EP20K30EFI144-2X - APEX 20KE FPGA 1200 Cells 93 I/O 144-BGA | Intel
부품 번호: EP20K30EFI144-2X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $38.5 | $385.00 |
| 100 | $32.75 | $3,275.00 |
| 500 | $27.5 | $13,750.00 |
| 1,000 | $22.95 | $22,950.00 |
EP20K30EFI144-2X 개요
What is an APEX 20KE FPGA? The APEX (Advanced Programmable Element Matrix) 20KE family is a multi-vendor-compatible programmable logic architecture combining look-up table (LUT)-based logic elements with embedded system blocks (ESBs) that double as RAM, ROM, or product-term logic. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor integrated circuit family, sitting between ASICs and discrete logic in flexibility and density. APEX 20KE parts were widely deployed in telecom, networking, and DSP applications in the late 1990s and early 2000s.
Key features of the EP20K30EFI144-2X include 1200 logic elements, 192 macrocells, 24576 embedded RAM bits, 93 maximum user I/O, and 1.8 V core operation. The device supports in-system programmability via IEEE 1149.1 JTAG, multi-vendor I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL), and dedicated clock and PLL resources. The 144-ball FineLine BGA package provides a compact footprint while preserving sufficient I/O count for typical glue-logic and DSP datapath designs.
Architecturally, the APEX 20KE combines a MegaLAB structure with embedded system blocks, allowing designers to trade logic density against memory width. The LUT-based logic elements support cascade chains for wide datapaths, while the ESBs can be configured as dual-port RAM or FIFO buffers. Hardware multipliers are not present in the 20KE family, so DSP functions are typically implemented using LUT-based multiplication or external co-processors.
Typical applications for the EP20K30EFI144-2X include telecom interface cards, protocol bridging logic, low-density DSP preprocessing, industrial control state machines, and PCI bus interface glue logic. The industrial temperature grade makes it suitable for factory automation and outdoor telecom equipment. Note that the APEX 20KE family is end-of-life; modern Cyclone IV/V or Lattice ECP5 devices are recommended for new designs.
When designing with this part, plan the I/O bank VCCIO assignments carefully because mixed-voltage standards require multiple supply rails. The Quartus II design tool (legacy versions supporting APEX 20KE) is required for bitstream generation. JTAG programming via a ByteBlaster or USB-Blaster download cable is the standard configuration path.
드롭인 대체품: EP20K30EFI144-2X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K30EFI144-2X (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Family, Operating Temperature, Series, Typical Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K30EFC144-2X
✅ 드롭인✓ 재고 있음
$58.5 / 개
데이터시트 보기 →EP20K30EFC144-1
✅ 드롭인✓ 재고 있음
$51.4 / 개
데이터시트 보기 →EP20K30EFI144-2XN
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K30EFC144-3
✅ 드롭인✓ 재고 있음
$10.4 / 개
데이터시트 보기 →EP20K30EFC144-1N
✅ 드롭인✓ 재고 있음
$125 / 개
데이터시트 보기 →EP20K30EFC144-3N
✅ 드롭인✓ 재고 있음
$64 / 개
데이터시트 보기 →EP20K30EFI144-2X 최대 정격 & 전기적 특성
| Series | APEX 20KE |
| Family | APEX 20KE Field Programmable Gate Array |
| Logic Elements / Cells | 1200 |
| Macrocells | 192 |
| Embedded RAM Bits | 24576 |
| Number of I/O | 93 |
| Maximum User I/O | 93 |
| 패키지 | 144-BGA (FineLine BGA) |
| 핀 수 | 144 |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 µm CMOS |
| Operating Temperature Grade | Industrial (E suffix) |
