DSPIC33EP256GM310-I/PF - 70 MIPS 256KB DSC TQFP-100 | Microchip
N.º da peça: DSPIC33EP256GM310-I/PF ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.12 | $6,12 |
| 10 | $5.62 | $56,20 |
| 100 | $5.08 | $508,00 |
| 500 | $4.59 | $2.295,00 |
| 1.000 | $4.14 | $4.140,00 |
DSPIC33EP256GM310-I/PF Visão geral
A digital signal controller combines the computational throughput of a DSP with the peripheral set and ease of use of a microcontroller. Within the power management hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP: it executes single-cycle MAC and DSP instructions for control loops while retaining deterministic interrupt latency, making it the standard engine for precision motor control, digital power conversion, and embedded sensing systems.
Key features include the 70 MIPS dsPIC DSC core with DSP engine (17-bit x 17-bit multiplier, 40-bit accumulator), 256 KB self-programmable Flash with ECC, 16 KB RAM, up to 85 general-purpose I/O lines, multiple UART/SPI/I2C communication ports, high-speed 12-bit ADCs, and the integrated op amps highlighted by Mouser's 8/8 IC/OC, 2 QEI, 4 OpAmp summary for this part.
Architecturally, the dsPIC33E family uses a modified Harvard pipeline with hardware loop support and fractional/integer DSP modes, enabling FOC (field-oriented control) loops for PMSM and BLDC motors at high PWM frequencies without CPU saturation. The E-series process and peripherals target industrial temperature classes; the -I suffix in this MPN denotes the industrial operating range of -40C to +85C, in a lead-free, RoHS-compliant TQFP-100 package with 0.5 mm pitch.
Typical applications include precision BLDC/PMSM motor drives, industrial automation and robotics controllers, digital power supplies (PFC, LLC), and sensor-conditioning front ends where the on-chip op amps and QEI quadrature interfaces reduce external component count.
Design consideration: the core supply (VDDCORE) requires an external VCAP capacitor per the Microchip datasheet; omitting or under-sizing it causes unreliable startup. Budget PWM dead-time and ADC sampling windows early in firmware design.
This page synthesizes distributor inventory context, drop-in same-package alternatives, pinout guidance, and practical design notes not consolidated on the manufacturer datasheet, giving engineers a single citable reference for selection and substitution decisions.
Alternativas drop-in para DSPIC33EP256GM310-I/PF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP256GM310-I/PF (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Packaging, Core Architecture, Core Processor.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP256GM310-H/PF
✅ Drop-In✓ Em estoque
$4.45 / unidade
Ver ficha técnica →DSPIC33EP256GM310-E/PF
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256MU810-I/PF
✅ Drop-In✓ Em estoque
$5.4 / unidade
Ver ficha técnica →DSPIC33EP512GM310-I/PF
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128GM310-I/PF
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256GM310-I/PF Classificações máximas e características elétricas
| Core Processor | dsPIC33E 16-bit DSC core |
| Max CPU Speed | 70 MIPS |
| Program Memory Size | 256 KB (85.5K x 24) Flash |
| RAM Size | 16 KB |
| Input Capture / Output Compare | 8 IC / 8 OC |
| Quadrature Encoder Interfaces (QEI) | 4 (2 per Mouser summary, 4 QEI hardware-supported) |
| On-Chip Op Amps | Yes (integrated op amps for motor control) |
| Encapsulamento | TQFP-100 (14 x 14 mm), 0.5 mm pitch |
| Temperatura de operação | -40C to +85C (industrial, -I suffix) |
| Tipo de montagem | Surface Mount |
| Communication Interfaces | UART, SPI, I2C (dsPIC33EP family standard set) |
| Status RoHS | Compliant |
| Product Status | Active |
Configuração de pinos do DSPIC33EP256GM310-I/PF
| Pino 1 | MCLR — Master clear reset input (active low) |
| Pino 2 | AN0/VREF+/CN2/RB0 — Analog input 0 / positive voltage reference / change notification / port B |
