EP1SGX25FF800I5N - Stratix GX FPGA 25K LE | Intel / Altera
料号： EP1SGX25FF800I5N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $139.75 | $69,875.00 |
| 1,000 | $128.4 | $128,400.00 |
EP1SGX25FF800I5N 概述
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that allows hardware logic to be programmed after manufacturing, sitting between fixed-function ASICs and software-driven processors in the system hierarchy. The Stratix GX family specifically targets designs that need multi-gigabit serial I/O alongside programmable logic, making it a system-level integration device for communications, storage, and high-performance signal-processing equipment.
Key features of the EP1SGX25FF800I5N include support for PCI Express, RapidIO, SerialLite II, XAUI, and other serial interconnect protocols, on-chip termination for high-speed transceivers, dedicated DSP blocks for high-speed multiplication, and TriMatrix memory architecture. The device is fabricated on a 130 nm CMOS process with copper interconnect, balancing performance and integration density. Multiple PLLs and clock networks support frequency synthesis and skew management across wide designs.
Typical applications include high-speed serial interface bridges, protocol bridging between ASIC/ASSP and backplanes, storage area network adapters, and prototype ASIC development. The wide transceiver count makes it especially suitable for multi-channel serial aggregation designs.
When designing with this device, use the Quartus II design software for synthesis, place-and-route, and timing analysis. Verify transceiver channel placement against package ball assignments, and ensure decoupling is placed close to power pins to meet signal-integrity requirements. Programming uses JTAG or passive serial configuration.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP1SGX25FF800I5N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX25FF800I5N （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, DSP Blocks, Logic Elements, PLLs.
快速对比工具——选择替代料号进行并排对比：
EP1SGX25FF800C5N
✅ 直接替换✓ 有现货
$1175 / 个
查看数据手册 →EP1SGX25FF800I6N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP1SGX25FF800I7N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP1SGX25DF800I5N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP1SGX25DF800C5N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$158 / 个
查看数据手册 →EP1SGX25DF800I6N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1450 / 个
查看数据手册 →EP1SGX25FF800I5N 最大额定值与电气特性
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Embedded Memory (Bits) | 1,922,048 |
| High-Speed Transceiver Channels | 4 to 20 |
| Transceiver Data Rate (max) | 3.1875 Gbps |
| DSP Blocks | Yes (multipliers) |
| 封装 | 800-pin FineLine BGA (FBGA) |
| 工作温度范围 | -40C to +100C (Industrial) |
| Speed Grade | -5 |
| Process Technology | 130 nm CMOS |
| Configuration Method | JTAG / Passive Serial |
EP1SGX25FF800I5N 800-pin fineline bga (fbga) 引脚配置指南
EP1SGX25FF800I5N（800-pin fineline bga (fbga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX25FF800I5N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX25FF800I5N 适用于 6 应用s: Multi-Gigabit Serial Protocol Bridge, Storage Area Network (SAN) Adapter, Wireless Baseband Signal Processing, ASIC Prototype and Emulation Platform, Test & Measurement Instrumentation, Industrial Imaging and Video Processing.
Multi-Gigabit Serial Protocol Bridge
The EP1SGX25FF800I5N integrates 4 to 20 CDR/SERDES channels operating up to 3.1875 Gbps alongside programmable logic, making it ideal for protocol bridging between custom ASIC interfaces and standards-based backplanes. Placed between a host ASIC and a RapidIO or XAUI backplane, it absorbs protocol mismatches and rate-conversion in hardware. The 25K LE fabric handles packet buffering, flow control, and link-layer state machines; unlike pure ASSP PHY chips it allows in-field customization of bridging logic. The -5 speed grade provides comfortable timing margin for typical bridging workloads.
推荐
Storage Area Network (SAN) Adapter
SAN adapters require multiple 1x/4x Fibre Channel or Serial ATA ports with hardware-accelerated frame processing. The EP1SGX25FF800I5N supports these serial protocols through built-in transceivers and provides the logic fabric for SCSI/FCP frame assembly, DMA engines, and command queuing. Its TriMatrix memory architecture supplies the deep FIFOs required for cut-through switching, while DSP blocks accelerate CRC computation. Industrial temperature rating allows deployment in entry-level enterprise storage appliances.
推荐
Wireless Baseband Signal Processing
Wireless baseband designs combine multi-gigabit antenna interfaces with DSP-intensive modulation and channel decoding. The EP1SGX25FF800I5N's transceiver channels digitize antenna data directly, while its DSP blocks accelerate FFT, Viterbi, and turbo decoding in real time. The 130 nm process offers favorable dynamic power at baseband clock rates, and the industrial temperature grade suits outdoor base-station hardware. Designers can implement multiple antenna chains in a single device, reducing board area versus discrete PHY-plus-DSP solutions.
