ATSAME70Q21A-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
N.º da peça: ATSAME70Q21A-CN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $27.02 | $27,02 |
| 10 | $24.32 | $243,20 |
| 100 | $21.62 | $2.162,00 |
| 500 | $19.5 | $9.750,00 |
| 1.000 | $17.55 | $17.550,00 |
ATSAME70Q21A-CN Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and programmable peripherals. The Cortex-M7 family represents ARM's highest-performance Cortex-M core, featuring a 6-stage superscalar pipeline, branch prediction, single-precision FPU, and tightly-coupled memory (TCM) for deterministic real-time response. The SAM E70 line sits at the top of the Cortex-M tier for industrial, automotive, and IoT gateway applications where DSP-class math is required.
Key features include the Cortex-M7 core running at 300 MHz with 16 KB ICache and 16 KB DCache, 384 KB SRAM with ECC, 2 MB Flash program memory, and a 16-bit external SDRAM controller supporting up to 64 MB. The peripheral set includes a 12-bit 2 MSPS ADC, two CAN-FD controllers, three USART/UART, two I2C, three SPI, one HS USB OTG with on-chip PHY, Ethernet MAC with 1588 PTP support, and a CMOS image sensor interface. The on-chip FPU enables single-precision IEEE 754 math in hardware.
Architecturally, the SAM E70 family is pin-to-pin compatible with the SAM4E family (100-pin and 144-pin variants) and the lower-density SAM E70 members (Q19, Q20). This compatibility allows code and PCB reuse across product tiers and across migration from older SAM4E designs. The 144-LFBGA package provides high I/O density for applications requiring many external interfaces.
Typical applications include industrial motor control (BLDC, servo, stepper), building automation (HVAC controllers, smart thermostats), audio processing (USB audio class 2.0, MP3 decoders, audio DSP), IoT gateways (Ethernet + Wi-Fi coexistence), automotive instrument clusters and ADAS sensor pre-processing, and high-speed connectivity hubs (USB + Ethernet bridges). The integrated HS USB PHY eliminates the need for an external ULPI transceiver in many designs.
When designing with this device, allocate 5-10% of PCB area to 100 nF + 4.7 uF decoupling distributed across each VDD pin pair; respect the LFBGA 0.8 mm pitch which requires NSMD land patterns with 0.4 mm via diameter for reliable assembly. Use SAM E70 Software Framework (ASF) or Harmony 3 drivers to accelerate firmware development, and verify sleep-mode current with the actual application peripherals rather than datasheet minimums.
This page synthesizes verified distributor pricing, same-brand and cross-brand drop-in alternatives, and practical design notes that complement but do not replace the manufacturer datasheet.
Alternativas drop-in para ATSAME70Q21A-CN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME70Q21A-CN (mesmo formato e footprint) — diferindo em Package, USB, ADC, Operating Temperature, SRAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME70Q21B-CN
✅ Drop-In✓ Em estoque
$16.75 / unidade
Ver ficha técnica →ATSAME70Q21A-CFNT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$11.4 / unidade
Ver ficha técnica →ATSAME70N21B-CNT
✅ Drop-In✓ Em estoque
$9.28 / unidade
Ver ficha técnica →ATSAME70Q21A-CN Classificações máximas e características elétricas
| Core | ARM Cortex-M7 with FPU |
| Maximum CPU Frequency | 300 MHz |
| Program Memory (Flash) | 2 MB (2048 KB) |
| SRAM | 384 KB |
| Instruction Cache (ICache) | 16 KB |
| Data Cache (DCache) | 16 KB |
| Operating Voltage | 1.62 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (industrial) |
| ADC | 12-bit, up to 2 MSPS (AFEC) |
| USB | Hi-Speed USB OTG with on-chip PHY |
| CAN | 2x CAN-FD |
| Ethernet | 10/100 MAC with 1588 PTP |
| External Bus | 16-bit SDRAM interface |
| Encapsulamento | 144-pin LFBGA 10x10 mm |
| Tipo de montagem | Surface Mount (BGA, 0.8 mm pitch) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do ATSAME70Q21A-CN 144-pin lfbga 10x10 mm
Configuração de pinos para ATSAME70Q21A-CN (pacote 144-pin lfbga 10x10 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para ATSAME70Q21A-CN.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ATSAME70Q21A-CN é adequado para 6 aplicaçãos: Industrial Motor Control (BLDC / Servo / Stepper), Building Automation and HVAC Controllers, High-Resolution USB Audio Interface, IoT Gateway with Ethernet and Wi-Fi Coexistence, Automotive Instrument Cluster and HMI, USB + Ethernet Multi-Function Connectivity Hub.
Industrial Motor Control (BLDC / Servo / Stepper)
The ATSAME70Q21A-CN's 300 MHz Cortex-M7 with hardware FPU delivers the DSP-class throughput required for field-oriented control of three-phase BLDC and PMSM motors, while the integrated PWM timers, 2 MSPS AFEC, and Quadrature Decoder interface directly to current-sense ADCs and Hall/encoder feedback. At 20 kHz PWM switching frequency, the M7 core leaves roughly 70% headroom for additional control loops, fault handling, and CAN-FD telemetry to a central inverter controller. The 144-LFBGA package also exposes enough I/O for multiple parallel motor channels in a single MCU.
