DSPIC33EV128GM104T-I/ML - 16-bit 70MIPS 5V DSC | Microchip
N.º da peça: DSPIC33EV128GM104T-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.87 | $48,70 |
| 100 | $4.32 | $432,00 |
| 500 | $3.89 | $1.945,00 |
| 1.000 | $3.51 | $3.510,00 |
DSPIC33EV128GM104T-I/ML Visão geral
A digital signal controller combines the computational power of a DSP engine with the peripherals, interrupt architecture, and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits between a general-purpose MCU and a dedicated DSP: it executes both tight control loops and signal-processing tasks such as motor-control field-oriented control, digital filters, and CAN-based communication stacks in a single chip.
Key differentiating features include the 5 V tolerant operating range, which improves noise immunity and sensor interfacing in harsh electrical environments; on-chip CAN networking for automotive and industrial fieldbus connectivity; ECC Flash memory that detects and corrects single-bit errors for functional-safety designs (the part is listed by DigiKey as a Functional Safety (FuSa) qualified device); and 70 MIPS throughput from the dsPIC DSC core with DSP multiply-accumulate instructions.
The architecture pairs a 16-bit modified Harvard core with a DSP engine (single-cycle MAC, dual operand fetch), 4 DMA channels that move data between peripherals and RAM without CPU intervention, and 7 timers for PWM generation, event capture, and task scheduling. The 44-QFN exposed-pad package improves thermal dissipation and grounding integrity for high-frequency switching applications.
Typical applications include BLDC and PMSM motor control in appliances and industrial drives, automotive body and auxiliary systems with CAN networking, and robust 5 V industrial control nodes where analog peripherals must interface directly with 24 V-adjacent sensing circuitry.
A key design consideration is that the core runs up to 70 MIPS at 5 V; decouple the VDD rails with low-ESR ceramics close to the QFN pins and use the exposed pad as a solid ground return to keep switching noise from motor PWM out of the analog front end.
This page synthesizes distributor inventory, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EV128GM104T-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EV128GM104T-I/ML (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Packaging, CAN, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EV128GM104T-E/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EV256GM104T-I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EV64GM104T-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.3 / unidade
Ver ficha técnica →DSPIC33EV32GM104T-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.95 / unidade
Ver ficha técnica →DSPIC33EV128GM104-E/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →DSPIC33EV128GM104T-I/ML Classificações máximas e características elétricas
| Core | 16-bit dsPIC DSC |
| Core Performance | 70 MIPS |
| Program Memory (Flash) | 128 KB (43K x 24) with ECC |
| RAM | 8 KB |
| Supply Voltage Range | 4.5 V to 5.5 V |
| Encapsulamento | 44-QFN (8x8 mm), exposed pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (I grade) |
| DMA Channels | 4 |
| Timers | 7 |
| CAN | Yes (on-chip CAN module) |
| Functional Safety Qualification | FuSa (per DigiKey listing) |
| Series | dsPIC33EV128GM1 |
| Packaging | Tape and Reel (T suffix) |
| Status RoHS | RoHS compliant (per distributor listing) |
Guia de Configuração de Pinos do DSPIC33EV128GM104T-I/ML 44-qfn (8x8 mm), exposed pad
Configuração de pinos para DSPIC33EV128GM104T-I/ML (pacote 44-qfn (8x8 mm), exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EV128GM104T-I/ML.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EV128GM104T-I/ML é adequado para 6 aplicaçãos: BLDC/PMSM Motor Control, Automotive CAN Nodes, Appliance Control Boards, Industrial Sensor and Control Nodes, Digital Power Conversion, Functional-Safety Embedded Control.
BLDC/PMSM Motor Control
The DSPIC33EV128GM104T-I/ML fits motor-control applications because its 70 MIPS DSP core executes single-cycle multiply-accumulate instructions for field-oriented control (FOC) loops, while the seven timers generate complementary PWM outputs for three-phase inverters. According to Microchip, the dsPIC33EV family is explicitly designed as a 5V robust DSC for motor control in harsh appliance and industrial environments. The 4 DMA channels transfer ADC current-sense samples to RAM without CPU intervention, keeping the control-loop jitter low. Operating directly at 4.5-5.5 V, the DSC interfaces with gate drivers and shunt amplifiers without level shifting. Place it in a QFN-44 board with the exposed pad grounded to the power-ground plane to keep PWM switching noise out of the analog sense lines.
Recomendado
Automotive CAN Nodes
The on-chip CAN module makes the DSPIC33EV128GM104T-I/ML suitable for automotive body, auxiliary, and industrial fieldbus nodes. Microchip markets the dsPIC33EV family for automotive and harsh applications, and the 5 V supply tolerance improves immunity to load-dump transients and noisy wiring harnesses common in vehicles. The 128 KB ECC Flash protects firmware integrity against single-bit upsets, a foundation for functional-safety requirements (DigiKey lists this part as FuSa qualified). The 70 MIPS core runs protocol stacks and application logic concurrently. Designers typically pair the controller with a 5 V CAN transceiver and place the QFN near the connector with solid grounding on the exposed pad to meet EMC requirements in electrically noisy 12 V/24 V vehicle systems.
Recomendado
Appliance Control Boards
Home and commercial appliances combine motors, heaters, user interfaces, and safety interlocks in electrically noisy 5 V-adjacent environments, which is exactly the operating envelope Microchip cites for the dsPIC33EV family. The DSPIC33EV128GM104T-I/ML runs the main control loop at 70 MIPS, handles PWM for induction or universal-motor drives, and its 5 V I/O connects directly to relays, sensors, and user-interface circuitry without external level converters. The 128 KB ECC Flash stores firmware plus appliance-specific calibration tables, and the industrial -40C to +85C rating covers unheated laundry rooms and freezer compartments. The 8x8 mm QFN keeps the controller footprint small on cost-sensitive single-sided power boards, with the exposed pad providing thermal relief near heater-drive circuitry.
