EP20K30EFI144-2X - APEX 20KE FPGA 1200 Cells 93 I/O 144-BGA | Intel
N.º da peça: EP20K30EFI144-2X ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $45 | $45,00 |
| 10 | $38.5 | $385,00 |
| 100 | $32.75 | $3.275,00 |
| 500 | $27.5 | $13.750,00 |
| 1.000 | $22.95 | $22.950,00 |
EP20K30EFI144-2X Visão geral
What is an APEX 20KE FPGA? The APEX (Advanced Programmable Element Matrix) 20KE family is a multi-vendor-compatible programmable logic architecture combining look-up table (LUT)-based logic elements with embedded system blocks (ESBs) that double as RAM, ROM, or product-term logic. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor integrated circuit family, sitting between ASICs and discrete logic in flexibility and density. APEX 20KE parts were widely deployed in telecom, networking, and DSP applications in the late 1990s and early 2000s.
Key features of the EP20K30EFI144-2X include 1200 logic elements, 192 macrocells, 24576 embedded RAM bits, 93 maximum user I/O, and 1.8 V core operation. The device supports in-system programmability via IEEE 1149.1 JTAG, multi-vendor I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL), and dedicated clock and PLL resources. The 144-ball FineLine BGA package provides a compact footprint while preserving sufficient I/O count for typical glue-logic and DSP datapath designs.
Architecturally, the APEX 20KE combines a MegaLAB structure with embedded system blocks, allowing designers to trade logic density against memory width. The LUT-based logic elements support cascade chains for wide datapaths, while the ESBs can be configured as dual-port RAM or FIFO buffers. Hardware multipliers are not present in the 20KE family, so DSP functions are typically implemented using LUT-based multiplication or external co-processors.
Typical applications for the EP20K30EFI144-2X include telecom interface cards, protocol bridging logic, low-density DSP preprocessing, industrial control state machines, and PCI bus interface glue logic. The industrial temperature grade makes it suitable for factory automation and outdoor telecom equipment. Note that the APEX 20KE family is end-of-life; modern Cyclone IV/V or Lattice ECP5 devices are recommended for new designs.
When designing with this part, plan the I/O bank VCCIO assignments carefully because mixed-voltage standards require multiple supply rails. The Quartus II design tool (legacy versions supporting APEX 20KE) is required for bitstream generation. JTAG programming via a ByteBlaster or USB-Blaster download cable is the standard configuration path.
Alternativas drop-in para EP20K30EFI144-2X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K30EFI144-2X (mesmo formato e footprint) — diferindo em Speed Grade, Family, Operating Temperature, Series, Typical Gates.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K30EFC144-2X
✅ Drop-In✓ Em estoque
$58.5 / unidade
Ver ficha técnica →EP20K30EFC144-1
✅ Drop-In✓ Em estoque
$51.4 / unidade
Ver ficha técnica →EP20K30EFI144-2XN
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP20K30EFC144-3
✅ Drop-In✓ Em estoque
$10.4 / unidade
Ver ficha técnica →EP20K30EFC144-1N
✅ Drop-In✓ Em estoque
$125 / unidade
Ver ficha técnica →EP20K30EFC144-3N
✅ Drop-In✓ Em estoque
$64 / unidade
Ver ficha técnica →EP20K30EFI144-2X Classificações máximas e características elétricas
| Series | APEX 20KE |
| Family | APEX 20KE Field Programmable Gate Array |
| Logic Elements / Cells | 1200 |
| Macrocells | 192 |
| Embedded RAM Bits | 24576 |
| Number of I/O | 93 |
| Maximum User I/O | 93 |
| Encapsulamento | 144-BGA (FineLine BGA) |
| Contagem de pinos | 144 |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 µm CMOS |
