EP1S10F484C7N - Stratix FPGA 10,570 LEs, 484-FBGA | Intel
N.º da peça: EP1S10F484C7N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $235.85 | $235,85 |
| 10 | $220 | $2.200,00 |
| 100 | $198 | $19.800,00 |
| 500 | $178 | $89.000,00 |
| 1.000 | $162 | $162.000,00 |
EP1S10F484C7N Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect fabric. FPGAs occupy a tier above general-purpose microcontrollers for workloads that demand deterministic parallel processing: DSP pipelines, high-speed serial interfaces, custom datapaths, and ASIC prototyping. Modern FPGAs typically embed block RAM, DSP blocks, PLLs, and high-speed transceivers; the Stratix family was the first to integrate dedicated TriMatrix memory and DSP blocks at this scale.
Key features include 10,570 logic elements (LEs) organized as 1,057 Logic Array Blocks (LABs), 920 Kbits of TriMatrix embedded RAM split into M512/M4K/M-RAM blocks, and 48 embedded DSP blocks for fixed- and floating-point signal processing. The device also integrates up to 12 PLLs, 335 user I/O pins with support for multiple I/O standards (LVTTL, LVCMOS, SSTL, LVDS, PCI), and 4 phase-locked loops dedicated to high-speed clock management. Configuration is supported via JTAG, Passive Serial, Passive Parallel, or via a configuration device such as the EPC16 or EPCS.
Architecturally, the Stratix fabric places 10 LEs into each LAB with a dedicated carry chain and a shared register chain for fast arithmetic. The TriMatrix memory blocks are tightly coupled to the DSP blocks, enabling single-cycle multiply-accumulate operations. The 130 nm process and 1.5 V core deliver a typical internal operating frequency in the range of hundreds of MHz for registered designs, with maximum internal performance cited in the family data sheet as 420 MHz in benchmark datapaths.
Typical applications include telecommunications line cards, baseband signal processing, video and image processing, military and aerospace prototyping, ASIC and ASIP emulation, and high-end industrial control. The large logic and RAM capacity also suits networking equipment such as routers and switches that require custom packet-processing pipelines. The wide I/O count and flexible I/O standard support make EP1S10 devices a common fit for legacy parallel bus interfaces that are no longer well served by smaller Cyclone or MAX families.
When designing with this part, ensure the Quartus II design toolchain (version 13.0 or earlier is recommended for legacy Stratix support) is selected, since later Quartus releases dropped the original Stratix device support. Pay attention to decoupling on each VCCINT, VCCIO bank, and PLL supply pin, and follow the Intel/Altera Stratix FPGA Hardware Design Guidelines for power rail sequencing and JTAG chain termination.
This page synthesizes distributor pricing (DigiKey, Mouser, Octopart), drop-in Altera/Intel variants in the same 484-FBGA footprint, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas drop-in para EP1S10F484C7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1S10F484C7N (mesmo formato e footprint) — diferindo em Package, Family, Operating Temperature, Mounting Type, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1S10F484C7
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →EP1S10F484C6N
✓ Em estoque
$226.31 / unidade
Ver ficha técnica →EP1S10F484C5N
✅ Drop-In✓ Em estoque
$52 / unidade
Ver ficha técnica →EP1S10F484C7N Classificações máximas e características elétricas
| Family | Stratix (EP1S) |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| Embedded Memory (Total) | 920,448 bits |
| Embedded Memory Blocks | TriMatrix (M512/M4K/M-RAM) |
| Embedded DSP Blocks | 48 |
| Maximum User I/O | 335 |
| PLLs | 12 |
| Encapsulamento | 484-ball FineLine BGA (FBGA-484), 23 x 23 mm, 1 mm pitch |
| Speed Grade | C7 (-7) |
| Operating Temperature (Commercial) | 0 C to +85 C |
| Configuration Methods | JTAG, Passive Serial, Passive Parallel |
Guia de Configuração de Pinos do EP1S10F484C7N 484-ball fineline bga (fbga-484), 23 x 23 mm, 1 mm pitch
Configuração de pinos para EP1S10F484C7N (pacote 484-ball fineline bga (fbga-484), 23 x 23 mm, 1 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1S10F484C7N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1S10F484C7N é adequado para 6 aplicaçãos: Telecommunications Line Card, ASIC and ASIC Prototyping, Digital Signal Processing (DSP), Video and Image Processing, Industrial Control and Networking, Legacy Migration and Bridging.
Telecommunications Line Card
The EP1S10F484C7N's 10,570 logic elements, 48 DSP blocks, and 920 Kbits of embedded TriMatrix memory make it well suited for telecom line-card datapaths such as Reed-Solomon FEC, Viterbi decoding, and packet-header parsing. With 335 user I/O it can connect to multiple external PHY devices across LVTTL/LVDS banks, while 12 PLLs provide the multi-frequency clocking required by SONET/SDH and OTN framer ASICs. Designers can run one instance per channel and scale across multiple line cards.
Recomendado
ASIC and ASIC Prototyping
Designers routinely use the EP1S10F484C7N as a building block for multi-FPGA ASIC prototyping of designs up to several million gates. Its 1,057 LABs and abundant routing deliver predictable timing closure, while the 484-FBGA footprint exposes enough I/O for the TDM-style interconnect fabric between FPGAs in a partitioning scheme. Quartus II 13.0 supports the original Stratix family directly, which shortens the bring-up loop compared with newer families lacking equivalent native support.
