EP1C20F324C7N - Cyclone FPGA 20K LEs 324-BGA | Intel | Altera
N.º da peça: EP1C20F324C7N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $93.39 | $93,39 |
| 10 | $84.05 | $840,50 |
| 100 | $74.71 | $7.471,00 |
| 500 | $65.37 | $32.685,00 |
| 1.000 | $56.04 | $56.040,00 |
EP1C20F324C7N Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high-density integration of an Application-Specific Integrated Circuit (ASIC) with the design-time reprogramability of discrete logic. The hierarchy runs: FPGA -> programmable logic -> logic IC -> integrated circuit. Within Intel's portfolio, FPGAs belong to the Programmable Solutions Group and are classified as SRAM-based, look-up-table (LUT) architectures that load their configuration from external flash at every power-up. Cyclone is positioned as Intel's low-cost, high-volume FPGA family, targeting cost-sensitive applications where FPGA flexibility is justified over fixed ASICs.
Key features of the EP1C20F324C7N include 20,060 logic elements (LEs), 294,912 bits of M4K embedded memory blocks, up to 233 user I/O pins, integrated LVDS support, dedicated external memory interface circuitry for DDR SDRAM, and an on-chip PLL count appropriate for the Cyclone family architecture. The Cyclone architecture also provides built-in multipliers for DSP-style signal processing and supports the Nios II embedded processor soft-core for custom CPU integration.
Typical applications include digital signal processing (DSP) front-ends, industrial control and machine vision, telecom line-card glue logic, video processing pipelines, low-cost ASIC prototyping, and embedded Nios II processor systems. Designers frequently target Cyclone I devices for proof-of-concept and low-volume production where non-recurring engineering cost must remain low.
When designing with this device, ensure PCB layout supports the 1.0 mm BGA pitch and that the configuration flash memory is properly sized. Power estimation is mandatory before layout because the BGA package limits thermal dissipation; use the Altera / Intel PowerPlay early power estimator during architectural exploration. The 'C7' commercial speed grade operates over the commercial temperature range - select an 'I7' industrial variant for industrial temperature environments.
Alternativas drop-in para EP1C20F324C7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C20F324C7N (mesmo formato e footprint) — diferindo em Speed Grade, Package, Process Technology, Operating Temperature, Total RAM Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C20F324C8N
✅ Drop-In✓ Em estoque
$42.36 / unidade
Ver ficha técnica →EP1C20F324I7N
✅ Drop-In✓ Em estoque
$53.1 / unidade
Ver ficha técnica →EP1C20F324C7
✅ Drop-In✓ Em estoque
$17.95 / unidade
Ver ficha técnica →EP1C20F324C6N
✅ Drop-In✓ Em estoque
$21.75 / unidade
Ver ficha técnica →EP1C12F324C7N
✅ Drop-In✓ Em estoque
$37.2 / unidade
Ver ficha técnica →EP1C20F324C7N Classificações máximas e características elétricas
| Series | Cyclone |
| Logic Elements (LEs) | 20060 |
| Logic Array Blocks (LABs) | 2006 |
| Total RAM Bits | 294912 |
| Maximum User I/O | 233 |
| Encapsulamento | 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch) |
| Speed Grade | C7 (commercial) |
| Lead-Free Status | Yes (N suffix = Pb-free) |
| Tipo de montagem | Surface Mount (BGA) |
| Process Technology | 0.13 um CMOS, SRAM-based |
| Core Voltage | 1.5 V |
| Temperatura de operação | Commercial (0C to +85C) |
| Tipo de memória | M4K embedded SRAM blocks |
| Configuration Scheme | SRAM-based, external flash |
| Soft-core Support | Nios II embedded processor |
| Status RoHS | Compliant |
| Status do ciclo de vida | Last Time Buy (Cyclone I family EOL announced by Intel/Altera) |
Guia de Configuração de Pinos do EP1C20F324C7N 324-bga (fbga-324, 19 x 19 mm, 1.0 mm pitch)
Configuração de pinos para EP1C20F324C7N (pacote 324-bga (fbga-324, 19 x 19 mm, 1.0 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1C20F324C7N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1C20F324C7N é adequado para 6 aplicaçãos: Industrial Motor Control and PLC, Digital Signal Processing Front-End, Telecom Line-Card Glue Logic, ASIC Prototyping and Emulation, Embedded Nios II Processor System, Video Processing and Display Pipelines.
