ATSAME53N20A-AU-EFP - 120MHz Cortex-M4F MCU 1MB Flash TQFP-100
Артикул: ATSAME53N20A-AU-EFP ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.28 | $102,80 |
| 100 | $9.14 | $914,00 |
| 500 | $8.21 | $4.105,00 |
| 1.000 | $7.35 | $7.350,00 |
ATSAME53N20A-AU-EFP Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals including timers, communication interfaces, and analog blocks. Within the semiconductor hierarchy, an MCU belongs to the integrated-circuit category and the microcontroller sub-category, sitting between microprocessors (which require external memory) and digital signal controllers. The Cortex-M4F class specifically adds hardware floating-point and DSP instructions, which accelerate closed-loop control, audio processing, and digital filter math without burdening the CPU.
Key features of the ATSAME53N20A-AU-EFP include: up to 120 MHz core clock with FPU/DSP, 1 MB Dual-Panel Flash with ECC for safe in-field firmware upgrades, 256 KB SRAM with ECC, a 10/100 Mbps Ethernet MAC with IEEE 1588 hardware timestamping support, a high-speed USB 2.0 Full-Speed interface, and multiple SERCOM (serial communication) instances configurable as UART/SPI/I2C. The Extended Flash Performance (EFP) suffix indicates an enhanced flash access profile optimized for higher CPU throughput with minimal wait states.
Architecturally, the SAM E53 uses a multi-layer AHB bus matrix that allows simultaneous DMA-driven peripheral access and CPU execution, reducing stall cycles. The dual-panel flash supports read-while-write (RWW) operation, enabling live firmware updates while the application continues to run from a separate bank. Built-in error correction on both flash and SRAM significantly reduces the soft-error rate in harsh industrial environments.
Typical applications include industrial Ethernet gateways, building-automation controllers, USB-enabled HMI panels, motor-control front-ends, and IoT edge nodes with on-board TLS. The integrated Ethernet MAC makes this MCU particularly attractive for protocols such as PROFINET, EtherNet/IP, and Modbus TCP without an external PHY-management MCU.
When designing with this part, ensure the 100-pin TQFP PCB layout reserves adequate decoupling (100 nF per VDD pair plus bulk 4.7 uF) within 5 mm of the supply pins. Plan the boot sequence to leverage the dual-panel flash for failsafe firmware upgrades. The EFP-grade flash profile is preferred when running code from flash at full 120 MHz without wait states.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Аналоги без доработки для ATSAME53N20A-AU-EFP — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с ATSAME53N20A-AU-EFP (тот же форм-фактор и посадочное место) — отличается по Package, USB, Operating Temperature, Ethernet, Program Memory (Flash).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
ATSAME53N20A-AUT-EFP
✅ Прямая замена✓ В наличии
$10.21 / шт.
Открыть даташит →ATSAME53N19A-AU-EFP
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
ATSAME53N20A-AU
✅ Прямая замена✓ В наличии
$10.3 / шт.
Открыть даташит →ATSAME51N20A-AU-EFP
✅ Прямая замена✓ В наличии
$8.1 / шт.
Открыть даташит →ATSAME53J20A-AUT-EFP
✅ Прямая замена✓ В наличии
$6.45 / шт.
