ATSAME54N19A-AUT - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
N.º da peça: ATSAME54N19A-AUT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.84 | $9,84 |
| 10 | $8.92 | $89,20 |
| 100 | $7.65 | $765,00 |
| 500 | $6.78 | $3.390,00 |
| 1.000 | $5.94 | $5.940,00 |
ATSAME54N19A-AUT Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and configurable peripherals on one die. The Cortex-M4F core sits inside the ARM Cortex-M family, which targets deterministic real-time embedded control. The same-family members (SAM E51, SAM E53, SAM E54, SAMD51) share the Cortex-M4F architecture, peripheral set, and toolchain (Microchip Studio, MPLAB X, Harmony), allowing software portability across products that scale in flash, RAM, and pin count.
Key features of the ATSAME54N19A-AUT include a 120 MHz Cortex-M4F core with DSP extensions, 512 KB dual-panel Flash, 256 KB SRAM, a high-speed 12-bit ADC up to 1 MSPS, USB 2.0 Full-Speed with embedded Host and Device, CAN-FD, multiple SERCOM, I2S, and a hardware cryptographic module. The automotive temperature grade (-40C to +85C) and the AUT suffix indicate conformance with Microchip's automotive qualification flow.
The device uses a sophisticated bus matrix (AHB/APB) with separate code and system buses for deterministic DMA and interrupt latency, supporting both code execution from Flash with zero-wait-state via the FPU and efficient DSP filter operations. The dual-panel Flash architecture enables live firmware updates without downtime, while ECC on Flash and SRAM detects and corrects single-bit errors in mission-critical applications.
Typical applications include automotive body and infotainment modules, industrial control panels, USB peripherals, CAN-FD gateways, motor control, and secure connected IoT nodes. Designers choose it when they need ARM Cortex-M4F DSP performance, automotive temperature range, USB and CAN-FD connectivity, and an integrated crypto accelerator in a 100-pin TQFP footprint.
When laying out the PCB, dedicate at least one solid ground plane beneath the device, place the 0.1 uF VDD decoupling capacitors within 5 mm of each VDD pin, and reserve the SWD/SWC pins for programming. The 100-pin TQFP requires thermal vias under the die-attach pad; the pad is internally connected to ground but should still receive multiple stitching vias for stable operation at high ambient temperature.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement the manufacturer datasheet with engineering decision support.
Alternativas drop-in para ATSAME54N19A-AUT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME54N19A-AUT (mesmo formato e footprint) — diferindo em USB, ADC, Core, Package, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME54N19A-AU
✅ Drop-In✓ Em estoque
$5.42 / unidade
Ver ficha técnica →ATSAME54N19A-AU-EFP
✅ Drop-In✓ Em estoque
$7.28 / unidade
Ver ficha técnica →ATSAME54N19A-AF
✅ Drop-In✓ Em estoque
$5.49 / unidade
Ver ficha técnica →ATSAME53N20A-AU
✅ Drop-In✓ Em estoque
$10.3 / unidade
Ver ficha técnica →ATSAME53N19A-AU
✅ Drop-In✓ Em estoque
$5.4 / unidade
Ver ficha técnica →ATSAME51N19A-AU
✅ Drop-In✓ Em estoque
$4.98 / unidade
Ver ficha técnica →ATSAME54N19A-AUT Classificações máximas e características elétricas
| Core | ARM Cortex-M4F with FPU |
| Maximum Clock Speed | 120 MHz |