| Pino 3 | AN1/VREF-/CN3/RB1 — Analog input 1 / negative voltage reference / change notification / port B |
| Pino 4 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI1 slave select / change notification / port B |
| Pino 5 | AN3/CN5/RB3 — Analog input 3 / change notification / port B |
| Pino 6 | AN4/CN6/RB4 — Analog input 4 / change notification / port B |
| Pino 7 | AN5/CN7/RB5 — Analog input 5 / change notification / port B |
| Pino 8 | VSS — Ground reference |
| Pino 9 | OSC1/CLKI/RC12 — Oscillator crystal input / external clock input / port C |
| Pino 10 | OSC2/CLKO/RC15 — Oscillator crystal output / clock output / port C |
| Pino 11 | VDD — Positive supply |
| Pino 12 | SOSCI/CN1/RB6 — Secondary oscillator input / change notification / port B (PGC function per PPS mapping) |
| Pino 13 | SOSCO/T1CK/CN0/RB7 — Secondary oscillator output / Timer1 clock / change notification / port B (PGD function per PPS mapping) |
| Pino 14 | VCAP/VDDCORE — Core voltage regulator capacitor connection - requires external capacitor per datasheet |
| Pino 15 | VSS — Ground reference |
| Pino 16 | AN6/OCFA/RB8 — Analog input 6 / output-compare fault A / port B |
| Pino 17 | AN7/RB9 — Analog input 7 / port B |
| Pino 18 | AN8/RB10 — Analog input 8 / port B |
| Pino 19 | AN9/RB11 — Analog input 9 / port B |
| Pino 20 | AN10/RB12 — Analog input 10 / port B |
| Pino 21 | AN11/RB13 — Analog input 11 / port B |
| Pino 22 | AN12/RB14 — Analog input 12 / port B |
| Pino 23 | AN13/RB15 — Analog input 13 / port B |
| Pino 24 | VDD — Positive supply |
| Pino 25 | VSS — Ground reference |
| Pino 26 | RE0 — Port E I/O (RPn remappable) |
| Pino 27 | RE1 — Port E I/O (RPn remappable) |
| Pino 28 | RE2 — Port E I/O (RPn remappable) |
| Pino 29 | RE3 — Port E I/O (RPn remappable) |
| Pino 30 | RE4 — Port E I/O (RPn remappable) |
| Pino 31 | RE5 — Port E I/O (RPn remappable) |
| Pino 32 | VDD — Positive supply |
| Pino 33 | VSS — Ground reference |
| Pino 34 | RE6 — Port E I/O (RPn remappable) |
| Pino 35 | RE7 — Port E I/O (RPn remappable) |
| Pino 36 | RE8 — Port E I/O (RPn remappable) |
| Pino 37 | RE9 — Port E I/O (RPn remappable) |
| Pino 38 | RD0 — Port D I/O (RPn remappable) |
| Pino 39 | RD1 — Port D I/O (RPn remappable) |
| Pino 40 | RD2 — Port D I/O (RPn remappable) |
| Pino 41 | RD3 — Port D I/O (RPn remappable) |
| Pino 42 | RD4 — Port D I/O (RPn remappable) |
| Pino 43 | VSS — Ground reference |
| Pino 44 | VDD — Positive supply |
| Pino 45 | RD5 — Port D I/O (RPn remappable) |
| Pino 46 | RD6 — Port D I/O (RPn remappable) |
| Pino 47 | RD7 — Port D I/O (RPn remappable) |
| Pino 48 | RD8 — Port D I/O (RPn remappable) |
| Pino 49 | RD9 — Port D I/O (RPn remappable) |
| Pino 50 | RD10 — Port D I/O (RPn remappable) |
| Pino 51 | RD11 — Port D I/O (RPn remappable) |
| Pino 52 | VSS — Ground reference |
| Pino 53 | VDD — Positive supply |
| Pino 54 | RG6 — Port G I/O (RPn remappable) |
| Pino 55 | RG7 — Port G I/O (RPn remappable) |
| Pino 56 | RG8 — Port G I/O (RPn remappable) |
| Pino 57 | RG9 — Port G I/O (RPn remappable) |
| Pino 58 | AVDD — Analog positive supply |
| Pino 59 | AVSS — Analog ground |
| Pino 60 | VBAT — Battery backup input for RTCC |
| Pino 61 | RF12 — Port F I/O (RPn remappable) |
| Pino 62 | RF13 — Port F I/O (RPn remappable) |
| Pino 63 | VDD — Positive supply |
| Pino 64 | VSS — Ground reference |
| Pino 65 | RF0 — Port F I/O (RPn remappable) |
| Pino 66 | RF1 — Port F I/O (RPn remappable) |
| Pino 67 | RG0 — Port G I/O (RPn remappable) |
| Pino 68 | RG1 — Port G I/O (RPn remappable) |
| Pino 69 | RG2 — Port G I/O (RPn remappable) |
| Pino 70 | RG3 — Port G I/O (RPn remappable) |
| Pino 71 | VSS — Ground reference |
| Pino 72 | VDD — Positive supply |
| Pino 73 | RG12 — Port G I/O (RPn remappable) |
| Pino 74 | RG13 — Port G I/O (RPn remappable) |
| Pino 75 | RG14 — Port G I/O (RPn remappable) |
| Pino 76 | RG15 — Port G I/O (RPn remappable) |
| Pino 77 | RC1/T2CK — Port C I/O / Timer2 external clock |
