EP1C20F324I7 - Cyclone FPGA, 20K LE, 324-FBGA, Industrial | Intel
N.º da peça: EP1C20F324I7 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $125.69 | $125,69 |
| 10 | $115.5 | $1.155,00 |
| 100 | $102.4 | $10.240,00 |
| 500 | $92.8 | $46.400,00 |
| 1.000 | $85.2 | $85.200,00 |
EP1C20F324I7 Visão geral
What is an FPGA? A Field Programmable Gate Array is a semiconductor device containing an array of configurable logic blocks (CLBs/LABs) connected by programmable interconnect and surrounded by programmable I/O cells. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) > complex programmable logic device (CPLD) > FPGA > Cyclone series > Cyclone I family. Compared to ASICs, FPGAs offer rapid prototyping, in-field reprogrammability, and lower NRE cost, while trading off absolute performance-per-watt and unit cost at high volumes.
Key features include 20,060 logic elements, four phase-locked loops (PLLs) for clock management, embedded multiplier blocks (3x3, 4x4) supporting DSP functions, 36 M4K RAM blocks (4 Kbit each = 144 Kbit of block RAM plus 64 Kbit of distributed RAM-like memory), and dedicated external memory interfaces. Configuration is supported via active serial (AS), passive serial (PS), and JTAG modes. The 1.5 V core with 3.3 V, 2.5 V, and 1.8 V I/O standards (LVTTL, LVCMOS, SSTL, LVDS) provides flexible system integration.
The Cyclone architecture separates logic, routing, and I/O into distinct hierarchical layers, with each LAB containing ten Logic Elements. Each LE includes a 4-input LUT, a programmable register, a carry chain for arithmetic, and a register chain. Internal SRAM configuration cells load at power-up from an external EPCS serial configuration device, allowing instant design changes via JTAG or serial download cables. The device supports single-event-upset-immune configuration memory via soft-error detection CRC.
Typical applications include digital signal processing front-ends, video and image processing pipelines, industrial control and motor drive glue logic, communications protocol bridging (UART/SPI/I2C/Ethernet MAC), and consumer electronics requiring custom I/O expansion. The wide I/O count (233) makes it well-suited for legacy parallel bus aggregation and bridge functions.
When designing with the EP1C20F324I7, ensure proper decoupling of all core and I/O rails (100 nF at every power pin plus bulk 10-100 uF), follow Altera's recommended PCB layout for FBGA escape routing (microvia or via-in-pad), and provision a configuration memory interface (EPCS4 or larger). Designers should budget for in-system programming via JTAG to enable field updates.
This page synthesizes distributor pricing, exact-same-family FPGA drop-in alternatives, and practical design notes not found on a single datasheet page, giving procurement and FPGA engineers a single decision-ready reference.
Alternativas drop-in para EP1C20F324I7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C20F324I7 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Speed Grade, Total RAM Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C20F324I7N
✅ Drop-In✓ Em estoque
$53.1 / unidade
Ver ficha técnica →EP1C20F324C8N
✅ Drop-In✓ Em estoque
$42.36 / unidade
Ver ficha técnica →EP1C20F324C6N
✅ Drop-In✓ Em estoque
$21.75 / unidade
Ver ficha técnica →EP1C20F324I8
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1C20F324C7N
✅ Drop-In✓ Em estoque
$56.04 / unidade
Ver ficha técnica →EP1C12F324I7
✅ Drop-In✓ Em estoque
$52.1 / unidade
Ver ficha técnica →EP1C12F324I7N
✅ Drop-In✓ Em estoque
$52.1 / unidade
Ver ficha técnica →EP1C20F324I7 Classificações máximas e características elétricas
| Series | Cyclone |
| Family | Cyclone I (EP1C20) |
| Logic Elements | 20,060 LE |
| Total RAM Bits | 294,912 bit |
| Number of LABs/CLBs | 2006 |
| Number of User I/O | 233 |
| Number of PLLs | 4 |
| Embedded Memory | 288 Kbit |
| Number of Logic Cells | 20060 |
| Supply Voltage (Core) | 1.5 V |
| Process Technology | 130 nm |
| Temperatura de operação | -40C to +100C (TJ) |
| Tipo de montagem | Surface Mount (SMT) |
| Encapsulamento | 324-FBGA (19x19 mm) |
| Configuration Mode | AS / PS / JTAG |
| Speed Grade | I7 (industrial) |
Guia de Configuração de Pinos do EP1C20F324I7 324-fbga (19x19 mm)
Configuração de pinos para EP1C20F324I7 (pacote 324-fbga (19x19 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1C20F324I7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1C20F324I7 é adequado para 6 aplicaçãos: Industrial Motor Drive Glue Logic, Video and Image Processing Front-End, Communications Protocol Bridging, Digital Signal Processing Pre-Processing, Custom I/O Expansion and Legacy Bus Aggregation, Test and Measurement Instrumentation.
Industrial Motor Drive Glue Logic
The EP1C20F324I7 fits motor drive control boards because its 20,060 logic elements and four PLLs deliver enough headroom for encoder decoding, PWM timing, and field-oriented-control glue logic, while the industrial -40C to +100C junction range handles factory-floor thermal stress. Its 233 user I/Os aggregate Hall-sensor, encoder, and parallel ADC interfaces without external muxes. Placed between the DSP/MCU controller and the power stage, it removes timing-critical tasks from software. Trade-off versus a CPLD: the FBGA package needs via-in-pad PCB escape and JTAG provision, but it pays back in deterministic latency and parallel I/O throughput.