| Operating Temperature Grade | Industrial (E suffix) |
| Speed Grade | -2 |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EP20K30EFI144-2X
| Pino A1 | I/O — User I/O pin (bank 1) |
| Pino A2 | I/O — User I/O pin (bank 1) |
| Pino A3 | I/O — User I/O pin (bank 1) |
| Pino A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pino A5 | I/O — User I/O pin (bank 1) |
| Pino A6 | I/O — User I/O pin (bank 1) |
| Pino A7 | I/O — User I/O pin (bank 1) |
| Pino A8 | GND — Ground |
| Pino A9 | I/O — User I/O pin (bank 2) |
| Pino A10 | I/O — User I/O pin (bank 2) |
| Pino A11 | I/O — User I/O pin (bank 2) |
| Pino A12 | VCCIO2 — I/O bank 2 supply voltage |
| Pino B1 | I/O — User I/O pin (bank 1) |
| Pino B2 | GND — Ground |
| Pino B3 | I/O — User I/O pin (bank 1) |
| Pino B4 | I/O — User I/O pin (bank 1) |
| Pino B5 | I/O — User I/O pin (bank 1) |
| Pino B6 | GND — Ground |
| Pino B7 | I/O — User I/O pin (bank 1) |
| Pino B8 | I/O — User I/O pin (bank 1) |
| Pino B9 | VCCIO2 — I/O bank 2 supply voltage |
| Pino B10 | I/O — User I/O pin (bank 2) |
| Pino B11 | I/O — User I/O pin (bank 2) |
| Pino B12 | I/O — User I/O pin (bank 2) |
| Pino C1 | I/O — User I/O pin (bank 1) |
| Pino C2 | I/O — User I/O pin (bank 1) |
| Pino C3 | VCCINT — Core supply voltage (1.8 V) |
| Pino C4 | I/O — User I/O pin (bank 1) |
| Pino C5 | GND — Ground |
| Pino C6 | I/O — User I/O pin (bank 1) |
| Pino C7 | I/O — User I/O pin (bank 1) |
| Pino C8 | VCCINT — Core supply voltage (1.8 V) |
| Pino C9 | I/O — User I/O pin (bank 2) |
| Pino C10 | GND — Ground |
| Pino C11 | I/O — User I/O pin (bank 2) |
| Pino C12 | I/O — User I/O pin (bank 2) |
| Pino D1 | I/O — User I/O pin (bank 3) |
| Pino D2 | I/O — User I/O pin (bank 3) |
| Pino D3 | I/O — User I/O pin (bank 3) |
| Pino D4 | VCCIO3 — I/O bank 3 supply voltage |
| Pino D5 | I/O — User I/O pin (bank 3) |
| Pino D6 | I/O — User I/O pin (bank 3) |
| Pino D7 | I/O — User I/O pin (bank 3) |
| Pino D8 | GND — Ground |
| Pino D9 | I/O — User I/O pin (bank 4) |
| Pino D10 | I/O — User I/O pin (bank 4) |
| Pino D11 | I/O — User I/O pin (bank 4) |
| Pino D12 | VCCIO4 — I/O bank 4 supply voltage |
| Pino E1 | I/O — User I/O pin (bank 3) |
| Pino E2 | GND — Ground |
| Pino E3 | I/O — User I/O pin (bank 3) |
| Pino E4 | I/O — User I/O pin (bank 3) |
| Pino E5 | I/O — User I/O pin (bank 3) |
| Pino E6 | GND — Ground |
| Pino E7 | I/O — User I/O pin (bank 3) |
| Pino E8 | I/O — User I/O pin (bank 3) |
| Pino E9 | VCCIO4 — I/O bank 4 supply voltage |
| Pino E10 | I/O — User I/O pin (bank 4) |
| Pino E11 | I/O — User I/O pin (bank 4) |
| Pino E12 | I/O — User I/O pin (bank 4) |
| Pino F1 | I/O — User I/O pin (bank 3) |
| Pino F2 | I/O — User I/O pin (bank 3) |
| Pino F3 | VCCINT — Core supply voltage (1.8 V) |
| Pino F4 | I/O — User I/O pin (bank 3) |
| Pino F5 | GND — Ground |
| Pino F6 | I/O — User I/O pin (bank 3) |
| Pino F7 | I/O — User I/O pin (bank 3) |
| Pino F8 | VCCINT — Core supply voltage (1.8 V) |
| Pino F9 | I/O — User I/O pin (bank 4) |
| Pino F10 | GND — Ground |
| Pino F11 | I/O — User I/O pin (bank 4) |
| Pino F12 | I/O — User I/O pin (bank 4) |
| Pino G1 | I/O — User I/O pin (bank 5) |
| Pino G2 | I/O — User I/O pin (bank 5) |
| Pino G3 | I/O — User I/O pin (bank 5) |
| Pino G4 | VCCIO5 — I/O bank 5 supply voltage |
| Pino G5 | I/O — User I/O pin (bank 5) |
| Pino G6 | I/O — User I/O pin (bank 5) |
| Pino G7 | I/O — User I/O pin (bank 5) |
| Pino G8 | GND — Ground |
| Pino G9 | I/O — User I/O pin (bank 6) |
| Pino G10 | I/O — User I/O pin (bank 6) |
| Pino G11 | I/O — User I/O pin (bank 6) |
| Pino G12 | VCCIO6 — I/O bank 6 supply voltage |
| Pino H1 | I/O — User I/O pin (bank 5) |
| Pino H2 | GND — Ground |