| Speed Grade | -2 |
| 실장 유형 | Surface Mount |
EP20K30EFI144-2X 핀 구성
| 핀 A1 | I/O — User I/O pin (bank 1) |
| 핀 A2 | I/O — User I/O pin (bank 1) |
| 핀 A3 | I/O — User I/O pin (bank 1) |
| 핀 A4 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 A5 | I/O — User I/O pin (bank 1) |
| 핀 A6 | I/O — User I/O pin (bank 1) |
| 핀 A7 | I/O — User I/O pin (bank 1) |
| 핀 A8 | GND — Ground |
| 핀 A9 | I/O — User I/O pin (bank 2) |
| 핀 A10 | I/O — User I/O pin (bank 2) |
| 핀 A11 | I/O — User I/O pin (bank 2) |
| 핀 A12 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 B1 | I/O — User I/O pin (bank 1) |
| 핀 B2 | GND — Ground |
| 핀 B3 | I/O — User I/O pin (bank 1) |
| 핀 B4 | I/O — User I/O pin (bank 1) |
| 핀 B5 | I/O — User I/O pin (bank 1) |
| 핀 B6 | GND — Ground |
| 핀 B7 | I/O — User I/O pin (bank 1) |
| 핀 B8 | I/O — User I/O pin (bank 1) |
| 핀 B9 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 B10 | I/O — User I/O pin (bank 2) |
| 핀 B11 | I/O — User I/O pin (bank 2) |
| 핀 B12 | I/O — User I/O pin (bank 2) |
| 핀 C1 | I/O — User I/O pin (bank 1) |
| 핀 C2 | I/O — User I/O pin (bank 1) |
| 핀 C3 | VCCINT — Core supply voltage (1.8 V) |
| 핀 C4 | I/O — User I/O pin (bank 1) |
| 핀 C5 | GND — Ground |
| 핀 C6 | I/O — User I/O pin (bank 1) |
| 핀 C7 | I/O — User I/O pin (bank 1) |
| 핀 C8 | VCCINT — Core supply voltage (1.8 V) |
| 핀 C9 | I/O — User I/O pin (bank 2) |
| 핀 C10 | GND — Ground |
| 핀 C11 | I/O — User I/O pin (bank 2) |
| 핀 C12 | I/O — User I/O pin (bank 2) |
| 핀 D1 | I/O — User I/O pin (bank 3) |
| 핀 D2 | I/O — User I/O pin (bank 3) |
| 핀 D3 | I/O — User I/O pin (bank 3) |
| 핀 D4 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 D5 | I/O — User I/O pin (bank 3) |
| 핀 D6 | I/O — User I/O pin (bank 3) |
| 핀 D7 | I/O — User I/O pin (bank 3) |
| 핀 D8 | GND — Ground |
| 핀 D9 | I/O — User I/O pin (bank 4) |
| 핀 D10 | I/O — User I/O pin (bank 4) |
| 핀 D11 | I/O — User I/O pin (bank 4) |
| 핀 D12 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 E1 | I/O — User I/O pin (bank 3) |
| 핀 E2 | GND — Ground |
| 핀 E3 | I/O — User I/O pin (bank 3) |
| 핀 E4 | I/O — User I/O pin (bank 3) |
| 핀 E5 | I/O — User I/O pin (bank 3) |
| 핀 E6 | GND — Ground |
| 핀 E7 | I/O — User I/O pin (bank 3) |
| 핀 E8 | I/O — User I/O pin (bank 3) |
| 핀 E9 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 E10 | I/O — User I/O pin (bank 4) |
| 핀 E11 | I/O — User I/O pin (bank 4) |
| 핀 E12 | I/O — User I/O pin (bank 4) |
| 핀 F1 | I/O — User I/O pin (bank 3) |
| 핀 F2 | I/O — User I/O pin (bank 3) |
| 핀 F3 | VCCINT — Core supply voltage (1.8 V) |
| 핀 F4 | I/O — User I/O pin (bank 3) |
| 핀 F5 | GND — Ground |
| 핀 F6 | I/O — User I/O pin (bank 3) |
| 핀 F7 | I/O — User I/O pin (bank 3) |
| 핀 F8 | VCCINT — Core supply voltage (1.8 V) |
| 핀 F9 | I/O — User I/O pin (bank 4) |
| 핀 F10 | GND — Ground |
| 핀 F11 | I/O — User I/O pin (bank 4) |
| 핀 F12 | I/O — User I/O pin (bank 4) |
| 핀 G1 | I/O — User I/O pin (bank 5) |
| 핀 G2 | I/O — User I/O pin (bank 5) |
| 핀 G3 | I/O — User I/O pin (bank 5) |
| 핀 G4 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 G5 | I/O — User I/O pin (bank 5) |
| 핀 G6 | I/O — User I/O pin (bank 5) |
| 핀 G7 | I/O — User I/O pin (bank 5) |
| 핀 G8 | GND — Ground |
| 핀 G9 | I/O — User I/O pin (bank 6) |
| 핀 G10 | I/O — User I/O pin (bank 6) |
| 핀 G11 | I/O — User I/O pin (bank 6) |
| 핀 G12 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 H1 | I/O — User I/O pin (bank 5) |
| 핀 H2 | GND — Ground |
| 핀 H3 | I/O — User I/O pin (bank 5) |