Recomendado
Video and Image Processing Front-End
The EP1C20F324I7 is well matched to mid-resolution video pipelines (D1 / 720p) where 20,060 LE and 36 M4K RAM blocks implement line buffers, color-space converters, and Bayer demosaicing. Four PLLs derive pixel-clock and double-data-rate memory clocks from a single 27 MHz oscillator, and 233 LVCMOS/LVDS-capable I/Os pair with external SDRAM/DDR memory. The 130 nm process keeps dynamic power reasonable at 50-80 MHz Fmax. Pair with a parallel-output CMOS sensor and an external frame buffer for a complete pipeline.
Recomendado
Communications Protocol Bridging
For protocol-bridge applications (UART to SPI, I2C to parallel bus, Ethernet MAC glue, CAN-to-LIN), the EP1C20F324I7 offers enough logic to implement multiple soft cores concurrently. Industrial temperature tolerance suits outdoor telecom cabinets, while 1.5 V core plus 3.3 V/2.5 V/1.8 V I/O standards bridge legacy 5 V-tolerant PHY devices via level shifters. PLLs generate independent baud-rate clocks for each port. The trade-off is BGA PCB complexity versus the flexibility to reconfigure bridge logic in the field via JTAG.
Recomendado
Digital Signal Processing Pre-Processing
The EP1C20F324I7 implements FIR filters, FFT pre-processors, and channel-decoding blocks using its embedded multiplier units and 4 PLLs. Industrial temperature tolerance suits defense and test-and-measurement instruments. The 233 I/Os stream 16-bit parallel data from ADCs at 50-100 MSPS, while 36 M4K RAM blocks store filter tap coefficients. Pair with a precision ADC and a host DSP/MCU for a complete signal-conditioning chain.
Recomendado
Custom I/O Expansion and Legacy Bus Aggregation
The EP1C20F324I7's 233 user I/Os aggregate legacy parallel buses (ISA, PC/104, custom 16/32-bit interfaces) that modern microcontrollers no longer support directly. Industrial temperature and 1.5 V core with multi-voltage I/O make it ideal for migrating mature designs without redesigning the backplane. Four PLLs retime asynchronous legacy clocks into a coherent domain for the host CPU. Trade-off: BGA escape is more complex than QFP, but the I/O density avoids external bus-switching chips.
Recomendado
Test and Measurement Instrumentation
The EP1C20F324I7 supports bench-top T&M equipment (logic analyzers, protocol exercisers, arbitrary waveform generators) by combining 20K LE logic capacity with industrial temperature tolerance for laboratory and field environments. Four PLLs synthesize precise sample clocks, and 36 M4K RAM blocks implement deep capture buffers. The 324-FBGA package allows dense mixed-signal PCB layouts with controlled-impedance differential pairs for high-speed probes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C20F324I7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C20F324I7N | EP1C20F324C8N | EP1C20F324C6N | EP1C20F324I8 | EP1C20F324C7N | EP1C12F324I7 | EP1C12F324I7N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-FBGA (19x19 mm) | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same |
| Logic Elements | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 12,060 LE (-40%) | 12,060 LE (-40%) |
| Total RAM Bits | 294,912 bit | 294,912 bit | 294,912 bit | 294,912 bit | 294,912 bit | 294,912 bit | 239,616 bit (-19%) | 239,616 bit (-19%) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I7 (7 ns) | I7 | C8 (slower) | C6 (slower) | I8 (slower) | C7 | I7 | I7 |
| RoHS Status | Non-RoHS | RoHS (Pb-free) | RoHS | RoHS | Non-RoHS | RoHS | Non-RoHS | RoHS (Pb-free) |
| Supply Voltage (Core) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Number of User I/O | 233 | 233 | 233 | 233 | 233 | 233 | 233 | 233 |
Principais diferenciais
- Industrial temperature rating vs commercial siblings (vs EP1C20F324C8N)
- Highest density in the 324-FBGA Cyclone I pinout (vs EP1C12F324I7)
- Faster speed grade within industrial temperature (vs EP1C20F324I8)
Notas de projeto
The 324-FBGA package requires either microvia or via-in-pad PCB technology for the breakout. Per the Cyclone I Handbook, place a 100 nF decoupling capacitor within 100 mils of every VCCINT and VCCIO power pin, plus 10-100 uF bulk capacitors near each power rail entry. The exposed die pad (if present in this BGA variant) must be soldered to a ground pour with multiple thermal vias for heat dissipation.
Estimated: at typical utilization (60% LE, 50% RAM, 25C ambient, 1.5 V core), core current is approximately 0.5-1 A. Designers should budget a 1.5 V regulator capable of 2 A peak with ±3% tolerance, plus separate PLL analog supply (VCCA_PLL) filtered through a ferrite bead and bypassed with 10 uF + 100 nF. Power sequencing requires VCCINT to reach 90% before VCCIO ramps per the Cyclone I handbook.
Common design pitfalls include: (1) failing to provision the JTAG chain correctly (TCK pull-down, TMS/TDI pull-ups), (2) using the wrong configuration mode (AS requires an EPCS device, PS requires a download cable or external host), and (3) omitting the CRC soft-error-detection logic in the Quartus design, which leaves the configuration bitstream vulnerable to SRAM bit flips in high-altitude or radiation-prone environments.
Informações de conformidade
Non-RoHS per Xecor comparison data. The Pb-free EP1C20F324I7N variant is the RoHS-compliant drop-in alternative. AEC-Q100 not applicable for industrial-grade Cyclone I FPGAs.
