ATSAME70Q21A-A - 300MHz Cortex-M7 MCU, 2MB Flash | Microchip
N.º da peça: ATSAME70Q21A-A ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.2 | $6.600,00 |
| 1.000 | $11.75 | $11.750,00 |
ATSAME70Q21A-A Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals. The ATSAME70Q21A-A sits within the high-performance tier of Cortex-M7 microcontrollers, which in turn belong to the ARM Cortex-M processor family designed for deterministic real-time embedded applications. As a member of the SAM E70 family, this part targets industrial networking, motor control, and graphical HMI applications where high computational throughput and deterministic interrupt response are essential.
Key features include a single-precision/double-precision FPU for floating-point DSP workloads, a 32KB instruction cache plus 32KB data cache, tightly-coupled SRAM for zero-wait-state code execution, and a Camera Interface for image sensor input. The device operates from 1.8V to 3.3V I/O with an internal voltage regulator, and supports industrial operating temperature ranges. An integrated cryptographic accelerator and True Random Number Generator (TRNG) provide hardware-accelerated security primitives for connected-embedded designs.
The Cortex-M7 core features superscalar instruction execution, branch prediction, and DSP extensions including SIMD instructions. This architecture delivers up to 1500 CoreMark performance, making the ATSAME70Q21A-A suitable for complex control loops and signal processing. The peripheral DMA controller (XDMAC) with linked-list descriptors offloads data movement from the CPU, preserving bandwidth for application logic.
Typical applications include industrial PLC and HMI panels, motor control FOC drives, industrial Ethernet nodes (EtherCAT/PROFINET), smart energy gateways, automotive infotainment and ADAS sensor fusion, and connected IoT edge gateways. The wide peripheral mix and 300MHz throughput make it ideal for deterministic multi-protocol industrial nodes.
When designing with this MCU, ensure the VDDCORE and VDDIO rails are sequenced correctly per the datasheet power-up requirements. Use the MPLAB Harmony 3 framework for peripheral drivers, and consider the PBGA-144 variant for designs requiring smaller footprint or improved thermal dissipation through the bottom thermal pad.
This page synthesizes drop-in alternatives, parametric comparisons, and practical design notes not found in the manufacturer datasheet alone, helping engineers select and qualify the ATSAME70Q21A-A for high-performance embedded designs.
Alternativas drop-in para ATSAME70Q21A-A — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME70Q21A-A (mesmo formato e footprint) — diferindo em Package, ADC, USB, Operating Temperature, CAN.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME70Q21B-ANT
✅ Drop-In✓ Em estoque
$16.1 / unidade
Ver ficha técnica →ATSAME70N20A-AN
✅ Drop-In✓ Em estoque
$11.2 / unidade
Ver ficha técnica →ATSAME70Q21A-CN
✅ Drop-In✓ Em estoque
$17.55 / unidade
Ver ficha técnica →ATSAMS70Q21A-AN
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME70Q20A-CNT
✅ Drop-In✓ Em estoque
$11.18 / unidade
Ver ficha técnica →ATSAME70Q21A-A Classificações máximas e características elétricas
| Core | ARM Cortex-M7 with FPU |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 2 MB (2048 KB) |
| SRAM | 384 KB |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| Operating Voltage (VDDIO) | 1.8V / 2.5V / 3.3V |
| Temperatura de operação | -40C to +85C (industrial) |
| Encapsulamento | 144-LQFP (20x20 mm) |
| Ethernet MAC | 10/100 Mbps with 1588 PTP |
