EP1C20F324I7N - Cyclone FPGA 20K LE, 324-BGA, Industrial | Intel
N.º da peça: EP1C20F324I7N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $63.8 | $6.380,00 |
| 250 | $58.4 | $14.600,00 |
| 500 | $53.1 | $26.550,00 |
EP1C20F324I7N Visão geral
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable interconnects, dedicated memory, and I/O blocks on a single silicon die. Cyclone FPGAs sit in the hierarchy below high-end FPGAs but above CPLDs and small logic devices, targeting cost-sensitive applications that still require tens of thousands of logic elements, embedded multipliers, and on-chip memory. EP1C20F324I7N belongs to the first-generation Cyclone family, the lowest-cost FPGA line introduced by Altera in 2003, manufactured on a 130 nm SRAM process.
Key specifications include 20,060 logic elements, 288 kbit embedded memory (294,912 bits), 233 maximum user I/Os, four PLLs, and a Phase-Locked Loop (PLL) block per quadrant for clock management. The device supports multiple configuration schemes via serial or parallel configuration devices and JTAG boundary-scan testing per IEEE Std 1149.1. The FineLine BGA-324 package measures 19 × 19 mm with a 1.0 mm ball pitch, offering a balance between board density and assembly yield.
Typical applications include industrial control and motor drive interfaces, video processing and image capture pipelines, communication protocol bridging (UART, SPI, I2C, parallel), and low-cost ASIC prototyping. Its combination of high logic density and a low unit cost made it a popular choice during the 2004-2012 design cycle for cost-sensitive embedded designs.
When designing with EP1C20F324I7N, ensure proper decoupling with 0.1 µF and 10 µF capacitors near each power pin. The device requires a dedicated configuration device (EPCS1/EPCS4) or JTAG programmer for SRAM-based configuration; no on-chip non-volatile memory is present. Confirm long-term availability, as the first-generation Cyclone family has transitioned through NRND (Not Recommended for New Designs) status at Altera/Intel.
This page synthesizes current distributor pricing, same-family drop-in alternatives, and practical PCB design guidance that goes beyond the manufacturer datasheet alone.
Alternativas drop-in para EP1C20F324I7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C20F324I7N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Speed Grade, Total RAM Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C20F324I7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$85.2 / unidade
Ver ficha técnica →EP1C20F324C8N
✅ Drop-In✓ Em estoque
$42.36 / unidade
Ver ficha técnica →EP1C20F324C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$56.04 / unidade
Ver ficha técnica →EP1C20F324C6N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$21.75 / unidade
Ver ficha técnica →EP1C12F324I7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$52.1 / unidade
Ver ficha técnica →EP1C12F324C8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$51.75 / unidade
Ver ficha técnica →EP1C12F324I7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$52.1 / unidade
Ver ficha técnica →EP1C20F324I7N Classificações máximas e características elétricas
| Family | Cyclone (first generation) |
| Logic Elements | 20,060 LE |
| Embedded Memory | 294,912 bits (288 kbit) |
| Maximum User I/Os | 233 |
| Number of Logic Array Blocks (LABs) | 20060 (per Cyclone Family datasheet) |
| Embedded Multipliers | 26 (18x18) |
| PLLs | 4 |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per I/O bank) |
| Process Technology | 0.13 µm CMOS |
| Maximum Internal Frequency | 320 MHz |
| Encapsulamento | 324-pin FineLine BGA (FBGA-324), 19 × 19 mm, 1.0 mm pitch |
| Temperatura de operação | -40 °C to +100 °C (industrial) |
| Speed/Grade Code | I7 (-40 °C to +100 °C, industrial speed grade 7) |
| Configuration | Serial/parallel via EPCS or JTAG (IEEE 1149.1) |
| Status RoHS | Compliant |
| Lead-Free / Halogen-Free | Lead-free; halogen-free per device datasheet |
Guia de Configuração de Pinos do EP1C20F324I7N 324-pin fineline bga (fbga-324), 19 × 19 mm, 1.0 mm pitch
Configuração de pinos para EP1C20F324I7N (pacote 324-pin fineline bga (fbga-324), 19 × 19 mm, 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1C20F324I7N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1C20F324I7N é adequado para 6 aplicaçãos: Industrial Motor Control, Video Image Processing and Capture, Communication Protocol Bridging, Low-Cost ASIC Prototyping, Legacy Equipment Maintenance and Repair, Educational and Development Platforms.
Industrial Motor Control
The EP1C20F324I7N is well suited to industrial motor-control and drive-interface designs thanks to its 20,060 logic elements, four PLLs, and 26 embedded 18×18 multipliers that can implement field-oriented control (FOC) loops, PID controllers, and PWM generation. Industrial temperature operation (-40 °C to +100 °C, I7 grade) supports deployment in factory-floor and outdoor enclosures. The 233 user I/Os enable direct connection to multi-axis encoder feedback and gate-driver signals without external muxing.
Recomendado
Video Image Processing and Capture
The 288 kbit of embedded M4K memory and 26 multipliers make EP1C20F324I7N a strong fit for video pipeline blocks such as color-space conversion, scaling, and simple edge detection running on parallel ITU-R BT.656 or VGA inputs. The 320 MHz internal clock supports real-time processing at common video rates (NTSC/PAL). Multiple I/O banks at 3.3 V and 1.8 V allow direct interface to image sensors and external SDRAM frame buffers.
