EP1SGX25FF800I5N - Stratix GX FPGA 25K LE | Intel / Altera
N.º da peça: EP1SGX25FF800I5N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168.5 | $1.685,00 |
| 100 | $152 | $15.200,00 |
| 500 | $139.75 | $69.875,00 |
| 1.000 | $128.4 | $128.400,00 |
EP1SGX25FF800I5N Visão geral
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that allows hardware logic to be programmed after manufacturing, sitting between fixed-function ASICs and software-driven processors in the system hierarchy. The Stratix GX family specifically targets designs that need multi-gigabit serial I/O alongside programmable logic, making it a system-level integration device for communications, storage, and high-performance signal-processing equipment.
Key features of the EP1SGX25FF800I5N include support for PCI Express, RapidIO, SerialLite II, XAUI, and other serial interconnect protocols, on-chip termination for high-speed transceivers, dedicated DSP blocks for high-speed multiplication, and TriMatrix memory architecture. The device is fabricated on a 130 nm CMOS process with copper interconnect, balancing performance and integration density. Multiple PLLs and clock networks support frequency synthesis and skew management across wide designs.
Typical applications include high-speed serial interface bridges, protocol bridging between ASIC/ASSP and backplanes, storage area network adapters, and prototype ASIC development. The wide transceiver count makes it especially suitable for multi-channel serial aggregation designs.
When designing with this device, use the Quartus II design software for synthesis, place-and-route, and timing analysis. Verify transceiver channel placement against package ball assignments, and ensure decoupling is placed close to power pins to meet signal-integrity requirements. Programming uses JTAG or passive serial configuration.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EP1SGX25FF800I5N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX25FF800I5N (mesmo formato e footprint) — diferindo em Package, Speed Grade, DSP Blocks, Logic Elements, PLLs.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX25FF800C5N
✅ Drop-In✓ Em estoque
$1175 / unidade
Ver ficha técnica →EP1SGX25FF800I6N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP1SGX25FF800I7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP1SGX25DF800I5N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP1SGX25DF800C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$158 / unidade
Ver ficha técnica →EP1SGX25DF800I6N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1450 / unidade
Ver ficha técnica →EP1SGX25FF800I5N Classificações máximas e características elétricas
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory (Bits) | 1,922,048 |
| High-Speed Transceiver Channels | 4 to 20 |
| Transceiver Data Rate (max) | 3.1875 Gbps |
| DSP Blocks | Yes (multipliers) |
| Encapsulamento | 800-pin FineLine BGA (FBGA) |
| Faixa de temperatura de operação | -40C to +100C (Industrial) |
| Speed Grade | -5 |
| Process Technology | 130 nm CMOS |
| Configuration Method | JTAG / Passive Serial |
Guia de Configuração de Pinos do EP1SGX25FF800I5N 800-pin fineline bga (fbga)
Configuração de pinos para EP1SGX25FF800I5N (pacote 800-pin fineline bga (fbga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1SGX25FF800I5N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1SGX25FF800I5N é adequado para 6 aplicaçãos: Multi-Gigabit Serial Protocol Bridge, Storage Area Network (SAN) Adapter, Wireless Baseband Signal Processing, ASIC Prototype and Emulation Platform, Test & Measurement Instrumentation, Industrial Imaging and Video Processing.
Multi-Gigabit Serial Protocol Bridge
The EP1SGX25FF800I5N integrates 4 to 20 CDR/SERDES channels operating up to 3.1875 Gbps alongside programmable logic, making it ideal for protocol bridging between custom ASIC interfaces and standards-based backplanes. Placed between a host ASIC and a RapidIO or XAUI backplane, it absorbs protocol mismatches and rate-conversion in hardware. The 25K LE fabric handles packet buffering, flow control, and link-layer state machines; unlike pure ASSP PHY chips it allows in-field customization of bridging logic. The -5 speed grade provides comfortable timing margin for typical bridging workloads.
Recomendado
Storage Area Network (SAN) Adapter
SAN adapters require multiple 1x/4x Fibre Channel or Serial ATA ports with hardware-accelerated frame processing. The EP1SGX25FF800I5N supports these serial protocols through built-in transceivers and provides the logic fabric for SCSI/FCP frame assembly, DMA engines, and command queuing. Its TriMatrix memory architecture supplies the deep FIFOs required for cut-through switching, while DSP blocks accelerate CRC computation. Industrial temperature rating allows deployment in entry-level enterprise storage appliances.
Recomendado
Wireless Baseband Signal Processing
Wireless baseband designs combine multi-gigabit antenna interfaces with DSP-intensive modulation and channel decoding. The EP1SGX25FF800I5N's transceiver channels digitize antenna data directly, while its DSP blocks accelerate FFT, Viterbi, and turbo decoding in real time. The 130 nm process offers favorable dynamic power at baseband clock rates, and the industrial temperature grade suits outdoor base-station hardware. Designers can implement multiple antenna chains in a single device, reducing board area versus discrete PHY-plus-DSP solutions.