Recomendado
Building Automation and HVAC Controllers
The ATSAME70Q21A-CN integrates Ethernet MAC with 1588 PTP, dual CAN-FD, and a 16-bit SDRAM interface - the precise combination needed for BACnet/IP or KNX/IP gateways used in modern HVAC and building automation controllers. The 384 KB of SRAM can host a full TCP/IP stack with TLS 1.2 plus a real-time BACnet scheduler, while the 12-bit ADC samples multiple analog sensor channels simultaneously for temperature, pressure, and air-quality monitoring. Industrial-grade operating temperature of -40 C to +85 C enables installation in unconditioned mechanical rooms.
Recomendado
High-Resolution USB Audio Interface
The ATSAME70Q21A-CN's on-chip Hi-Speed USB OTG PHY and Cortex-M7 DSP performance make it an ideal host processor in USB Audio Class 2.0 interfaces at 24-bit/192 kHz. The hardware FPU executes biquad filters, dynamic range compression, and mixer paths with negligible CPU load, while the on-chip 384 KB SRAM buffers multiple audio streams without external memory in simpler designs. For larger DSP graphs, the external 16-bit SDRAM interface can attach 8-32 MB of external RAM to hold look-up tables and delay-line buffers.
Recomendado
IoT Gateway with Ethernet and Wi-Fi Coexistence
The ATSAME70Q21A-CN is well-suited for industrial IoT gateways because the 300 MHz M7 can run both an Ethernet TCP/IP stack with TLS and a UART-attached Wi-Fi module AT command interpreter simultaneously. The 2 MB Flash holds full MCU firmware plus OTA staging area for secure firmware updates. The two CAN-FD controllers can also bridge industrial fieldbus to Ethernet, supporting protocols like CANopen or J1939 in factory automation environments where deterministic latency matters.
Recomendado
Automotive Instrument Cluster and HMI
The ATSAME70Q21A-CN's Cortex-M7 with FPU is strong enough to drive automotive instrument clusters with full TFT-LCD displays, CAN-FD connectivity for body and powertrain networks, and graphics rendering at 60 fps. The integrated CMOS image sensor interface supports rear-view or surround-view camera input for HMI overlays, and the 12-bit AFEC handles multiple analog sensor inputs. For designs requiring AEC-Q100 qualification, the SAM E70 family includes automotive-qualified variants with the same 144-LFBGA package.
Recomendado
USB + Ethernet Multi-Function Connectivity Hub
The ATSAME70Q21A-CN integrates both Hi-Speed USB OTG and 10/100 Ethernet MAC on a single die, eliminating two chips from designs that need to bridge USB peripherals onto an Ethernet network. The Cortex-M7 can run a lightweight TCP/IP stack with USB device or host stack concurrently, while 384 KB SRAM buffers packets efficiently. The 16-bit SDRAM interface additionally supports mass-storage applications that need to bridge USB thumb drives to network-attached storage protocols.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME70Q21A-CN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME70Q21B-CN | ATSAME70N21B-CNT | ATSAMS70Q21A-AN | ATSAME70Q20B-AN |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LFBGA (10x10) | 144-LFBGA (10x10) | 144-LFBGA (10x10) | 144-LQFP | 144-LQFP |
| Core | Cortex-M7 @ 300 MHz | Cortex-M7 @ 300 MHz | Cortex-M7 @ 300 MHz | Cortex-M7 @ 300 MHz | Cortex-M7 @ 300 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Hi-Speed USB PHY | Yes (on-chip) | Yes (on-chip) | Yes (on-chip) | Yes (on-chip) | Yes (on-chip) |
| Ethernet MAC | Yes (10/100 with 1588 PTP) | Yes | No (SAM N70 omits EMAC) | Yes | Yes |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
Principais diferenciais
- Highest-density Flash in 144-LFBGA SAM E70 family (vs ATSAME70Q20B-AN)
- Revision B silicon with errata fixes (vs ATSAME70Q21A-CN vs ATSAME70Q21B-CN)
- On-chip Hi-Speed USB PHY eliminates external ULPI chip (vs ATSAME53N20A-AU)
Notas de projeto
Estimated: the 144-LFBGA package uses a 12x12 ball grid at 0.8 mm pitch. Use an NSMD land pattern with 0.4 mm diameter vias-in-pad for reliable assembly. Place a 100 nF + 4.7 uF decoupling pair on each VDDCORE and VDDIO pin pair, within 2 mm of the ball. For multi-layer PCBs, dedicate one inner layer as a continuous ground plane directly under the BGA to reduce supply inductance.
At 300 MHz with all peripherals active, the ATSAME70Q21A-CN core draws approximately 200 mA from VDDCORE. Estimated: with theta_JA of approximately 25 C/W on a 4-layer JEDEC test board, junction temperature rises about 5 C above ambient, well within the 85 C industrial limit. For applications in enclosed enclosures with no airflow, derate CPU frequency if ambient exceeds 70 C.
Do not enable the on-chip USB PHY if the external USB connector is not present - leaving the PHY enabled adds idle current. Wait for the PLL lock to settle before switching the CPU clock to PLL output, otherwise the core may execute from an unstable clock and lock up. Always use SAM E70 errata sheet updates when designing; some peripheral revisions have specific workaround requirements.
Informações de conformidade
RoHS compliant per Microchip product page. Standard industrial-grade variant is not AEC-Q100 qualified; SAM E70 family has separate automotive-qualified variants for AEC-Q100 applications.