| Pino H3 | I/O — User I/O pin (bank 5) |
| Pino H4 | I/O — User I/O pin (bank 5) |
| Pino H5 | I/O — User I/O pin (bank 5) |
| Pino H6 | GND — Ground |
| Pino H7 | I/O — User I/O pin (bank 5) |
| Pino H8 | I/O — User I/O pin (bank 5) |
| Pino H9 | VCCIO6 — I/O bank 6 supply voltage |
| Pino H10 | I/O — User I/O pin (bank 6) |
| Pino H11 | I/O — User I/O pin (bank 6) |
| Pino H12 | I/O — User I/O pin (bank 6) |
| Pino J1 | I/O — User I/O pin (bank 7) |
| Pino J2 | I/O — User I/O pin (bank 7) |
| Pino J3 | VCCINT — Core supply voltage (1.8 V) |
| Pino J4 | I/O — User I/O pin (bank 7) |
| Pino J5 | GND — Ground |
| Pino J6 | I/O — User I/O pin (bank 7) |
| Pino J7 | I/O — User I/O pin (bank 7) |
| Pino J8 | VCCINT — Core supply voltage (1.8 V) |
| Pino J9 | I/O — User I/O pin (bank 8) |
| Pino J10 | GND — Ground |
| Pino J11 | I/O — User I/O pin (bank 8) |
| Pino J12 | I/O — User I/O pin (bank 8) |
| Pino K1 | I/O — User I/O pin (bank 7) |
| Pino K2 | I/O — User I/O pin (bank 7) |
| Pino K3 | I/O — User I/O pin (bank 7) |
| Pino K4 | VCCIO7 — I/O bank 7 supply voltage |
| Pino K5 | I/O — User I/O pin (bank 7) |
| Pino K6 | I/O — User I/O pin (bank 7) |
| Pino K7 | I/O — User I/O pin (bank 7) |
| Pino K8 | GND — Ground |
| Pino K9 | I/O — User I/O pin (bank 8) |
| Pino K10 | I/O — User I/O pin (bank 8) |
| Pino K11 | I/O — User I/O pin (bank 8) |
| Pino K12 | VCCIO8 — I/O bank 8 supply voltage |
| Pino L1 | TCK — JTAG Test Clock |
| Pino L2 | TDO — JTAG Test Data Out |
| Pino L3 | TMS — JTAG Test Mode Select |
| Pino L4 | TDI — JTAG Test Data In |
| Pino L5 | nCONFIG — Configuration control (active low) |
| Pino L6 | nSTATUS — Configuration status (active low) |
| Pino L7 | DCLK — Configuration clock input |
| Pino L8 | DATA0 — Configuration data input |
| Pino L9 | MSEL0 — Configuration mode select 0 |
| Pino L10 | MSEL1 — Configuration mode select 1 |
| Pino L11 | CLK0 — Clock input 0 (dedicated) |
| Pino L12 | CLK1 — Clock input 1 (dedicated) |
Aplicações típicas
EP20K30EFI144-2X é adequado para 6 aplicaçãos: Telecom Interface Cards, PCI Bus Interface Glue Logic, Industrial Control State Machines, Low-Density DSP Preprocessing, Networking Protocol Bridging, Legacy Test and Measurement Instrumentation.
Telecom Interface Cards
The EP20K30EFI144-2X's 1200 logic elements and 93 user I/O make it suitable for telecom interface cards implementing protocol bridges, framing logic, and low-density SERDES control planes. Its 24576 embedded RAM bits provide buffering for cell/packet payloads in ATM or Ethernet-over-SDH designs. The 1.8 V core and multi-standard I/O (LVTTL, LVCMOS, HSTL, GTL+) simplify interfacing to legacy telecom ASICs. Industrial temperature grade supports outdoor enclosures.
Recomendado
PCI Bus Interface Glue Logic
The EP20K30EFI144-2X integrates well into PCI 32-bit/33 MHz bus designs by providing target/master state machines, address decoding, and interrupt handling in a single 144-FBGA device. PCI-compliant I/O standards are supported natively through dedicated VCCIO banks. The 1200 logic cells are sufficient for typical bridge functions between a host CPU and peripheral ASICs, reducing board area and BOM cost versus discrete logic.
Recomendado
Industrial Control State Machines
The EP20K30EFI144-2X is widely deployed in factory automation PLCs, motor controllers, and process control systems because of its industrial temperature rating and deterministic LUT-based logic. The 192 macrocells and embedded RAM blocks allow multi-axis state machine sequencing, encoder interface logic, and PWM generation in one device. Field programmability supports late-stage customization without ASIC redesign cycles.
