EP1C20F324I7 - Cyclone FPGA, 20K LE, 324-FBGA, Industrial | Intel
MPN: EP1C20F324I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $125.69 | $125.69 |
| 10 | $115.5 | $1,155.00 |
| 100 | $102.4 | $10,240.00 |
| 500 | $92.8 | $46,400.00 |
| 1,000 | $85.2 | $85,200.00 |
Drop-in alternatives for EP1C20F324I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C20F324I7N
✅ Drop-In✓ In Stock
$53.1 / Unit
View Datasheet →EP1C20F324C8N
✅ Drop-In✓ In Stock
$42.36 / Unit
View Datasheet →EP1C20F324C6N
✅ Drop-In✓ In Stock
$21.75 / Unit
View Datasheet →EP1C20F324I8
✅ Drop-In📋 Reference alternative (not in catalog)
EP1C20F324C7N
✅ Drop-In✓ In Stock
$56.04 / Unit
View Datasheet →EP1C12F324I7
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP1C12F324I7N
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP1C20F324I7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone |
| Family | Cyclone I (EP1C20) |
| Logic Elements | 20,060 LE |
| Total RAM Bits | 294,912 bit |
| Number of LABs/CLBs | 2006 |
| Number of User I/O | 233 |
| Number of PLLs | 4 |
| Embedded Memory | 288 Kbit |
| Number of Logic Cells | 20060 |
| Supply Voltage (Core) | 1.5 V |
| Process Technology | 130 nm |
| Operating Temperature | -40C to +100C (TJ) |
| Mounting Type | Surface Mount (SMT) |
| Package | 324-FBGA (19x19 mm) |
| Configuration Mode | AS / PS / JTAG |
| Speed Grade | I7 (industrial) |
EP1C20F324I7 324-fbga (19x19 mm) Pin Configuration Guide
Complete pinout information for EP1C20F324I7 (324-fbga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C20F324I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C20F324I7 is suitable for 6 applications: Industrial Motor Drive Glue Logic, Video and Image Processing Front-End, Communications Protocol Bridging, Digital Signal Processing Pre-Processing, Custom I/O Expansion and Legacy Bus Aggregation, Test and Measurement Instrumentation.
Industrial Motor Drive Glue Logic
The EP1C20F324I7 fits motor drive control boards because its 20,060 logic elements and four PLLs deliver enough headroom for encoder decoding, PWM timing, and field-oriented-control glue logic, while the industrial -40C to +100C junction range handles factory-floor thermal stress. Its 233 user I/Os aggregate Hall-sensor, encoder, and parallel ADC interfaces without external muxes. Placed between the DSP/MCU controller and the power stage, it removes timing-critical tasks from software. Trade-off versus a CPLD: the FBGA package needs via-in-pad PCB escape and JTAG provision, but it pays back in deterministic latency and parallel I/O throughput.
Recommended
Video and Image Processing Front-End
The EP1C20F324I7 is well matched to mid-resolution video pipelines (D1 / 720p) where 20,060 LE and 36 M4K RAM blocks implement line buffers, color-space converters, and Bayer demosaicing. Four PLLs derive pixel-clock and double-data-rate memory clocks from a single 27 MHz oscillator, and 233 LVCMOS/LVDS-capable I/Os pair with external SDRAM/DDR memory. The 130 nm process keeps dynamic power reasonable at 50-80 MHz Fmax. Pair with a parallel-output CMOS sensor and an external frame buffer for a complete pipeline.
Recommended
Communications Protocol Bridging
For protocol-bridge applications (UART to SPI, I2C to parallel bus, Ethernet MAC glue, CAN-to-LIN), the EP1C20F324I7 offers enough logic to implement multiple soft cores concurrently. Industrial temperature tolerance suits outdoor telecom cabinets, while 1.5 V core plus 3.3 V/2.5 V/1.8 V I/O standards bridge legacy 5 V-tolerant PHY devices via level shifters. PLLs generate independent baud-rate clocks for each port. The trade-off is BGA PCB complexity versus the flexibility to reconfigure bridge logic in the field via JTAG.
