ATSAME54N19A-AU - 120MHz Cortex-M4F MCU, 512KB Flash | Microchip
N.º da peça: ATSAME54N19A-AU ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.85 | $78,50 |
| 100 | $6.93 | $693,00 |
| 500 | $6.1 | $3.050,00 |
| 1.000 | $5.42 | $5.420,00 |
ATSAME54N19A-AU Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals. The Cortex-M4F belongs to ARM's Cortex-M family of energy-efficient processors designed for embedded deterministic real-time control. Within the SAM E54 series, the ATSAME54N19A-AU sits in the Cortex-M4F -> Cortex-M -> 32-bit MCU -> embedded processor hierarchy, targeting industrial HMI, connectivity gateways, and audio processing applications.
Key features include the Cortex-M4F core with single-precision FPU and DSP extensions, a high-speed on-chip 12-bit 1 Msps ADC, USB 2.0 Full-Speed with on-chip PHY, a 100 MHz system bus, multiple SERCOM channels configurable as UART/SPI/I2C, an I2S interface for digital audio, a 16-bit HSMCI for SD card storage, and a Crypto Accelerator (TRNG, AES, SHA). The 100-TQFP package provides ample I/O for parallel TFT displays and external memory buses.
The SAM E54 architecture uses a multi-layer AHB bus matrix connecting the CPU, DMA controllers, and peripherals, allowing concurrent access with deterministic latency. The dual-panel Flash subsystem enables live firmware updates and EEPROM emulation, while the SRAM with ECC supports safety-critical applications where single-bit errors must be corrected automatically.
Typical applications include industrial HMI panels with TFT displays, smart energy metering, IoT edge nodes with USB connectivity, digital audio streaming devices using I2S, and automotive aftermarket infotainment controllers. Designers value the on-chip FPU for sensor-fusion algorithms and the integrated crypto block for secure boot implementations.
When designing with the ATSAME54N19A-AU, ensure 100 nF and 4.7 uF decoupling caps are placed near each VDD pin pair, and that the 12 MHz crystal or external clock meets the accuracy requirements specified in the SAM E54 datasheet. For USB applications, the DP/DM trace impedance must be tuned to 90 ohms differential.
Alternativas drop-in para ATSAME54N19A-AU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME54N19A-AU (mesmo formato e footprint) — diferindo em USB, ADC, Operating Temperature, SRAM, Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME54N19A-AF
✅ Drop-In✓ Em estoque
$5.49 / unidade
Ver ficha técnica →ATSAME54N20A-AU
✅ Drop-In✓ Em estoque
$8.75 / unidade
Ver ficha técnica →ATSAME54N19A-AUT
✅ Drop-In✓ Em estoque
$5.94 / unidade
Ver ficha técnica →ATSAME54P19A-AU
✅ Drop-In✓ Em estoque
$8.35 / unidade
Ver ficha técnica →ATSAME54P20A-AU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME51N19A-AU
✅ Drop-In✓ Em estoque
$4.98 / unidade
Ver ficha técnica →ATSAME54N19A-AU Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4F with FPU and DSP extensions |
| Frequência máxima de clock | 120 MHz |
| Program Memory (Flash) | 512 KB (dual-panel with ECC) |
| SRAM | 192 KB with ECC |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| Temperatura de operação | -40C to +85C (industrial) |
| Encapsulamento | 100-pin TQFP (14x14 mm) |
| Tipo de montagem | Surface Mount |
| ADC | 12-bit, up to 1 Msps, 16 channels |
| USB | USB 2.0 Full-Speed with on-chip PHY |
| SERCOM Channels | 8 (configurable as UART/SPI/I2C) |
