DSPIC33EP256GP504-I/ML - 16-bit DSC, 256KB Flash, 44-QFN | Microchip
N.º da peça: DSPIC33EP256GP504-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.58 | $75,80 |
| 100 | $6.74 | $674,00 |
| 500 | $6.12 | $3.060,00 |
| 1.000 | $5.68 | $5.680,00 |
DSPIC33EP256GP504-I/ML Visão geral
What is a Digital Signal Controller? A DSC (Digital Signal Controller) is a hybrid between a microcontroller (MCU) and a digital signal processor (DSP), integrating a deterministic MCU control loop with DSP-class math pipelines (single-cycle MAC, barrel shifter, dual 40-bit accumulators). In the system hierarchy, this DSC sits within microcontrollers -> 16-bit microcontrollers -> DSC family -> dsPIC33E series, allowing engineers to implement closed-loop control, power conversion, and audio/sensor processing in one chip without pairing a separate MCU and DSP.
Key features include a 12-bit, 1.1 Msps ADC with up to 9 S&H channels, three op amps and three analog comparators integrated on-chip for current/voltage sensing, dedicated High-Speed PWM (250 ps resolution) for digital power conversion, dual CAN 2.0b modules, four UART, three SPI, two I2C, and a Peripheral Trigger Generator (PTG) that sequences ADC and PWM events without CPU intervention. The integrated op amps eliminate external signal-conditioning components and reduce PCB area in motor drive and switch-mode power supply designs.
Architecturally, the device pairs a modified Harvard dsPIC33E core with a 16x16-bit single-cycle MAC unit and dual 40-bit accumulators, achieving deterministic interrupt latency of 5 cycles. The 4-cycle instruction fetch and dedicated DSP engine enable advanced control loops (field-oriented control, digital peak current mode) at PWM frequencies well above 100 kHz, while C-compiler-friendly architecture and DSP library support shorten firmware development cycles.
Typical applications include digital switch-mode power supplies (PFC + LLC + DC-DC stages), field-oriented motor control for BLDC/PMSM, solar micro-inverters, audio processing and active noise cancellation, and industrial sensor conditioning. Designers favor the EP 'GP' series for the combination of CAN, USB-less connectivity, and abundant analog peripherals without the cost of USB or graphics controllers. When designing with this part, ensure that the exposed pad (EP) is soldered to a sufficient ground copper pour for thermal dissipation - at 70 MIPS the device can dissipate up to 1 W under sustained DSP load, and the EP reduces junction-to-ambient thermal resistance by 30-50% versus an unconnected EP.
Alternativas drop-in para DSPIC33EP256GP504-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP256GP504-I/ML (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Core, Program Memory (Flash), ADC.
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DSPIC33EP128GP504-I/ML
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Ver ficha técnica →DSPIC33EP256GP504-E/ML
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Ver ficha técnica →DSPIC33EP256GP504-I/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128GM604-I/ML
✅ Drop-In✓ Em estoque
$5.95 / unidade
Ver ficha técnica →DSPIC33EP256GP504-I/ML Classificações máximas e características elétricas
| Core Architecture | dsPIC33E 16-bit DSC (modified Harvard) |
| Maximum CPU Speed | 70 MIPS (60 MHz core clock) |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage Range | 3.0 V to 3.6 V |
