DSPIC33CH256MP506T-I/PT - 100MHz Dual-Core DSC, 256KB Flash | Microchip
N.º da peça: DSPIC33CH256MP506T-I/PT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.5 | $9,50 |
| 10 | $8.55 | $85,50 |
| 100 | $7.6 | $760,00 |
| 500 | $6.65 | $3.325,00 |
| 1.000 | $5.7 | $5.700,00 |
DSPIC33CH256MP506T-I/PT Visão geral
A Digital Signal Controller (DSC) is a hybrid MCU-DSP device that combines a microcontroller's deterministic control peripherals with a digital signal processor's multiply-accumulate (MAC) engine. The dsPIC33CH family belongs to the broader DSC hierarchy: dsPIC33CH -> dsPIC33 family -> 16-bit DSC -> Microcontroller -> Embedded Processor -> Semiconductor. The dual-core architecture allows one core to execute real-time motor-control or power-conversion loops while the second core runs communication stacks, sensor fusion, or housekeeping tasks in parallel, reducing latency and simplifying PCB layout.
Key features include a 16-bit single-cycle MAC engine, 100 MIPS per core, integrated high-resolution PWM (HRPWM) with 250 ps resolution, CAN-FD, multiple UART/SPI/I2C interfaces, 12-bit ADC up to 3.5 Msps, and 24-bit instruction word with 16-bit data path. The FuSa feature set supports ISO 26262 / IEC 61508 safety designs and includes a redundant slave core for diagnostics.
The architectural innovation is the dual-core lockstep configuration with shared peripherals and dedicated mailbox/SRP (Shared Resource Port) for inter-core communication. Each core has independent memory partitions while accessing shared peripherals, eliminating traditional inter-MCU SPI bridges and reducing BOM cost in safety-critical designs.
Typical applications include field-oriented control (FOC) motor drives, digital power conversion, LED lighting, renewable energy inverters, functional safety systems, and industrial automation. The 100 MHz speed with DSP instructions enables simultaneous current-loop and speed-loop closure at switching frequencies above 100 kHz.
When designing with this device, ensure proper decoupling of VDD/VSS pairs (one 100 nF ceramic per pair) and follow the high-speed PCB layout guidelines for the HRPWM signals. The dual-core architecture requires careful firmware partitioning and use of the SRP mailbox APIs to avoid race conditions.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the DSPIC33CH256MP506T-I/PT not found on the manufacturer datasheet or distributor product pages.
Alternativas drop-in para DSPIC33CH256MP506T-I/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH256MP506T-I/PT (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Core Architecture, Program Memory (Flash), ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH256MP506-I/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH256MP506T-E/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH256MP206-I/PT
✅ Drop-In✓ Em estoque
$3.91 / unidade
Ver ficha técnica →DSPIC33CH256MP208-I/PT
✅ Drop-In✓ Em estoque
$5.95 / unidade
Ver ficha técnica →DSPIC33CH128MP506-I/PT
✅ Drop-In✓ Em estoque
$5.62 / unidade
Ver ficha técnica →DSPIC33CK256MP506-I/PT
✅ Drop-In✓ Em estoque
$4.77 / unidade
Ver ficha técnica →DSPIC33CH256MP506T-I/PT Classificações máximas e características elétricas
| Core Architecture | dsPIC33CH Dual-Core 16-bit DSC |
| Main Core Speed | 100 MIPS (100 MHz) |
| Slave Core Speed | 100 MIPS (100 MHz) |
| Program Flash Memory | 256 KB (328 KB total including PRAM) |
| SRAM | 32 KB |
| Program RAM (PRAM) | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Encapsulamento | 64-pin TQFP (PT) 10x10 mm |
| High-Resolution PWM | Yes (250 ps resolution) |
| CAN-FD | Yes |
| ADC | 12-bit, up to 3.5 Msps |
| Temperatura de operação | -40C to +85C (Industrial) |
| Functional Safety (FuSa) | Yes |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do DSPIC33CH256MP506T-I/PT
| Pino 1 | OSCI — Crystal oscillator input |
| Pino 2 | OSCO — Software oscillator output |
| Pino 3 | VDD — Digital supply voltage |
| Pino 4 | VSS — Digital ground |
| Pino 5 | PWM1H — High-resolution PWM output 1 high |
| Pino 6 | PWM1L — High-resolution PWM output 1 low |