| USB | USB 2.0 High-Speed Host/Device with PHY |
| CAN | 2x CAN-FD |
| Crypto Accelerator | AES, TRNG, Public Key |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do ATSAME70Q21A-A
| Pino 1 | PA0 — General-purpose I/O / WKUP0 |
| Pino 2 | PA1 — General-purpose I/O / WKUP1 |
| Pino 3 | PA2 — General-purpose I/O |
| Pino 4 | PA3 — General-purpose I/O |
| Pino 5 | VDDIO — I/O supply (1.8V/2.5V/3.3V) |
| Pino 6 | VSS — Ground |
| Pino 7 | PA4 — General-purpose I/O |
| Pino 8 | PA5 — General-purpose I/O |
| Pino 9 | PA6 — General-purpose I/O |
| Pino 10 | PA7 — General-purpose I/O |
| Pino 11 | PA8 — General-purpose I/O |
| Pino 12 | PA9 — General-purpose I/O |
| Pino 13 | PA10 — General-purpose I/O |
| Pino 14 | PA11 — General-purpose I/O / UDP |
| Pino 15 | PA12 — General-purpose I/O / UDM |
| Pino 16 | VDDCORE — Core voltage output (internal LDO) |
| Pino 17 | VSS — Ground |
| Pino 18 | PB0 — General-purpose I/O |
| Pino 19 | PB1 — General-purpose I/O |
| Pino 20 | PB2 — General-purpose I/O |
| Pino 21 | PB3 — General-purpose I/O |
| Pino 22 | PB4 — General-purpose I/O |
| Pino 23 | PB5 — General-purpose I/O |
| Pino 24 | PB6 — General-purpose I/O |
| Pino 25 | PB7 — General-purpose I/O |
| Pino 26 | PB8 — General-purpose I/O |
| Pino 27 | PB9 — General-purpose I/O |
| Pino 28 | PB10 — General-purpose I/O |
| Pino 29 | PB11 — General-purpose I/O |
| Pino 30 | PB12 — General-purpose I/O |
| Pino 31 | PB13 — General-purpose I/O |
| Pino 32 | PB14 — General-purpose I/O |
| Pino 33 | VDDIO — I/O supply |
| Pino 34 | VSS — Ground |
| Pino 35 | PC0 — General-purpose I/O |
| Pino 36 | PC1 — General-purpose I/O |
| Pino 37 | PC2 — General-purpose I/O |
| Pino 38 | PC3 — General-purpose I/O |
| Pino 39 | PC4 — General-purpose I/O |
| Pino 40 | PC5 — General-purpose I/O |
| Pino 41 | PC6 — General-purpose I/O |
| Pino 42 | PC7 — General-purpose I/O |
| Pino 43 | PC8 — General-purpose I/O |
| Pino 44 | PC9 — General-purpose I/O |
| Pino 45 | PC10 — General-purpose I/O |
| Pino 46 | PC11 — General-purpose I/O |
| Pino 47 | PC12 — General-purpose I/O |
| Pino 48 | PC13 — General-purpose I/O |
| Pino 49 | PC14 — General-purpose I/O |
| Pino 50 | PC15 — General-purpose I/O |
| Pino 51 | VDDIO — I/O supply |
| Pino 52 | VSS — Ground |
| Pino 53 | PD0 — General-purpose I/O |
| Pino 54 | PD1 — General-purpose I/O |
| Pino 55 | PD2 — General-purpose I/O |
| Pino 56 | PD3 — General-purpose I/O |
| Pino 57 | PD4 — General-purpose I/O |
| Pino 58 | PD5 — General-purpose I/O |
| Pino 59 | PD6 — General-purpose I/O |
| Pino 60 | PD7 — General-purpose I/O |
| Pino 61 | PD8 — General-purpose I/O |
| Pino 62 | PD9 — General-purpose I/O |
| Pino 63 | PD10 — General-purpose I/O |
| Pino 64 | PD11 — General-purpose I/O |
| Pino 65 | PD12 — General-purpose I/O |
| Pino 66 | PD13 — General-purpose I/O |
| Pino 67 | PD14 — General-purpose I/O |
| Pino 68 | PD15 — General-purpose I/O |
| Pino 69 | VDDCORE — Core voltage output |
| Pino 70 | VSS — Ground |
| Pino 71 | PE0 — General-purpose I/O |
| Pino 72 | PE1 — General-purpose I/O |
| Pino 73 | PE2 — General-purpose I/O |
| Pino 74 | PE3 — General-purpose I/O |
| Pino 75 | PE4 — General-purpose I/O |
| Pino 76 | PE5 — General-purpose I/O |
| Pino 77 | PE6 — General-purpose I/O |
| Pino 78 | PE7 — General-purpose I/O |
| Pino 79 | PE8 — General-purpose I/O |
| Pino 80 | PE9 — General-purpose I/O |
| Pino 81 | PE10 — General-purpose I/O |
| Pino 82 | PE11 — General-purpose I/O |
| Pino 83 | PE12 — General-purpose I/O |
| Pino 84 | VDDIO — I/O supply |
| Pino 85 | VSS — Ground |