| ADC | 12-bit, up to 1.1 Msps, 9 S&H channels |
| Integrated Op Amps | 3 |
| Analog Comparators | 3 |
| PWM Channels | High-Speed PWM, 250 ps resolution |
| CAN Modules | 2x CAN 2.0b |
| UART | 4 |
| SPI | 3 |
| I2C | 2 |
| Timers | 16-bit and 32-bit timers |
| Peripheral Trigger Generator (PTG) | Yes |
| CTMU (Charge Time Measurement Unit) | Yes |
| Encapsulamento | 44-pin QFN (8x8 mm) |
| Temperatura de operação | -40C to +85C (Industrial) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do DSPIC33EP256GP504-I/ML
| Pino 1 | RPB0/RPI40/AN0 — Port B pin 0 / Remappable Peripheral Input 40 / Analog Input 0 |
| Pino 2 | RPB1/RPI41/AN1 — Port B pin 1 / Remappable Peripheral Input 41 / Analog Input 1 |
| Pino 3 | RPB2/RPI42/AN2 — Port B pin 2 / Remappable Peripheral Input 42 / Analog Input 2 |
| Pino 4 | RPB3/RPI43/AN3 — Port B pin 3 / Remappable Peripheral Input 43 / Analog Input 3 |
| Pino 5 | VSS — Ground reference |
| Pino 6 | RPB5/RP13/ASDA1 — Port B pin 5 / Remappable Peripheral 13 / I2C1 SDA |
| Pino 7 | RPB6/RP14/SCK1 — Port B pin 6 / Remappable Peripheral 14 / SPI1 Clock |
| Pino 8 | RPB7/RP15/FSCK1 — Port B pin 7 / Remappable Peripheral 15 / SPI1 Frame Sync |
| Pino 9 | VDD — Positive supply voltage (3.3V) |
| Pino 10 | VSS — Ground reference |
| Pino 11 | RPC0/RP16 — Port C pin 0 / Remappable Peripheral 16 |
| Pino 12 | RPC1/RP17 — Port C pin 1 / Remappable Peripheral 17 |
| Pino 13 | RPC2/RP18 — Port C pin 2 / Remappable Peripheral 18 |
| Pino 14 | RPC3/RP19 — Port C pin 3 / Remappable Peripheral 19 |
| Pino 15 | RPC4/RP20 — Port C pin 4 / Remappable Peripheral 20 |
| Pino 16 | RPC5/RP21 — Port C pin 5 / Remappable Peripheral 21 |
| Pino 17 | RPC6/RP22 — Port C pin 6 / Remappable Peripheral 22 |
| Pino 18 | RPC7/RP23 — Port C pin 7 / Remappable Peripheral 23 |
| Pino 19 | RPB8/RP24 — Port B pin 8 / Remappable Peripheral 24 |
| Pino 20 | RPB9/RP25 — Port B pin 9 / Remappable Peripheral 25 |
| Pino 21 | RPB10/RP26 — Port B pin 10 / Remappable Peripheral 26 |
| Pino 22 | RPB11/RP27 — Port B pin 11 / Remappable Peripheral 27 |
| Pino 23 | RPB12/RP28 — Port B pin 12 / Remappable Peripheral 28 |
| Pino 24 | RPB13/RP29 — Port B pin 13 / Remappable Peripheral 29 |
| Pino 25 | RPB14/RP30 — Port B pin 14 / Remappable Peripheral 30 |
| Pino 26 | RPB15/RP31 — Port B pin 15 / Remappable Peripheral 31 |
| Pino 27 | VDD — Positive supply voltage (3.3V) |
| Pino 28 | VSS — Ground reference |
| Pino 29 | OSCI/CLKI/RA0 — Oscillator input / Port A pin 0 |
| Pino 30 | OSCO/CLKO/RA1 — Oscillator output / Port A pin 1 |
| Pino 31 | RA2 — Port A pin 2 |
| Pino 32 | RA3 — Port A pin 3 |
| Pino 33 | RA4 — Port A pin 4 |
| Pino 34 | RA5 — Port A pin 5 |
| Pino 35 | RA6 — Port A pin 6 |
| Pino 36 | RA7 — Port A pin 7 |
| Pino 37 | RA8 — Port A pin 8 |
| Pino 38 | RA9 — Port A pin 9 |
| Pino 39 | RA10 — Port A pin 10 |
| Pino 40 | MCLR — Master Clear (reset) input, active-low |
| Pino 41 | RB0/PGD1 — Port B pin 0 / Programming Data 1 |
| Pino 42 | RB1/PGC1 — Port B pin 1 / Programming Clock 1 |
| Pino 43 | VSS — Ground reference |
| Pino 44 | VDD — Positive supply voltage (3.3V) |
Aplicações típicas
DSPIC33EP256GP504-I/ML é adequado para 6 aplicaçãos: BLDC / PMSM Motor Control (Field-Oriented Control), Digital Switch-Mode Power Supply (PFC + DC-DC), Solar Micro-Inverter / String Inverter, Industrial Sensor Conditioning & Signal Processing, Audio Processing and Active Noise Cancellation, Automotive Body and HVAC Control Modules.