Recommended
Digital Signal Processing Pre-Processing
The EP1C20F324I7 implements FIR filters, FFT pre-processors, and channel-decoding blocks using its embedded multiplier units and 4 PLLs. Industrial temperature tolerance suits defense and test-and-measurement instruments. The 233 I/Os stream 16-bit parallel data from ADCs at 50-100 MSPS, while 36 M4K RAM blocks store filter tap coefficients. Pair with a precision ADC and a host DSP/MCU for a complete signal-conditioning chain.
Recommended
Custom I/O Expansion and Legacy Bus Aggregation
The EP1C20F324I7's 233 user I/Os aggregate legacy parallel buses (ISA, PC/104, custom 16/32-bit interfaces) that modern microcontrollers no longer support directly. Industrial temperature and 1.5 V core with multi-voltage I/O make it ideal for migrating mature designs without redesigning the backplane. Four PLLs retime asynchronous legacy clocks into a coherent domain for the host CPU. Trade-off: BGA escape is more complex than QFP, but the I/O density avoids external bus-switching chips.
Recommended
Test and Measurement Instrumentation
The EP1C20F324I7 supports bench-top T&M equipment (logic analyzers, protocol exercisers, arbitrary waveform generators) by combining 20K LE logic capacity with industrial temperature tolerance for laboratory and field environments. Four PLLs synthesize precise sample clocks, and 36 M4K RAM blocks implement deep capture buffers. The 324-FBGA package allows dense mixed-signal PCB layouts with controlled-impedance differential pairs for high-speed probes.
Recommended
Recommended Products Summary
Engineering reference data for EP1C20F324I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C20F324I7N | EP1C20F324C8N | EP1C20F324C6N | EP1C20F324I8 | EP1C20F324C7N | EP1C12F324I7 | EP1C12F324I7N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-FBGA (19x19 mm) | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same | 324-FBGA (19x19 mm) - same |
| Logic Elements | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 12,060 LE (-40%) | 12,060 LE (-40%) |
| Total RAM Bits | 294,912 bit | 294,912 bit | 294,912 bit | 294,912 bit | 294,912 bit | 294,912 bit | 239,616 bit (-19%) | 239,616 bit (-19%) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | I7 (7 ns) | I7 | C8 (slower) | C6 (slower) | I8 (slower) | C7 | I7 | I7 |
| RoHS Status | Non-RoHS | RoHS (Pb-free) | RoHS | RoHS | Non-RoHS | RoHS | Non-RoHS | RoHS (Pb-free) |
| Supply Voltage (Core) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Number of User I/O | 233 | 233 | 233 | 233 | 233 | 233 | 233 | 233 |
Key Differentiators
- Industrial temperature rating vs commercial siblings (vs EP1C20F324C8N)
- Highest density in the 324-FBGA Cyclone I pinout (vs EP1C12F324I7)
- Faster speed grade within industrial temperature (vs EP1C20F324I8)
Design Notes
The 324-FBGA package requires either microvia or via-in-pad PCB technology for the breakout. Per the Cyclone I Handbook, place a 100 nF decoupling capacitor within 100 mils of every VCCINT and VCCIO power pin, plus 10-100 uF bulk capacitors near each power rail entry. The exposed die pad (if present in this BGA variant) must be soldered to a ground pour with multiple thermal vias for heat dissipation.
Estimated: at typical utilization (60% LE, 50% RAM, 25C ambient, 1.5 V core), core current is approximately 0.5-1 A. Designers should budget a 1.5 V regulator capable of 2 A peak with ±3% tolerance, plus separate PLL analog supply (VCCA_PLL) filtered through a ferrite bead and bypassed with 10 uF + 100 nF. Power sequencing requires VCCINT to reach 90% before VCCIO ramps per the Cyclone I handbook.
Common design pitfalls include: (1) failing to provision the JTAG chain correctly (TCK pull-down, TMS/TDI pull-ups), (2) using the wrong configuration mode (AS requires an EPCS device, PS requires a download cable or external host), and (3) omitting the CRC soft-error-detection logic in the Quartus design, which leaves the configuration bitstream vulnerable to SRAM bit flips in high-altitude or radiation-prone environments.
Compliance Information
Non-RoHS per Xecor comparison data. The Pb-free EP1C20F324I7N variant is the RoHS-compliant drop-in alternative. AEC-Q100 not applicable for industrial-grade Cyclone I FPGAs.
