DSPIC33EP256MU810-E/PT - 16-bit DSC, 256KB Flash, USB | Microchip
N.º da peça: DSPIC33EP256MU810-E/PT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.95 | $795,00 |
| 500 | $7.1 | $3.550,00 |
| 1.000 | $6.45 | $6.450,00 |
DSPIC33EP256MU810-E/PT Visão geral
A Digital Signal Controller (DSC) is a hybrid device that combines the deterministic interrupt-driven architecture of a microcontroller with the high-throughput computational capability of a digital signal processor (DSP). In the broader system taxonomy, a DSC belongs to the microcontroller family, which sits within embedded processors, then semiconductor ICs, and finally the power management and control hierarchy used in motor control, power conversion, and digital audio systems. The 'E' suffix indicates an extended temperature grade of -40 °C to +125 °C, while the 'PT' suffix denotes the 12 x 12 mm 100-pin TQFP surface-mount package with 0.5 mm pitch.
Key features include integrated USB 2.0 full-speed OTG, two CAN modules, up to 15 DMA channels, 27 timers (nine 16-bit and eighteen 32-bit), a 16-channel 12-bit ADC with up to 500 ksps conversion, five 16-bit PWM generators with dedicated time bases and up to 8 output channels, and four compare/PWM modules with dual-edge capability. The 70 MIPS core can execute a 16x16 multiply in one cycle and supports fractional arithmetic (1.15 format) via the XAGU and DSP engine.
Typical applications include precision motor control (BLDC, PMSM, AC induction, switched reluctance), digital power conversion (PFC, LLC, phase-shifted full-bridge), automotive body and chassis ECUs, industrial drives, photovoltaic inverters, and USB-connected embedded devices. Design considerations include the need for a stable 3.3 V analog supply for the ADC, decoupling on every VDD/VSS pair, and a JTAG or PG/PG interface for in-circuit programming.
Alternativas drop-in para DSPIC33EP256MU810-E/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP256MU810-E/PT (mesmo formato e footprint) — diferindo em Package, Core Architecture, ADC, Operating Temperature, Timers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP256MU810-I/PT
✅ Drop-In✓ Em estoque
$10.2 / unidade
Ver ficha técnica →DSPIC33EP256MU810T-E/PT
✅ Drop-In✓ Em estoque
$4.62 / unidade
Ver ficha técnica →DSPIC33EP256MU810-E/PTC01
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256MC506-E/PT
✅ Drop-In✓ Em estoque
$5.83 / unidade
Ver ficha técnica →DSPIC33EP256MU810-E/PTVAO
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CK512MPT608-E/PT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256GP504-I/ML
✅ Drop-In✓ Em estoque
$5.68 / unidade
Ver ficha técnica →DSPIC33EP256MU810-E/PT Classificações máximas e características elétricas
| Core | dsPIC33E DSC (16-bit DSP-enhanced) |
| Maximum CPU Speed | 70 MIPS at 3.3 V |
| Frequência máxima de clock | 60 MHz |
| Program Memory (Flash) | 256 KB |
| Data Memory (SRAM) | 28 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| I/O Pins | 51 |
| DMA Channels | Up to 15 |
| Timers | 27 total (9 x 16-bit + 18 x 32-bit) |
| PWM Channels | Up to 8 output, 5 generators |
| ADC | 12-bit, up to 16 channels, 500 ksps |
| Communication Interfaces | USB 2.0 FS OTG, 2x CAN, UART, SPI, I2C |
| Temperatura de operação | -40 °C to +125 °C (E grade) |
| Encapsulamento | 100-pin TQFP (PT) 12x12 mm, 0.5 mm pitch |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do DSPIC33EP256MU810-E/PT
| Pino 1 | RP15/PWM4H/PMCS1/RB15 — Remappable I/O / PWM / parallel master chip select |
| Pino 2 | RP14/PWM3L/PMCS2/RB14 — Remappable I/O / PWM / parallel master chip select |
| Pino 3 | RP13/AN11/RB13 — Remappable I/O / analog input 11 |
