EP20K400EFC672-3 - 400K Gate APEX-20KE FPGA 672-BBGA | Intel
N.º da peça: EP20K400EFC672-3 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 250 | $213.75 | $53.437,50 |
| 500 | $199.5 | $99.750,00 |
EP20K400EFC672-3 Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable interconnect that the user can redefine after manufacture. APEX-20KE belongs to the APEX (Advanced Logic Element Matrix) family and was Altera's first System-On-a-Programmable-Chip (SOPC) architecture, integrating look-up-table (LUT) based logic with embedded dual-port RAM and True-LVDS support so that complex glue-logic, datapath, and bus-interface functions can be consolidated into a single device.
Key features of the EP20K400EFC672-3 include 488 maximum user I/Os, 1.8 V core supply with 2.5 V multi-voltage I/O support, on-chip PLL clock management, LVDS/True-LVDS compatible I/O pairs, and MultiCore architecture that combines fine-grained LUTs with embedded memory blocks (ESBs). The -3 speed grade denotes the fastest commercial-grade speed bin in this family and pairs with a 0 to 85 C operating temperature window.
Architecturally, the device embeds 212 Kbits of distributed SRAM organized as embedded system blocks, each capable of true dual-port operation. Combined with dedicated multiplier/carry chains and high fan-out routing, the EP20K400 supports high-bandwidth datapath designs, bus interfaces (PCI, SDRAM), and protocol bridging on a single die. The 672-ball FineLine BGA provides controlled-impedance signal integrity for high-speed parallel buses.
Typical applications include telecommunication line cards, industrial control and automation, networking switches/routers, and ASIC prototyping/emulation. APEX-20KE was widely adopted in mid-2000s designs and remains available as a long-lifecycle part for industrial and military refresh programs.
Design consideration: ensure I/O bank supply voltages match the connected logic (3.3 V, 2.5 V, 1.8 V). Add decoupling on every VCCINT/VCCIO pin and verify JTAG chain integrity before in-system programming. This page synthesizes distributor inventory, same-package alternatives, and design context not found in the original datasheet.
Alternativas drop-in para EP20K400EFC672-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K400EFC672-3 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Process Technology, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K400EFC672-2
✅ Drop-In✓ Em estoque
$92.75 / unidade
Ver ficha técnica →EP20K400EFC672-2N
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP20K400EFC672-2X
✅ Drop-In✓ Em estoque
$118.9 / unidade
Ver ficha técnica →EP20K400EFC672-1
✅ Drop-In✓ Em estoque
$110 / unidade
Ver ficha técnica →EP20K400EFC672-1N
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →EP20K400EFC672-1XN
✅ Drop-In✓ Em estoque
$215 / unidade
Ver ficha técnica →EP20K400EFC672-3 Classificações máximas e características elétricas
| Product Type | FPGA (Field Programmable Gate Array) |
| Series | APEX-20KE |
| Logic Elements | 16,640 (approx. 1,052,000 system gates) |
| Embedded Memory (bits) | 212,992 |
| User I/Os | 488 |
| Maximum User I/O | 488 pins |
| Propagation Delay | 2.5 ns |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 2.5 V (multi-voltage I/O) |
| Speed Grade | -3 (fastest commercial) |
| Temperatura de operação | 0 C to +85 C (commercial) |
| Encapsulamento | 672-ball FineLine BGA |
| Tipo de montagem | Surface Mount |
| Logic Family | CMOS |
Guia de Configuração de Pinos do EP20K400EFC672-3 672-ball fineline bga
Configuração de pinos para EP20K400EFC672-3 (pacote 672-ball fineline bga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP20K400EFC672-3.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP20K400EFC672-3 é adequado para 6 aplicaçãos: Telecommunication Line Cards, Industrial Control and Automation, Networking Switches and Routers, ASIC Prototyping and Emulation, Military and Aerospace Avionics, Medical Imaging Systems.
Telecommunication Line Cards
The EP20K400EFC672-3's 488 user I/Os and 212 Kbits of embedded SRAM make it well-suited for telecommunication line-card designs including T1/E1 framers, DSLAM backplanes, and SONET/SDH interface cards. Its MultiCore architecture combines LUT logic with embedded dual-port memory blocks, enabling concurrent datapath processing and frame buffering without external FIFOs. The 672-ball FineLine BGA package provides controlled-impedance signal integrity for high-speed parallel buses running at 66 MHz and above, while 1.8 V core operation keeps power consumption manageable in dense multi-FPGA line cards.
Recomendado
Industrial Control and Automation
Industrial PLC and motion-control systems benefit from the EP20K400EFC672-3's high I/O count, which accommodates multi-axis encoder inputs, sensor arrays, and parallel bus interfaces within a single device. The 0 to 85 C commercial operating range covers most factory-floor enclosures, and APEX-20KE's long-term supply program ensures multi-year lifecycle support for industrial customers. Designers implement custom PID loops, safety interlocks, and protocol bridges (Modbus, Profibus) in the LUT fabric while using ESB memory blocks for encoder-capture buffering and waveform generation.