Recomendado
Digital Signal Processing (DSP)
The 48 dedicated DSP blocks let the EP1S10F484C7N sustain single-cycle multiply-accumulate operations at hundreds of MHz, suitable for FIR filters, FFT engines, and channelizers in radar and software-defined radio. The TriMatrix memory hierarchy (M512, M4K, M-RAM) keeps coefficient storage on-chip to avoid off-memory bottlenecks. 335 I/O pins and 12 PLLs allow multiple synchronized ADC/DAC data streams to be aggregated at the FPGA fabric with deterministic latency.
Recomendado
Video and Image Processing
The EP1S10F484C7N's 920 Kbits of embedded RAM and 335 I/O pins support real-time video pipelines at SD and HD resolutions: 3-channel de-interlacing, scaling, color-space conversion, and on-screen-display overlay. TriMatrix blocks can be configured as line buffers or small frame buffers without external SRAM. The 1.5 V core plus LVDS support on selected banks allows direct connection to Camera Link and Channel Link image sensors.
Recomendado
Industrial Control and Networking
With 335 user I/O, the EP1S10F484C7N can sink multiple parallel industrial buses (parallel ADC, parallel DAC, PLC backplanes, and legacy 32/64-bit CPU interfaces) while running deterministic control loops in the fabric. The 12 PLLs allow precise synchronization to encoder feedback or grid-frequency clocks. The commercial 0 to +85 C range covers most factory-floor enclosures, and the 130 nm process is well understood by long-lifecycle industrial customers.
Recomendado
Legacy Migration and Bridging
Designers migrating older Altera APEX or FLEX designs to a modern footprint often adopt the EP1S10F484C7N because it preserves the same Quartus II toolchain generation and supports the same JTAG and Passive Serial configuration flows. The 484-FBGA footprint gives plenty of I/O to bridge legacy 32-bit parallel buses (PCI, VME, PMC) to newer high-speed serial links. This makes it an attractive bridge ASIC for aerospace and defense systems with long qualification cycles.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1S10F484C7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1S10F484C7 | EP1S10F484C6N | EP1S10F484C5N | EP1S10B672C7N | EP1S10B672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FBGA (23x23 mm, 1.0 mm pitch) | 484-ball FBGA (23x23 mm, 1.0 mm pitch) - same | 484-ball FBGA (23x23 mm, 1.0 mm pitch) - same | 484-ball FBGA (23x23 mm, 1.0 mm pitch) - same | 672-ball BGA (different footprint) | 672-ball BGA (different footprint) |
| Speed Grade | C7 (-7) | C7 (-7) | C6 (-6) | C5 (-5) | C7 (-7) | C7 (-7) |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded RAM | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits |
| DSP Blocks | 48 | 48 | 48 | 48 | 48 | 48 |
| PLLs | 12 | 12 | 12 | 12 | 12 | 12 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
Principais diferenciais
- Highest speed grade available in EP1S10 family (vs EP1S10F484C6N)
- Lower unit cost vs C7 with same silicon (vs EP1S10F484C5N)
- Stratix-class DSP and TriMatrix memory (vs Cyclone IV EP4CE10 (hypothetical cross-brand))
Notas de projeto
Stratix EP1S10 devices require multiple power rails: VCCINT at 1.5 V for core logic, VCCIO at 1.5 V/1.8 V/2.5 V/3.3 V per I/O bank, VCCPD for pre-drivers, and a separate VCCA_PLL rail per PLL bank. Decoupling per Intel/Altera Stratix Hardware Design Guidelines requires 0.1 uF X7R at every VCC pin plus bulk 22 uF tantalum or ceramic on each rail. Power sequencing should assert VCCINT before VCCIO; failure to sequence can latch-up I/O buffers.
The 484-ball FBGA package dissipates up to 5 W in worst-case utilization. Use a minimum 4-layer PCB with continuous GND plane under the BGA for heat spreading. Theta-JA is typically 14 C/W with a JEDEC JESD51 test board; without airflow or a thermal via array, junction temperature can exceed 100 C at 85 C ambient under heavy DSP utilization. Add thermal vias in the BGA land pattern to keep Tj within commercial 125 C limits.
The 1.0 mm pitch 484-ball FBGA requires 0.5 mm diameter land pads with non-solder-mask-defined (NSMD) finish for reliable assembly. Use a 1:1 trace-to-via fanout under the BGA in inner layers and escape the outer rows on the top layer. Keep all differential pairs length-matched within 150 mil for LVDS signals. Follow Intel/Altera AN 224: PCB Layout for High-Density BGA Packages for via-in-pad and microvia recommendations.
Quartus Prime 14.0 and later do NOT support the original Stratix family - design files must be rebuilt with Quartus II 13.0 or earlier. A common pitfall is selecting the wrong configuration mode: Passive Serial requires an Altera configuration device (EPCS4/EPCS16/EPC16), Passive Parallel requires a flash or CPLD controller. JTAG chain order matters when the EP1S10 shares the JTAG bus with other devices; configure BSDL files carefully.
Informações de conformidade
N suffix in part number designates Pb-free ball finish per Altera/Intel ordering guide; full RoHS, REACH, halogen-free and conflict-mineral disclosures should be requested from the authorized distributor. AEC-Q100 not applicable (commercial grade FPGA).