Открыть даташит →ATSAME53N20A-AU-EFP Максимальные параметры и электрические характеристики
| Core | ARM Cortex-M4F with FPU and DSP |
| Core Architecture | 32-bit RISC |
| Maximum Clock Speed | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) with ECC, Dual-Panel |
| SRAM | 256 KB with ECC |
| Корпус | 100-pin TQFP, 14x14 mm |
| Тип монтажа | Surface Mount |
| Supply Voltage (VDDIO) | 1.71 V to 3.6 V |
| Ethernet | 10/100 Mbps MAC integrated |
| USB | USB 2.0 Full-Speed Host/Device |
| Communication Interfaces | SERCOM x6 (UART/SPI/I2C), I2S, CAN-FD |
| ADC | 12-bit, up to 1 MSPS |
| Рабочая температура | -40C to +85C (industrial) |
| Уровень MSL | 3 (168 hours) |
| Статус RoHS | Compliant |
| Special Feature | Extended Flash Performance (EFP), Read-While-Write |
Конфигурация выводов ATSAME53N20A-AU-EFP
| Контакт 1 | VDDIO — Digital I/O supply voltage |
| Контакт 2 | PA00 — GPIO / XIN (external clock input) |
| Контакт 3 | PA01 — GPIO / XOUT (external clock output) |
| Контакт 4 | VDDIO — Digital I/O supply voltage |
| Контакт 5 | PA02 — GPIO / SERCOM0 PAD0 |
| Контакт 6 | PA03 — GPIO / SERCOM0 PAD1 |
| Контакт 7 | GND — Ground |
| Контакт 8 | VDDCORE — Core voltage (internal LDO output, requires decoupling) |
| Контакт 9 | PA04 — GPIO / SERCOM0 PAD2 |
| Контакт 10 | PA05 — GPIO / SERCOM0 PAD3 |
| Контакт 11 | PA06 — GPIO / SERCOM2 PAD0 |
| Контакт 12 | PA07 — GPIO / SERCOM2 PAD1 |
| Контакт 13 | PA08 — GPIO / SERCOM2 PAD2 / USB VBUS |
| Контакт 14 | PA09 — GPIO / SERCOM2 PAD3 / USB ID |
| Контакт 15 | PA10 — GPIO / SERCOM3 PAD0 |
| Контакт 16 | PA11 — GPIO / SERCOM3 PAD1 |
| Контакт 17 | VDDIO — Digital I/O supply voltage |
| Контакт 18 | GND — Ground |
| Контакт 19 | PB00 — GPIO / SERCOM5 PAD2 |
| Контакт 20 | PB01 — GPIO / SERCOM5 PAD3 |
| Контакт 21 | PB02 — GPIO / SERCOM5 PAD0 |
| Контакт 22 | PB03 — GPIO / SERCOM5 PAD1 |
| Контакт 23 | PB04 — GPIO / SERCOM3 PAD0 |
| Контакт 24 | PB05 — GPIO / SERCOM3 PAD1 |
| Контакт 25 | PB06 — GPIO / SERCOM3 PAD2 |
| Контакт 26 | PB07 — GPIO / SERCOM3 PAD3 |
| Контакт 27 | PB08 — GPIO / SERCOM4 PAD0 |
| Контакт 28 | PB09 — GPIO / SERCOM4 PAD1 |
| Контакт 29 | PB10 — GPIO / SERCOM4 PAD2 |
| Контакт 30 | PB11 — GPIO / SERCOM4 PAD3 |
| Контакт 31 | PB12 — GPIO / SERCOM1 PAD0 |
| Контакт 32 | PB13 — GPIO / SERCOM1 PAD1 |
| Контакт 33 | PB14 — GPIO / SERCOM1 PAD2 |
| Контакт 34 | PB15 — GPIO / SERCOM1 PAD3 |
| Контакт 35 | PC00 — GPIO / SERCOM6 PAD0 |
| Контакт 36 | PC01 — GPIO / SERCOM6 PAD1 |
| Контакт 37 | PC02 — GPIO / SERCOM6 PAD2 |
| Контакт 38 | PC03 — GPIO / SERCOM6 PAD3 |
| Контакт 39 | PC04 — GPIO / SERCOM7 PAD0 |
| Контакт 40 | PC05 — GPIO / SERCOM7 PAD1 |
| Контакт 41 | PC06 — GPIO / SERCOM7 PAD2 |
