DSPIC33CH128MP202T-I/SS - 16-bit Dual-Core 200MHz DSC | Microchip
N.º da peça: DSPIC33CH128MP202T-I/SS ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.58 | $55,80 |
| 100 | $4.97 | $497,00 |
| 500 | $4.45 | $2.225,00 |
| 1.000 | $3.94 | $3.940,00 |
DSPIC33CH128MP202T-I/SS Visão geral
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic interrupt response and peripheral set of a microcontroller with the high-throughput math capabilities of a DSP. In the system hierarchy, the dsPIC33CH family sits above general-purpose 16-bit MCUs and below 32-bit Cortex-M microcontrollers, fitting applications that need both real-time control loops (motor control, power conversion) and signal-processing throughput (audio, sensor fusion, digital filtering).
The DSPIC33CH128MP202T-I/SS supports a 3V to 3.6V supply, -40C to +85C industrial temperature range, and Functional Safety (FuSa) features targeting applications needing fault detection. Programmable gain amplifiers and high-resolution PWM simplify closed-loop power and motor designs.
Typical applications include high-performance digital power conversion (wireless charging, server PSUs, telecom rectifiers), motor control (BLDC, PMSM, FOC drives), drones, automotive sensors, and digital lighting ballasts. The slave core can run dedicated housekeeping or safety firmware independently of the master core.
When designing with the DSPIC33CH128MP202T-I/SS, observe decoupling guidelines and follow the dual-core inter-processor mailbox structure documented in the Microchip datasheet. The 28-pin SSOP package is suitable for moderate thermal dissipation in compact industrial modules.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes compiled across multiple sources not found in any single manufacturer document.
Alternativas drop-in para DSPIC33CH128MP202T-I/SS — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH128MP202T-I/SS (mesmo formato e footprint) — diferindo em Core Architecture, Operating Temperature, Package, Program Memory (Flash), Data RAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH128MP202-I/SS
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →DSPIC33CH128MP202T-E/SS
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP202T-I/MM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP202T-I/SS Classificações máximas e características elétricas
| Core Architecture | dsPIC33CH 16-bit Dual-Core (master + slave) |
| Master Core Frequency | 200 MHz |
| Slave Core Frequency | 180 MHz |
| Program Memory (Flash) | 152 KB (152K x 8) |
| Data RAM | 20 KB total (16 KB + 4 KB split between cores) |
| I/O Pins | 21 general-purpose I/O |
| ADC | 23-channel, 12-bit |
| DAC | 4 x 12-bit |
| DMA Channels | 8 |
| Serial I/O Ports | 3 |
| Timers | 2 (16-bit) |
| Operating Voltage | 3.0 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial - I grade) |
| Encapsulamento | 28-pin SSOP |
| Tipo de montagem | Surface Mount |
| Functional Safety | FuSa-capable |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do DSPIC33CH128MP202T-I/SS 28-pin ssop
Configuração de pinos para DSPIC33CH128MP202T-I/SS (pacote 28-pin ssop). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33CH128MP202T-I/SS.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33CH128MP202T-I/SS é adequado para 6 aplicaçãos: High-Performance Digital Power Conversion, BLDC / PMSM Motor Control (Field-Oriented Control), Drones and UAV Flight Controllers, Automotive Sensors and Functional Safety Modules, Digital Lighting and LED Ballasts, Server and Telecom Power Supply Units.
High-Performance Digital Power Conversion
The DSPIC33CH128MP202T-I/SS fits digital power conversion designs such as wireless charging, telecom and server PSUs, where the 200MHz master core executes the control loop and the 180MHz slave core runs housekeeping or telemetry in parallel. With 23-channel 12-bit ADC, 4-channel 12-bit DAC, and high-resolution PWM, the device achieves sub-microsecond feedback latency. Compared to a single-core MCU approach, the dual-core design simplifies partitioning between fast control and slow system management firmware, and the FuSa-capable architecture supports fault detection required in modern server and telecom rectifiers.
Recomendado
BLDC / PMSM Motor Control (Field-Oriented Control)
The DSPIC33CH128MP202T-I/SS is suited to BLDC and PMSM motor drives using field-oriented control (FOC), with the master core computing the FOC loop at 200MHz and the slave core handling sensor-fusion or position estimation. The 23-channel 12-bit ADC samples phase currents, while high-resolution PWM outputs drive the gate stage. The dual-core split reduces interrupt latency on the control loop and simplifies safety integration per ISO 26262. Compared with single-core dsPIC33EP, the CH variant removes contention between current-loop and housekeeping tasks in drone and robotics motor drives.
Recomendado
Drones and UAV Flight Controllers
The DSPIC33CH128MP202T-I/SS supports drone flight-controller designs that require parallel execution of motor FOC loops and sensor fusion on the same chip. The master core at 200MHz runs four motor FOC loops, while the slave core handles IMU sensor fusion and communication. With 23 ADC channels, the device samples current sensors across all four ESC channels plus battery monitoring. Compared with Cortex-M4 flight controllers, the dsPIC33CH provides tighter PWM control for high-payload industrial drones, though programming requires MPLAB X IDE rather than the Arduino/STM32 toolchain.
