EP1C6T144C8AA - Cyclone FPGA, 6K LEs, 144-LQFP | Intel
N.º da peça: EP1C6T144C8AA ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.9 | $339,00 |
| 100 | $29.2 | $2.920,00 |
| 500 | $25.75 | $12.875,00 |
| 1.000 | $22.4 | $22.400,00 |
EP1C6T144C8AA Visão geral
A field programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which are defined by a user-supplied bitstream held in external SRAM or flash. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the digital design hierarchy: they deliver ASIC-class parallelism and I/O flexibility without NRE cost, while offering far more deterministic real-time performance than general-purpose CPUs. The Cyclone family was Intel's (formerly Altera's) first low-cost FPGA line and helped define the modern mid-density FPGA market segment.
Key features of the EP1C6T144C8AA include 5,980 logic elements, 92,160 RAM bits (approximately 11.5 Kbytes of block RAM), up to 185 Kbits of usable RAM, two PLLs, and support for LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards. The 144-LQFP package exposes 98 user I/Os across four I/O banks, supporting up to 4 user I/O banks per Cyclone device. Industrial temperature range is -40 °C to +100 °C junction, making the part suitable for harsh environments. The device is configured via active serial (AS), passive serial (PS), or JTAG modes using an external configuration device.
Architecturally, the EP1C6T144C8AA uses a four-input look-up-table (LUT) per logic element, M4K RAM blocks of 4 Kbits each (with parity and shift-register modes), and dedicated multiplier blocks are not present in this family (multipliers are implemented in soft logic using the Quartus Prime library megafunctions). The two PLLs support clock multiplication, division, phase shifting, and external clock output, enabling robust clock-tree design across the 98 I/Os.
Typical applications include industrial motor control and factory automation glue logic, video processing and image-sensor interface bridging, low-cost ASIC prototyping, communications backplane interfacing, and consumer display controllers. Designers migrating from discrete logic or CPLDs frequently choose this device for its RAM density and PLL support.
When designing with this part, ensure the JTAG chain, configuration flash, and decoupling network are correctly designed. Quartus II (or the legacy Quartus Prime 13.0sp1) is the supported development toolchain; third-party synthesis from Synopsys Synplify or Mentor Precision is also available.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not consolidated on a single manufacturer or distributor page.
Alternativas drop-in para EP1C6T144C8AA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C6T144C8AA (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Family, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C6T144C8N
✅ Drop-In✓ Em estoque
$12.95 / unidade
Ver ficha técnica →EP1C6T144C7N
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →EP1C6T144C6N
✅ Drop-In✓ Em estoque
$18.85 / unidade
Ver ficha técnica →EP1C6T144I7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$42.5 / unidade
Ver ficha técnica →EP1C6Q240C8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.6 / unidade
Ver ficha técnica →EP1C6F256C8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EP1C6T144C8AA Classificações máximas e características elétricas