Recomendado
Communication Protocol Bridging
The EP1C20F324I7N's 20K logic elements and 233 I/Os allow multi-protocol bridging between UART, SPI, I2C, parallel, and custom industrial buses in a single device. The four PLLs provide independent clock domains for each interface, eliminating the need for external clock buffers. Industrial temperature operation supports building automation, substation gateways, and railway signaling equipment where protocol translation is required.
Recomendado
Low-Cost ASIC Prototyping
The EP1C20F324I7N's 20,060 logic elements provide enough capacity to prototype mid-complexity ASICs for validation before tape-out, while the FBGA-324 footprint supports a wide range of I/O pin-out assignments. Engineers can re-spin logic in minutes using Quartus II and the JTAG-based program/erase flow, dramatically shortening verification cycles. The Cyclone family is widely supported by synthesis tools and IP libraries, accelerating time-to-prototype.
Recomendado
Legacy Equipment Maintenance and Repair
Hundreds of thousands of deployed systems built 2005-2015 use EP1C20F324I7N for I/O expansion, glue logic, and timing control. NRND status has tightened supply, but the part remains in active distribution for sustainment programs in railway signaling, factory automation, military communications, and aerospace test equipment. Long-term authorized stockists with date-code verification support MRO requirements for these legacy platforms.
Recomendado
Educational and Development Platforms
University digital-logic and embedded-systems courses continue to use EP1C20F324I7N-equipped Altera/Intel development boards because the device delivers meaningful 20K-LE capacity at low per-board cost. Quartus II Web Edition remains a free design entry point, and the JTAG-based program/erase cycle supports fast student iteration cycles. Industrial temperature grade also allows teaching labs to deploy boards into outdoor robotics projects.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C20F324I7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C20F324I7 | EP1C20F324C8N | EP1C20F324C7N | EP1C20F324C6N | EP1C12F324I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-324 | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same | FBGA-324 - same |
| Logic Elements | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 12,060 LE (-40%) |
| Embedded Memory | 288 kbit | 288 kbit | 288 kbit | 288 kbit | 288 kbit | 239,616 bits (~239 kbit) |
| Temperature Range | -40 to +100 °C (industrial) | -40 to +100 °C (industrial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | 0 to +85 °C (commercial) | -40 to +100 °C (industrial) |
| Speed Grade | 7 (industrial) | 7 (industrial) | 8 (commercial, faster) | 7 (commercial) | 6 (commercial, slower) | 7 (industrial) |
| Maximum User I/Os | 233 | 233 | 233 | 233 | 233 | 233 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Same-package lower-cost Cyclone I density variant (vs EP1C12F324I7N)
- Industrial temperature grade for harsh environments (vs EP1C20F324C8N)
- Higher speed grade than slower commercial options (vs EP1C20F324C6N)
Notas de projeto
EP1C20F324I7N requires 1.5 V on VCCINT and 1.5/1.8/2.5/3.3 V on VCCIO pins. Place one 0.1 µF ceramic decoupling capacitor adjacent to every VCCINT pin and a 10 µF bulk capacitor per VCCIO bank. Estimated: with 1.5 V core at typical 20K-LE utilization, core current draw can reach 0.5-1 A during configuration; ensure the 1.5 V regulator supplies at least 1.5 A peak with low-noise LDO such as the TI TPS7A4701 for clean PLL operation.
The FBGA-324 has 1.0 mm ball pitch on a 19 × 19 mm body. Use a 4-layer or 6-layer PCB with 0.5 oz copper on outer layers and 1 oz on inner power planes. Place 8-10 micro vias in the central thermal array to a dedicated inner ground plane. Estimated: with all four PLL banks active and 50% logic utilization, junction-to-ambient thermal resistance (θJA) is approximately 18 °C/W on a JEDEC 4-layer test board; derate outputs if ambient exceeds 70 °C.
First-generation Cyclone FPGAs require configuration at every power-up because the configuration RAM is volatile. Always include an EPCS1 or EPCS4 serial configuration device on the board, or plan for JTAG-only configuration via ByteBlaster II / USB-Blaster. Forgetting the configuration device is the single most common board bring-up failure. Also note that the device does not support single-voltage supply operation; 2.5 V or 3.3 V only will not power the core.
The 233 user I/Os include DDR-compatible output structures, but signal-integrity constraints apply above 100 MHz. Source-synchronous interfaces (DDR, LVDS-style) require 100 Ω differential routing and matched pair lengths within 50 mils. Use the Quartus II pin planner to assign I/O pins per bank voltage and to verify SSN (simultaneous switching noise) budget. Place reference-voltage pins (VREF) with 0.1 µF + 1 µF decoupling when using SSTL or HSTL I/O standards.
Informações de conformidade
RoHS compliance and lead-free terminal finish indicated by the "N" suffix in the MPN per Altera/Intel marking convention. JEDEC J-STD-020 MSL rating per package outline; refer to device-specific packing label for exact MSL level.