Industrial Motor Control and PLC
The EP1C20F324C7N's 20,060 logic elements and 233 user I/Os suit industrial PLC backplanes driving stepper motors and process control loops. The device integrates up to 294,912 bits of embedded SRAM, which holds encoder state machines and PWM lookup tables for closed-loop torque control, while LVDS-capable I/O pairs cleanly to industrial encoder feedback lines. The Cyclone I PLL count is sufficient to generate the multi-axis PWM frequencies needed for 3-phase inverters. Because the C7 commercial speed grade meets factory-floor temperatures inside an enclosure, designers can avoid the cost premium of an industrial variant. The BGA-324 package keeps the footprint small enough for DIN-rail-mounted controller boards.
Recomendado
Digital Signal Processing Front-End
With 20,060 logic elements and embedded M4K memory blocks, the EP1C20F324C7N efficiently implements FIR filters, FFT engines, and modulation pipelines for audio and baseband DSP. Each M4K block provides 4 Kbits plus dual-port access, which accelerates the butterfly structures common in 256- to 1024-point FFTs without requiring external SRAM. The 233 I/Os include LVDS-capable pairs suitable for high-speed ADC/DAC interfacing. Although Cyclone I lacks dedicated DSP multiplier blocks, the LE fabric still reaches usable clock rates for audio-band DSP at C7 speed grade. Nios II soft-core integration enables a complete DSP controller plus algorithm accelerator on one die.
Recomendado
Telecom Line-Card Glue Logic
Telecom line cards historically depend on FPGAs for protocol bridging, TDM aggregation, and clock-domain crossing. The EP1C20F324C7N's 20,060 LEs handle STS-1/STM-0 framing alongside HDLC controllers, while the 233 I/Os interface directly to framer ICs, LIUs, and backplane serials. Embedded M4K blocks store de-skew FIFOs and elastic store buffers at multi-MHz rates. The Cyclone I PLL count synchronizes the line card to T1/E1 or SONET/SDH references without external clock generators. Intel/Altera Cyclone I FPGAs saw broad adoption in telecom line cards during the 2000s, and many sustaining designs still ship today.
Recomendado
ASIC Prototyping and Emulation
Engineers use the EP1C20F324C7N as a fast-turnaround ASIC prototype because 20,060 LEs map most sub-million-gate ASIC designs, and Quartus II / Quartus Prime synthesis completes in minutes. The 324-FBGA package exposes enough I/O for functional pads plus JTAG and trace ports, which accelerates bring-up versus gate-array ASICs that need a multi-month fab turn. Re-spin cycles cost only programming time, not mask sets. Nios II soft-core integration lets designers test custom CPU subsystems before taping out the ASIC. The C7 speed grade hits clock rates typical of mid-speed ASIC prototypes.
Recomendado
Embedded Nios II Processor System
Cyclone I devices natively support the Nios II soft-core embedded processor, and the EP1C20F324C7N's 20,060 LEs fit Nios II/f plus substantial peripheral fabric. Designers instantiate Nios II/f, on-chip peripherals, custom logic accelerators, and external memory controllers all within one FPGA, eliminating an external microcontroller. The 294,912 bits of M4K embedded RAM back the Nios II instruction and data caches, removing the need for separate cache SRAM. Custom instructions accelerate DSP or packet processing in the same fabric. Commercial temperature grade is sufficient for most embedded control products that live in benign enclosures.