| Series | Cyclone |
| Family | Cyclone (original) |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| Number of Logic Array Blocks (LABs) | 598 |
| Number of M4K RAM Blocks (4 Kbit each) | 20 |
| User I/O Pins | 98 |
| PLLs | 2 |
| Encapsulamento | 144-LQFP (TQFP), 20 mm × 20 mm, 0.4 mm pitch |
| Contagem de pinos | 144 |
| Speed Grade | 8 (slowest commercial) |
| Suffix AA | Lead-free, industrial temperature grade |
| Operating Temperature (junction) | -40 °C to +100 °C |
| Supply Voltage (Core) | 1.5 V |
| Configuration Modes | AS, PS, JTAG |
| I/O Standards | LVTTL, LVCMOS, SSTL, PCI, LVDS |
| Process Technology | 0.13 µm SRAM |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant (lead-free AA suffix) |
| Nível MSL | 3 (168 hours, per AIChipLink listing) |
Configuração de pinos do EP1C6T144C8AA
| Pino 1 | I/O (Bank 1) — User I/O; dual-purpose configuration pin |
| Pino 2 | I/O (Bank 1) — User I/O |
| Pino 3 | I/O (Bank 1) — User I/O |
| Pino 4 | I/O (Bank 1) — User I/O |
| Pino 5 | VCCIO1 — I/O bank 1 supply |
| Pino 6 | I/O (Bank 1) — User I/O |
| Pino 7 | I/O (Bank 1) — User I/O |
| Pino 8 | GND — Ground |
| Pino 9 | I/O (Bank 1) — User I/O |
| Pino 10 | I/O (Bank 1) — User I/O |
| Pino 11 | I/O (Bank 1) — User I/O |
| Pino 12 | VCCINT — Core supply (1.5 V) |
| Pino 13 | I/O (Bank 1) — User I/O |
| Pino 14 | I/O (Bank 1) — User I/O |
| Pino 15 | I/O (Bank 1) — User I/O |
| Pino 16 | GND — Ground |
| Pino 17 | I/O (Bank 1) — User I/O |
| Pino 18 | I/O (Bank 1) — User I/O |
| Pino 19 | I/O (Bank 1) — User I/O |
| Pino 20 | VCCIO1 — I/O bank 1 supply |
| Pino 21 | I/O (Bank 1) — User I/O |
| Pino 22 | I/O (Bank 1) — User I/O |
| Pino 23 | I/O (Bank 1) — User I/O |
| Pino 24 | I/O (Bank 1) — User I/O |
| Pino 25 | I/O (Bank 1) — User I/O |
| Pino 26 | I/O (Bank 1) — User I/O |
| Pino 27 | I/O (Bank 1) — User I/O |
| Pino 28 | GND — Ground |
| Pino 29 | I/O (Bank 1) — User I/O |
| Pino 30 | I/O (Bank 1) — User I/O |
| Pino 31 | VCCIO1 — I/O bank 1 supply |
| Pino 32 | I/O (Bank 1) — User I/O |
| Pino 33 | I/O (Bank 1) — User I/O |
| Pino 34 | I/O (Bank 1) — User I/O |
| Pino 35 | I/O (Bank 1) — User I/O |
| Pino 36 | I/O (Bank 1) — User I/O |
| Pino 37 | VCCINT — Core supply (1.5 V) |
| Pino 38 | I/O (Bank 2) — User I/O |
| Pino 39 | I/O (Bank 2) — User I/O |
| Pino 40 | I/O (Bank 2) — User I/O |
| Pino 41 | GND — Ground |
| Pino 42 | I/O (Bank 2) — User I/O |
| Pino 43 | I/O (Bank 2) — User I/O |
| Pino 44 | VCCIO2 — I/O bank 2 supply |
| Pino 45 | I/O (Bank 2) — User I/O |
| Pino 46 | I/O (Bank 2) — User I/O |
| Pino 47 | I/O (Bank 2) — User I/O |
| Pino 48 | I/O (Bank 2) — User I/O |
| Pino 49 | GND — Ground |
| Pino 50 | I/O (Bank 2) — User I/O |
| Pino 51 | I/O (Bank 2) — User I/O |
| Pino 52 | I/O (Bank 2) — User I/O |
| Pino 53 | VCCIO2 — I/O bank 2 supply |
| Pino 54 | I/O (Bank 2) — User I/O |
| Pino 55 | I/O (Bank 2) — User I/O |
| Pino 56 | I/O (Bank 2) — User I/O |
| Pino 57 | I/O (Bank 2) — User I/O |
| Pino 58 | VCCINT — Core supply (1.5 V) |
| Pino 59 | I/O (Bank 2) — User I/O |
| Pino 60 | I/O (Bank 2) — User I/O |
| Pino 61 | I/O (Bank 2) — User I/O |
| Pino 62 | GND — Ground |
| Pino 63 | I/O (Bank 2) — User I/O |
| Pino 64 | I/O (Bank 2) — User I/O |
| Pino 65 | I/O (Bank 2) — User I/O |
| Pino 66 | VCCIO2 — I/O bank 2 supply |
| Pino 67 | I/O (Bank 2) — User I/O |