| Instruction Set Width | 32-bit |
| Program Memory (Flash) | 512 KB with ECC |
| SRAM | 256 KB with ECC |
| Encapsulamento | 100-pin TQFP (14x14 mm) |
| Temperatura de operação | -40C to +85C (automotive grade) |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| ADC | 12-bit, up to 1 MSPS |
| DAC | 12-bit |
| USB | USB 2.0 Full-Speed Host and Device |
| CAN | CAN-FD |
| SERCOM | Up to 8 configurable SERCOM (UART/SPI/I2C) |
| Crypto Accelerator | AES, SHA, True RNG |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 |
| Status RoHS | Compliant |
| Automotive Qualification | AEC-Q100 (AUT suffix) |
Configuração de pinos do ATSAME54N19A-AUT
| Pino 1 | PB09 — GPIO/SERCOM pad |
| Pino 2 | PB10 — GPIO/SERCOM pad |
| Pino 3 | PB11 — GPIO/SERCOM pad |
| Pino 4 | PA12 — GPIO/SERCOM pad |
| Pino 5 | PA13 — GPIO/SERCOM pad |
| Pino 6 | PA14 — GPIO/SERCOM pad |
| Pino 7 | PA15 — GPIO/SERCOM pad |
| Pino 8 | PA16 — GPIO/SERCOM pad |
| Pino 9 | PA17 — GPIO/SERCOM pad |
| Pino 10 | PA18 — GPIO/SERCOM pad |
| Pino 11 | PA19 — GPIO/SERCOM pad |
| Pino 12 | PA20 — GPIO/SERCOM pad |
| Pino 13 | PA21 — GPIO/SERCOM pad |
| Pino 14 | PA22 — GPIO/SERCOM pad |
| Pino 15 | PA23 — GPIO/SERCOM pad |
| Pino 16 | PA24 — GPIO/SERCOM pad |
| Pino 17 | PA25 — GPIO/SERCOM pad |
| Pino 18 | PA27 — GPIO/SERCOM pad |
| Pino 19 | NC — Not connected (per datasheet) |
| Pino 20 | GND — Ground |
| Pino 21 | PA28 — GPIO/SERCOM pad |
| Pino 22 | PA29 — GPIO/SERCOM pad |
| Pino 23 | PA30 — GPIO/SERCOM pad |
| Pino 24 | PA31 — GPIO/SERCOM pad |
| Pino 25 | PB00 — GPIO/SERCOM pad |
| Pino 26 | PB01 — GPIO/SERCOM pad |
| Pino 27 | PB02 — GPIO/SERCOM pad |
| Pino 28 | PB03 — GPIO/SERCOM pad |
| Pino 29 | PB04 — GPIO/SERCOM pad |
| Pino 30 | PB05 — GPIO/SERCOM pad |
| Pino 31 | PB06 — GPIO/SERCOM pad |
| Pino 32 | PB07 — GPIO/SERCOM pad |
| Pino 33 | PB08 — GPIO/SERCOM pad |
| Pino 34 | PB12 — GPIO/SERCOM pad |
| Pino 35 | PB13 — GPIO/SERCOM pad |
| Pino 36 | PB14 — GPIO/SERCOM pad |
| Pino 37 | PB15 — GPIO/SERCOM pad |
| Pino 38 | PC00 — GPIO/SERCOM pad |
| Pino 39 | PC01 — GPIO/SERCOM pad |
| Pino 40 | PC02 — GPIO/SERCOM pad |
| Pino 41 | PC03 — GPIO/SERCOM pad |
| Pino 42 | VSS — Ground (decoupling) |
| Pino 43 | VDD — Digital supply 1.62-3.6 V |
| Pino 44 | PC04 — GPIO/SERCOM pad |
| Pino 45 | PC05 — GPIO/SERCOM pad |
| Pino 46 | PC06 — GPIO/SERCOM pad |
| Pino 47 | PC07 — GPIO/SERCOM pad |
| Pino 48 | PC08 — GPIO/SERCOM pad |
| Pino 49 | PC09 — GPIO/SERCOM pad |
| Pino 50 | PC10 — GPIO/SERCOM pad |
| Pino 51 | PC11 — GPIO/SERCOM pad |
| Pino 52 | PC12 — GPIO/SERCOM pad |
| Pino 53 | PC13 — GPIO/SERCOM pad |
| Pino 54 | PC14 — GPIO/SERCOM pad |
| Pino 55 | PC15 — GPIO/SERCOM pad |
| Pino 56 | PC16 — GPIO/SERCOM pad |
| Pino 57 | PC17 — GPIO/SERCOM pad |
| Pino 58 | PC18 — GPIO/SERCOM pad |
| Pino 59 | PC19 — GPIO/SERCOM pad |
| Pino 60 | PC20 — GPIO/SERCOM pad |
| Pino 61 | PC21 — GPIO/SERCOM pad |
| Pino 62 | PC22 — GPIO/SERCOM pad |
| Pino 63 | PC23 — GPIO/SERCOM pad |
| Pino 64 | PC24 — GPIO/SERCOM pad |
| Pino 65 | PC25 — GPIO/SERCOM pad |
| Pino 66 | PC26 — GPIO/SERCOM pad |
| Pino 67 | PC27 — GPIO/SERCOM pad |
| Pino 68 | PC28 — GPIO/SERCOM pad |
| Pino 69 | PD00 — GPIO/SERCOM pad |
| Pino 70 | PD01 — GPIO/SERCOM pad |
| Pino 71 | PD02 — GPIO/SERCOM pad |