Recomendado
Video Processing and Display Pipelines
The EP1C20F324C7N's 233 user I/Os interface to BT.656, BT.1120, or RGB video sources, while 20,060 LEs implement deinterlacers, scalers, and on-screen-display overlays. Embedded M4K blocks serve as line buffers with widths up to 36 bits, fitting 16-bit video plus chroma key. LVDS I/O pairs drive flat-panel display connectors directly. Video pipelines running at pixel-clock rates of 54-148 MHz are achievable at the C7 speed grade. Designers historically used Cyclone I for surveillance DVRs, medical imaging, and industrial machine-vision controllers - many of those products still ship.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C20F324C7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C20F324C8N | EP1C20F324I7N | EP1C20F324C7 | EP1C20F324C6N | EP1C12F324C7N |
|---|---|---|---|---|---|---|
| Package | 324-FBGA (19x19 mm, 1.0 mm pitch) | 324-FBGA (19x19 mm, 1.0 mm pitch) - same | 324-FBGA (19x19 mm, 1.0 mm pitch) - same | 324-FBGA (19x19 mm, 1.0 mm pitch) - same | 324-FBGA (19x19 mm, 1.0 mm pitch) - same | 324-FBGA (19x19 mm, 1.0 mm pitch) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 20060 | 20060 | 20060 | 20060 | 20060 | 12060 (-40%) |
| Embedded RAM (bits) | 294912 | 294912 | 294912 | 294912 | 294912 | 239616 (-19%) |
| Speed Grade | C7 | C8 (slower) | I7 (industrial temp) | C7 (non-Pb-free) | C6 (faster) | C7 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Commercial | Commercial |
| Lead-Free / RoHS | Yes (Pb-free, RoHS) | Yes | Yes | No (non-Pb-free) | Yes | Yes |
| Maximum User I/O | 233 | 233 | 233 | 233 | 233 | 249 (different pin map) |
Principais diferenciais
- Mid-density Cyclone I with full 233 I/O availability (vs EP1C12F324C7N)
- C7 commercial speed grade balanced for general use (vs EP1C20F324C8N)
- Lead-free / RoHS compliant (N suffix) (vs EP1C20F324C7 (no N suffix))
- Last-time-buy stock still widely available from authorized distributors (vs Cyclone IV EP4CE22F29C8N)
Notas de projeto
Estimated: the 324-FBGA at 1.0 mm pitch requires a 4-6 layer PCB stackup with microvias or via-in-pad to escape the inner balls. Outer-row balls should escape on the top layer with microvias to inner planes; deeper balls need buried vias. Use a 0.8 mm ball pad diameter with non-solder-mask-defined (NSMD) pads for reliable reflow. Maintain 50-ohm controlled impedance on clock and DDR traces that exit the BGA.
The 19 x 19 mm FBGA package has a typical theta-JA around 25-30 C/W on a standard JEDEC 4-layer test board. At 20,060 LEs running at moderate toggle rates (say 25% utilization), typical core power ranges 0.5-1.5 W - well within thermal limits. Use Intel's PowerPlay Early Power Estimator before committing to a heatsink or thermal via design. For high-utilization designs, add thermal vias beneath the BGA's center thermal pad.
Cyclone I bitstreams are NOT compatible with Cyclone II/III/IV devices even if LE counts match - each generation has a unique configuration bitstream format. Programming files generated for EP1C20 will not load onto a Cyclone IV EP4CE22, even at the same LE count. Use the Quartus II software version that targets Cyclone I (typically Quartus II 9.1 or earlier; later Quartus Prime versions dropped Cyclone I support). Do not assume newer Quartus versions will accept Cyclone I designs.
Estimated: Cyclone I requires four power rails - 1.5 V core (VCCINT), 3.3 V I/O (VCCIO, bank-dependent), 2.5 V auxiliary (VCCAUX for PLL/JTAG), and a 1.5 V or 3.3 V configuration voltage. Decoupling caps: place one 0.1 uF per VCCINT pin, plus 4.7 uF bulk caps every 10-15 power pins. PLL power requires filtered ferrite-bead-isolated 2.5 V. Ramp all rails monotonically within 100 ms to avoid configuration failure on power-up.
Differential pairs (LVDS) require matched-length routing within 20 mils (0.5 mm) for clock rates above 100 MHz, with 100-ohm differential impedance. Single-ended I/O should use 50-ohm traces with series termination at the FPGA pin. Keep PLL filter components within 1 cm of the PLL power pin and isolated from noisy digital signals. JTAG chain signals (TCK, TMS, TDI, TDO) should be guarded by ground traces to prevent noise-induced configuration errors.
Informações de conformidade
Pb-free (N suffix) per Altera/Intel package marking. Halogen-free status and conflict-minerals compliance not explicitly stated in the verified distributor data; set to unknown pending manufacturer datasheet confirmation. Not AEC-Q100 qualified - this is a commercial-grade FPGA not intended for automotive safety-critical applications.