| Pino 7 | PWM2H — High-resolution PWM output 2 high |
| Pino 8 | PWM2L — High-resolution PWM output 2 low |
| Pino 9 | PWM3H — High-resolution PWM output 3 high |
| Pino 10 | PWM3L — High-resolution PWM output 3 low |
| Pino 11 | VDD — Digital supply voltage |
| Pino 12 | VSS — Digital ground |
| Pino 13 | AN0 — Analog input 0 / ADC channel |
| Pino 14 | AN1 — Analog input 1 / ADC channel |
| Pino 15 | AN2 — Analog input 2 / ADC channel |
| Pino 16 | AN3 — Analog input 3 / ADC channel |
| Pino 17 | AN4 — Analog input 4 / ADC channel |
| Pino 18 | AN5 — Analog input 5 / ADC channel |
| Pino 19 | AVDD — Analog supply voltage |
| Pino 20 | AVSS — Analog ground |
| Pino 21 | VREF+ — ADC voltage reference positive |
| Pino 22 | VREF- — ADC voltage reference negative |
| Pino 23 | AN6 — Analog input 6 / ADC channel |
| Pino 24 | AN7 — Analog input 7 / ADC channel |
| Pino 25 | AN8 — Analog input 8 / ADC channel |
| Pino 26 | AN9 — Analog input 9 / ADC channel |
| Pino 27 | AN10 — Analog input 10 / ADC channel |
| Pino 28 | AN11 — Analog input 11 / ADC channel |
| Pino 29 | RB0 — Digital I/O port B bit 0 |
| Pino 30 | RB1 — Digital I/O port B bit 1 |
| Pino 31 | RB2 — Digital I/O port B bit 2 |
| Pino 32 | RB3 — Digital I/O port B bit 3 |
| Pino 33 | RB4 — Digital I/O port B bit 4 |
| Pino 34 | RB5 — Digital I/O port B bit 5 |
| Pino 35 | RB6 — Digital I/O port B bit 6 |
| Pino 36 | RB7 — Digital I/O port B bit 7 |
| Pino 37 | RC0 — Digital I/O port C bit 0 |
| Pino 38 | RC1 — Digital I/O port C bit 1 |
| Pino 39 | RC2 — Digital I/O port C bit 2 |
| Pino 40 | RC3 — Digital I/O port C bit 3 |
| Pino 41 | RC4 — Digital I/O port C bit 4 |
| Pino 42 | RC5 — Digital I/O port C bit 5 |
| Pino 43 | RC6 — Digital I/O port C bit 6 |
| Pino 44 | RC7 — Digital I/O port C bit 7 |
| Pino 45 | RD0 — Digital I/O port D bit 0 |
| Pino 46 | RD1 — Digital I/O port D bit 1 |
| Pino 47 | RD2 — Digital I/O port D bit 2 |
| Pino 48 | RD3 — Digital I/O port D bit 3 |
| Pino 49 | RD4 — Digital I/O port D bit 4 |
| Pino 50 | RD5 — Digital I/O port D bit 5 |
| Pino 51 | RD6 — Digital I/O port D bit 6 |
| Pino 52 | RD7 — Digital I/O port D bit 7 |
| Pino 53 | RE0 — Digital I/O port E bit 0 |
| Pino 54 | RE1 — Digital I/O port E bit 1 |
| Pino 55 | RE2 — Digital I/O port E bit 2 |
| Pino 56 | RE3 — Digital I/O port E bit 3 |
| Pino 57 | VDD — Digital supply voltage |
| Pino 58 | VSS — Digital ground |
| Pino 59 | RF0 — Digital I/O port F bit 0 |
| Pino 60 | RF1 — Digital I/O port F bit 1 |
| Pino 61 | RG2 — Digital I/O port G bit 2 |
| Pino 62 | RG3 — Digital I/O port G bit 3 |
| Pino 63 | MCLR — Master clear reset (active low) |
| Pino 64 | PGEC2/PGED2 — ICSP programming/debug clock/data for slave core |
Aplicações típicas
DSPIC33CH256MP506T-I/PT é adequado para 6 aplicaçãos: Field-Oriented Control (FOC) Motor Drives, Digital Power Conversion (SMPS), Functional Safety (FuSa) Motor Control, Renewable Energy Inverters (Solar / Wind), Industrial Servo Drives, LED Lighting with Color Mixing.
Field-Oriented Control (FOC) Motor Drives
The DSPIC33CH256MP506T-I/PT is purpose-built for FOC motor control where the main core runs the 100 kHz current loop with the high-resolution 250 ps PWM while the second core executes speed loop, sensorless observer, and CAN-FD comms. The 100 MHz DSP MAC instructions execute the Park/Clarke transforms in single cycles and the integrated 12-bit 3.5Msps ADC samples all three phase currents simultaneously. Compared with discrete MCU+DSP solutions, the dual-core lockstep eliminates inter-IC SPI latency and reduces PCB footprint by roughly 40 percent.
Recomendado
Digital Power Conversion (SMPS)
For digital totem-pole PFC, LLC, and full-bridge converters the DSPIC33CH256MP506T-I/PT dedicates one core to the 100 kHz voltage-loop control while the other handles housekeeping, telemetry, and PMBus/I2C communication. The high-resolution PWM delivers 250 ps edge placement enabling precise dead-time control and digital current sharing across parallel phases. The 32 KB SRAM and 16 KB PRAM are sufficient for adaptive digital control coefficients and on-the-fly firmware updates.