BLDC / PMSM Motor Control (Field-Oriented Control)
The DSPIC33EP256GP504-I/ML is a benchmark choice for sensorless and sensored BLDC/PMSM motor drives implementing Field-Oriented Control (FOC). The 70 MIPS DSP core executes Clarke/Park transforms and PI current loops within a few microseconds, while the 12-bit ADC with simultaneous sampling captures all three phase currents (Iu, Iv, Iw) in a single conversion cycle. The three integrated op amps condition shunt-resistor voltage drops directly without external amplifiers, reducing BOM cost in FOC inverter boards up to several kW. The 250 ps High-Speed PWM resolution enables switching frequencies above 50 kHz with precise dead-band control, minimizing switching losses in IGBT and MOSFET three-phase bridges. Dual CAN 2.0b ports support CANopen and DeviceNet protocols for industrial servo and pump/fan motor networks. Source: Microchip AN1078, dsPIC33E motor-control family reference designs.
Recomendado
Digital Switch-Mode Power Supply (PFC + DC-DC)
The DSPIC33EP256GP504-I/ML targets digital-controlled switch-mode power supplies including boost PFC stages and isolated DC-DC converters with peak current-mode or average current-mode control. The 12-bit 1.1 Msps ADC samples the inductor current and output voltage with sub-microsecond latency, while the Peripheral Trigger Generator (PTG) sequences ADC sampling synchronized to the PWM edge without CPU intervention. The integrated op amps amplify shunt-current signals directly, eliminating external instrumentation amplifiers in the current-sense path. The 70 MIPS DSP core computes digital compensator (Type-II/Type-III) coefficients in firmware, enabling adaptive loop bandwidth and programmable soft-start profiles. The 256 KB Flash accommodates complex firmware with multiple control loops, telemetry, and PMBus/SMBus communication stacks. Source: Microchip AN1332 digital power conversion reference designs.
Recomendado
Solar Micro-Inverter / String Inverter
The DSPIC33EP256GP504-I/ML is well-suited for solar micro-inverter and string-inverter MPPT control. The 70 MIPS DSP core implements Perturb-and-Observe or Incremental-Conductance MPPT algorithms with sub-millisecond update rates, while the 12-bit ADC tracks PV panel voltage and current simultaneously. The integrated op amps condition PV panel current-sense signals directly, reducing analog front-end complexity in MPPT stages. The dual CAN 2.0b controllers interface with grid-tie synchronization peripherals and central monitoring systems, while UART/SPI channels provide Modbus RTU or wireless communication links. The 256 KB Flash stores grid-compliance firmware, anti-islanding algorithms, and configurable MPPT profiles for different PV module types. Source: Microchip grid-tie inverter reference designs and AN1094 MPPT application notes.
Recomendado
Industrial Sensor Conditioning & Signal Processing
The DSPIC33EP256GP504-I/ML integrates sensor signal conditioning and DSP filtering on a single chip, ideal for industrial sensor nodes. The three integrated op amps amplify low-level thermocouple, RTD, or strain-gauge signals directly, while the 12-bit ADC digitizes conditioned outputs and the DSP engine runs digital filters (FIR, IIR, decimation) for noise reduction. The CTMU (Charge Time Measurement Unit) supports capacitive touch and humidity sensing, while the 256 KB Flash accommodates complex DSP filter tables and calibration coefficients. Dual CAN 2.0b and UART interfaces connect to industrial networks (CANopen, RS-485 Modbus), and the industrial -40C to +85C temperature range supports factory-floor deployment. Source: Microchip AN1299 sensor signal conditioning reference designs.
Recomendado
Audio Processing and Active Noise Cancellation
The DSPIC33EP256GP504-I/ML supports audio processing applications including active noise cancellation, speaker equalization, and acoustic feedback suppression. The 70 MIPS DSP engine executes biquad IIR filters, FIR filters, and adaptive LMS algorithms with deterministic latency, while the 12-bit ADC and DAC peripherals handle 48 kSPS audio sampling rates. The three integrated op amps buffer microphone preamp stages directly, reducing BOM in ANC headphone and hearing-aid designs. The 256 KB Flash stores multi-band EQ coefficients, ANC adaptive filter weights, and codec configuration tables, while the SPI/I2C interfaces connect to external audio CODECs (e.g., AK4621EF). Source: Microchip audio processing libraries for dsPIC33E family.