| I2S Audio Interface | Yes |
| Crypto Accelerator | TRNG, AES-256, SHA-256, RSA |
| External Memory Bus | Yes (EBI, 16-bit) |
| Status RoHS | Compliant |
| Nível MSL | 3 |
Configuração de pinos do ATSAME54N19A-AU
| Pino 1 | PA03 — General I/O / ADC AIN[1] |
| Pino 2 | PA04 — General I/O / ADC AIN[2] |
| Pino 3 | PA05 — General I/O / ADC AIN[3] |
| Pino 4 | PA06 — General I/O / ADC AIN[4] |
| Pino 5 | PA07 — General I/O / ADC AIN[5] |
| Pino 6 | VDDIO — I/O supply voltage 1.62V-3.6V |
| Pino 7 | VDD — Core voltage regulator input |
| Pino 8 | GND — Ground |
| Pino 9 | PA08 — General I/O / NMI |
| Pino 10 | PA09 — General I/O |
| Pino 11 | PA10 — General I/O |
| Pino 12 | PA11 — General I/O |
| Pino 13 | PA12 — General I/O |
| Pino 14 | PA13 — General I/O |
| Pino 15 | PA14 — General I/O |
| Pino 16 | PA15 — General I/O |
| Pino 17 | PA16 — General I/O |
| Pino 18 | PA17 — General I/O |
| Pino 19 | PA18 — General I/O |
| Pino 20 | PA19 — General I/O |
| Pino 21 | PA20 — General I/O |
| Pino 22 | PA21 — General I/O |
| Pino 23 | PA22 — General I/O |
| Pino 24 | PA23 — General I/O |
| Pino 25 | PA24 — General I/O / USB DP |
| Pino 26 | PA25 — General I/O / USB DM |
| Pino 27 | GND — Ground |
| Pino 28 | VDDIO — I/O supply voltage |
| Pino 29 | PB00 — General I/O |
| Pino 30 | PB01 — General I/O |
| Pino 31 | PB02 — General I/O |
| Pino 32 | PB03 — General I/O |
| Pino 33 | PB04 — General I/O |
| Pino 34 | PB05 — General I/O |
| Pino 35 | PB06 — General I/O |
| Pino 36 | PB07 — General I/O |
| Pino 37 | PB08 — General I/O |
| Pino 38 | PB09 — General I/O |
| Pino 39 | PB10 — General I/O |
| Pino 40 | PB11 — General I/O |
| Pino 41 | PB12 — General I/O |
| Pino 42 | PB13 — General I/O |
| Pino 43 | PB14 — General I/O |
| Pino 44 | PB15 — General I/O |
| Pino 45 | PB16 — General I/O |
| Pino 46 | PB17 — General I/O |
| Pino 47 | PB18 — General I/O |
| Pino 48 | PB19 — General I/O |
| Pino 49 | PB20 — General I/O |
| Pino 50 | PB21 — General I/O |
| Pino 51 | PB22 — General I/O |
| Pino 52 | PB23 — General I/O |
| Pino 53 | PB24 — General I/O |
| Pino 54 | PB25 — General I/O |
| Pino 55 | VDDIO — I/O supply voltage |
| Pino 56 | GND — Ground |
| Pino 57 | PC00 — General I/O |
| Pino 58 | PC01 — General I/O |
| Pino 59 | PC02 — General I/O |
| Pino 60 | PC03 — General I/O |
| Pino 61 | PC04 — General I/O |
| Pino 62 | PC05 — General I/O |
| Pino 63 | PC06 — General I/O |
| Pino 64 | PC07 — General I/O |
| Pino 65 | PC08 — General I/O |
| Pino 66 | PC09 — General I/O |
| Pino 67 | PC10 — General I/O |
| Pino 68 | PC11 — General I/O |
| Pino 69 | PC12 — General I/O |
| Pino 70 | PC13 — General I/O |
| Pino 71 | PC14 — General I/O / XOSC1 |
| Pino 72 | PC15 — General I/O / XOSC2 |
| Pino 73 | PC16 — General I/O |
| Pino 74 | PC17 — General I/O |
| Pino 75 | PC18 — General I/O |
| Pino 76 | PC19 — General I/O |
| Pino 77 | PC20 — General I/O |
| Pino 78 | PC21 — General I/O |
| Pino 79 | PC22 — General I/O |
| Pino 80 | PC23 — General I/O |
| Pino 81 | PC24 — General I/O |
| Pino 82 | PC25 — General I/O |
| Pino 83 | PC26 — General I/O |
| Pino 84 | PC27 — General I/O |
| Pino 85 | PC28 — General I/O |
| Pino 86 | PC29 — General I/O |
| Pino 87 | PC30 — General I/O |
| Pino 88 | PC31 — General I/O |
| Pino 89 | PD00 — General I/O |
| Pino 90 | PD01 — General I/O |
| Pino 91 | PD02 — General I/O |
| Pino 92 | PD03 — General I/O |
