EP1AGX35DF780I6N - Arria GX FPGA, 33.5K LE, 3.125 Gbps Transceiver | Intel
N.º da peça: EP1AGX35DF780I6N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EP1AGX35DF780I6N Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic functionality is defined after manufacturing through configuration bitstream programming. Arria GX belongs to Altera's mid-range FPGA family hierarchy: FPGA > programmable logic > structured ASIC alternative. Arria GX was specifically designed for high-speed serial I/O, embedding multi-gigabit transceivers (MGTs) on-chip to accelerate protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and SerialLite II. FPGAs occupy the broader category of programmable logic devices (PLDs), alongside CPLDs and configuration memory.
Key features of the EP1AGX35DF780I6N include 1,676 logic array blocks (LABs) for fine-grained combinational and sequential logic, embedded 18x18 multipliers for DSP acceleration, and on-chip RAM blocks totaling approximately 1.35 Mbit. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, allowing direct interfacing with DDR/DDR2 SDRAM memories. Configuration can be loaded via passive serial, fast passive parallel, or JTAG modes.
Typical applications include communications infrastructure (baseband processing, protocol bridging), industrial imaging and video processing, test and measurement instrumentation, and military/aerospace signal processing. The 780-pin FC-FBGA package provides the high pin density required for the device's 341 user I/Os plus dedicated transceiver, clock, and configuration pins.
When designing with this device, ensure that the PCB land pattern matches the 780-ball FC-FBGA footprint and that the transceiver reference clock jitter meets the 3.125 Gbps link budget. Industrial-grade screening means careful attention to thermal management for full-temperature operation. This page synthesizes distributor pricing, package-accurate drop-in alternatives, and practical design notes that are not present in the manufacturer datasheet alone.
Alternativas drop-in para EP1AGX35DF780I6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1AGX35DF780I6N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Transceivers, RoHS Status, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1AGX35DF780C6N
✅ Drop-In✓ Em estoque
$199.5 / unidade
Ver ficha técnica →EP1AGX35DF780I6
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →EP1AGX35DF780I5N
✅ Drop-In✓ Em estoque
$225 / unidade
Ver ficha técnica →EP1AGX35DF780C6
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP1AGX35DF780C5N
✅ Drop-In✓ Em estoque
$198 / unidade
Ver ficha técnica →EP1AGX35DF780
✅ Drop-In✓ Em estoque
$142.6 / unidade
Ver ficha técnica →EP1AGX20CF780I6N
✅ Drop-In✓ Em estoque
$295 / unidade
Ver ficha técnica →EP1AGX35DF780I6N Classificações máximas e características elétricas
| Series | Arria GX |
| Family | Arria GX FPGA |
| Logic Elements | 33,520 |
| Number of LABs/CLBs | 1676 |
| Total RAM Bits | 1,350,144 (1350 Kbit) |
| Number of I/O | 341 |
| Transceiver Data Rate | 3.125 Gbps |
| Technology Node | 90 nm |
| Core Voltage | 1.2 V |
| Temperatura de operação | -40C to +100C (Industrial) |
| Speed Grade | 6 |
| Package Type | 780-ball FC-FBGA |
| Tipo de montagem | Surface Mount |
| Lead Free / RoHS | Lead free / RoHS Compliant |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG |
Guia de Configuração de Pinos do EP1AGX35DF780I6N 780-ball fc-fbga
Configuração de pinos para EP1AGX35DF780I6N (pacote 780-ball fc-fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1AGX35DF780I6N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1AGX35DF780I6N é adequado para 7 aplicaçãos: Telecom Backhaul and Protocol Bridging, Industrial Imaging and Video Processing, Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Medical Imaging and Diagnostic Equipment, Broadcast Video Infrastructure, Industrial Factory Automation Controllers.
Telecom Backhaul and Protocol Bridging
The EP1AGX35DF780I6N's 3.125 Gbps multi-gigabit transceivers make it well suited for telecom backhaul line cards where Ethernet, CPRI, or Serial RapidIO must be bridged to legacy TDM or parallel data paths. The 33,520 logic elements and 1,676 LABs provide ample capacity for protocol stack implementation and bridging FIFOs. Its 341 user I/Os allow direct connection to DDR/DDR2 SDRAM buffers and parallel backplane buses without external bridge chips. Industrial temperature screening ensures reliable operation in thermally constrained central-office racks.
Recomendado
Industrial Imaging and Video Processing
The EP1AGX35DF780I6N serves as a flexible processing hub in industrial camera and machine-vision systems where raw sensor data must be formatted, cropped, and serialized onto CoaXPress, Camera Link, or GigE Vision links. Embedded 18x18 multipliers and ~1.35 Mbit of block RAM accelerate Bayer demosaicing and edge-detection kernels. The 780-FBGA package supports both the LVDS sensor interface and the multi-gigabit serial uplink. Industrial-grade temperature screening supports factory-floor deployment from -40C to +100C.
Recomendado
Test and Measurement Instrumentation
The EP1AGX35DF780I6N is used in high-end oscilloscopes, logic analyzers, and protocol analyzers where its 3.125 Gbps transceivers enable multi-lane data acquisition and the 33,520 logic elements implement deep trigger sequencers and pattern generators. The 341 user I/Os interface to high-speed ADCs and DACs, while 1.2 V core operation simplifies power tree design. Industrial temperature screening supports benchtop and portable instrument operation. Altera Quartus II tooling accelerates timing closure for complex acquisition paths.