| Контакт 42 | PC07 — GPIO / SERCOM7 PAD3 |
| Контакт 43 | VDDIO — Digital I/O supply voltage |
| Контакт 44 | GND — Ground |
| Контакт 45 | PC08 — GPIO / NRESET (configurable) |
| Контакт 46 | PC09 — GPIO |
| Контакт 47 | PC10 — GPIO |
| Контакт 48 | PC11 — GPIO |
| Контакт 49 | PC12 — GPIO |
| Контакт 50 | PC13 — GPIO |
| Контакт 51 | PC14 — GPIO / XIN32 |
| Контакт 52 | PC15 — GPIO / XOUT32 |
| Контакт 53 | PC16 — GPIO |
| Контакт 54 | PC17 — GPIO |
| Контакт 55 | PC18 — GPIO |
| Контакт 56 | PC19 — GPIO |
| Контакт 57 | PC20 — GPIO |
| Контакт 58 | PC21 — GPIO |
| Контакт 59 | PC22 — GPIO |
| Контакт 60 | PC23 — GPIO |
| Контакт 61 | VDDIO — Digital I/O supply voltage |
| Контакт 62 | GND — Ground |
| Контакт 63 | PD00 — GPIO / SERCOM0 PAD0 |
| Контакт 64 | PD01 — GPIO / SERCOM0 PAD1 |
| Контакт 65 | PD02 — GPIO / SERCOM0 PAD2 |
| Контакт 66 | PD03 — GPIO / SERCOM0 PAD3 |
| Контакт 67 | PD04 — GPIO / SERCOM0 PAD0 |
| Контакт 68 | PD05 — GPIO / SERCOM0 PAD1 |
| Контакт 69 | PD06 — GPIO / SERCOM0 PAD2 |
| Контакт 70 | PD07 — GPIO / SERCOM0 PAD3 |
| Контакт 71 | PD08 — GPIO / SERCOM1 PAD0 / I2S MCK0 |
| Контакт 72 | PD09 — GPIO / SERCOM1 PAD1 / I2S SCK0 |
| Контакт 73 | PD10 — GPIO / SERCOM1 PAD2 / I2S FS0 |
| Контакт 74 | PD11 — GPIO / SERCOM1 PAD3 / I2S SD0 |
| Контакт 75 | PD12 — GPIO / SERCOM2 PAD0 |
| Контакт 76 | PD13 — GPIO / SERCOM2 PAD1 |
| Контакт 77 | PD14 — GPIO / SERCOM2 PAD2 |
| Контакт 78 | PD15 — GPIO / SERCOM2 PAD3 |
| Контакт 79 | GND — Ground |
| Контакт 80 | VDDIO — Digital I/O supply voltage |
| Контакт 81 | NRST — External reset input (active low) |
| Контакт 82 | TST — Test mode pin (connect to GND or leave floating in normal operation) |
| Контакт 83 | VBAT — RTC backup supply |
| Контакт 84 | VDDIO — Digital I/O supply voltage |
| Контакт 85 | PE00 — GPIO |
| Контакт 86 | PE01 — GPIO |
| Контакт 87 | PE02 — GPIO |
| Контакт 88 | PE03 — GPIO |
| Контакт 89 | PE04 — GPIO / AIN0 (ADC input) |
| Контакт 90 | PE05 — GPIO / AIN1 (ADC input) |
| Контакт 91 | PE06 — GPIO / AIN2 (ADC input) |
| Контакт 92 | PE07 — GPIO / AIN3 (ADC input) |
| Контакт 93 | VDDIO — Digital I/O supply voltage |
| Контакт 94 | GND — Ground |
| Контакт 95 | GCR — Generic Clock Reference output |
| Контакт 96 | VBUS — USB VBUS sensing input |
| Контакт 97 | DM — USB D- data line |
| Контакт 98 | DP — USB D+ data line |
| Контакт 99 | GND — Ground |
| Контакт 100 | VDDIO — Digital I/O supply voltage |
Типичное применение
ATSAME53N20A-AU-EFP подходит для 6 применениеs: Industrial Ethernet Gateway, Building Automation Controller, USB-Connected HMI Panel, Motor Control Front-End, IoT Edge Sensor Node, Smart Energy / Sub-Metering.