| Pino 93 | PD04 — General I/O |
| Pino 94 | PD05 — General I/O |
| Pino 95 | PD06 — General I/O |
| Pino 96 | PD07 — General I/O |
| Pino 97 | PD08 — General I/O |
| Pino 98 | PD09 — General I/O |
| Pino 99 | GND — Ground |
| Pino 100 | VDDIO — I/O supply voltage |
Aplicações típicas
ATSAME54N19A-AU é adequado para 6 aplicaçãos: Industrial HMI Touch Panel, Smart Energy Meter with Crypto Security, USB Audio Streaming Device, IoT Edge Gateway with BLE Bridge, Digital Audio Mixer Console, Automotive Aftermarket Telematics.
Industrial HMI Touch Panel
The ATSAME54N19A-AU drives TFT LCD panels up to WVGA resolution through its external memory interface (EBI) while the 120 MHz Cortex-M4F with FPU runs LVGL/EmWin graphics libraries smoothly. The 16-channel 12-bit ADC handles resistive touch sensing with hardware averaging, and 84 GPIO pins provide ample I/O for keypad scanning and LED indicators. The integrated USB Full-Speed PHY enables firmware updates and HMI configuration via USB drive. Compared with Cortex-M0 designs, the FPU accelerates Bezier curve rendering and image scaling for more responsive industrial operator interfaces.
Recomendado
Smart Energy Meter with Crypto Security
The ATSAME54N19A-AU measures voltage and current via its 12-bit 1 Msps ADC for Class 1 energy metering accuracy, while the Cortex-M4F DSP extensions perform real-time FFT harmonic analysis. The hardware AES-256 and SHA-256 accelerators secure DLMS/COSEM communication over the SERCOM UART, and the TRNG generates keys for secure boot. The on-chip USB allows field technicians to download consumption logs without disassembly. Wide 1.62 V to 3.6 V supply tolerates battery-backed RTC operation during power outages.
Recomendado
USB Audio Streaming Device
The ATSAME54N19A-AU streams 24-bit 96 kHz audio through its I2S interface while presenting a USB Audio Class 1.0 device to the host. The integrated USB Full-Speed PHY and on-chip 48 MHz PLL eliminate the external oscillator and transceiver, reducing BOM cost in USB DAC and headphone amplifier designs. The Cortex-M4F FPU runs biquad filters and 3D spatial audio effects at low latency, while the dual-panel Flash allows live firmware updates over USB without audio dropout. Sufficient SRAM buffers multiple audio frames for jitter-free playback.
Recomendado
IoT Edge Gateway with BLE Bridge
The ATSAME54N19A-AU acts as an IoT edge node aggregating data from Bluetooth Low Energy sensors via an external module connected through SERCOM UART, then forwarding processed data to the cloud over USB or Ethernet. The hardware crypto block accelerates TLS handshakes, while 192 KB SRAM holds local MQTT buffers and OTA staging area. The eight SERCOM channels permit multiple sensor interfaces simultaneously without pin conflicts, supporting Modbus, SPI flash, and I2C sensors in parallel.
Recomendado
Digital Audio Mixer Console
The ATSAME54N19A-AU mixes multiple I2S audio streams from external codecs, applies DSP effects via the Cortex-M4F single-precision FPU, and outputs to a USB audio interface for DAW recording. The dual-panel Flash stores multiple effect presets with zero-downtime switching, while the 192 KB SRAM hosts 32-bit floating-point audio buffers. The on-chip 12-bit ADC reads potentiometer positions for hardware controls at sample rates above 1 kHz. This MCU replaces legacy DSP chips in compact 4-channel mixers.