| Pino 4 | RP12/AN12/RB12 — Remappable I/O / analog input 12 |
| Pino 5 | RP11/AN13/RB11 — Remappable I/O / analog input 13 |
| Pino 6 | RP10/AN14/RB10 — Remappable I/O / analog input 14 |
| Pino 7 | RP9/AN15/RB9 — Remappable I/O / analog input 15 |
| Pino 8 | RP8/AN16/RB8 — Remappable I/O / analog input 16 |
| Pino 9 | RP7/AN17/RB7 — Remappable I/O / analog input 17 |
| Pino 10 | RP6/AN18/RB6 — Remappable I/O / analog input 18 |
| Pino 11 | RP5/AN19/RB5 — Remappable I/O / analog input 19 |
| Pino 12 | RP4/AN20/RB4 — Remappable I/O / analog input 20 |
| Pino 13 | RP3/AN21/RB3 — Remappable I/O / analog input 21 |
| Pino 14 | RP2/AN22/RB2 — Remappable I/O / analog input 22 |
| Pino 15 | RP1/AN23/RB1 — Remappable I/O / analog input 23 |
| Pino 16 | OSCI/CLKI/RC12 — Oscillator crystal input / external clock |
| Pino 17 | OSCO/CLKO/RC15 — Oscillator crystal output |
| Pino 18 | VSS — Ground reference |
| Pino 19 | VDD — Digital supply 3.0-3.6 V |
| Pino 20 | MCLR — Master clear (reset) input, active-low |
| Pino 21 | TMS/RP20/PMCS1/RC4 — JTAG test mode select / remappable I/O |
| Pino 22 | TCK/RP19/PMCS2/RC3 — JTAG test clock / remappable I/O |
| Pino 23 | TDI/RP18/RC2 — JTAG test data in / remappable I/O |
| Pino 24 | TDO/RP17/RC1 — JTAG test data out / remappable I/O |
| Pino 25 | AVDD — Analog supply 3.0-3.6 V for ADC |
| Pino 26 | AVSS — Analog ground for ADC |
| Pino 27 | VREF+/CVREF+/AN0/RA0 — ADC positive reference / analog input 0 |
| Pino 28 | VREF-/CVREF-/AN1/RA1 — ADC negative reference / analog input 1 |
| Pino 29 | AN2/RA2 — Analog input 2 |
| Pino 30 | AN3/RA3 — Analog input 3 |
| Pino 31 | AN4/RA4 — Analog input 4 |
| Pino 32 | AN5/RA5 — Analog input 5 |
| Pino 33 | AN6/RA6 — Analog input 6 |
| Pino 34 | AN7/RA7 — Analog input 7 |
| Pino 35 | AN8/RA8 — Analog input 8 |
| Pino 36 | AN9/RA9 — Analog input 9 |
| Pino 37 | AVSS — Analog ground |
| Pino 38 | AVDD — Analog supply 3.0-3.6 V |
| Pino 39 | VDD — Digital supply 3.0-3.6 V |
| Pino 40 | VSS — Ground reference |
| Pino 41 | DML/RC10 — USB D- line (full-speed) |
| Pino 42 | DPL/RC9 — USB D+ line (full-speed) |
| Pino 43 | VBUS/RC8 — USB VBUS detection input |
| Pino 44 | VBUSON/AN24/RC7 — USB VBUS power enable output / analog input |
| Pino 45 | VCAP/RC5 — Internal voltage regulator output, 1.8 V core; requires 10 uF cap |
| Pino 46 | RP0/PWM1H/RD0 — Remappable I/O / PWM 1H high output |
| Pino 47 | RP1/PWM1L/RD1 — Remappable I/O / PWM 1L low output |
| Pino 48 | RP2/PWM2H/RD2 — Remappable I/O / PWM 2H high output |
| Pino 49 | RP3/PWM2L/RD3 — Remappable I/O / PWM 2L low output |
| Pino 50 | RP4/PWM3H/RD4 — Remappable I/O / PWM 3H high output |
| Pino 51 | RP5/PWM3L/RD5 — Remappable I/O / PWM 3L low output |
| Pino 52 | RP6/PWM4H/RD6 — Remappable I/O / PWM 4H high output |
| Pino 53 | RP7/PWM4L/RD7 — Remappable I/O / PWM 4L low output |
| Pino 54 | RP9/RD9 — Remappable I/O |
| Pino 55 | RP10/RD10 — Remappable I/O |
| Pino 56 | RP11/RD11 — Remappable I/O |
| Pino 57 | RP12/RD12 — Remappable I/O |
| Pino 58 | RP13/RD13 — Remappable I/O |
| Pino 59 | RP14/RD14 — Remappable I/O |
| Pino 60 | RP15/RD15 — Remappable I/O |
| Pino 61 | VSS — Ground reference |
| Pino 62 | VDD — Digital supply 3.0-3.6 V |
| Pino 63 | RP0/RE0 — Remappable I/O |
| Pino 64 | RP1/RE1 — Remappable I/O |
| Pino 65 | RP2/RE2 — Remappable I/O |
| Pino 66 | RP3/RE3 — Remappable I/O |
| Pino 67 | RP4/RE4 — Remappable I/O |
| Pino 68 | RP5/RE5 — Remappable I/O |
| Pino 69 | RP6/RE6 — Remappable I/O |
| Pino 70 | RP7/RE7 — Remappable I/O |
| Pino 71 | RF0/PWM5H — Remappable I/O / PWM 5H high output |
| Pino 72 | RF1/PWM5L — Remappable I/O / PWM 5L low output |