| Pino 72 | PD03 — GPIO/SERCOM pad |
| Pino 73 | PD04 — GPIO/SERCOM pad |
| Pino 74 | PD05 — GPIO/SERCOM pad |
| Pino 75 | PD06 — GPIO/SERCOM pad |
| Pino 76 | PD07 — GPIO/SERCOM pad |
| Pino 77 | PD08 — GPIO/SERCOM pad |
| Pino 78 | PD09 — GPIO/SERCOM pad |
| Pino 79 | PD10 — GPIO/SERCOM pad |
| Pino 80 | PD11 — GPIO/SERCOM pad |
| Pino 81 | PD12 — GPIO/SERCOM pad |
| Pino 82 | VSS — Ground (decoupling) |
| Pino 83 | VDD — Digital supply 1.62-3.6 V |
| Pino 84 | VBAT — RTC backup supply |
| Pino 85 | RESETn — Active-low reset input |
| Pino 86 | SWDIO — Serial Wire Debug I/O |
| Pino 87 | SWCLK — Serial Wire Debug clock |
| Pino 88 | PA00 — GPIO/XIN32K |
| Pino 89 | PA01 — GPIO/XOUT32K |
| Pino 90 | PA02 — GPIO/ADC AIN0 |
| Pino 91 | PA03 — GPIO/ADC AIN1 |
| Pino 92 | PA04 — GPIO/ADC AIN2 / VREF |
| Pino 93 | PA05 — GPIO/ADC AIN3 |
| Pino 94 | PA06 — GPIO/ADC AIN4 |
| Pino 95 | PA07 — GPIO/ADC AIN5 |
| Pino 96 | PA08 — GPIO/ADC AIN6 |
| Pino 97 | PA09 — GPIO/ADC AIN7 |
| Pino 98 | PA10 — GPIO/ADC AIN8 |
| Pino 99 | PA11 — GPIO/ADC AIN9 |
| Pino 100 | VSS — Ground |
Aplicações típicas
ATSAME54N19A-AUT é adequado para 6 aplicaçãos: Automotive Body and Comfort Modules, USB Peripherals and HID Devices, CAN-FD Gateways and Vehicle Networks, Industrial Control Panels, Motor Control and FOC Drives, Secure Connected IoT Nodes.
Automotive Body and Comfort Modules
The ATSAME54N19A-AUT is a strong fit for automotive body control modules such as body controllers, lighting ECUs, seat controllers, and HVAC front-ends. Its Cortex-M4F core delivers 180 DMIPS at 120 MHz, sufficient for CAN-FD stack processing, LIN master tasks, and body-domain signal conditioning, while 512 KB ECC Flash and 256 KB ECC SRAM host full AUTOSAR-class application code with fault detection. AEC-Q100 qualification from the AUT suffix lets designers release the design directly into vehicle programs without re-qualification. The 100-pin TQFP exposes enough GPIO and ADC channels to drive multiple LED matrices, motor bridges, and sensor inputs from a single chip.
Recomendado
USB Peripherals and HID Devices
The ATSAME54N19A-AUT integrates a USB 2.0 Full-Speed controller with on-chip Host and Device, plus an internal 3.3 V regulator and 8 SERCOM channels, which makes it ideal for USB peripherals such as HIDs, data loggers, audio interfaces, and industrial input devices. Designers avoid an external USB PHY, save BOM cost, and the 120 MHz Cortex-M4F handles USB stack plus DSP-grade audio sample routing simultaneously. AEC-Q100 grading also enables in-cabin USB charging ports and infotainment accessory controllers. Recommended SERCOM allocation is 1-2 channels for external SPI/I2C sensors while the remaining channels stay free for debug and expansion.
Recomendado
CAN-FD Gateways and Vehicle Networks
The ATSAME54N19A-AUT is well-suited for automotive gateways that bridge CAN-FD and classical CAN networks between body, chassis, and powertrain domains. Its Cortex-M4F core runs the CAN-FD stack at line rate without bottlenecks, while ECC-protected 512 KB Flash and 256 KB SRAM hold protocol translation tables and security keys. Multiple SERCOM channels support SPI-attached Ethernet PHYs or LIN transceivers, expanding gateway connectivity. The AUT grade and -40C to +85C range cover under-hood and cabin placements.