| 핀 H4 | I/O — User I/O pin (bank 5) |
| 핀 H5 | I/O — User I/O pin (bank 5) |
| 핀 H6 | GND — Ground |
| 핀 H7 | I/O — User I/O pin (bank 5) |
| 핀 H8 | I/O — User I/O pin (bank 5) |
| 핀 H9 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 H10 | I/O — User I/O pin (bank 6) |
| 핀 H11 | I/O — User I/O pin (bank 6) |
| 핀 H12 | I/O — User I/O pin (bank 6) |
| 핀 J1 | I/O — User I/O pin (bank 7) |
| 핀 J2 | I/O — User I/O pin (bank 7) |
| 핀 J3 | VCCINT — Core supply voltage (1.8 V) |
| 핀 J4 | I/O — User I/O pin (bank 7) |
| 핀 J5 | GND — Ground |
| 핀 J6 | I/O — User I/O pin (bank 7) |
| 핀 J7 | I/O — User I/O pin (bank 7) |
| 핀 J8 | VCCINT — Core supply voltage (1.8 V) |
| 핀 J9 | I/O — User I/O pin (bank 8) |
| 핀 J10 | GND — Ground |
| 핀 J11 | I/O — User I/O pin (bank 8) |
| 핀 J12 | I/O — User I/O pin (bank 8) |
| 핀 K1 | I/O — User I/O pin (bank 7) |
| 핀 K2 | I/O — User I/O pin (bank 7) |
| 핀 K3 | I/O — User I/O pin (bank 7) |
| 핀 K4 | VCCIO7 — I/O bank 7 supply voltage |
| 핀 K5 | I/O — User I/O pin (bank 7) |
| 핀 K6 | I/O — User I/O pin (bank 7) |
| 핀 K7 | I/O — User I/O pin (bank 7) |
| 핀 K8 | GND — Ground |
| 핀 K9 | I/O — User I/O pin (bank 8) |
| 핀 K10 | I/O — User I/O pin (bank 8) |
| 핀 K11 | I/O — User I/O pin (bank 8) |
| 핀 K12 | VCCIO8 — I/O bank 8 supply voltage |
| 핀 L1 | TCK — JTAG Test Clock |
| 핀 L2 | TDO — JTAG Test Data Out |
| 핀 L3 | TMS — JTAG Test Mode Select |
| 핀 L4 | TDI — JTAG Test Data In |
| 핀 L5 | nCONFIG — Configuration control (active low) |
| 핀 L6 | nSTATUS — Configuration status (active low) |
| 핀 L7 | DCLK — Configuration clock input |
| 핀 L8 | DATA0 — Configuration data input |
| 핀 L9 | MSEL0 — Configuration mode select 0 |
| 핀 L10 | MSEL1 — Configuration mode select 1 |
| 핀 L11 | CLK0 — Clock input 0 (dedicated) |
| 핀 L12 | CLK1 — Clock input 1 (dedicated) |
일반적인 애플리케이션
EP20K30EFI144-2X 적합 용도: 6 애플리케이션s: Telecom Interface Cards, PCI Bus Interface Glue Logic, Industrial Control State Machines, Low-Density DSP Preprocessing, Networking Protocol Bridging, Legacy Test and Measurement Instrumentation.
Telecom Interface Cards
The EP20K30EFI144-2X's 1200 logic elements and 93 user I/O make it suitable for telecom interface cards implementing protocol bridges, framing logic, and low-density SERDES control planes. Its 24576 embedded RAM bits provide buffering for cell/packet payloads in ATM or Ethernet-over-SDH designs. The 1.8 V core and multi-standard I/O (LVTTL, LVCMOS, HSTL, GTL+) simplify interfacing to legacy telecom ASICs. Industrial temperature grade supports outdoor enclosures.
추천
PCI Bus Interface Glue Logic
The EP20K30EFI144-2X integrates well into PCI 32-bit/33 MHz bus designs by providing target/master state machines, address decoding, and interrupt handling in a single 144-FBGA device. PCI-compliant I/O standards are supported natively through dedicated VCCIO banks. The 1200 logic cells are sufficient for typical bridge functions between a host CPU and peripheral ASICs, reducing board area and BOM cost versus discrete logic.
추천
Industrial Control State Machines
The EP20K30EFI144-2X is widely deployed in factory automation PLCs, motor controllers, and process control systems because of its industrial temperature rating and deterministic LUT-based logic. The 192 macrocells and embedded RAM blocks allow multi-axis state machine sequencing, encoder interface logic, and PWM generation in one device. Field programmability supports late-stage customization without ASIC redesign cycles.