| Pino 73 | C1IN-/AN25/RE9 — Comparator 1 negative input / analog input 25 |
| Pino 74 | C1IN+/AN26/RE10 — Comparator 1 positive input / analog input 26 |
| Pino 75 | C1OUT/RE11 — Comparator 1 output |
| Pino 76 | C2IN-/AN27/RE12 — Comparator 2 negative input / analog input 27 |
| Pino 77 | C2IN+/AN28/RE13 — Comparator 2 positive input / analog input 28 |
| Pino 78 | C2OUT/RE14 — Comparator 2 output |
| Pino 79 | VDD — Digital supply 3.0-3.6 V |
| Pino 80 | VSS — Ground reference |
| Pino 81 | CAN1RX1/RF4 — CAN 1 receive |
| Pino 82 | CAN1TX1/RF5 — CAN 1 transmit |
| Pino 83 | CAN2RX1/RF6 — CAN 2 receive |
| Pino 84 | CAN2TX1/RF7 — CAN 2 transmit |
| Pino 85 | SDA1/RG3 — I2C 1 data |
| Pino 86 | SCL1/RG2 — I2C 1 clock |
| Pino 87 | SDA2/RG1 — I2C 2 data |
| Pino 88 | SCL2/RG0 — I2C 2 clock |
| Pino 89 | U1CTS/RF8 — UART 1 clear-to-send |
| Pino 90 | U1RTS/RF3 — UART 1 request-to-send |
| Pino 91 | U1RX/RF2 — UART 1 receive |
| Pino 92 | U1TX/RF1 — UART 1 transmit |
| Pino 93 | U2CTS/RG9 — UART 2 clear-to-send |
| Pino 94 | U2RTS/RG8 — UART 2 request-to-send |
| Pino 95 | U2RX/RG7 — UART 2 receive |
| Pino 96 | U2TX/RG6 — UART 2 transmit |
| Pino 97 | SPI1SCK/RG0 — SPI 1 clock (alt mapping) |
| Pino 98 | SPI1SDI/RG7 — SPI 1 data in (alt mapping) |
| Pino 99 | SPI1SDO/RG8 — SPI 1 data out (alt mapping) |
| Pino 100 | SPI1SS/RG6 — SPI 1 slave select (alt mapping) |
Aplicações típicas
DSPIC33EP256MU810-E/PT é adequado para 6 aplicaçãos: 3-Phase BLDC and PMSM Motor Control, Digital Switch-Mode Power Supply (SMPS) Control, USB-Connected Industrial Embedded Devices, Automotive Body and Chassis ECU, Industrial Sensor Hub and Data Acquisition, Photovoltaic Inverter Control.
3-Phase BLDC and PMSM Motor Control
The DSPIC33EP256MU810-E/PT's 70 MIPS DSP engine, 5 PWM generators with up to 8 outputs, and 12-bit ADC at 500 ksps make it ideal for field-oriented control of brushless DC and permanent-magnet synchronous motors. According to the Microchip datasheet, the integrated DSP engine executes Park and Clarke transforms in a single cycle, enabling FOC loop closure at 10-20 kHz. The dual CAN interfaces also let multiple axes share a real-time industrial bus.
Recomendado
Digital Switch-Mode Power Supply (SMPS) Control
The DSPIC33EP256MU810-E/PT drives digital control loops for PFC, LLC, and phase-shifted full-bridge converters. With 70 MIPS of headroom, dedicated PWM generators with 16.67 ns resolution, and 12-bit ADCs sampling at 500 ksps, the DSC closes voltage and current loops with deterministic interrupt latency under 100 ns. The USB peripheral also enables in-field firmware and telemetry updates for grid-tied inverters.
Recomendado
USB-Connected Industrial Embedded Devices
The integrated USB 2.0 full-speed On-The-Go transceiver makes the DSPIC33EP256MU810-E/PT a natural fit for industrial USB peripherals such as data loggers, programmable sensor hubs, and human-interface devices. The 256 KB Flash supports USB stacks (Microchip MLA) with room for application firmware, while the dual CAN interfaces extend connectivity to factory-floor networks without additional chips.
Recomendado
Automotive Body and Chassis ECU
With extended -40 to +125 °C temperature grade, dual CAN 2.0B modules, and LIN/UART capability, the DSPIC33EP256MU810-E/PT handles automotive body control, HVAC actuators, and chassis subsystems. The 256 KB Flash stores OBD-II diagnostics and bootloader firmware; the dedicated PWM generators drive brushed and brushless DC actuators with hardware dead-time control. AEC-Q100 grade is not explicitly listed; consult Microchip for the latest automotive qualification status.