Recomendado
Low-Density DSP Preprocessing
The EP20K30EFI144-2X handles low-density DSP preprocessing tasks such as FIR filtering, fixed-point arithmetic, and data routing before downstream processors. While the APEX 20KE family lacks hardware multipliers, 1200 cells suffice for 8-bit or 16-bit preprocessing in audio or video pipelines. The embedded system blocks (ESBs) double as fast dual-port RAM for coefficient storage, eliminating external SRAM.
Recomendado
Networking Protocol Bridging
The EP20K30EFI144-2X provides cost-effective bridging between Ethernet, HDLC, Frame Relay, and proprietary protocols in legacy router and switch line cards. The 1200 cells support protocol encapsulation, header parsing, and forwarding tables, while the embedded RAM caches routing entries for fast lookups. Multiple VCCIO banks connect directly to 3.3 V and 5 V PHYs without level shifters.
Recomendado
Legacy Test and Measurement Instrumentation
The EP20K30EFI144-2X is commonly found in legacy oscilloscopes, logic analyzers, and signal generators as timing control, trigger logic, and display interface glue. The JTAG interface simplifies firmware updates in production. Industrial temperature grade supports lab and field environments. Note: new designs should consider Cyclone IV GX or Lattice ECP5 for modern instrumentation platforms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K30EFI144-2X — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K30EFC144-2X | EP20K30EFC144-1 | EP20K30EFI144-2XN | EP20K30EFC144-3 | EP20K30EFC144-1N | EP20K30EFC144-3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-FBGA | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Logic Elements | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| Embedded RAM Bits | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| Maximum User I/O | 93 | 93 | 93 | 93 | 93 | 93 | 93 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -3 (faster) | -1 (slower) | -3 (faster) |
| Temperature Grade | Industrial | Commercial | Commercial | Industrial | Commercial | Commercial | Commercial |
Principais diferenciais
- Same 144-FBGA footprint across entire speed grade and Pb-free matrix (vs EP20K30EFC144-2X vs EP20K30EFC144-3)
- Industrial temperature grade with Pb-free availability (vs EP20K30EFI144-2X vs EP20K30EFC144-2X)
- Mid-density APEX 20KE position with 93 I/O in compact FBGA (vs EP20K30EFI144-2X vs EP20K100EFC324-2X)
Notas de projeto
Estimated: VCCINT must be regulated to 1.8 V ±5% with bulk decoupling of 100 µF tantalum plus 0.1 µF ceramic per VCCINT ball. Each VCCIO bank can be set independently to 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V via LVTTL/LVCMOS/PCI/HSTL/GTL+ I/O standards. Place one 0.1 µF ceramic per VCCIO ball and one 10 µF bulk per bank to suppress switching transients during configuration. Multiple ground balls must be connected to a low-impedance ground plane.
The 144-FBGA package requires 1.0 mm ball pitch PCB land pattern with NSMD (non-solder-mask-defined) pads for best thermal cycling reliability. Use 4-6 layer PCB with continuous ground planes beneath the BGA for VCCINT/GND return paths. Via-in-pad with filled and plated-over copper is recommended for inner balls to escape routing. Reflow profile must not exceed 220 °C peak (SnPb) or 245 °C peak (Pb-free) per JEDEC J-STD-020.
Do not leave MSEL0/MSEL1 floating: tie them high or low to select the configuration mode (AS, PS, JTAG). nCONFIG must be held high via 10 kΩ pull-up; nSTATUS requires 10 kΩ pull-up. During multi-device configuration, all EP20K30E devices must share DCLK and DATA0. The legacy Quartus II (v9.0 or earlier) toolchain is mandatory - Quartus Prime does not support APEX 20KE bitstream generation.
Differential clock inputs (CLK0/CLK1) require 50 Ω controlled-impedance routing and AC termination if driving from a non-TTL source. Series dampen resistors (33 Ω) on high-speed I/O signals crossing bank boundaries reduce reflections. JTAG chain (TCK/TMS/TDI/TDO) should be buffered if the chain exceeds 4 devices; otherwise TDO fanout degradation can cause configuration failures.
Informações de conformidade
Compliance data not provided in Verified Web Data. The -N suffix variants (e.g., EP20K30EFI144-2XN) are by convention Pb-free; however, explicit RoHS/REACH declarations should be requested from Intel/Avnet for production use. APEX 20KE FPGAs are obsolete and not AEC-Q100 qualified.