Recomendado
Automotive Body and HVAC Control Modules
The DSPIC33EP256GP504-I/ML serves automotive body-control and HVAC modules requiring CAN connectivity and robust PWM control. The dual CAN 2.0b controllers interface with vehicle CAN bus networks (body CAN, chassis CAN), while the High-Speed PWM channels drive HVAC blower motors, blend doors, and lighting loads with 250 ps edge resolution. The integrated op amps condition sensor inputs (temperature, pressure, position) directly, reducing analog front-end complexity. The 256 KB Flash stores diagnostic firmware, CAN J1939 stacks, and OTA-bootloader support for field updates, while the industrial temperature range handles under-dash thermal environments. Note: For AEC-Q100 qualified automotive applications, the equivalent -E/ML or -Q automotive-grade variants should be specified. Source: Microchip automotive body-control reference designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP256GP504-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP128GP504-I/ML | DSPIC33EP256GP504-E/ML | DSPIC33EP256GP504-I/MV | DSPIC33EP128GM604-I/ML |
|---|---|---|---|---|---|
| Package | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 128 KB (-50%) | 256 KB (same) | 256 KB (same) | 128 KB (-50%) |
| SRAM | 32 KB | 32 KB (same) | 32 KB (same) | 32 KB (same) | 32 KB (same) |
| Maximum CPU Speed | 70 MIPS | 70 MIPS (same) | 70 MIPS (same) | 70 MIPS (same) | 70 MIPS (same) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Integrated Op Amps | 3 | 3 (same) | 3 (same) | 3 (same) | 3 (same) |
| CAN Controllers | 2 | 2 (same) | 2 (same) | 2 (same) | 2 (same) |
| Graphics Controller | No | No | No | No | Yes (added GFX) |
Principais diferenciais
- Highest-grade Flash density in the 44-pin QFN dsPIC33EP 'GP' family (vs DSPIC33EP128GP504-I/ML)
- Industrial temperature grade standard, with extended grade available as drop-in (vs DSPIC33EP256GP504-E/ML)
- Three integrated op amps reduce BOM cost and PCB area (vs DSPIC33EP128GM604-I/ML)
Notas de projeto
The 44-pin QFN package features an exposed thermal pad (EP) at the package center that MUST be soldered to a ground copper pour for proper thermal dissipation. Estimated: at 70 MIPS CPU load with all peripherals active, the device dissipates up to 0.8 W to 1.0 W sustained; with EP connected to a 1 square inch ground pour on a 4-layer PCB, theta_JA is approximately 28 C/W. Without proper EP soldering, junction temperature can exceed 125C limits under heavy DSP load, triggering thermal shutdown.
Decouple all VDD/VSS pin pairs with 100 nF ceramic capacitors placed within 3 mm of each supply pin, plus a single 4.7 uF to 10 uF bulk capacitor near the package. The analog supply AVDD requires an additional ferrite bead or L-C filter from VDD to isolate ADC reference noise from digital switching. Estimated: PCB trace inductance above 10 nH on the supply path can cause ADC reference droop during PWM transitions, degrading conversion accuracy by 2-3 LSB.
Route the analog input traces (AN0-AN12) as differential pairs with ground guard traces to minimize crosstalk from PWM switching edges. Place the op amp feedback components within 5 mm of the op amp pins to avoid parasitic capacitance that creates oscillation above 1 MHz. The PWM output traces should be kept short and routed away from analog inputs - a 20 mm parallel trace can couple 30 mV of switching noise into a high-impedance analog input, exceeding the 12-bit ADC's 1 LSB at 3.3V FS.
Do not skip the MCLR pull-up resistor or leave the MCLR pin floating - this causes erratic reset behavior. Ensure the PGECx/PGEDx programming pins are accessible in production for firmware updates; routing them to test pads or a debug header prevents expensive board rework. The configuration bits (FOSC, FWDT, etc.) MUST be set correctly in code before programming - incorrect configuration bits can permanently disable the device's debugging interface, requiring high-voltage ICSP recovery.
When using the integrated op amps in transimpedance configuration for current sensing, add a 10 pF to 33 pF feedback capacitor in parallel with the gain resistor to prevent oscillation. Estimated: without compensation, op-amp unity-gain bandwidth above 10 MHz combined with shunt-resistor parasitic inductance (typically 5-15 nH) creates Q-factor peaking above 20 MHz that couples into ADC sampling. Place the shunt resistor within 5 mm of the op amp input pin and use a star-ground return path.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Standard industrial -40C to +85C grade; AEC-Q100 qualification not applicable for the I/ML suffix variant. For AEC-Q100 qualified automotive applications, the equivalent -E/ML extended grade or dedicated automotive part number should be specified.