| Pino 68 | I/O (Bank 2) — User I/O |
| Pino 69 | I/O (Bank 2) — User I/O |
| Pino 70 | I/O (Bank 2) — User I/O |
| Pino 71 | GND — Ground |
| Pino 72 | I/O (Bank 2) — User I/O |
| Pino 73 | I/O (Bank 3) — User I/O |
| Pino 74 | VCCIO3 — I/O bank 3 supply |
| Pino 75 | I/O (Bank 3) — User I/O |
| Pino 76 | I/O (Bank 3) — User I/O |
| Pino 77 | I/O (Bank 3) — User I/O |
| Pino 78 | VCCINT — Core supply (1.5 V) |
| Pino 79 | I/O (Bank 3) — User I/O |
| Pino 80 | I/O (Bank 3) — User I/O |
| Pino 81 | I/O (Bank 3) — User I/O |
| Pino 82 | GND — Ground |
| Pino 83 | I/O (Bank 3) — User I/O |
| Pino 84 | I/O (Bank 3) — User I/O |
| Pino 85 | I/O (Bank 3) — User I/O |
| Pino 86 | VCCIO3 — I/O bank 3 supply |
| Pino 87 | I/O (Bank 3) — User I/O |
| Pino 88 | I/O (Bank 3) — User I/O |
| Pino 89 | I/O (Bank 3) — User I/O |
| Pino 90 | I/O (Bank 3) — User I/O |
| Pino 91 | GND — Ground |
| Pino 92 | I/O (Bank 3) — User I/O |
| Pino 93 | I/O (Bank 3) — User I/O |
| Pino 94 | VCCIO3 — I/O bank 3 supply |
| Pino 95 | I/O (Bank 3) — User I/O |
| Pino 96 | I/O (Bank 3) — User I/O |
| Pino 97 | I/O (Bank 3) — User I/O |
| Pino 98 | I/O (Bank 3) — User I/O |
| Pino 99 | VCCINT — Core supply (1.5 V) |
| Pino 100 | I/O (Bank 3) — User I/O |
| Pino 101 | I/O (Bank 3) — User I/O |
| Pino 102 | I/O (Bank 3) — User I/O |
| Pino 103 | GND — Ground |
| Pino 104 | I/O (Bank 3) — User I/O |
| Pino 105 | I/O (Bank 3) — User I/O |
| Pino 106 | I/O (Bank 3) — User I/O |
| Pino 107 | VCCIO3 — I/O bank 3 supply |
| Pino 108 | I/O (Bank 3) — User I/O |
| Pino 109 | VCCINT — Core supply (1.5 V) |
| Pino 110 | I/O (Bank 4) — User I/O |
| Pino 111 | I/O (Bank 4) — User I/O |
| Pino 112 | I/O (Bank 4) — User I/O |
| Pino 113 | GND — Ground |
| Pino 114 | I/O (Bank 4) — User I/O |
| Pino 115 | I/O (Bank 4) — User I/O |
| Pino 116 | VCCIO4 — I/O bank 4 supply |
| Pino 117 | I/O (Bank 4) — User I/O |
| Pino 118 | I/O (Bank 4) — User I/O |
| Pino 119 | I/O (Bank 4) — User I/O |
| Pino 120 | I/O (Bank 4) — User I/O |
| Pino 121 | GND — Ground |
| Pino 122 | I/O (Bank 4) — User I/O |
| Pino 123 | I/O (Bank 4) — User I/O |
| Pino 124 | VCCIO4 — I/O bank 4 supply |
| Pino 125 | I/O (Bank 4) — User I/O |
| Pino 126 | I/O (Bank 4) — User I/O |
| Pino 127 | I/O (Bank 4) — User I/O |
| Pino 128 | I/O (Bank 4) — User I/O |
| Pino 129 | VCCINT — Core supply (1.5 V) |
| Pino 130 | I/O (Bank 4) — User I/O |
| Pino 131 | I/O (Bank 4) — User I/O |
| Pino 132 | I/O (Bank 4) — User I/O |
| Pino 133 | GND — Ground |
| Pino 134 | nCONFIG — Configuration start (active-low) |
| Pino 135 | nSTATUS — Configuration status (active-low) |
| Pino 136 | CONF_DONE — Configuration complete (open-drain) |
| Pino 137 | DCLK — Configuration clock |
| Pino 138 | MSEL0 — Configuration mode select |
| Pino 139 | MSEL1 — Configuration mode select |
| Pino 140 | TDI — JTAG test data in |
| Pino 141 | TMS — JTAG test mode select |
| Pino 142 | TCK — JTAG test clock |
| Pino 143 | TDO — JTAG test data out |
| Pino 144 | VCCIO4 — I/O bank 4 supply (also JTAG bank) |
Aplicações típicas
EP1C6T144C8AA é adequado para 6 aplicaçãos: Industrial Motor Control and Factory Automation, Video Image-Sensor Interface Bridging, Legacy Telecom Backplane and Bus Bridging, Low-Cost ASIC Prototyping, Consumer Display Controllers and LCD Adapters, Test and Measurement Front-End Logic.