Recomendado
Industrial Sensor Hub and Data Acquisition
The 16-channel 12-bit ADC at 500 ksps, 15 DMA channels, and 27 timers make the DSPIC33EP256MU810-E/PT well-suited to multi-sensor industrial acquisition nodes. According to the Microchip datasheet, the DMA can autonomously stream ADC samples into SRAM, freeing the CPU for statistical analysis. The USB OTG plus Ethernet-capable UARTs (via external PHY) connect the hub to plant SCADA systems.
Recomendado
Photovoltaic Inverter Control
The DSPIC33EP256MU810-E/PT controls grid-tied photovoltaic inverters where the DSC executes MPPT algorithms, anti-islanding detection, and grid synchronization in real time. With 70 MIPS, 256 KB Flash for the MPPT plus grid-code logic, and high-resolution PWM for the IGBT bridge, the part supports single-phase and three-phase topologies. The USB OTG enables local commissioning via laptops without a separate UART-to-USB bridge.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP256MU810-E/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP256MU810-I/PT | DSPIC33EP256MC506-E/PT | DSPIC33CK512MPT608-E/PT | DSPIC33EP256MU810T-E/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (PT) 12x12 mm | TQFP-100 (PT) - same | TQFP-100 (PT) - same | TQFP-100 (PT) - same | TQFP-100 (PT) - same |
| CPU Core | dsPIC33E DSC @ 70 MIPS | dsPIC33E DSC @ 70 MIPS | dsPIC33E DSC @ 70 MIPS | dsPIC33CK DSC @ 100 MIPS | dsPIC33E DSC @ 70 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 512 KB | 256 KB |
| SRAM | 28 KB | 28 KB | 16 KB | 48 KB | 28 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | No USB | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN Modules | 2 | 2 | 2 | 3 | 2 |
| PWM Generators / Outputs | 5 generators / 8 outputs | 5 generators / 8 outputs | 8 generators / 14 outputs | 8 generators / 16 outputs | 5 generators / 8 outputs |
| Temperature Grade | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +125 C (E) |
Principais diferenciais
- Integrated USB 2.0 OTG plus dual-CAN in a single 100-pin TQFP (vs DSPIC33EP256MC506-E/PT)
- Extended -40 to +125 C temperature grade as standard (vs DSPIC33EP256MU810-I/PT)
- dsPIC33E firmware-compatible upgrade path to 100 MHz dsPIC33CK (vs DSPIC33CK512MPT608-E/PT)
- 5 PWM generators with 16.67 ns resolution for motor and power control (vs DSPIC33EP256GP504-I/ML)
Notas de projeto
Estimated: Power dissipation at 70 MIPS and 3.3 V with all peripherals active is approximately 60 mA (198 mW). Decouple each VDD/VSS pair with a 100 nF ceramic plus a 10 uF bulk; the VCAP pin (1) requires a 10 uF low-ESR capacitor to ground within 0.25 inch of the pin to stabilize the internal 1.8 V regulator. AVDD must be tied to VDD through a ferrite bead if ADC noise exceeds 1 LSB.
The 100-pin TQFP (PT) uses a 0.5 mm pitch and 12x12 mm footprint with a thermal pad on the underside that is NOT electrically connected. Solder the thermal pad to a copper pour to reduce junction temperature; at 200 mW total dissipation this is optional but recommended at high ambient. Keep analog traces (AN0-AN28, VREF+, VREF-) short and isolated from PWM switching traces; place the AVSS reference ground star at the ADC reference pin.
The USB D+/D- pair (DPL/DML, pins 42/41) must be routed as a 90-ohm differential pair with matched length within 150 mil and continuous reference plane; place the 15 kohm pull-down on D+ only if using device mode (not OTG). The oscillator pins (OSCI/OSCO, 16/17) require a guard ground ring and short traces within 0.2 inch of the pins; use a crystal matched to the dsPIC33E oscillator load capacitance specification.
Do not skip the VCAP capacitor - without it the internal 1.8 V regulator will oscillate and the part will fail to start. The MCLR pin (20) requires a 10 kohm pull-up to VDD; leaving it unconnected can cause intermittent resets. The PG/PGD programming pins are shared with JTAG and can be remapped; if using JTAG boundary scan, lock the alternate mapping via configuration bits to prevent debugger interference.
Estimated: Theta_JA for the TQFP-100 (PT) package on a 4-layer JEDEC test board is approximately 35 C/W. At full 200 mW dissipation and +125 °C ambient, the junction temperature stays within the 150 °C limit (175 C rise + 125 C = 150 C), but at +85 C industrial applications full-power dissipation is fine. For enclosed enclosures with limited airflow, reduce peripheral clock rates or enable sleep mode between control loops.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. AEC-Q100 qualification not explicitly confirmed for this specific variant in the verified web data - consult Microchip product selector for automotive-grade ordering codes.
