DSPIC33CH64MP206T-I/MR - Dual-Core 16-Bit DSC, 88KB Flash | Microchip
N.º da peça: DSPIC33CH64MP206T-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.5936 | $2,59 |
| 10 | $2.4 | $24,00 |
| 100 | $2.15 | $215,00 |
| 500 | $1.92 | $960,00 |
| 1.000 | $1.75 | $1.750,00 |
DSPIC33CH64MP206T-I/MR Visão geral
A Digital Signal Controller (DSC) is a hybrid between a microcontroller (MCU) and a Digital Signal Processor (DSP). It combines deterministic on-chip peripherals, interrupt latency, and bit-level I/O control with hardware multiply-accumulate (MAC) and barrel shifter blocks, enabling single-cycle math on fractional data. The dsPIC33CH family specifically adds a second independent core inside the same silicon die, partitioning firmware into a high-level supervisory core (master) and a real-time control core (slave) that communicate through a tightly-coupled dual-core mailbox. This hierarchical topology belongs to the broader embedded control category: DSC -> MCU family -> embedded processor -> semiconductor device.
Key features include 88 KB Flash with Error Correction Code (ECC), up to 16 KB RAM split between the cores, a 12-bit ADC with up to 3.5 Msps conversion, high-resolution PWM (250 ps edge placement), CAN Flexible Data (CAN FD) support, and a functional-safety (FuSa) hardware path qualified to assist ISO 26262 system designs. The part is rated for the industrial -40C to +85C temperature range and ships in a tape-and-reel-friendly 64-pin QFN with thermal pad for 1.7 W typical dissipation headroom.
Architecturally the slave core can be programmed and debugged independently, enabling software teams to develop the control algorithm separately from the supervisory logic. Integrated op amps, comparators, and dead-time generators reduce external analog components on the PCB, which is critical for compact motor-drive and digital-power stages.
Typical applications include digital switch-mode power supplies, field-oriented control (FOC) motor drives, solar microinverters, wireless charging transmitters, and functional-safety industrial controllers. The dual-core partition also suits lighting ballast and Class-D audio amplifier designs.
When designing with this device, allocate the master core to communication stacks (UART, SPI, CAN FD) and the slave core to closed-loop control tasks. Use a 4-layer PCB stack-up to keep the exposed thermal pad soldered to a continuous ground pour for proper heat extraction under sustained PWM load.
This page synthesizes distributor pricing, drop-in same-family alternates, and practical dual-core design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33CH64MP206T-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH64MP206T-I/MR (mesmo formato e footprint) — diferindo em Core Architecture, Package, ADC, Operating Temperature, PWM Resolution.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH64MP206-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH64MP206-E/MR
✅ Drop-In✓ Em estoque
$3.59 / unidade
Ver ficha técnica →DSPIC33CH64MP206T-H/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH64MP202-I/2N
✅ Drop-In✓ Em estoque
$3.31 / unidade
Ver ficha técnica →DSPIC33CH512MP206-I/MR
✅ Drop-In✓ Em estoque
$3.96 / unidade
Ver ficha técnica →DSPIC33CH64MP206T-I/MR Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33C dual-core (master + slave) |
| Core Count | 2 (Master + Slave) |
| CPU Speed (Master) | 180 MHz |
| CPU Speed (Slave) | 200 MHz |
| Program Flash Memory | 88 KB |
| Encapsulamento | 64-pin QFN (9x9 mm) |
| Temperatura de operação | -40C to +85C (Industrial) |
| ADC | 12-bit, up to 3.5 Msps |
| PWM Resolution | High-resolution, 250 ps edge placement |
| CAN FD Support | Yes |
| Functional Safety (FuSa) | Hardware path assisting ISO 26262 |
| Tensão de alimentação | 3.0 V to 3.6 V |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| DMA Channels | 8 |
| Operating Temperature Grade | Industrial |
Guia de Configuração de Pinos do DSPIC33CH64MP206T-I/MR 64-pin qfn (9x9 mm)
Configuração de pinos para DSPIC33CH64MP206T-I/MR (pacote 64-pin qfn (9x9 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33CH64MP206T-I/MR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33CH64MP206T-I/MR é adequado para 6 aplicaçãos: Digital Switch-Mode Power Supply (SMPS), Field-Oriented Control (FOC) Motor Drive, Wireless Power Transmitter, Solar Microinverter, Functional-Safety Industrial Controller, Automotive Sensor Hub.
Digital Switch-Mode Power Supply (SMPS)
The DSPIC33CH64MP206T-I/MR's 250 ps high-resolution PWM and 3.5 Msps 12-bit ADC enable tight closed-loop control of buck, boost, and LLC converters at switching frequencies above 500 kHz. The slave core runs the voltage-mode or current-mode control loop with sub-microsecond interrupt latency, while the master core handles PMBus, UART telemetry, and fault logging without disturbing the control loop timing. The 88 KB Flash holds complex state-machine firmware for soft-start, adaptive dead-time, and synchronous rectification.
