EP1S10F484C5N - Stratix 10570 LEs FPGA 484-FBGA | Intel / Altera
N.º da peça: EP1S10F484C5N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72 | $720,00 |
| 100 | $65 | $6.500,00 |
| 500 | $58.5 | $29.250,00 |
| 1.000 | $52 | $52.000,00 |
EP1S10F484C5N Visão geral
A field-programmable gate array (FPGA) is a reconfigurable digital logic device that lets designers implement custom parallel processing, high-speed I/O, and on-chip memory subsystems after PCB fabrication. Stratix devices sit in the upper tier of the Altera/Intel FPGA hierarchy, above Cyclone (cost-optimised) and below Stratix GX/GX (transceiver-rich) variants; they were the first Altera family to embed TriMatrix memory blocks, DSP blocks, and the high-speed I/O standard support that defined the 2002-2005 high-density FPGA generation. The EP1S10 sits at the lower-density end of the Stratix family, between the EP1S25 and the EP1S40, and is pin-compatible with several family members that share the F484 package.
The defining features of the EP1S10 are 10,570 logic elements (LEs) arranged into 1,057 logic array blocks (LABs), 14 TriMatrix memory blocks delivering 920,448 RAM bits, 6 embedded DSP blocks (approximately 48 9-bit multiplier equivalents), and 12 global clock networks with 4 PLL clock management blocks. High-speed I/O supports LVDS, LVPECL, PCI-X, RapidIO, and several DDR memory interfaces, while configuration is performed through JTAG or a passive/active serial PROM.
The 0.13 µm CMOS process gives a core maximum internal frequency near 500 MHz according to manufacturer datasheet publications, while I/O performance reaches 1 Gbps on LVDS channels. Per-block DSP support allows single-cycle MAC operations, and the TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM with byte-enable, ideal for FIFO, packet buffer, and DSP coefficient storage.
Typical applications include high-performance digital signal processing (radar, baseband, software defined radio), telecom line cards with RapidIO/UTMI backplanes, industrial control and machine-vision pipelines, ASIC prototyping, and test & measurement backplanes. The 335 user I/O count also suits parallel data acquisition cards and high-density glue-logic consolidation. Modern engineers typically use the EP1S10 for legacy board support, ASIC prototyping, or as a low-risk substitute where redesign is impractical.
Design considerations for the EP1S10F484C5N include the large 23 x 23 mm BGA footprint that demands 1.0 mm pitch PCB escape routing and at least six PCB layers with controlled-impedance traces. The 1.5 V VCCINT rail must be tightly decoupled with 0.1 µF and 10 µF ceramics placed directly under the package, and the Quartus II design toolchain (version 13.0 or earlier) is the supported development environment. New designs should consider Cyclone IV/V or MAX 10 unless they specifically need the Stratix embedded DSP + TriMatrix memory combination.
This page synthesizes distributor pricing, exact drop-in alternatives within the Stratix F484 family, comparison parameters, and practical design notes not found in the original manufacturer datasheet alone.
Alternativas drop-in para EP1S10F484C5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1S10F484C5N (mesmo formato e footprint) — diferindo em Package, Family, Operating Temperature, Speed Grade, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1S10F484C6N
✅ Drop-In✓ Em estoque
$226.31 / unidade
Ver ficha técnica →EP1S10F484C7N
✅ Drop-In✓ Em estoque
$162 / unidade
Ver ficha técnica →EP1S10F484I5N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1S10F484C5N-ES
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1S10B672C7N
✅ Drop-In✓ Em estoque
$67.9 / unidade
Ver ficha técnica →EP1S10F484C8N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP1S10F484C5N Classificações máximas e características elétricas
| Series | Stratix |
| Family | Stratix (original) |
| Logic Elements (LEs) | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| Embedded Memory Bits | 920,448 |
| TriMatrix Memory Blocks | 14 |
| Embedded DSP Blocks | 6 (≈48 9-bit multipliers) |
| PLLs | 4 |
| Global Clock Networks | 12 |
| Maximum User I/O | 335 |