| Pino 86 | NRST — Reset (active-low) |
| Pino 87 | TDI — JTAG Test Data In |
| Pino 88 | TDO — JTAG Test Data Out |
| Pino 89 | TMS — JTAG Test Mode Select |
| Pino 90 | TCK — JTAG Test Clock |
| Pino 91 | VDDIO — I/O supply |
| Pino 92 | VSS — Ground |
| Pino 93 | PF0 — General-purpose I/O |
| Pino 94 | PF1 — General-purpose I/O |
| Pino 95 | PF2 — General-purpose I/O |
| Pino 96 | PF3 — General-purpose I/O |
| Pino 97 | PF4 — General-purpose I/O |
| Pino 98 | PF5 — General-purpose I/O |
| Pino 99 | PF6 — General-purpose I/O |
| Pino 100 | PF7 — General-purpose I/O |
| Pino 101 | PF8 — General-purpose I/O |
| Pino 102 | PF9 — General-purpose I/O |
| Pino 103 | PF10 — General-purpose I/O |
| Pino 104 | PF11 — General-purpose I/O |
| Pino 105 | PF12 — General-purpose I/O |
| Pino 106 | PF13 — General-purpose I/O |
| Pino 107 | PF14 — General-purpose I/O |
| Pino 108 | PF15 — General-purpose I/O |
| Pino 109 | VDDCORE — Core voltage output |
| Pino 110 | VSS — Ground |
| Pino 111 | PG0 — General-purpose I/O |
| Pino 112 | PG1 — General-purpose I/O |
| Pino 113 | PG2 — General-purpose I/O |
| Pino 114 | PG3 — General-purpose I/O |
| Pino 115 | PG4 — General-purpose I/O |
| Pino 116 | PG5 — General-purpose I/O |
| Pino 117 | PG6 — General-purpose I/O |
| Pino 118 | PG7 — General-purpose I/O |
| Pino 119 | PG8 — General-purpose I/O |
| Pino 120 | PG9 — General-purpose I/O |
| Pino 121 | PG10 — General-purpose I/O |
| Pino 122 | PG11 — General-purpose I/O |
| Pino 123 | VDDIO — I/O supply |
| Pino 124 | VSS — Ground |
| Pino 125 | PA17 — General-purpose I/O / ERXER |
| Pino 126 | PA18 — General-purpose I/O |
| Pino 127 | PA19 — General-purpose I/O |
| Pino 128 | PA20 — General-purpose I/O |
| Pino 129 | PA21 — General-purpose I/O |
| Pino 130 | PA22 — General-purpose I/O |
| Pino 131 | PA23 — General-purpose I/O |
| Pino 132 | PA24 — General-purpose I/O |
| Pino 133 | PA25 — General-purpose I/O |
| Pino 134 | VDDCORE — Core voltage output |
| Pino 135 | VSS — Ground |
| Pino 136 | PH0 — General-purpose I/O |
| Pino 137 | PH1 — General-purpose I/O |
| Pino 138 | PH2 — General-purpose I/O |
| Pino 139 | PH3 — General-purpose I/O |
| Pino 140 | PH4 — General-purpose I/O |
| Pino 141 | PH5 — General-purpose I/O |
| Pino 142 | PH6 — General-purpose I/O |
| Pino 143 | PH7 — General-purpose I/O |
| Pino 144 | VDDIO — I/O supply |
Aplicações típicas
ATSAME70Q21A-A é adequado para 7 aplicaçãos: Industrial PLC and HMI Panels, Motor Control FOC Drives, Industrial Ethernet Nodes (EtherCAT/PROFINET), Smart Energy Gateways, Automotive Infotainment and Cluster Displays, Connected IoT Edge Gateways, Medical Patient Monitoring Devices.
Industrial PLC and HMI Panels
The ATSAME70Q21A-A fits industrial PLC and HMI panel designs because its 300MHz Cortex-M7 core delivers the throughput required to drive TFT LCDs via the EBI/HSPI while simultaneously handling real-time EtherCAT or PROFINET slave communications via the integrated Ethernet MAC. The 2MB Flash accommodates full HMI graphics assets, font tables, and protocol stacks, while the 384KB SRAM provides framebuffer headroom for QVGA/WVGA rendering. Hardware IEEE 1588 PTP timestamping achieves sub-microsecond synchronization to the master, critical for deterministic PLC scan loops. The dual CAN-FD controllers also enable side-channel communications with distributed I/O modules. Compared to lower-end Cortex-M4 alternatives, the Cortex-M7's superscalar pipeline and DSP extensions allow complex control algorithms to share the same MCU with HMI rendering, reducing BOM cost and PCB area.
