EP1S10F484C7N - Stratix FPGA 10,570 LEs, 484-FBGA | Intel
MPN: EP1S10F484C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $235.85 | $235.85 |
| 10 | $220 | $2,200.00 |
| 100 | $198 | $19,800.00 |
| 500 | $178 | $89,000.00 |
| 1,000 | $162 | $162,000.00 |
Drop-in alternatives for EP1S10F484C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F484C7
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP1S10F484C6N
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$226.31 / Unit
View Datasheet →EP1S10F484C5N
✅ Drop-In✓ In Stock
$52 / Unit
View Datasheet →EP1S10F484C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix (EP1S) |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| Embedded Memory (Total) | 920,448 bits |
| Embedded Memory Blocks | TriMatrix (M512/M4K/M-RAM) |
| Embedded DSP Blocks | 48 |
| Maximum User I/O | 335 |
| PLLs | 12 |
| Package | 484-ball FineLine BGA (FBGA-484), 23 x 23 mm, 1 mm pitch |
| Speed Grade | C7 (-7) |
| Operating Temperature (Commercial) | 0 C to +85 C |
| Configuration Methods | JTAG, Passive Serial, Passive Parallel |
EP1S10F484C7N 484-ball fineline bga (fbga-484), 23 x 23 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1S10F484C7N (484-ball fineline bga (fbga-484), 23 x 23 mm, 1 mm pitch package) with 48 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F484C7N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 48 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F484C7N is suitable for 6 applications: Telecommunications Line Card, ASIC and ASIC Prototyping, Digital Signal Processing (DSP), Video and Image Processing, Industrial Control and Networking, Legacy Migration and Bridging.
Telecommunications Line Card
The EP1S10F484C7N's 10,570 logic elements, 48 DSP blocks, and 920 Kbits of embedded TriMatrix memory make it well suited for telecom line-card datapaths such as Reed-Solomon FEC, Viterbi decoding, and packet-header parsing. With 335 user I/O it can connect to multiple external PHY devices across LVTTL/LVDS banks, while 12 PLLs provide the multi-frequency clocking required by SONET/SDH and OTN framer ASICs. Designers can run one instance per channel and scale across multiple line cards.
Recommended
ASIC and ASIC Prototyping
Designers routinely use the EP1S10F484C7N as a building block for multi-FPGA ASIC prototyping of designs up to several million gates. Its 1,057 LABs and abundant routing deliver predictable timing closure, while the 484-FBGA footprint exposes enough I/O for the TDM-style interconnect fabric between FPGAs in a partitioning scheme. Quartus II 13.0 supports the original Stratix family directly, which shortens the bring-up loop compared with newer families lacking equivalent native support.
Recommended
Digital Signal Processing (DSP)
The 48 dedicated DSP blocks let the EP1S10F484C7N sustain single-cycle multiply-accumulate operations at hundreds of MHz, suitable for FIR filters, FFT engines, and channelizers in radar and software-defined radio. The TriMatrix memory hierarchy (M512, M4K, M-RAM) keeps coefficient storage on-chip to avoid off-memory bottlenecks. 335 I/O pins and 12 PLLs allow multiple synchronized ADC/DAC data streams to be aggregated at the FPGA fabric with deterministic latency.
Recommended
Video and Image Processing
The EP1S10F484C7N's 920 Kbits of embedded RAM and 335 I/O pins support real-time video pipelines at SD and HD resolutions: 3-channel de-interlacing, scaling, color-space conversion, and on-screen-display overlay. TriMatrix blocks can be configured as line buffers or small frame buffers without external SRAM. The 1.5 V core plus LVDS support on selected banks allows direct connection to Camera Link and Channel Link image sensors.
Recommended
Industrial Control and Networking
With 335 user I/O, the EP1S10F484C7N can sink multiple parallel industrial buses (parallel ADC, parallel DAC, PLC backplanes, and legacy 32/64-bit CPU interfaces) while running deterministic control loops in the fabric. The 12 PLLs allow precise synchronization to encoder feedback or grid-frequency clocks. The commercial 0 to +85 C range covers most factory-floor enclosures, and the 130 nm process is well understood by long-lifecycle industrial customers.