Industrial Motor Control and Factory Automation
The EP1C6T144C8AA's 5,980 logic elements and two PLLs make it well-suited to industrial motor control front-ends, where the device performs PWM generation, encoder decoding, and field-oriented control glue logic. The 98 user I/Os in 144-LQFP provide enough headroom for multi-axis step/direction interfaces, limit-switch inputs, and opto-isolated gate-driver control lines. Industrial AA temperature grade (-40 to +100 C junction) supports deployment inside sealed control cabinets without active cooling. Compared with a CPLD of equivalent pin count, the Cyclone adds block RAM for storing sine look-up tables and small PID state histories. The 144-LQFP also simplifies hand-rework and field replacement, a practical advantage for installed-base industrial equipment.
Recomendado
Video Image-Sensor Interface Bridging
The EP1C6T144C8AA is frequently used as a bridge between parallel CMOS image sensors and downstream processors in industrial cameras, scanners, and machine-vision systems. The 92,160 RAM bits organized as twenty M4K blocks are ideal for line buffers and Bayer-pattern demosaicing pipelines, while the LVDS-capable I/Os accept high-speed pixel clocks up to 640 Mbps. The two PLLs allow independent generation of the sensor master clock and the downstream parallel interface clock, maintaining clean clock-domain isolation. With 98 user I/Os, the device can drive a 24-bit RGB bus plus control lines and still leave margin for I2C configuration and JTAG. The 144-LQFP package is preferred over BGA for prototype builds that need to be reworked on the bench.
Recomendado
Legacy Telecom Backplane and Bus Bridging
Telecom backplanes often require glue logic between asynchronous serial links (T1/E1, RS-485, SPI, I2C) and backplane fabrics such as H.110 or proprietary parallel buses. The EP1C6T144C8AA's 98 user I/Os comfortably cover a multi-link serial-to-parallel aggregator plus H.110 CT_BUS interface, while the 5,980 logic elements handle per-channel framing and CRC insertion. AA industrial temperature grade ensures reliable operation in CO (central-office) environments. The 92,160 bits of block RAM can store ping-pong buffers for line-rate conversion, eliminating external FIFOs. Many telecom OEMs built long-life Cyclone I designs and continue to service installed base, which is why demand for this part persists in aftermarket channels.
Recomendado
Low-Cost ASIC Prototyping
Designers routinely map mid-complexity ASICs onto the EP1C6T144C8AA for pre-silicon validation and firmware bring-up. The 5,980 logic elements, 92,160 RAM bits, and dual PLLs cover many sub-100K-gate ASIC RTL designs, while the SRAM-based configuration enables rapid design iteration via JTAG. Industrial temperature grade allows the prototype board to be deployed in the actual end-product environment for accelerated life testing. The 144-LQFP package is also cost-effective for prototype runs of a few hundred units. Quartus II 13.0sp1 supports incremental compilation and the SOPC Builder flow, enabling team-based prototyping of heterogeneous subsystems.
Recomendado
Consumer Display Controllers and LCD Adapters
The EP1C6T144C8AA is widely deployed as a low-cost display-format converter for legacy consumer electronics, medical monitors, and kiosk displays. Its LVDS-capable I/Os drive up to XGA resolution panels, while the block RAM provides line buffers for frame-rate conversion and scaling. Designers can implement multiple digital video interfaces (DVI, HDMI bridge, LVDS) alongside an MCU-attached control plane on a single chip. The two PLLs regenerate pixel clocks and provide independent audio-clock synthesis. Industrial temperature grade supports indoor and protected-outdoor kiosk deployments. The 144-LQFP package is hand-solderable, simplifying small-batch repairs and field retrofits.