추천
Low-Density DSP Preprocessing
The EP20K30EFI144-2X handles low-density DSP preprocessing tasks such as FIR filtering, fixed-point arithmetic, and data routing before downstream processors. While the APEX 20KE family lacks hardware multipliers, 1200 cells suffice for 8-bit or 16-bit preprocessing in audio or video pipelines. The embedded system blocks (ESBs) double as fast dual-port RAM for coefficient storage, eliminating external SRAM.
추천
Networking Protocol Bridging
The EP20K30EFI144-2X provides cost-effective bridging between Ethernet, HDLC, Frame Relay, and proprietary protocols in legacy router and switch line cards. The 1200 cells support protocol encapsulation, header parsing, and forwarding tables, while the embedded RAM caches routing entries for fast lookups. Multiple VCCIO banks connect directly to 3.3 V and 5 V PHYs without level shifters.
추천
Legacy Test and Measurement Instrumentation
The EP20K30EFI144-2X is commonly found in legacy oscilloscopes, logic analyzers, and signal generators as timing control, trigger logic, and display interface glue. The JTAG interface simplifies firmware updates in production. Industrial temperature grade supports lab and field environments. Note: new designs should consider Cyclone IV GX or Lattice ECP5 for modern instrumentation platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K30EFI144-2X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K30EFC144-2X | EP20K30EFC144-1 | EP20K30EFI144-2XN | EP20K30EFC144-3 | EP20K30EFC144-1N | EP20K30EFC144-3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-FBGA | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Logic Elements | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| Embedded RAM Bits | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| Maximum User I/O | 93 | 93 | 93 | 93 | 93 | 93 | 93 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -3 (faster) | -1 (slower) | -3 (faster) |
| Temperature Grade | Industrial | Commercial | Commercial | Industrial | Commercial | Commercial | Commercial |
주요 차별점
- Same 144-FBGA footprint across entire speed grade and Pb-free matrix (vs EP20K30EFC144-2X vs EP20K30EFC144-3)
- Industrial temperature grade with Pb-free availability (vs EP20K30EFI144-2X vs EP20K30EFC144-2X)
- Mid-density APEX 20KE position with 93 I/O in compact FBGA (vs EP20K30EFI144-2X vs EP20K100EFC324-2X)
설계 노트
Estimated: VCCINT must be regulated to 1.8 V ±5% with bulk decoupling of 100 µF tantalum plus 0.1 µF ceramic per VCCINT ball. Each VCCIO bank can be set independently to 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V via LVTTL/LVCMOS/PCI/HSTL/GTL+ I/O standards. Place one 0.1 µF ceramic per VCCIO ball and one 10 µF bulk per bank to suppress switching transients during configuration. Multiple ground balls must be connected to a low-impedance ground plane.
The 144-FBGA package requires 1.0 mm ball pitch PCB land pattern with NSMD (non-solder-mask-defined) pads for best thermal cycling reliability. Use 4-6 layer PCB with continuous ground planes beneath the BGA for VCCINT/GND return paths. Via-in-pad with filled and plated-over copper is recommended for inner balls to escape routing. Reflow profile must not exceed 220 °C peak (SnPb) or 245 °C peak (Pb-free) per JEDEC J-STD-020.
Do not leave MSEL0/MSEL1 floating: tie them high or low to select the configuration mode (AS, PS, JTAG). nCONFIG must be held high via 10 kΩ pull-up; nSTATUS requires 10 kΩ pull-up. During multi-device configuration, all EP20K30E devices must share DCLK and DATA0. The legacy Quartus II (v9.0 or earlier) toolchain is mandatory - Quartus Prime does not support APEX 20KE bitstream generation.
Differential clock inputs (CLK0/CLK1) require 50 Ω controlled-impedance routing and AC termination if driving from a non-TTL source. Series dampen resistors (33 Ω) on high-speed I/O signals crossing bank boundaries reduce reflections. JTAG chain (TCK/TMS/TDI/TDO) should be buffered if the chain exceeds 4 devices; otherwise TDO fanout degradation can cause configuration failures.
규정 준수 정보
Compliance data not provided in Verified Web Data. The -N suffix variants (e.g., EP20K30EFI144-2XN) are by convention Pb-free; however, explicit RoHS/REACH declarations should be requested from Intel/Avnet for production use. APEX 20KE FPGAs are obsolete and not AEC-Q100 qualified.