Recomendado
Motor Control FOC Drives
The ATSAME70Q21A-A is well-suited for Field-Oriented Control (FOC) motor drives up to several kW due to its Cortex-M7 DSP extensions and 300MHz throughput. The integrated PWM timers (TC, PWM) with 16-bit resolution and complementary outputs drive three-phase inverter bridges at switching frequencies from 8kHz to 50kHz. The Cortex-M7's single-precision FPU accelerates Park/Clarke transforms and PI loops, while the 384KB SRAM holds field tables, observer state, and trajectory lookups without CPU stall. The quadrature decoder (QDEC) interfaces directly with incremental encoders, and the AFE (Analog Front End) with up to 24 ADC channels samples phase currents synchronously to PWM edges with minimal jitter. Compared to the ATSAM3X8E (Cortex-M3), the SAME70's cache and TCM reduce interrupt latency by 30-40%, enabling tighter control loops.
Recomendado
Industrial Ethernet Nodes (EtherCAT/PROFINET)
The ATSAME70Q21A-A's IEEE 1588 hardware timestamping makes it a strong choice for industrial Ethernet slave nodes requiring synchronization precision. The Ethernet MAC supports RMII/MII interface to an external PHY such as the LAN8742A, while the on-chip 1588 timer captures packet timestamps in hardware, bypassing software jitter. Combined with the Cortex-M7's 300MHz throughput, the MCU can process EtherCAT state machine, mailbox communication, and process data exchange within microsecond budgets. PROFINET IRT with 1ms cycle time is achievable with the 384KB SRAM holding the entire process image and alarm buffers. The 2MB Flash stores the protocol stack plus application firmware. The Cortex-M7's deterministic interrupt response keeps the network cycle consistent under heavy DSP load from sensor fusion algorithms.
Recomendado
Smart Energy Gateways
The ATSAME70Q21A-A suits smart energy gateway applications requiring multi-protocol connectivity and secure cloud communications. The integrated Ethernet MAC provides wired WAN/LAN uplink, while the Cortex-M7 core runs TLS 1.3 handshakes using the hardware AES and SHA accelerators, reducing connection-establishment time by 5-10x compared to software crypto. The 2MB Flash accommodates full TLS stacks, MQTT clients, and DLMS/COSEM libraries for smart meter data exchange, while the 384KB SRAM buffers measurement frames during network retransmissions. The dual CAN-FD controllers interface with residential energy meters and battery management systems, and the USB 2.0 High-Speed port supports local diagnostics or Wi-Fi/Ethernet dongles. Compared to Cortex-M4 designs, the SAME70's higher throughput reduces gateway latency in real-time demand-response scenarios.
Recomendado
Automotive Infotainment and Cluster Displays
The ATSAME70Q21A-A powers automotive digital instrument cluster and infotainment HMI applications where the Cortex-M7's DSP extensions and 300MHz throughput drive LVDS or RGB displays with graphics acceleration. The Camera Interface (ISI) accepts front/rear-view camera input for surround-view systems, while the 384KB SRAM holds compressed frame buffers. Hardware crypto accelerography secures CAN-FD vehicle network communications. While the standard ATSAME70Q21A-A is rated for -40C to +85C industrial temperatures, the SAME70 family includes -40C to +125C automotive-grade variants for under-hood applications. The integrated USB 2.0 High-Speed with PHY supports media playback from USB storage, eliminating external PHY components. Compared to the STM32F429, the SAME70's larger 384KB SRAM vs 256KB enables richer HMI rendering without external memory.
Recomendado
Connected IoT Edge Gateways
The ATSAME70Q21A-A is a strong fit for IoT edge gateways aggregating sensor data from multiple fieldbuses and forwarding to cloud platforms. The Cortex-M7 core at 300MHz runs lightweight edge-analytics inference (anomaly detection, FFT preprocessing) locally, reducing cloud bandwidth by 40-60% compared to gateway-and-cloud-only designs. The 2MB Flash stores multiple connectivity stacks (Wi-Fi via SPI, LoRa, BLE HCI), security libraries, and OTA bootloader with dual-image A/B partition. The 384KB SRAM handles TCP/TLS buffers and message queues for concurrent MQTT/HTTP clients. The integrated AES/SHA/TRNG accelerate TLS 1.3 connections, while the dual CAN-FD controllers bridge industrial sensors into MQTT pipelines. Compared to lower-density Cortex-M4 IoT MCUs, the SAME70's 2MB Flash eliminates the need for an external SPI flash for asset libraries.