Recommended
Legacy Migration and Bridging
Designers migrating older Altera APEX or FLEX designs to a modern footprint often adopt the EP1S10F484C7N because it preserves the same Quartus II toolchain generation and supports the same JTAG and Passive Serial configuration flows. The 484-FBGA footprint gives plenty of I/O to bridge legacy 32-bit parallel buses (PCI, VME, PMC) to newer high-speed serial links. This makes it an attractive bridge ASIC for aerospace and defense systems with long qualification cycles.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F484C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F484C7 | EP1S10F484C6N | EP1S10F484C5N | EP1S10B672C7N | EP1S10B672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FBGA (23x23 mm, 1.0 mm pitch) | 484-ball FBGA (23x23 mm, 1.0 mm pitch) - same | 484-ball FBGA (23x23 mm, 1.0 mm pitch) - same | 484-ball FBGA (23x23 mm, 1.0 mm pitch) - same | 672-ball BGA (different footprint) | 672-ball BGA (different footprint) |
| Speed Grade | C7 (-7) | C7 (-7) | C6 (-6) | C5 (-5) | C7 (-7) | C7 (-7) |
| Logic Elements | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 | 10,570 |
| Embedded RAM | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits | 920,448 bits |
| DSP Blocks | 48 | 48 | 48 | 48 | 48 | 48 |
| Maximum User I/O | 335 | 335 | 335 | 335 | [DATA_NEEDED] | [DATA_NEEDED] |
| PLLs | 12 | 12 | 12 | 12 | 12 | 12 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
Key Differentiators
- Highest speed grade available in EP1S10 family (vs EP1S10F484C6N)
- Lower unit cost vs C7 with same silicon (vs EP1S10F484C5N)
- Stratix-class DSP and TriMatrix memory (vs Cyclone IV EP4CE10 (hypothetical cross-brand))
Design Notes
Stratix EP1S10 devices require multiple power rails: VCCINT at 1.5 V for core logic, VCCIO at 1.5 V/1.8 V/2.5 V/3.3 V per I/O bank, VCCPD for pre-drivers, and a separate VCCA_PLL rail per PLL bank. Decoupling per Intel/Altera Stratix Hardware Design Guidelines requires 0.1 uF X7R at every VCC pin plus bulk 22 uF tantalum or ceramic on each rail. Power sequencing should assert VCCINT before VCCIO; failure to sequence can latch-up I/O buffers.
The 484-ball FBGA package dissipates up to 5 W in worst-case utilization. Use a minimum 4-layer PCB with continuous GND plane under the BGA for heat spreading. Theta-JA is typically 14 C/W with a JEDEC JESD51 test board; without airflow or a thermal via array, junction temperature can exceed 100 C at 85 C ambient under heavy DSP utilization. Add thermal vias in the BGA land pattern to keep Tj within commercial 125 C limits.
The 1.0 mm pitch 484-ball FBGA requires 0.5 mm diameter land pads with non-solder-mask-defined (NSMD) finish for reliable assembly. Use a 1:1 trace-to-via fanout under the BGA in inner layers and escape the outer rows on the top layer. Keep all differential pairs length-matched within 150 mil for LVDS signals. Follow Intel/Altera AN 224: PCB Layout for High-Density BGA Packages for via-in-pad and microvia recommendations.
Quartus Prime 14.0 and later do NOT support the original Stratix family - design files must be rebuilt with Quartus II 13.0 or earlier. A common pitfall is selecting the wrong configuration mode: Passive Serial requires an Altera configuration device (EPCS4/EPCS16/EPC16), Passive Parallel requires a flash or CPLD controller. JTAG chain order matters when the EP1S10 shares the JTAG bus with other devices; configure BSDL files carefully.
Compliance Information
N suffix in part number designates Pb-free ball finish per Altera/Intel ordering guide; full RoHS, REACH, halogen-free and conflict-mineral disclosures should be requested from the authorized distributor. AEC-Q100 not applicable (commercial grade FPGA).