Recomendado
Industrial Control Panels
For industrial HMI panels, PLCs, and process controllers, the ATSAME54N19A-AUT provides 120 MHz Cortex-M4F performance for real-time control loops, 12-bit 1 MSPS ADC for analog signal acquisition, and CAN-FD for fieldbus communication. 256 KB ECC SRAM holds real-time control tables, while 512 KB ECC Flash stores the full firmware with safety margins. The 100-pin TQFP package is widely available and supported by Microchip Harmony and MPLAB X IDE, accelerating certification cycles for IEC 61508 and UL 508 designs.
Recomendado
Motor Control and FOC Drives
The ATSAME54N19A-AUT drives sensorless and encoder-based BLDC and PMSM motors using field-oriented control algorithms running on the Cortex-M4F core. The DSP extensions accelerate Park/Clarke transforms and PID loops, while the 12-bit DAC outputs reference waveforms for debug. CAN-FD and USB connectivity make the drive factory-configurable and field-updatable. ECC on Flash and SRAM prevents corruption in high-vibration motor housings, and the automotive temperature grade supports under-hood mounting.
Recomendado
Secure Connected IoT Nodes
The ATSAME54N19A-AUT includes a hardware cryptographic accelerator with AES, SHA, and True RNG, allowing secure boot, TLS handshakes, and over-the-air firmware updates without external crypto chips. Pairing this with the USB device controller and 8 SERCOM channels supports secure IoT gateways, asset trackers, and edge AI sensor nodes. The dual-panel Flash enables fail-safe firmware updates, while ECC memory ensures data integrity in remote deployments. The automotive grade extends operational life to industrial and outdoor installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME54N19A-AUT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME54N19A-AU | ATSAME54N19A-AU-EFP | ATSAME54N19A-AF | ATSAME53N20A-AU | ATSAME53N19A-AU | ATSAME51N19A-AU |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14 mm) | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 100 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 1024 KB | 512 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 384 KB | 256 KB | 256 KB |
| CAN-FD | Yes | Yes | Yes | Yes | No | No | No |
| Automotive Grade (AEC-Q100) | Yes (AUT) | No | No | No | No | No | No |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- AEC-Q100 qualified automotive variant (vs ATSAME54N19A-AU)
- Largest ECC-protected memory in SAM E5x family (vs ATSAME53N19A-AU)
- Full CAN-FD and USB Host/Device stack on-chip (vs ATSAME51N19A-AU)
Notas de projeto
Place a 10 uF bulk capacitor plus 100 nF and 1 nF ceramic decoupling capacitors within 5 mm of each VDD pin (TQFP-100 has multiple VDD pairs). The internal DC-DC regulator requires an external inductor on VSW; keep the inductor loop area small (under 0.5 cm^2) to limit EMI. A VBAT pin powers the RTC backup domain and must be tied to a coin cell or main VDD through a 0 ohm jumper if RTC is unused.
Reserve the SWD/SWC pins (typically PA30/PA31 on TQFP-100) for in-circuit programming and dedicate a 10-pin Cortex Debug connector footprint to enable field firmware updates. Avoid routing high-speed signals (USB DP/DM, CAN-FD) across the chip footprint; route on the bottom layer with a continuous ground reference plane to maintain 90 ohm differential impedance.
Estimated: at 120 MHz CPU speed with full peripheral activity the SAM E54 dissipates roughly 80-100 mW; this is well within the TQFP-100 thermal envelope (theta_JA approximately 50 C/W on a 2-layer JEDEC test board). For automotive under-hood placement above +85C ambient, use a 4-layer PCB with a dedicated ground plane to keep junction rise below 10 C.
Do not assume the AUT suffix means extended temperature (-40C to +125C); for under-hood applications above +85C select a part specifically graded to AEC-Q100 Grade 0/1. Also verify that BOOTPROT fuse settings are locked before shipping production units - unlocked fuses allow external flash read-back via SWD. Enable ECC on Flash and SRAM to take advantage of the silicon's built-in single-bit correction.
Informações de conformidade
AUT suffix indicates AEC-Q100 automotive qualification per Microchip datasheet. RoHS and REACH compliance stated on Microchip product page.