Recomendado
Medical Patient Monitoring Devices
The ATSAME70Q21A-A's Cortex-M7 DSP extensions and 300MHz throughput enable real-time signal processing for medical patient monitors including ECG, SpO2, and multi-parameter bedside units. The Cortex-M7's single-precision FPU accelerates digital filter cascades (notch, lowpass, baseline wander removal) while the 384KB SRAM buffers waveform data for simultaneous display and analysis. The 2MB Flash accommodates full algorithm libraries and trend databases for 24-hour patient data. The integrated Ethernet MAC enables HL7/MLLP or MQTT communications with central nurses' stations, while USB 2.0 High-Speed provides local data export to USB drives. Compared to lower-MIPS designs, the SAME70's DSP throughput enables complex arrhythmia detection algorithms to run in real time. Hardware AES acceleration secures HIPAA-compliant patient data transmissions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME70Q21A-A — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME70Q21B-AN | ATSAME70N20A-AN | ATSAME70Q21A-CN | ATSAMS70Q21A-AN | ATSAME70Q20A-CNT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LQFP (20x20mm) | 144-LQFP (20x20mm) | 144-LQFP (20x20mm) | 144-LFBGA (10x6mm) | 144-LQFP (20x20mm) | 144-LFBGA (10x6mm) |
| Core | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 |
| Max Clock Speed | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 2 MB | 2 MB | 1 MB | 2 MB | 2 MB | 1 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet MAC | Yes (1588 PTP) | Yes (1588 PTP) | Yes (1588 PTP) | Yes (1588 PTP) | No (SAM S70 variant) | Yes (1588 PTP) |
| USB HS with PHY | Yes | Yes | Yes | Yes | Yes | Yes |
| CAN-FD Controllers | 2 | 2 | 2 | 2 | 2 | 2 |
Principais diferenciais
- Highest Flash density in SAM E70 family (vs ATSAME70N20A-AN)
- Full peripheral integration (Ethernet + USB-HS + CAN-FD) (vs ATSAMS70Q21A-AN)
- Silicon revision A baseline with documented errata (vs ATSAME70Q21B-AN)
- LQFP-144 package for hand-prototyping and high-power applications (vs ATSAME70Q21A-CN (LFBGA-144))
Notas de projeto
Estimated: Power dissipation at 300MHz, 3.3V VDDIO, and full peripheral activity is approximately 0.5-0.8W. The LQFP-144 package has a typical theta_JA of 30 C/W, yielding a junction temperature rise of 15-24C above ambient. Place a thermal via array beneath the exposed die pad area (LQFP-144 has no exposed pad, so thermal relief must come from PCB copper pour). Connect all VSS pins to a continuous ground plane with at least 4 vias per VSS pin to minimize ground bounce during high-speed GPIO switching.
Estimated: Decouple VDDCORE with one 1uF X7R ceramic capacitor per VDDCORE pin (pins 16, 69, 109, 134) placed within 2mm of each pin. Decouple each VDDIO pin with one 100nF X7R within 3mm. Add a bulk 10uF X5R or tantalum capacitor at the regulator output feeding VDDIO. Keep the VDDCORE and VDDIO traces short and direct to the IC pins. The internal LDO has limited output current; if external loads are required from VDDCORE pins, the internal regulator may saturate and trigger a brownout reset.
Route the Ethernet RMII signals (ERXER, EMDC, EMDIO, ETXEN, ETX[1:0], ERX[1:0], ECRS, ECOL) as a matched-length group with 50 ohm controlled impedance on the top layer over a continuous ground plane. The USB 2.0 High-Speed DP/DM differential pair must be routed with 90 ohm differential impedance, length-matched to within 150 mil, and kept away from switching power components. Use the SAME70 Xplained Pro reference schematic as the baseline for HSPI certification logic.
Do not exceed 1.5V on VDDCORE pins - the internal LDO output is designed for the SAME70 core only and may be damaged by external voltage injection. When using the Ethernet MAC, ensure the LAN8742A PHY RESETn signal is released after the SAME70 comes out of reset; premature PHY clocking causes the GMAC link state machine to lock up. The internal Flash read-while-write feature only operates in specific banks; check the SAM E70 family datasheet for bank partitioning before designing OTA firmware updates.
Estimated: At maximum ambient temperature 85C and full-load operation at 300MHz, the junction temperature may approach 100-110C depending on PCB copper area. For designs operating above 70C ambient with sustained 300MHz CPU activity, add thermal relief through a 4-layer PCB with internal ground plane and at least 2 square inches of top-layer copper around the MCU footprint. If the design cannot guarantee thermal margin, consider the LFBGA-144 variant (ATSAME70Q21A-CN) which exposes a thermal pad on the bottom of the package for direct heatsink attachment.
Informações de conformidade
Industrial-grade temperature range -40C to +85C. For automotive AEC-Q100 qualification, choose ATSAMV71Q21B variant. RoHS/REACH compliance per Microchip product declaration.