Recomendado
Military and Aerospace Signal Processing
Defense electronics and avionics subsystems leverage the EP1AGX35DF780I6N for radar baseband processing, electronic-countermeasures (ECM) waveform generation, and secure communications links. Its industrial temperature grade and robust 780-FBGA package support harsh-environment operation, while the 3.125 Gbps transceivers enable high-speed encrypted data links. 33,520 logic elements accommodate FIR filters, FFT pipelines, and crypto cores. Long-life-cycle industrial screening suits multi-year defense programs.
Recomendado
Medical Imaging and Diagnostic Equipment
Ultrasound beamformers, MRI gradient controllers, and CT data acquisition boards rely on the EP1AGX35DF780I6N for real-time signal processing of high-bandwidth sensor arrays. Embedded multipliers and block RAM enable parallel FIR filtering and image reconstruction pipelines. Multi-gigabit transceivers move processed data to host processors without bottlenecking throughput. The industrial temperature grade supports operating-room and lab-equipment environments, and the 780-FBGA package concentrates I/O density on compact medical boards.
Recomendado
Broadcast Video Infrastructure
Broadcast studios and outside-broadcast vans use the EP1AGX35DF780I6N for SDI/HD-SDI/3G-SDI routing, format conversion, and embedding/de-embedding audio and ancillary data. The 3.125 Gbps transceivers natively handle 3G-SDI data rates with margin, while the 33,520 logic elements implement cross-point switches and frame synchronizers. The 780-FBGA package supports the high pin count needed for multiple SDI directions and HDMI bridging. Industrial temperature screening suits temperature-variable van and field installations.
Recomendado
Industrial Factory Automation Controllers
High-end programmable automation controllers (PACs) and motion-control platforms integrate the EP1AGX35DF780I6N to run EtherCAT, PROFINET, or SERCOS III master stacks alongside deterministic motion algorithms. The 3.125 Gbps transceivers support multi-axis drive loops over real-time Ethernet, while 33,520 logic elements handle PLC ladder logic, safety logic, and HMI rendering. Industrial temperature screening and the rugged 780-FBGA package suit 24/7 factory-floor operation in dusty, vibration-prone environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1AGX35DF780I6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1AGX35DF780C6N | EP1AGX35DF780I6 | EP1AGX35DF780I5N | EP1AGX35DF780C6 | EP1AGX35DF780C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA | 780-ball FC-FBGA | 780-ball FC-FBGA | 780-ball FC-FBGA | 780-ball FC-FBGA |
| Logic Elements | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 |
| Number of LABs/CLBs | 1676 | 1676 | 1676 | 1676 | 1676 | 1676 |
| Number of I/O | 341 | 341 | 341 | 341 | 341 | 341 |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | I6 | C6 | I6 | I5 | C6 | C5 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principais diferenciais
- Industrial temperature screening with high transceiver bandwidth (vs EP1AGX35DF780C6N)
- Faster speed grade than I5 variant (vs EP1AGX35DF780I5N)
- Full 33,520 logic element capacity (vs EP1AGX20CF780I6N)
Notas de projeto
The 780-ball FC-FBGA package concentrates substantial heat flux at the die. For industrial temperature screening (-40C to +100C), design the PCB with at least 4 thermal vias under the central BGA thermal pad and provide adequate airflow or a heatsink. Estimated: at quiescent core power of approximately 3-5 W and ~31 C/W theta_JA on a 4-layer JEDEC board, junction rise above ambient is 90-150 C. Derate clock frequency if junction temperature exceeds 100 C during operation.
Match the PCB land pattern exactly to the 780-ball FC-FBGA footprint specified in the Arria GX Device Data Sheet. Use 0.5 mm or 0.8 mm pitch per the package datasheet and apply non-solder-mask-defined (NSMD) pads with proper microvia-in-pad construction for reliable BGA assembly. Provide a continuous ground plane under the FPGA and route high-speed transceiver lanes as 100 ohm differential pairs with length matching within 5 mil.
Do not assume that any EP1AGX35 variant in the 780-FBGA package is a universal drop-in: I6/C6 speed grades differ in Fmax, and I/C temperature grades differ in operating range. The EP1AGX20CF780I6N uses a different die (20K LE vs 33.5K LE) - it fits the same PCB footprint but supports only ~60 percent of the design's logic capacity. When migrating designs, re-validate timing closure in Quartus II and verify all transceiver lanes are within spec.
Each 3.125 Gbps transceiver lane requires a clean reference clock with sub-picosecond RMS jitter for proper link operation. Use a dedicated jitter-cleaner PLL such as an Si5315 or CDCE62005 to provide the reference clock, and keep the reference clock trace length matched within 50 mil of the FPGA clock input. Apply AC coupling capacitors on transmit and receive pairs per the Arria GX hardware design guidelines.
Informações de conformidade
RoHS compliant and lead-free per the Altera/Intel product listing. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. Conflict-minerals status not explicitly disclosed in the verified web data.