Recomendado
Field-Oriented Control (FOC) Motor Drive
For PMSM, BLDC, and AC induction motors the dsPIC33CH slave core runs the FOC algorithm at full CPU speed, executing Clarke-Park transforms and SVPWM in single-cycle MAC instructions. The 12-bit ADC synchronously samples phase currents at the PWM reload point, eliminating software jitter. Integrated op amps and comparators reduce the analog front-end to a handful of passives, shrinking the BOM for drone, e-bike, and appliance motor drives.
Recomendado
Wireless Power Transmitter
Wireless charging transmitters operating at 100 kHz to 6.78 MHz benefit from the dsPIC33CH64MP206T-I/MR's slave-core real-time control: the slave core maintains the resonant tank frequency and foreign-object detection (FOD) loop with deterministic latency, while the master core runs Qi or AirFuel protocol stacks over I2C/SPI. CAN FD connectivity supports in-vehicle charging networks, and the ECC Flash helps meet automotive functional-safety targets.
Recomendado
Solar Microinverter
In a 250 W to 600 W solar microinverter, the master core of the dsPIC33CH64MP206T-I/MR performs MPPT computation while the slave core maintains the grid-tie current regulation loop at 50/60 Hz with THD below 3%. CAN FD connects multiple modules in a string, and the FuSa hardware path assists ISO 13849 and IEC 61800 compliance. The 64-pin QFN with thermal pad handles continuous power dissipation on the inverter PCB without active cooling.
Recomendado
Functional-Safety Industrial Controller
The dsPIC33CH64MP206T-I/MR's FuSa hardware path supports SIL 2 / SIL 3 designs by providing lockstep diagnostic features, ECC Flash, and dual watchdog timers. The dual-core split lets one core run the safety function while the other runs diagnostics and housekeeping. CAN FD and SPI interfaces connect to industrial sensor networks in factory automation cells where IEC 61508 certification is mandatory.
Recomendado
Automotive Sensor Hub
The AEC-Q100 friendly dsPIC33CH64MP206T-I/MR handles automotive sensor fusion for body and chassis ECUs, running LIN/CAN FD bus stacks on the master core and time-critical sensor sampling on the slave core. The 64-QFN 9x9 mm footprint fits inside small ECU enclosures, and the high-resolution PWM supports active suspension and electric power-steering (EPS) torque overlay. Industrial-grade -40C to +85C covers most cabin and under-hood locations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH64MP206T-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH64MP206-I/MR | DSPIC33CH64MP206-E/MR | DSPIC33CH64MP206T-H/MR | DSPIC33CH64MP202-I/2N | DSPIC33CH512MP206-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Core Architecture | Dual-core (180/200 MHz) | Dual-core (180/200 MHz) | Dual-core (180/200 MHz) | Dual-core (180/200 MHz) | Dual-core (180/200 MHz) | Dual-core (180/200 MHz) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C | High-temp -40C to +150C | Industrial -40C to +85C | Industrial -40C to +85C |
| Packaging | Tape & Reel | Tray | Tray | Tape & Reel | Tray | Tray |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes | Yes | Yes |
| CAN FD | Yes | Yes | Yes | Yes | Yes | Yes |
Principais diferenciais
- Dual-core master/slave architecture in a single die (vs DSPIC33CH64MP202-I/2N)
- Built-in functional-safety hardware path (vs DSPIC33CK64MC105 (single-core))
- 64-pin QFN with thermal pad in 9x9 mm (vs DSPIC33CH128MP506-I/PT (64-TQFP))
Notas de projeto
Solder the exposed thermal pad of the 64-QFN package to a continuous copper pour of at least 1 square inch on the top layer, stitched with 0.3 mm thermal vias to the inner ground plane. Estimated: with both cores active at 180/200 MHz, dissipation is around 1.5 W; using 2 oz copper on a 4-layer FR-4 PCB, junction-to-ambient thermal resistance drops to roughly 25 C/W, keeping Tj below +125 C at +85 C ambient. This is an estimate - consult the manufacturer datasheet thermal table for production designs.
Place decoupling capacitors (100 nF X7R plus 10 uF bulk) within 3 mm of each VDD/VCAP pin pair. Keep the analog AVDD trace star-connected back to the regulator ferrite bead, and provide a separate ground return island under the ADC traces to prevent digital switching noise coupling into current-sense measurements. Reference: Microchip AN2721 'dsPIC33C PCB Design Guide'.
The dual-core architecture requires both cores to be programmed with separate firmware images, but only one ICSP programming header is shared. Without proper PGECx/PGEDx pin assignment and a pull-up on S1MCLRx (the slave-core programming pin), the slave core may fail to enter debug mode after reset - see Northern Software developer notes and the datasheet programming section. Do not assume the slave core boots automatically on master reset; you must explicitly release the slave core from its reset state via the master mailbox.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial grade - not AEC-Q100 qualified; for AEC-Q100 automotive applications verify with the Q-grade ordering code.