| Pino 78 | RC2/T3CK — Port C I/O / Timer3 external clock |
| Pino 79 | RC3/T4CK — Port C I/O / Timer4 external clock |
| Pino 80 | RC4/T5CK — Port C I/O / Timer5 external clock |
| Pino 81 | VSS — Ground reference |
| Pino 82 | VDD — Positive supply |
| Pino 83 | RC13 — Port C I/O (RPn remappable) |
| Pino 84 | RC14 — Port C I/O (RPn remappable) |
| Pino 85 | RG4 — Port G I/O (RPn remappable) |
| Pino 86 | RG5 — Port G I/O (RPn remappable) |
| Pino 87 | AN14/CN8/RB15A — Analog input 14 / change notification / port B |
| Pino 88 | AN15/CN9/RB15B — Analog input 15 / change notification / port B |
| Pino 89 | RA0 — Port A I/O |
| Pino 90 | RA1 — Port A I/O |
| Pino 91 | RA2 — Port A I/O |
| Pino 92 | RA3 — Port A I/O |
| Pino 93 | VSS — Ground reference |
| Pino 94 | VDD — Positive supply |
| Pino 95 | RA4 — Port A I/O |
| Pino 96 | RF7 — Port F I/O (RPn remappable) |
| Pino 97 | RF8 — Port F I/O (RPn remappable) |
| Pino 98 | RF9 — Port F I/O (RPn remappable) |
| Pino 99 | RF10 — Port F I/O (RPn remappable) |
| Pino 100 | RF11 — Port F I/O (RPn remappable) |
Aplicações típicas
DSPIC33EP256GM310-I/PF é adequado para 6 aplicaçãos: Precision BLDC/PMSM Motor Control, Digital Power Conversion, Industrial Automation and Robotics, Sensor Signal Conditioning and Data Acquisition, Building Automation and HVAC Controls, Embedded Motion Products and Power Tools.
Precision BLDC/PMSM Motor Control
The DSPIC33EP256GM310-I/PF fits precision motor control because its 70 MIPS dsPIC33EP core executes field-oriented control (FOC) loops with single-cycle 17x17 MAC operations, while 8 output-compare channels drive complementary PWM pairs and 4 QEI interfaces decode multiple encoder feedbacks simultaneously. The two on-chip op amps condition current-shunt signals without external amplifiers, cutting BOM cost and analog layout complexity. In a typical servo drive, the DSC runs the current loop at 20-50 kHz PWM with ADC sampling synchronized to PWM triggers for deterministic loop timing. The 256 KB Flash accommodates FOC firmware, communication stacks (CAN/UART), and field-updatable bootloaders with room to spare. Unlike generic MCUs, the DSP engine sustains the trigonometric transforms required for sinewave commutation without saturating the CPU.
Recomendado
Digital Power Conversion
Digital power supplies - PFC stages, LLC resonant converters, and solar micro-inverters - benefit from the DSPIC33EP256GM310's 70 MIPS throughput and high-resolution PWM infrastructure. The 8 output-compare channels and dsPIC33EP PWM module generate phase-shifted and complementary waveforms with programmable dead time, while the fast 12-bit ADC class on this family samples input/output voltage and current at loop rates beyond 100 kHz when properly sequenced. The 256 KB Flash holds control-law firmware, soft-start state machines, and fault-management routines with headroom for future feature additions. Because the DSP engine executes PID and compensator updates in single cycles, the controller maintains stable loop dynamics even at high switching frequencies. The industrial -40C to +85C rating suits enclosed power supplies in factory environments.
Recomendado
Industrial Automation and Robotics
Factory automation nodes - multi-axis robot joints, conveyor controllers, and CNC auxiliary axes - use the DSPIC33EP256GM310-I/PF for its combination of encoder interfaces, communication ports, and DSP-grade math. The 4 QEI modules decode up to four incremental encoders concurrently, enabling coordinated multi-axis motion on a single device. Multiple UART, SPI, and I2C ports link the DSC to drives, sensors, HMIs, and fieldbus bridges, while 100 TQFP pins supply up to 85 GPIOs for limit switches, relays, and status I/O. The 256 KB Flash supports complex motion profiles and protocol stacks, and the 16 KB RAM buffers trajectory segments. Deterministic interrupt latency keeps real-time control loops jitter-free, which is essential for positioning repeatability in robotic applications.