Recomendado
Industrial Sensor and Control Nodes
In industrial installations, sensor heads and actuator controllers must tolerate 24 V system transients while delivering deterministic processing. The DSPIC33EV128GM104T-I/ML operates from 4.5-5.5 V, so its analog and digital I/O tolerate the noise margins of industrial cabinets, and its DSP engine implements digital filtering (IIR/FIR) of sensor signals at 70 MIPS. The seven timers support precise sampling scheduling, and 4 DMA channels stream ADC results for spectrum analysis or condition monitoring. CAN networking allows daisy-chained nodes on a factory line without additional communication controllers. The 44-QFN 8x8 mm package with exposed pad mounts on standard two-layer control boards; a solid ground pour under the QFN and 100 nF decoupling at every VDD pin maintain ADC accuracy in switching-noise-rich environments.
Recomendado
Digital Power Conversion
Switching power supplies, PFC stages, and DC-DC converters benefit from the DSPIC33EV128GM104T-I/ML's combination of fast DSP math and precision timing. The 70 MIPS core closes voltage-mode or current-mode control loops with sample rates in the tens of kilohertz using single-cycle MAC instructions, while the timer modules generate high-resolution PWM for the power stage. The 5 V supply allows direct interface with gate-driver logic and current-shunt amplifiers common in digital power designs. The 128 KB ECC Flash accommodates compensation algorithms, soft-start state machines, and fault-handling tables. Because the DSC executes control software, designers can tune loop parameters in firmware rather than analog compensation networks, and the FuSa qualification and ECC Flash support power systems destined for safety-relevant infrastructure.
Recomendado
Functional-Safety Embedded Control
DigiKey classifies the DSPIC33EV128GM104T-I/ML within Microchip's Functional Safety (FuSa) dsPIC33EV offering, making it a candidate for safety-related embedded controllers in industrial and appliance equipment. The hardware foundation is the 128 KB ECC Flash, which detects and corrects single-bit memory errors during execution, plus the robust 5 V process technology that tolerates supply and EMI stress better than low-voltage CMOS. The 70 MIPS core runs application logic and diagnostic routines (RAM tests, watchdog supervision, ADC cross-checks) concurrently. Design teams must still complete the safety lifecycle with Microchip's functional-safety documentation packages and certify the end product under the applicable standard. The QFN-44 footprint and active lifecycle status ensure long-term sourcing for products with decade-long certification and service lifetimes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EV128GM104T-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EV128GM104T-E/ML | DSPIC33EV256GM104T-I/ML | DSPIC33EV64GM104T-I/ML | DSPIC33EV32GM104T-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 70 MIPS, 16-bit | 70 MIPS, 16-bit | 70 MIPS, 16-bit | 70 MIPS, 16-bit | 70 MIPS, 16-bit |
| Program Flash | 128 KB (43K x 24) ECC | 128 KB (43K x 24) ECC | 256 KB (86K x 24) ECC | 64 KB (21K x 24) ECC | 32 KB (11K x 24) ECC |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| CAN / DMA / Timers | CAN, 4 DMA, 7 timers | CAN, 4 DMA, 7 timers | CAN, 4 DMA, 7 timers | CAN, 4 DMA, 7 timers | CAN, 4 DMA, 7 timers |
Principais diferenciais
- Extended temperature option on identical die (vs DSPIC33EV128GM104T-E/ML)
- Firmware headroom without redesign (vs DSPIC33EV64GM104T-I/ML)
- Functional-safety supported memory (vs DSPIC33EV32GM104T-I/ML)
Notas de projeto
The exposed pad on the 44-QFN 8x8 mm package is the primary ground and thermal path. Create a grounded PCB pad under the QFN with a 3x3 (or denser) array of vias to the ground plane and ensure full solder coverage - an unsoldered or voided pad causes ground bounce at 70 MIPS and raises junction temperature during motor PWM operation. Place one 100 nF X7R ceramic capacitor within 2 mm of every VDD pin, plus a 10 uF bulk capacitor near the supply entry. Connect AVSS to the same solid ground and feed AVDD through an RC (e.g., ferrite bead + 1 uF) filter from the 5 V rail for ADC accuracy.
Verify the temperature suffix before approving the BOM: this -I part is rated -40C to +85C, while the -E variant covers -40C to +125C per Microchip USA data. Designs mounted near motor windings, heaters, or engine bays must use the E grade even if ambient air is cold. Also confirm the T suffix (tape and reel) matches your assembly-line feeder requirements; the same die is available in non-reel packaging. Finally, since ECC Flash is central to FuSa claims, do not disable ECC-related configuration in bootloader projects intended for safety-certified products.
At 5 V and 70 MIPS, dsPIC33EV output edges are fast enough to cause crosstalk on adjacent QFN pins carrying analog signals. Keep ADC input traces away from PWM output pins, guard them with ground traces, and route them on a layer adjacent to the ground plane. For CAN, use a transceiver (e.g., MCP2562) placed close to the connector with a split-termination network per the transceiver datasheet, and keep the CAN stub lengths under one-third of the bit-time propagation length. Estimated: keeping PWM rise edges from sharing a return path with the analog ground can reduce ADC noise by tens of LSB counts in switching systems.
Informações de conformidade
Distributor listing describes the part as RoHS compliant ("16-bit MCU/DSC, 128 KB, 8192 Bytes, 70 MHz, 4.5 to 5.5V, QFN-44, RoHS"). AEC-Q100 and REACH declarations should be obtained from Microchip product compliance documentation.