Recomendado
Automotive Sensors and Functional Safety Modules
The DSPIC33CH128MP202T-I/SS Functional Safety (FuSa) capability and dual-core architecture suit automotive sensor modules where one core runs the primary measurement loop and the other executes safety diagnostics in parallel. With -40C to +85C industrial temperature range, the I-grade variant fits under-hood and chassis electronics. The -40C to +125C E-grade variant (DSPIC33CH128MP202T-E/SS) is preferred for under-hood or transmission-mounted modules. Compared with single-core automotive MCUs, the CH family simplifies ASIL decomposition and reduces software complexity for redundant fault detection.
Recomendado
Digital Lighting and LED Ballasts
The DSPIC33CH128MP202T-I/SS drives high-end digital lighting ballasts and tunable white LED drivers where the master core computes current-loop control and the slave core manages DMX or DALI protocol stacks in parallel. With 4-channel 12-bit DAC, the device can drive multiple LED channels with high dimming resolution. The 200MHz computational headroom enables predictive thermal management algorithms that adjust current based on measured junction temperature. Compared with traditional 8-bit ballast controllers, the CH variant delivers smoother dimming curves and supports IoT-connected lighting control.
Recomendado
Server and Telecom Power Supply Units
The DSPIC33CH128MP202T-I/SS fits server and telecom PSU primary-side and secondary-side control loops where the master core executes the digital feedback loop at 200MHz and the slave core runs PMBus, telemetry, and fault logging concurrently. With high-resolution PWM and 23-channel ADC, the device supports totem-pole PFC, LLC, and full-bridge topologies used in 80+ Titanium-rated PSUs. The FuSa-capable architecture supports fault detection mandated by datacenter reliability standards. Compared with analog UCC25640 controllers, the dsPIC33CH variant enables adaptive digital control and firmware-upgradeable platforms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH128MP202T-I/SS — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH128MP202-I/SS | DSPIC33CH128MP202T-E/SS | DSPIC33CH128MP202T-I/MM |
|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-uQFN - same pin count, different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Master Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Slave Core Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Flash Memory | 152 KB | 152 KB | 152 KB | 152 KB |
| Data RAM | 20 KB (16 KB + 4 KB) | 20 KB | 20 KB | 20 KB |
| Operating Temperature | -40 C to +85 C (I grade) | -40 C to +85 C (I grade) | -40 C to +125 C (E grade) | -40 C to +85 C (I grade) |
| ADC Channels | 23 x 12-bit | 23 x 12-bit | 23 x 12-bit | 23 x 12-bit |
| DAC Outputs | 4 x 12-bit | 4 x 12-bit | 4 x 12-bit | 4 x 12-bit |
| GPIO Pins | 21 | 21 | 21 | 21 |
Principais diferenciais
- True dual-core architecture with inter-processor mailbox (vs Single-core dsPIC33EP variants)
- Highest flash density at the SSOP-28 pin count (vs Smaller dsPIC33CH MP102 variants)
- Functional Safety (FuSa) capable dual-core partition (vs Single-core dsPIC33CK/CV devices)
Notas de projeto
The DSPIC33CH128MP202T-I/SS operates from a single 3.0V to 3.6V supply. Place a 10uF bulk decoupling capacitor and a 0.1uF ceramic decoupling capacitor as close to each VDD/VSS pair as possible. The dual-core architecture draws higher peak current than single-core dsPIC33EP devices, so a low-impedance 3.3V rail (LT3042 or similar LDO with <2mV ripple) is recommended to prevent core brown-out during ADC sampling events.
Route the 200MHz master-core traces as 50-ohm microstrip on the top layer over a continuous ground plane. Keep analog ADC traces short and away from PWM switching signals to minimize crosstalk into current-sense measurements. The exposed pad (if present on the SSOP-28 variant) should be soldered to a grounded copper pour of at least 0.5 square inch to keep junction temperature rise within industrial limits. Estimated: at 200MHz, 80% peripheral utilization, expect ~150mA active current.
Do not assume the master and slave cores share a single binary image; each core has its own firmware partition loaded into separate flash regions, and the inter-processor mailbox requires explicit initialization. Programming the device requires MPLAB X IDE with a PICkit 4, MPLAB ICD 4, or MPLAB Snap debugger - older PICkit 3 supports basic programming but not real-time dual-core debug. Also note: firmware for the I-grade variant cannot be used on the E-grade without re-verifying thermal derating in your enclosure design.
Informações de conformidade
RoHS compliant per Microchip product page. AEC-Q100 not qualified in the I grade; the E grade variant (DSPIC33CH128MP202T-E/SS) extends to automotive temperature range but is not formally AEC-Q100 qualified per public documentation.