Recomendado
Networking Switches and Routers
The EP20K400EFC672-3 supports high-port-count networking switch and router designs by aggregating multiple Gigabit Ethernet MACs, packet-classification engines, and switch fabrics into a single device. The 212 Kbits of embedded SRAM implement per-port statistics counters and lookup tables, while 488 user I/Os interface directly to PHY devices and packet-memory buffers. The MultiCore architecture supports parallel packet-processing pipelines at line rate, and Quartus II synthesis libraries are mature and well-validated for networking protocol implementations.
Recomendado
ASIC Prototyping and Emulation
The EP20K400EFC672-3 is widely deployed in ASIC prototyping and emulation rigs where 1,052,000 system gates of logic and 488 I/Os can emulate mid-complexity ASIC designs in real time. Designers partition large ASICs across multiple APEX-20KE devices connected through the BGA ball grid, using the LVDS pairs for high-speed chip-to-chip signaling. The mature Quartus II toolchain supports incremental design flows, hardware breakpoints, and live logic-analyzer probing through JTAG, all of which streamline ASIC bring-up and software-development timelines.
Recomendado
Military and Aerospace Avionics
Long-lifecycle military and avionics programs rely on the EP20K400EFC672-3 because the APEX-20KE family is part of Altera/Intel's extended-lifecycle program with guaranteed supply for 15+ years from launch. Designs implementing MIL-STD-1553, ARINC 429, and custom radar-processing datapaths use the FPGA's 488 I/Os for multi-channel serial interfacing, while embedded ESBs buffer radar-return samples. The 0 to 85 C range covers commercial avionics; rugged variants (EP20K400EFC672-1XN-style with extended grade) cover harsher military environments.
Recomendado
Medical Imaging Systems
Ultrasound, CT, and MRI imaging systems leverage the EP20K400EFC672-3's 16,640 logic elements and 212 Kbits of embedded SRAM to implement beamforming, image reconstruction, and real-time filter pipelines. The 488 user I/Os interface directly to analog front-end ADCs and high-speed data converters, while ESB memory blocks accumulate scan-line data and intermediate pixel buffers. The mature Quartus II DSP library provides optimized FIR, IIR, and FFT megafunctions that accelerate medical-image processing while keeping power consumption low for portable cart-based systems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K400EFC672-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K400EFC672-2 | EP20K400EFC672-2N | EP20K400EFC672-2X | EP20K400EFC672-1 | EP20K400EFC672-1N | EP20K400EFC672-1XN |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BBGA (FineLine BGA) | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same |
| Speed Grade | -3 (fastest commercial) | -2 (mid-range) | -2 (mid-range) | -2 (extended) | -1 (slowest) | -1 (slowest) | -1 (extended) |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded Memory (bits) | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 to +85 C | 0 to +85 C | 0 to +85 C | Extended | 0 to +85 C | 0 to +85 C | Extended |
Principais diferenciais
- Highest-speed commercial bin in the APEX-20KE family (vs EP20K400EFC672-2)
- Maximum 488 user I/Os in the 672-BBGA package (vs EP20K400EBC652-3)
- True-LVDS and multi-voltage I/O support (vs EP20K400EFC672-1)
Notas de projeto
The EP20K400EFC672-3 requires separate 1.8 V VCCINT and 2.5 V VCCIO rails. Decouple every VCCINT/VCCIO ball with a 0.1 uF X7R ceramic plus a 10 uF bulk tantalum placed within 0.25 inches of the ball. Add a ferrite bead between the regulator and the FPGA VCCINT pins to attenuate switching noise from the core logic. Estimated core current for a 100% utilized APEX-20KE device at typical toggle rates is approximately 1-2 A; verify with Quartus II PowerPlay early in the design cycle.
The 672-ball FineLine BGA requires a multilayer PCB (minimum 6 layers, recommended 8-10) with a dedicated ground plane and at least one solid power plane. Use 0.5 mm pitch ball pads with non-solder-mask-defined (NSMD) pads for higher assembly yield. Match trace lengths within each LVDS pair to within 100 mils for proper differential signaling. Escape routing must use dog-bone fanout or via-in-pad microvias to break out the dense 1.0 mm pitch ball grid.
Do not assume -3 timing-closure designs automatically meet timing on -1 speed grade parts. Recompile and re-run timing analysis for any speed-grade migration. Also, do not leave VCCIO banks floating; unused I/O banks should be tied to a valid VCCIO rail (typically 2.5 V) to prevent input-buffer oscillation. The JTAG TCK signal must be pulled low through a 1-10 kohm resistor to prevent floating-clock configuration errors during board bring-up.
Informações de conformidade
RoHS and lead-free status not explicitly stated in the verified web data; the N-suffixed variants (EP20K400EFC672-2N, EP20K400EFC672-1N) likely indicate lead-free termination per Altera naming convention but confirmation requires datasheet verification. AEC-Q100 is not applicable as this is an FPGA, not an automotive-grade discrete.