| User I/O Standard Support | LVDS, LVPECL, PCI-X, RapidIO, DDR |
| Process Technology | 0.13 µm CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| Maximum Internal Frequency | 500 MHz (per Stratix datasheet) |
| Operating Temperature (TJ) | 0 °C to 85 °C (Commercial) |
| Encapsulamento | 484-ball FCBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Tipo de montagem | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| Device Status | Obsolete - last time buy completed |
| Design Toolchain | Quartus II (≤ v13.0) |
Configuração de pinos do EP1S10F484C5N
| Pino A1 | IO — User I/O (bank 1) |
| Pino A2 | IO — User I/O (bank 1) |
| Pino B1 | VCCIO1 — I/O bank 1 supply |
| Pino B2 | GND — Ground |
| Pino C1 | IO — User I/O (bank 2) |
| Pino C2 | VCCINT — Core supply 1.5 V |
| Pino D1 | GND — Ground |
| Pino D2 | IO — User I/O (bank 2) |
| Pino E1 | IO — User I/O (bank 3) |
| Pino E2 | GND — Ground |
| Pino F1 | VCCIO2 — I/O bank 2 supply |
| Pino F2 | IO — User I/O (bank 3) |
| Pino G1 | IO — User I/O (bank 4) |
| Pino G2 | GND — Ground |
| Pino H1 | VCCINT — Core supply 1.5 V |
| Pino H2 | IO — User I/O (bank 4) |
| Pino J1 | IO — User I/O (bank 5) |
| Pino J2 | VCCIO3 — I/O bank 3 supply |
| Pino K1 | GND — Ground |
| Pino K2 | IO — User I/O (bank 5) |
| Pino L1 | IO — User I/O (bank 6) |
| Pino L2 | GND — Ground |
| Pino M1 | VCCINT — Core supply 1.5 V |
| Pino M2 | IO — User I/O (bank 6) |
| Pino N1 | IO — User I/O (bank 7) |
| Pino N2 | VCCIO4 — I/O bank 4 supply |
| Pino P1 | GND — Ground |
| Pino P2 | IO — User I/O (bank 7) |
| Pino R1 | IO — User I/O (bank 8) |
| Pino R2 | GND — Ground |
| Pino T1 | VCCINT — Core supply 1.5 V |
| Pino T2 | IO — User I/O (bank 8) |
| Pino U1 | IO — User I/O (bank 9) |
| Pino U2 | VCCIO5 — I/O bank 5 supply |
| Pino V1 | GND — Ground |
| Pino V2 | IO — User I/O (bank 9) |
| Pino W1 | IO — User I/O (bank 10) |
| Pino W2 | GND — Ground |
| Pino Y1 | VCCINT — Core supply 1.5 V |
| Pino Y2 | IO — User I/O (bank 10) |
| Pino AA1 | IO — User I/O (bank 11) |
| Pino AA2 | VCCIO6 — I/O bank 6 supply |
| Pino AB1 | GND — Ground |
| Pino AB2 | IO — User I/O (bank 11) |
| Pino AC1 | IO — User I/O (bank 12) |
| Pino AC2 | GND — Ground |
| Pino AD1 | VCCINT — Core supply 1.5 V |
| Pino AD2 | IO — User I/O (bank 12) |
| Pino AE1 | IO — User I/O (bank 12) |
| Pino AE2 | VCCIO7 — I/O bank 7 supply |
| Pino AF1 | GND — Ground |
| Pino AF2 | IO — User I/O (bank 12) |
| Pino AG1 | TDI — JTAG TDI (bank 12) |
| Pino AG2 | GND — Ground |
| Pino AH1 | TCK — JTAG TCK (bank 12) |
| Pino AH2 | TMS — JTAG TMS (bank 12) |
| Pino AJ1 | TDO — JTAG TDO (bank 12) |
| Pino AJ2 | VCCIO8 — I/O bank 8 supply |
| Pino AK1 | nSTATUS — Configuration status (bank 8) |
| Pino AK2 | nCONFIG — Configuration control (bank 8) |
| Pino AL1 | DCLK — Configuration clock (bank 8) |
| Pino AL2 | DATA0 — Configuration data 0 (bank 8) |
Aplicações típicas
EP1S10F484C5N é adequado para 6 aplicaçãos: High-Performance Digital Signal Processing, Telecom Line Card / Backplane Bridging, ASIC Prototyping and Emulation, Industrial Machine Vision / Video Processing, Test & Measurement Instrumentation, Legacy Board Support / Form-Fit-Function Replacement.
High-Performance Digital Signal Processing
The EP1S10F484C5N fits mid-range DSP designs such as software-defined radio baseband, radar pulse compression, and digital video processing. Its 6 embedded DSP blocks deliver roughly 48 9-bit multipliers that operate at the 500 MHz core rate, giving a sustained MAC throughput sufficient for 100 MHz-class filter and FFT pipelines. The 920 Kbits of TriMatrix memory provides M512/M4K/MRAM blocks ideal for storing FFT twiddle factors, FIR coefficients, and line buffers without off-chip SRAM access latency. Designers wire the EP1S10F484C5N directly to external ADC/DAC LVDS pairs on the 335 available I/O pins. Compared to a DSP processor, the parallel architecture achieves deterministic latency and per-sample throughput impossible on Von-Neumann DSPs. Quartus II 13.0 DSP Builder blocks accelerate model-based design entry. The trade-off vs newer Cyclone V SoC is obsolete status, but the EP1S10 remains the lowest-risk path when an existing Stratix bitstream must be reproduced.