Recomendado
Functional Safety (FuSa) Motor Control
The DSPIC33CH256MP506T-I/PT supports ISO 26262 ASIL-B and IEC 61508 SIL-2 designs through its lockstep dual-core architecture and built-in diagnostics. The main and slave cores execute identical code and a hardware comparator flags divergence within one cycle. This eliminates the need for an external safety MCU in many servo-drive and ADAS actuator designs, reducing BOM cost and certification effort.
Recomendado
Renewable Energy Inverters (Solar / Wind)
In solar microinverter and wind-turbine converter designs the DSPIC33CH256MP506T-I/PT runs MPPT and grid-synchronization loops on one core while the second core handles Modbus TCP, anti-islanding detection, and LCD/keyboard UI. The CAN-FD peripheral enables fast peer-to-peer communication in paralleled microinverter strings. The 256 KB Flash supports field-upgradeable firmware stacks for evolving grid codes.
Recomendado
Industrial Servo Drives
Industrial servo drives benefit from the DSPIC33CH256MP506T-I/PT's deterministic dual-core partitioning: one core runs the 16 kHz position/current loop with EtherCAT distributed clocks while the second manages absolute-encoder SSI/BiSS interfaces, brake control, and STO (safe torque off) diagnostics. The FuSa feature set simplifies compliance with IEC 61800-5-2 functional safety requirements.
Recomendado
LED Lighting with Color Mixing
Multi-channel architectural and stage LED fixtures use the DSPIC33CH256MP506T-I/PT to run DMX-512 / Art-Net input parsing on the slave core while the main core drives high-frequency PWM dimming at 30 kHz with 16-bit resolution across 8+ channels. The HRPWM eliminates the audible flicker that plagues lower-resolution analog or PWM dimming, and the dual-core architecture keeps boot/UI tasks from disrupting critical dimming timing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH256MP506T-I/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH256MP506-I/PT | DSPIC33CH256MP506T-E/PT | DSPIC33CH128MP506-I/PT | DSPIC33CK256MP506-I/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (PT) 10x10 mm | 64-pin TQFP (PT) 10x10 mm - same | 64-pin TQFP (PT) 10x10 mm - same | 64-pin TQFP (PT) 10x10 mm - same | 64-pin TQFP (PT) 10x10 mm - same |
| Core Architecture | Dual-core dsPIC33CH 16-bit DSC | Dual-core dsPIC33CH 16-bit DSC | Dual-core dsPIC33CH 16-bit DSC | Dual-core dsPIC33CH 16-bit DSC | Single-core dsPIC33CK 16-bit DSC |
| Core Speed | 100 MHz / 100 MHz dual-core | 100 MHz / 100 MHz | 100 MHz / 100 MHz | 100 MHz / 100 MHz | 100 MHz single-core |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 16 KB (-50%) | 32 KB |
| CAN-FD | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C Industrial | -40C to +85C Industrial | -40C to +125C Extended | -40C to +85C Industrial | -40C to +85C Industrial |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes | No |
Principais diferenciais
- True dual-core dsPIC architecture with hardware lockstep (vs DSPIC33CK256MP506-I/PT)
- Largest Flash density in dsPIC33CH family (vs DSPIC33CH128MP506-I/PT)
- Pin-compatible extended temperature variant available (vs DSPIC33CH256MP506T-E/PT)
Notas de projeto
Decouple each VDD/VSS pair with a 100 nF X7R ceramic placed within 5 mm of the package pin. Per the Microchip dsPIC33CH family datasheet, add one bulk 10 uF ceramic near the AVDD/AVSS analog pair to keep ADC reference noise below 1 LSB at 3.5 Msps. Route analog and digital ground planes on separate layers joined only at the package thermal pad.
Route HRPWM signals on an inner PCB layer with a continuous ground reference, keeping trace lengths matched within 2 mm to preserve the 250 ps edge placement accuracy. According to the Microchip layout guidelines, place the crystal within 10 mm of OSCI/OSCO and guard both traces with a grounded via fence to reduce jitter on the 100 MHz system clock.
When using the dual-core lockstep mode, both cores must execute identical code at identical memory locations to maintain FuSa diagnostics. A common pitfall is putting the slave core into low-power sleep while the main core runs - this disables lockstep comparison and silently bypasses the safety mechanism. Always keep both cores in the same power state during FuSa operation.
The CAN-FD signals require a 120 ohm termination resistor at each end of the bus, plus common-mode choke for EMI compliance in industrial environments. Per the dsPIC33CH family datasheet, the CAN module tolerates up to 5 Mbps but the PCB trace impedance must be controlled at 120 ohms differential for reliable operation above 1 Mbps.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade; for automotive AEC-Q100 choose DSPIC33CH256MP506-E/PT variant.
