ground planes to keep Tj below 100 C.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified - use ATSAME53N20A-AUT-EFP for automotive. Conflict-mineral declaration available from Microchip.