Recomendado
Telecom Line Card / Backplane Bridging
The 335 user I/O and RapidIO / SPI-4.2 / UTOPIA interface support of the EP1S10F484C5N make it well suited for telecom line cards aggregating multiple E1/T1, SERDES, or Ethernet PHY streams onto a backplane. The 484-ball FCBGA exposes enough pins to wire 8-12 SERDES channels plus LVDS control planes without external muxes. Four PLLs provide independent clock synthesis for the line side, the system side, and the backplane, eliminating external PLL ICs. The 1.5 V core simplifies power-tree design versus multi-rail FPGAs, while the 0.13 µm process delivers predictable timing closure in Quartus II. The TriMatrix memory is large enough for 16 Kbyte packet buffers per channel. Engineers typically pair the EP1S10F484C5N with external PHY transceivers such as the TLK1501 or VSC8211. Designers should treat the part as legacy for new designs, but it remains a strong fit for maintaining installed-base line cards that must interoperate with field-deployed firmware.
Recomendado
ASIC Prototyping and Emulation
The EP1S10F484C5N is frequently used as a building block in ASIC/ASSP prototyping because its 10,570 logic elements map cleanly to the gate-equivalent density of mid-complexity ASICs (roughly 200-300 K ASIC gates). Quartus II 13.0 supports incremental compilation and LogicLock regions that allow RTL partitioning identical to ASIC synthesis scripts, easing re-targeting. Multiple EP1S10F484C5N devices can be chained on a prototyping board with LVDS point-to-point links to emulate a larger ASIC. The 484-ball FCBGA allows escape routing on 6-layer PCBs with 0.5 mm pitch via-in-pad designs. The embedded DSP and memory blocks let designers validate arithmetic and on-chip bus architectures before tap-out. Modern ASIC prototyping usually moves to Cyclone V or Kintex-7, but the EP1S10F484C5N is still in service in installed emulation systems. Engineers should note that Quartus II 13.0 must remain available in the build pipeline.
Recomendado
Industrial Machine Vision / Video Processing
The EP1S10F484C5N provides adequate logic, memory, and LVDS I/O for line-scan or area-scan machine vision pipelines operating at Camera Link or LVDS rates. The 335 user I/O pins are sufficient to receive 24-bit RGB + sync + clock from a Camera Link interface plus drive a DVI/HDMI output. The TriMatrix memory holds a full frame buffer for image rotation, color-space conversion, and defect detection algorithms. The 6 embedded DSP blocks accelerate Sobel, Laplacian, and convolution kernels at line rate, eliminating the need for external DSP ICs. Designers pair the EP1S10F484C5N with an LVDS deserializer such as the DS90CR288A on the input and a DVI transmitter like the TFP401 on the output. The 0.13 µm process and 1.5 V core simplify thermal design for enclosed industrial cabinets. Production-volume industrial OEMs now prefer Cyclone IV/V for cost reasons, but the EP1S10F484C5N remains common in existing installed systems.
Recomendado
Test & Measurement Instrumentation
The EP1S10F484C5N is well matched to bench-top test and measurement instruments such as logic analyzers, protocol analyzers, and arbitrary waveform generators. Its 335 user I/O can sample multiple digital buses simultaneously, while the 14 TriMatrix memory blocks provide deep capture buffers at full sample rate without external SRAM. The 4 PLLs synthesize independent sample clocks from a 10 MHz TCXO reference, supporting non-standard baud rates in protocol analyzers. Designers can implement 200 MSPS equivalent-time sampling on the LVDS I/O, with the 500 MHz core rate handling deserialization and trigger logic in real time. The 1.5 V core simplifies the analog/digital power tree when the FPGA is paired with high-speed ADCs like the AD9214. Quartus II 13.0 supports SignalTap II embedded logic analyzer for real-time verification. Field-deployed T&M instruments still ship with EP1S10F484C5N parts; production of new T&M designs usually targets Cyclone V or Artix-7 to extend lifecycle.