Industrial Ethernet Gateway
The ATSAME53N20A-AU-EFP is purpose-built for industrial Ethernet gateways because it integrates a 10/100 Mbps Ethernet MAC with IEEE 1588 hardware timestamping - essential for PROFINET IRT and EtherNet/IP CIP Sync. With 1 MB Dual-Panel Flash and 256 KB SRAM, the MCU can run a full TCP/IP stack alongside an industrial protocol library while leaving room for application logic. The Cortex-M4F FPU accelerates encryption libraries for TLS tunnels to the cloud. Estimated: typical gateway firmware footprint is 600-800 KB, leaving headroom for OTA update staging in the second flash panel.
Рекомендуется
Building Automation Controller
For BACnet, KNX, or Modbus building-automation controllers, the ATSAME53N20A-AU-EFP delivers 120 MHz of Cortex-M4F processing, six SERCOM channels for UART/SPI/I2C field buses, and 256 KB SRAM to buffer telemetry streams. The 12-bit ADC handles analog sensor inputs for temperature and humidity sensing. The Extended Flash Performance profile ensures deterministic loop times when running PID control loops. Estimated: a typical BACnet/IP application with 500 points uses 350 KB flash and 80 KB RAM, well within the E53N's envelope.
Рекомендуется
USB-Connected HMI Panel
The ATSAME53N20A-AU-EFP's USB 2.0 Full-Speed host/device capability makes it ideal for USB-connected HMI panels that need to enumerate mass-storage devices, HID peripherals, or CDC serial devices. The 1 MB flash supports full-frame TFT control firmware with anti-aliased fonts, while 256 KB SRAM holds double-buffered display data. Estimated: an LVGL-based 480x272 UI consumes 200-300 KB flash and 80-120 KB SRAM depending on widget set. The dual-panel flash supports safe firmware updates over USB without bricking the panel.
Рекомендуется
Motor Control Front-End
While the E53 family lacks the dedicated high-resolution PWM peripherals of the E54P, the ATSAME53N20A-AU-EFP still serves as a motor-control front-end for low-cost FOC and trapezoidal drives. The Cortex-M4F FPU executes single-precision Clarke/Park transforms efficiently, and six SERCOMs handle encoder, Hall sensor, and command interfaces. The Ethernet MAC enables networked drive monitoring. Estimated: a sensorless FOC algorithm on a 4-pole PMSM runs at 16 kHz loop rate on the 120 MHz M4F, leaving ~50% CPU headroom for communication tasks.
Рекомендуется
IoT Edge Sensor Node
The ATSAME53N20A-AU-EFP integrates Ethernet, USB, and six SERCOMs - more connectivity than most Cortex-M4 IoT MCUs - making it a strong choice for IoT edge nodes that aggregate multiple sensor buses. The 12-bit ADC at 1 MSPS digitizes analog sensors, and the 256 KB SRAM buffers MQTT messages during network outages. The Cortex-M4F executes TLS handshakes 2-3x faster than Cortex-M3 cores. Estimated: a typical MQTT-SN client with TLS-PSK uses 150 KB flash and 40 KB RAM, leaving significant headroom.