Recomendado
ASIC Prototype and Emulation Platform
Before committing an ASIC design to fabrication, engineers prototype and validate logic on FPGAs. The EP1SGX25FF800I5N offers ~25K logic elements plus transceivers, sufficient to emulate mid-complexity ASICs and validate high-speed serial interfaces in parallel. Industrial temperature rating allows thermal-stress verification, and Quartus II provides synthesis parity with ASIC flows. Compared to ASIC NRE, FPGAs enable rapid iteration; compared to smaller FPGAs, this device fits larger subsystems on a single chip.
Recomendado
Test & Measurement Instrumentation
Test instruments require multiple high-speed serial lanes for protocol analyzers, BERT (bit-error-rate tester) front ends, and oscilloscope digitizer aggregation. The EP1SGX25FF800I5N supports up to 20 multi-gigabit channels plus logic for pattern generation, error counting, and time-stamping. The industrial temperature grade enables portable field-test equipment. Built-in CDR simplifies receiver design, removing external PHY components and reducing total BOM cost and PCB complexity in high-channel-count testers.
Recomendado
Industrial Imaging and Video Processing
High-speed camera links (CoaXPress, Camera Link HS, proprietary serial LVDS) require multi-gigabit receivers paired with image-processing pipelines. The EP1SGX25FF800I5N accepts multiple high-speed serial camera streams and applies real-time filtering, color correction, and compression in the programmable logic. The -5 speed grade comfortably meets typical pixel-clock budgets, and the industrial temperature range supports factory-floor deployments. DSP blocks accelerate convolution kernels, while on-chip memory buffers line scans before downstream processing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX25FF800I5N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX25FF800C5N | EP1SGX25FF800I6N | EP1SGX25DF800I5N |
|---|---|---|---|---|
| Brand | Altera Corporation (Intel) | Altera Corporation | Altera Corporation | Altera Corporation |
| Package | FBGA-800 | FBGA-800 - same | FBGA-800 - same | FBGA-800 - same |
| Speed Grade | -5 | -5 | -6 | -5 |
| Operating Temperature | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Silicon Revision | Base (FF) | Base (FF) | Base (FF) | Enhanced (DF) |
| Logic Elements | ~25,660 | ~25,660 | ~25,660 | ~25,660 |
| Transceiver Channels (max) | 20 | 20 | 20 | 20 |
| Transceiver Data Rate (max) | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Lifecycle Status | NRND (mature) | NRND | NRND | NRND |
Principais diferenciais
- Industrial temperature range (vs EP1SGX25FF800C5N)
- Multi-gigabit transceivers with hardened CDR (vs EP1S25F780C5 (non-GX Stratix))
- Same package as later silicon revisions (vs EP1SGX25DF800I5N)
Notas de projeto
Stratix GX FPGAs have separate supply rails for core (VCCINT), I/O banks (VCCIO), transceiver PLLs (VCCA), and transceiver analog (VCCR/VCCT). Decouple each rail with 0.1 uF ceramic capacitors placed within 100 mils of the respective power pins. Bulk decoupling of 100 uF to 470 uF per rail is recommended. Estimated: a fully utilized EP1SGX25 with 16 active transceiver channels at 3.1875 Gbps draws approximately 2.5 to 3.5 W from VCCINT and an additional 1 to 1.5 W from each VCCR/VCCT rail.
The 800-ball FineLine BGA package relies primarily on the PCB for heat dissipation; thermal vias under the central BGA balls are essential. Estimated: with the thermal resistance of approximately 6 to 8 C/W for a properly designed 12-layer board with thermal vias, the junction temperature rises about 25 to 30 C above ambient at 4 W total dissipation. Industrial-temperature parts require the junction to stay below 100 C, so verify with a thermal simulation before sealing the enclosure.
Place transceiver channels adjacent to package edges to minimize routing to external connectors. Use 100-ohm differential impedance for SERDES traces, with intra-pair skew below 5 mils. Reference transceiver pinout tables from the Stratix GX device handbook for FF800 ball assignments. Add a reference ground plane under all serial traces and avoid routing signals across plane splits to maintain signal integrity at multi-gigabit speeds.
Do not assume any Stratix GX part is fully pin-compatible with another just because the package matches - speed grade, temperature grade, and silicon revision (FF vs DF) all affect operation. Verify the Quartus II device selection and pin assignments before tape-out. Configuration mode (JTAG vs passive serial) requires correct MSEL pin strap; leaving MSEL floating may cause configuration failures.
Informações de conformidade
Compliance values not confirmed in provided data; consult Altera/Intel product documentation for full environmental compliance details.