Recomendado
Test and Measurement Front-End Logic
Bench-top and modular instruments frequently use the EP1C6T144C8AA as a flexible digital-front-end between sensors and a DSP or host CPU. The 98 user I/Os handle multi-channel parallel ADC/DAC interfaces, trigger lines, and front-panel LEDs, while the two PLLs generate clean ADC sample clocks and decimate clocks. Industrial temperature grade supports lab and light-industrial environments. The block RAM stores calibration coefficients, look-up tables, and short capture buffers, eliminating external SRAM. The 144-LQFP package is convenient for instrument firmware engineers who need direct access to JTAG and configuration pins during development and re-spin cycles.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C6T144C8AA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C6T144C8N | EP1C6T144C7N | EP1C6T144C6N | EP1C6T144I7N | EP1C6Q240C8N | EP1C6F256C8N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 144-LQFP (TQFP) - same footprint | 240-PQFP - larger, not footprint-compatible | 256-FBGA - not footprint-compatible |
| Brand | Intel | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) | Intel (same brand) |
| Logic Elements | 5,980 | 5,980 (identical) | 5,980 (identical) | 5,980 (identical) | 5,980 (identical) | 5,980 (identical die) | 5,980 (identical die) |
| Total RAM Bits | 92,160 | 92,160 (identical) | 92,160 (identical) | 92,160 (identical) | 92,160 (identical) | 92,160 (identical die) | 92,160 (identical die) |
| User I/O Pins | 98 | 98 (identical) | 98 (identical) | 98 (identical) | 98 (identical) | 185 (more I/O, larger package) | 185 (more I/O, BGA package) |
| Speed Grade | 8 (slowest) | 8 (identical) | 7 (~12% Fmax improvement) | 6 (fastest Cyclone I bin, ~25% Fmax improvement) | 7 (industrial) | 8 (identical speed) | 8 (identical speed) |
| Temperature Grade | Industrial (-40 to +100 C junction) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
| PLLs | 2 | 2 (identical) | 2 (identical) | 2 (identical) | 2 (identical) | 2 (identical die) | 2 (identical die) |
| Footprint-Compatibility with 144-LQFP | Yes (this part) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | Yes (drop-in for footprint) | No (different package) | No (BGA package) |
| Lifecycle Status (as of 2026-09-06) | Last-time-buy | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) | Last-time-buy (Cyclone I family) |
Principais diferenciais
- Industrial temperature grade in a Cyclone I 144-LQFP (vs EP1C6T144C8N)
- Slower speed grade (8) with full industrial rating (vs EP1C6T144I7N)
- Drop-in compatible with all EP1C6T144 variants (vs EP1C3T144C8 / EP1C12Q240C8N)
Notas de projeto
Estimated: at 25 °C ambient, full 98-I/O utilization, 100 MHz core clock, the EP1C6T144C8AA typically consumes 200-300 mA from VCCINT (1.5 V) plus per-bank VCCIO current. Estimated Icc_int = 250 mA, VCCINT power = 0.375 W. Add four bulk 100 µF tantalum or ceramic capacitors on each VCCIO bank and place 0.1 µF + 0.01 µF high-frequency bypass capacitors within 100 mil of every VCCINT pin. Use a ferrite bead to isolate PLL analog supply from digital VCCINT, per the Cyclone device handbook.
144-LQFP at 0.4 mm pitch requires 0.2 mm trace width and 0.2 mm clearance for fanout. Use at least 4 PCB layers with one continuous ground plane under the device; route all 98 user I/Os on inner layers to escape the fine-pitch perimeter. Place the EPCS configuration flash within 50 mm of DCLK and DATA0/ASDO pins to meet AS-mode timing. JTAG chain (TCK/TMS/TDO/TDI) must be kept short and daisy-chained with 4.7 kΩ pull-ups on TCK/TMS as recommended in the Cyclone handbook.
Cyclone I family is configured by a 1.5 V core and requires an Altera/Intel EPCS1/EPCS4/EPCS16 serial flash - older EPC1/EPC2 parallel configuration devices will NOT work. Do not confuse the MSEL pin settings between AS, PS, and JTAG-only modes; incorrect MSEL causes configuration failure. LVDS pairs require an external 100 Ω differential termination across each pair. Avoid using LVDS channels adjacent to PLL analog supply pins to prevent jitter injection. When migrating from a commercial-grade part to AA industrial grade, verify junction-temperature derating against your real enclosure thermal profile.
Estimated: the 144-LQFP package has a theta_JA of approximately 35 °C/W on a 4-layer JEDEC test board. At typical 0.5 W dissipation, junction rise is about 17 °C above ambient; at the worst-case 1 W dissipation in enclosed industrial enclosures, junction rise is 35 °C. Industrial-grade (-40 to +100 °C junction) headroom is comfortable for most cabinet-mounted designs, but continuous 85 °C ambient operation with full I/O toggling should be validated thermally. A 50 mm × 50 mm copper thermal pad under the device footprint reduces theta_JA by 15-20 %.
Informações de conformidade
AA suffix indicates lead-free finish; part is RoHS and REACH compliant per Intel/Altera Cyclone family documentation. Not AEC-Q100 qualified - this part targets industrial (not automotive) applications. Original Cyclone I family is in last-time-buy; Intel recommends migration to Cyclone IV or Cyclone 10 LP for new designs.