Recomendado
Automotive Aftermarket Telematics
The ATSAME54N19A-AU powers OBD-II dongles and aftermarket telematics units, reading vehicle CAN bus data via an external transceiver interfaced through SERCOM. The crypto accelerator secures OTA firmware updates, while USB enables diagnostic log download to a laptop. The 100-TQFP package withstands automotive cabin temperatures when the -AF (extended) variant is selected; the -AU industrial variant suits non-critical fleet management. Wide 3.3 V supply tolerance handles 12 V battery transients with external regulation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME54N19A-AU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME54N19A-AF | ATSAME54N20A-AU | ATSAME54N19A-AUT | ATSAME54P19A-AU | ATSAME51N19A-AU |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TQFP (14x14) | 100-TQFP (14x14) - same | 100-TQFP (14x14) - same | 100-TQFP (14x14) - same | 100-TQFP (14x14) - same | 100-TQFP (14x14) - same |
| Core | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash | 512 KB | 512 KB | 1 MB (+100%) | 512 KB | 512 KB | 512 KB |
| SRAM | 192 KB | 192 KB | 256 KB (+33%) | 192 KB | 192 KB | 192 KB |
| Operating Temperature | -40C to +85C | -40C to +125C (extended) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| USB | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY | USB 2.0 FS with on-chip PHY |
| Crypto Accelerator | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG |
| I2S Audio | Yes | Yes | Yes | Yes | Yes | No (-20%) |
Principais diferenciais
- Integrated USB 2.0 Full-Speed PHY (vs ATSAME51N19A-AU)
- Dual-Panel Flash with ECC (vs ATSAME54N19A-AUT)
- 512 KB Flash at 120 MHz Cortex-M4F (vs ATSAME53N20A-AU)
Notas de projeto
Decoupling is critical for the ATSAME54N19A-AU given its 120 MHz operation. Place a 100 nF X7R ceramic capacitor and a 4.7 uF X5R bulk capacitor within 3 mm of each VDDIO/VDD pin pair on the 100-TQFP package. The internal 1.2 V core LDO requires a 1 uF capacitor on the VDDLC pin. Failure to provide adequate decoupling can cause Flash read errors at high clock frequencies and ADC measurement drift. Use multiple vias to a dedicated ground pour for return currents.
Do not confuse the ATSAME54N19A-AU (industrial -40C to +85C) with the ATSAME54N19A-AF (extended -40C to +125C) when sourcing for automotive or under-hood applications. Both share the same 100-TQFP footprint but the -AU grade will fail reliability tests above 85C. Also verify the SAM E54 datasheet revision for the specific GPN (General Purpose Nomenclature) suffix to ensure your firmware matches the exact memory layout and errata.
For USB applications, the DP (PA24) and DM (PA25) traces must be routed as a 90-ohm differential pair with matched lengths within 150 mil, with a continuous ground reference plane beneath. Place the 22-ohm series termination resistors within 4 mm of the MCU pins. The crystal oscillator traces (XIN/XOUT) should be kept short and surrounded by ground pour to minimize EMI pickup. Use a 4-layer PCB stackup with dedicated power and ground planes for best EMC performance.
The 100-TQFP package has a typical theta_JA of approximately 50 C/W, allowing the ATSAME54N19A-AU to operate up to 120 MHz without a heatsink at industrial temperatures. At sustained 120 MHz with all peripherals active, internal power dissipation is around 200 mW, producing a 10C temperature rise above ambient. For high-temperature environments above 70C ambient, consider adding thermal vias under the exposed pad and reducing clock speed to 80 MHz for headroom.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose ATSAME54N19A-AF (extended temp) or other -CF variants for automotive applications. Lead-free and halogen-free per Microchip material declaration.