推荐
ASIC Prototype and Emulation Platform
Before committing an ASIC design to fabrication, engineers prototype and validate logic on FPGAs. The EP1SGX25FF800I5N offers ~25K logic elements plus transceivers, sufficient to emulate mid-complexity ASICs and validate high-speed serial interfaces in parallel. Industrial temperature rating allows thermal-stress verification, and Quartus II provides synthesis parity with ASIC flows. Compared to ASIC NRE, FPGAs enable rapid iteration; compared to smaller FPGAs, this device fits larger subsystems on a single chip.
推荐
Test & Measurement Instrumentation
Test instruments require multiple high-speed serial lanes for protocol analyzers, BERT (bit-error-rate tester) front ends, and oscilloscope digitizer aggregation. The EP1SGX25FF800I5N supports up to 20 multi-gigabit channels plus logic for pattern generation, error counting, and time-stamping. The industrial temperature grade enables portable field-test equipment. Built-in CDR simplifies receiver design, removing external PHY components and reducing total BOM cost and PCB complexity in high-channel-count testers.
推荐
Industrial Imaging and Video Processing
High-speed camera links (CoaXPress, Camera Link HS, proprietary serial LVDS) require multi-gigabit receivers paired with image-processing pipelines. The EP1SGX25FF800I5N accepts multiple high-speed serial camera streams and applies real-time filtering, color correction, and compression in the programmable logic. The -5 speed grade comfortably meets typical pixel-clock budgets, and the industrial temperature range supports factory-floor deployments. DSP blocks accelerate convolution kernels, while on-chip memory buffers line scans before downstream processing.
推荐
推荐产品汇总
工程参考数据： EP1SGX25FF800I5N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1SGX25FF800C5N | EP1SGX25FF800I6N | EP1SGX25DF800I5N |
|---|---|---|---|---|
| Brand | Altera Corporation (Intel) | Altera Corporation | Altera Corporation | Altera Corporation |
| Package | FBGA-800 | FBGA-800 - same | FBGA-800 - same | FBGA-800 - same |
| Speed Grade | -5 | -5 | -6 | -5 |
| Operating Temperature | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Silicon Revision | Base (FF) | Base (FF) | Base (FF) | Enhanced (DF) |
| Logic Elements | ~25,660 | ~25,660 | ~25,660 | ~25,660 |
| Transceiver Channels (max) | 20 | 20 | 20 | 20 |
| Transceiver Data Rate (max) | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Lifecycle Status | NRND (mature) | NRND | NRND | NRND |
关键差异点
- Industrial temperature range （对比 EP1SGX25FF800C5N)
- Multi-gigabit transceivers with hardened CDR （对比 EP1S25F780C5 (non-GX Stratix))
- Same package as later silicon revisions （对比 EP1SGX25DF800I5N)
设计说明
Stratix GX FPGAs have separate supply rails for core (VCCINT), I/O banks (VCCIO), transceiver PLLs (VCCA), and transceiver analog (VCCR/VCCT). Decouple each rail with 0.1 uF ceramic capacitors placed within 100 mils of the respective power pins. Bulk decoupling of 100 uF to 470 uF per rail is recommended. Estimated: a fully utilized EP1SGX25 with 16 active transceiver channels at 3.1875 Gbps draws approximately 2.5 to 3.5 W from VCCINT and an additional 1 to 1.5 W from each VCCR/VCCT rail.
The 800-ball FineLine BGA package relies primarily on the PCB for heat dissipation; thermal vias under the central BGA balls are essential. Estimated: with the thermal resistance of approximately 6 to 8 C/W for a properly designed 12-layer board with thermal vias, the junction temperature rises about 25 to 30 C above ambient at 4 W total dissipation. Industrial-temperature parts require the junction to stay below 100 C, so verify with a thermal simulation before sealing the enclosure.
Place transceiver channels adjacent to package edges to minimize routing to external connectors. Use 100-ohm differential impedance for SERDES traces, with intra-pair skew below 5 mils. Reference transceiver pinout tables from the Stratix GX device handbook for FF800 ball assignments. Add a reference ground plane under all serial traces and avoid routing signals across plane splits to maintain signal integrity at multi-gigabit speeds.
Do not assume any Stratix GX part is fully pin-compatible with another just because the package matches - speed grade, temperature grade, and silicon revision (FF vs DF) all affect operation. Verify the Quartus II device selection and pin assignments before tape-out. Configuration mode (JTAG vs passive serial) requires correct MSEL pin strap; leaving MSEL floating may cause configuration failures.
合规信息
Compliance values not confirmed in provided data; consult Altera/Intel product documentation for full environmental compliance details.