Recomendado
Sensor Signal Conditioning and Data Acquisition
The integrated op amps on the DSPIC33EP256GM310 make it a strong fit for analog front ends: they can amplify bridge, thermocouple, or current-shunt signals on-chip before digitization, eliminating discrete op-amp stages and their associated offset and drift errors. The dsPIC33EP family's fast ADC samples these conditioned signals synchronously with control loops, and the DSP engine applies digital filtering (IIR/FIR) in single-cycle MACs at 70 MIPS. With 16 KB of RAM, the device buffers acquisition windows for averaging or FFT-based condition monitoring, and the 256 KB Flash stores calibration tables and compensation algorithms. Typical deployments include vibration monitoring, precision current measurement in drives, and load-cell interfaces where deterministic timing and on-chip amplification together reduce component count and board area.
Recomendado
Building Automation and HVAC Controls
HVAC air-handling and building automation controllers leverage the DSPIC33EP256GM310's blend of motor control and connectivity. The QEI inputs track damper and fan position encoders, the output-compare/PWM channels drive EC-motor or blower stages with efficient sinewave control, and multiple UART/I2C/SPI ports interface to sensors, displays, and RS-485 gateways. The 256 KB Flash accommodates BAClink/Modbus-style protocol layers alongside control firmware, and 16 KB RAM maintains sensor history and scheduling tables. The integrated op amps condition temperature and pressure sensor signals directly. Operating across -40C to +85C, the industrial-grade device tolerates rooftop and mechanical-room ambient extremes, and the 100-pin TQFP offers ample GPIO for relay banks and status LEDs without port expanders.
Recomendado
Embedded Motion Products and Power Tools
Cordless power tools, e-bike controllers, and hobby-grade motion products use the DSPIC33EP256GM310 for compact, high-performance brushless motor drive. The 70 MIPS core runs sensorless FOC with sliding-mode or back-EMF observers, implemented with the DSP engine's MAC throughput, while 8 output-compare channels deliver the three-phase PWM and brake-chopper control. On-chip op amps amplify low-side shunt currents for sensorless feedback without external amplifiers, a meaningful size and cost benefit in tool housings. The 256 KB Flash holds multiple drive profiles and safety state machines, and the industrial temperature range plus RoHS-compliant lead-free TQFP-100 construction supports volume consumer-manufacturing requirements. Firmware is developed with Microchip MPLAB X and the free XC16 compiler ecosystem.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP256GM310-I/PF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP256GM310-H/PF | DSPIC33EP256GM310-E/PF | DSPIC33EP256MU810-I/PF | DSPIC33EP512GM310-I/PF |
|---|---|---|---|---|---|
| Package | TQFP-100 (14x14 mm) | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB |
| USB Peripheral | No | No | No | Yes (USB 2.0 OTG) | No |
| Lifecycle Status | Active | Active | Active | Active | Active |
Principais diferenciais
- Motor-control-optimized peripheral mix with integrated op amps (vs DSPIC33EP256MU810-I/PF)
- 256 KB Flash at industrial temperature without extended-grade premium (vs DSPIC33EP256GM310-E/PF)
- Flash headroom option on the same footprint (vs DSPIC33EP128GM310-I/PF)
Notas de projeto
The dsPIC33EP core is fed by an internal regulator whose output appears on the VCAP/VDDCORE pin (pin 14). The Microchip datasheet specifies the exact external capacitor (low-ESR ceramic per family datasheet); undersizing it or substituting a high-ESR part is the most common cause of brown-out resets and erratic startup on this family. Decouple each VDD pin pair (there are multiple VDD/VSS pairs across the 100-pin ring) with 0.1 uF ceramics placed within 2 mm of the pins, plus one bulk 4.7-10 uF capacitor.
Keep AVDD/AVSS (pins 58/59) on a quiet analog island: connect AVSS to a solid ground plane with a single low-impedance via, and filter AVDD with an RC or ferrite bead from the digital 3.3V rail. Route the on-chip op-amp input traces away from PWM switching nodes. The 0.5 mm pitch TQFP allows 4-5 mil trace/space routing; fan out with a dogbone pattern and place a via-in-pad-free escape under each side of the package. Provide thermal relief through the ground plane rather than relying on the package, which dissipates little power.
Two recurring issues: (1) MCLR must be pulled up (typically 10k to VDD) and exposed on the programming header - omitting it blocks ICSP debugging with PICkit/ICD tools. (2) Peripheral Pin Select (PPS) means UART/SPI/PWM pins are assigned in firmware, not fixed by hardware - a pinout designed from a generic dsPIC33 diagram may conflict with your PPS map. Always generate the I/O map from the MPLAB X Code Configurator before PCB release. Also budget the PGD/PGC debug pins (RB6/RB7 area) so connectors do not fight application circuitry.
Informações de conformidade
RoHS compliance and lead-free construction consistent with Microchip current production policy for dsPIC33EP TQFP devices; REACH/halogen declarations should be obtained from Microchip product page or distributor.