Рекомендуется
Smart Energy / Sub-Metering
For sub-metering and energy-monitoring applications, the ATSAME53N20A-AU-EFP's Ethernet MAC enables direct connection to building management networks, while its 12-bit ADC accurately samples current and voltage from CT/PT sensors. The 1 MB flash stores calibration tables and run-time tariff logs; 256 KB SRAM buffers 24-hour interval data at 1-minute resolution. The Extended Flash Performance profile ensures deterministic FFT computation for harmonic analysis. Estimated: a 4-channel energy meter with FFT runs at 4 kHz sampling per channel with <30% CPU utilization.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для ATSAME53N20A-AU-EFP — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | ATSAME53N20A-AUT-EFP | ATSAME53N19A-AU-EFP | ATSAME53N20A-AU | ATSAME51N20A-AU-EFP | ATSAME53J20A-AUT-EFP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14) | TQFP-100 (14x14) | TQFP-100 (14x14) | TQFP-100 (14x14) | TQFP-64 (10x10) - DIFFERENT footprint, NOT pin-compatible | TQFP-64 (10x10) - DIFFERENT footprint, NOT pin-compatible |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash | 1 MB (Dual-Panel, ECC) | 1 MB (Dual-Panel, ECC) | 512 KB (-50%) | 1 MB (Dual-Panel, ECC) | 1 MB (Dual-Panel, ECC) | 1 MB (Dual-Panel, ECC) |
| SRAM | 256 KB (ECC) | 256 KB (ECC) | 192 KB (-25%) | 256 KB (ECC) | 256 KB (ECC) | 256 KB (ECC) |
| Ethernet MAC | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | Yes (10/100 + IEEE 1588) | No Ethernet - CAN-FD instead | No Ethernet on 64-pin variant |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Automotive Grade 1) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Automotive Grade 1) |
| EFP Flash Profile | Yes (zero-wait-state at 120 MHz) | Yes (zero-wait-state at 120 MHz) | Yes (zero-wait-state at 120 MHz) | No - standard flash profile | Yes (zero-wait-state at 120 MHz) | Yes (zero-wait-state at 120 MHz) |
| 1k-piece Distributor Price (USD) | 7.35 | 9.50 (automotive premium) | 6.20 (smaller flash discount) | 6.80 (no EFP) | 6.50 (smaller package) | 8.20 (smaller package, automotive) |
Ключевые отличия
- On-chip 10/100 Ethernet MAC with IEEE 1588 hardware timestamping (против ATSAME51N20A-AU-EFP)
- Dual-Panel Flash with ECC and Read-While-Write support (против ATSAME53J20A-AUT-EFP)
- Extended Flash Performance profile for zero-wait-state execution at 120 MHz (против ATSAME53N20A-AU)
Заметки по проектированию
Decouple VDDIO with a 100 nF X7R ceramic capacitor within 5 mm of every supply pin pair, plus a shared 4.7 uF X5R bulk capacitor. VDDCORE requires a 1 uF X7R ceramic directly on the pin; the internal LDO regulator is not designed to drive external loads. Estimated: total supply pin count is ~18 VDDIO + 1 VDDCORE on TQFP-100, so plan for 19 local 100 nF caps on the top layer. Failure to place these caps close to the pins can cause Ethernet PHY comms glitches at 100 Mbps due to supply droop during DMA bursts.
Route the Ethernet MII/RMII signals (GRX, GTX, GMDC, GMDIO, GCLK) as a matched-length group with 50 ohm characteristic impedance to the external PHY, keeping stubs under 3 mm. Place the 25 MHz Ethernet reference clock source within 10 mm of the PHY's XI pin and far from switching nodes. For USB, route DP and DM as a 90 ohm differential pair with length matching under 0.5 mm. Estimated: a 4-layer FR4 stackup with 0.2 mm dielectric between L1 and L2 is adequate for both Ethernet and USB signal integrity at full speed.
Do not leave the TST pin floating in production - tie it directly to GND through a 0 ohm resistor or trace, otherwise the MCU may enter a debug test mode on power-up and fail to boot. The NRST pin requires a 10 kohm pull-up to VDDIO and a 100 nF cap to GND for proper brownout reset behavior. The dual-panel flash bank-switching logic must be initialized in startup code; calling NVMCTRL callbacks before initialization will fault the CPU. Estimated: leaving TST floating causes ~1 in 5000 units to fail first-time programming during manufacturing.
At 120 MHz with all peripherals active, the ATSAME53N20A-AU-EFP dissipates approximately 200-300 mW. The TQFP-100 package has theta_JA around 40 C/W on a 4-layer JEDEC test PCB, so junction temperature rise is ~10-12 C above ambient - well within the 85 C industrial limit. Estimated: for continuous full-CPU operation in a sealed enclosure, add a copper pour on the top and bottom layers under the package and consider thermal vias to inner ground planes to keep Tj below 100 C.
Информация о соответствии
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified - use ATSAME53N20A-AUT-EFP for automotive. Conflict-mineral declaration available from Microchip.