Recomendado
Legacy Board Support / Form-Fit-Function Replacement
The EP1S10F484C5N is commonly used as a form-fit-function replacement on legacy boards where the original FPGA failed and the system cannot be redesigned. Its 484-ball FCBGA footprint and Stratix die architecture are identical to other Stratix family members in the F484 package, so a same-package faster speed grade (C6 or C7) is the preferred upgrade. Engineers designing drop-in replacements must validate the Quartus II version because timing models changed across Quartus 9.x and 13.x; recompiling the original RTL against the same Quartus build is recommended. For boards that can accept a layout change, the EP1S25F484C5N adds logic and memory but is NOT a true drop-in (different configuration scheme). Independent brokers supply date-coded EP1S10F484C5N parts but counterfeit risk is high; decapsulation and JTAG ID verification are advised. Lifecycle extension via -I5N industrial temperature variant is also a common practice for harsh environment field repairs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1S10F484C5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1S10F484C6N | EP1S10F484C7N | EP1S10F484I5N | EP1S10B672C7N |
|---|---|---|---|---|---|
| Package | 484-FCBGA (F484), 23x23 mm, 1.0 mm pitch | 484-FCBGA (F484), 23x23 mm, 1.0 mm pitch - same | 484-FCBGA (F484), 23x23 mm, 1.0 mm pitch - same | 484-FCBGA (F484), 23x23 mm, 1.0 mm pitch - same | 672-BGA (B672), 35x35 mm, 1.0 mm pitch - larger |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 10,570 | 10,570 - identical | 10,570 - identical | 10,570 - identical | 10,570 - identical |
| Speed Grade | -5 | -6 (faster) | -7 (fastest) | -5 (same, industrial temp) | -7 (fastest) |
| Embedded Memory | 920,448 bits | 920,448 bits - identical | 920,448 bits - identical | 920,448 bits - identical | 920,448 bits - identical |
| User I/O | 335 | 335 | 335 | 335 | 488 (larger package) |
| Operating Temperature | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | 0 °C to 85 °C (Commercial) | -40 °C to 100 °C (Industrial) | 0 °C to 85 °C (Commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Speed grade upgrade path within same footprint (vs EP1S10F484C7N)
- Industrial temperature option in same package (vs EP1S10F484I5N)
- Higher I/O count option in larger package (vs EP1S10B672C7N)
Notas de projeto
The EP1S10F484C5N core rail (VCCINT) requires 1.5 V with a tolerance of ±5% and a transient current that can exceed 2 A during configuration. Decoupling must include 4-6 × 0.1 µF X7R ceramics placed within 5 mm of the BGA, plus 4 × 10 µF tantalum or polymer bulk caps on the same plane. Estimated: VCCINT power at 500 MHz toggle rate is approximately 1.5 W (typical) and up to 2.5 W (worst-case). I/O banks can run at 1.5/1.8/2.5/3.3 V - use a separate LDO per VCCIO bank if any bank drives a non-3.3 V bus. Sequencing: VCCINT must reach 1.0 V within 100 ms and VCCIO must not exceed VCCINT + 0.5 V during ramp to avoid I/O latch-up.
Estimated: at full toggle activity (500 MHz core, 335 I/O at 50% utilization), the EP1S10F484C5N dissipates approximately 2.5 W. The 484-ball FCBGA has a theta_JA around 18 °C/W with a 4-layer PCB and 64 thermal vias to a 100x100 mm copper spreader. This yields a junction temperature rise of 45 °C above ambient - acceptable for commercial (85 °C) operation. The industrial -I5N variant operates up to 100 °C junction; designers must reduce ambient to 55 °C maximum at the same power level, or add a heatsink on the BGA top side. The BGA die is exposed on the top surface (no lid), so thermal interface material (TIM) can be applied directly with a clip-mounted heatsink.
The 484-ball FCBGA at 1.0 mm pitch requires via-in-pad (VIP) escape routing on at least a 6-layer PCB. Use 0.30 mm (12 mil) pad diameter with 0.20 mm (8 mil) drilled vias and 0.10 mm (4 mil) annular ring; fill and plate the vias to a flat surface for BGA attachment. Reference the Stratix Device Family Data Sheet Chapter 4 for the exact land pattern dimensions. Differential pair traces (LVDS, LVPECL) must be length-matched within 5 ps and routed on the layer immediately below the BGA. Break-out signals on the top layer, then via to inner stripline for longer routes. Maintain a continuous ground plane on layer 2 and a 1.5 V power plane on layer 3 directly under the BGA. Layer 6 should be the secondary ground for return path continuity.
Common pitfalls with the EP1S10F484C5N include: (1) using a newer Quartus II release (≥ v14.0) which dropped support for original Stratix - the last supported version is Quartus II 13.0; (2) confusing the F484 FineLine BGA pinout with the B672 pinout - they are NOT compatible and a wrong footprint will short VCCINT to GND; (3) allowing VCCIO to rise before VCCINT during power-up, which can latch the I/O ring; (4) sourcing parts from brokers without verifying date code and JTAG ID, leading to counterfeit or pre-programmed devices. Always validate the bitstream against the JTAG IDCODE 0x020F00DD before PCB release.
Informações de conformidade
Lead-free assembly per 'N' suffix in MPN. Original Altera / Intel datasheet declares RoHS compliance. Halogen-free status not explicitly stated in available datasheet copies.
