EP20K600CF1020I9 - APEX 20KC FPGA 600K Gates 1020-BGA | Intel / Altera
N.º da peça: EP20K600CF1020I9 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118 | $11.800,00 |
| 250 | $109 | $27.250,00 |
| 500 | $99.5 | $49.750,00 |
EP20K600CF1020I9 Visão geral
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells into a single semiconductor die. Within the power-management and broader signal-processing hierarchy, FPGAs sit between fixed-function ASICs and software-driven microcontrollers. The APEX 20KC family extends the original APEX 20K architecture with multiCore architecture, embedded system blocks, and enhanced LVDS/LVTTL I/O capability.
Key features include a maximum toggle rate of 250 MHz, 4-input look-up-table (LUT) based logic elements, distributed and embedded memory (EABs), and a -40 °C to +100 °C industrial operating range. The 1020-ball FC-FBGA package uses a 1.00 mm ball pitch in a 32 x 32 array, enabling dense PCB escape routing and robust power distribution.
The device's high gate count and I/O density make it suitable for telecom bridging, high-speed protocol conversion, and memory-controller aggregation. Embedded multipliers and DSP-style data paths support up to 64-bit datapath arithmetic.
Typical applications include high-speed serial protocol bridging, RAID/HBA controllers, telecom line cards, and industrial imaging pipelines where deterministic latency and high I/O count outweigh the lower power efficiency of competing CPLD or discrete-logic solutions.
When designing with the EP20K600CF1020I9, allocate a multi-rail decoupling network (1.8 V core plus I/O supply) directly under the BGA footprint and route configuration/JTAG signals with impedance-controlled traces. Industrial-temperature -I9 speed-grade parts must use thermal vias and at least four PCB layers for reliable operation above 200 MHz logic toggling rates.
This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical PCB layout notes not collected in the original manufacturer datasheet alone.
Alternativas drop-in para EP20K600CF1020I9 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K600CF1020I9 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Maximum Operating Frequency, Process Technology, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K600CF1020I8
✅ Drop-In✓ Em estoque
$325 / unidade
Ver ficha técnica →EP20K600CF1020I7
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP20K600CF1020C9
✅ Drop-In✓ Em estoque
$165 / unidade
Ver ficha técnica →EP20K600CF1020C8
✅ Drop-In✓ Em estoque
$92 / unidade
Ver ficha técnica →EP20K600CF1020C7
✅ Drop-In✓ Em estoque
$212.4 / unidade
Ver ficha técnica →EP20K600CF1020I9 Classificações máximas e características elétricas
| Family | APEX 20KC |
| Series | EP20K600 |
| Função | Loadable PLD / FPGA |
| Technology | CMOS, 0.15 µm process |
| System Gates | 600,000 |
| Logic Elements / Cells | 24,320 |
| Maximum Operating Frequency | 250 MHz |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Count | 588 user I/O |
| Dedicated Inputs | 580 |
| Encapsulamento | 1020-ball FC-FBGA |
| Terminal Pitch | 1.00 mm |
| Ball Array | 32 x 32 |
| Temperatura de operação | -40 °C to +100 °C (Industrial) |
| Speed Grade | I9 (-9 speed grade, industrial) |
| PCI SIG Compliance | PCI Local Bus Specification Revision 2.2 (32/64-bit, 33/66 MHz, 3.3 V) |
| External Memory Support | DDR SDRAM, ZBT SRAM |
Guia de Configuração de Pinos do EP20K600CF1020I9 1020-ball fc-fbga
Configuração de pinos para EP20K600CF1020I9 (pacote 1020-ball fc-fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP20K600CF1020I9.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP20K600CF1020I9 é adequado para 6 aplicaçãos: Telecom Line-Card Protocol Bridging, High-Speed Memory Controller Aggregation, Industrial Imaging / Video Pipeline, RAID / HBA Storage Controller, Aerospace Avionics Databus Interface, High-Speed Test & Measurement Instrumentation.
Telecom Line-Card Protocol Bridging
The EP20K600CF1020I9 fits telecom line-card protocol bridging because its 600K system gates and 24,320 logic cells provide ample capacity for concurrent serial protocol converters (T1/E1, HDLC, SPI-4.2) and 588 user I/O can directly connect to backplane transceivers and 32/64-bit PCI buses. PCI SIG Revision 2.2 compliance at 66 MHz supports legacy host interface cards. The 1.8 V core keeps per-FPGA power reasonable when eight or more line cards populate a shelf, and 250 MHz internal toggling handles high-speed state-machine arbitration without timing closure issues.
Recomendado
High-Speed Memory Controller Aggregation
The EP20K600CF1020I9's dedicated DDR SDRAM and ZBT SRAM interface circuitry makes it well suited as a memory-controller aggregation point in RAID HBAs or base-station baseband cards. Source-synchronous data-strobe timing and embedded memory blocks (EABs) cut external delay-locked loops and reduce component count. Industrial -40 °C to +100 °C operation supports outdoor cabinet deployments, while 580 dedicated inputs allow multiple DDR channels to fan into the device without external multiplexing.
Recomendado
Industrial Imaging / Video Pipeline
For machine-vision, medical imaging, or video-broadcast frame buffers, the EP20K600CF1020I9 offers high logic density at a moderate 250 MHz internal rate, which is sufficient to capture LVDS camera-link data at 80 MHz, store frames in DDR SDRAM, and pipe them to a processing ASIC. 588 user I/O handle multi-tap sensor interfaces, and the 1.00 mm-pitch FC-FBGA package routes cleanly on 4-6 layer HDI boards commonly used in camera electronics. Industrial temperature grade ensures reliability in factory-floor or outdoor environments.
Recomendado
RAID / HBA Storage Controller
Storage controllers for RAID 5/6 HBAs and SAS/SATA aggregators use the EP20K600CF1020I9 because of its high logic density and 580 dedicated inputs, which can ingest multiple SAS PHY data channels simultaneously. The 32/64-bit PCI bus at 33/66 MHz interfaces directly to host chipsets, and embedded EABs deliver parity-buffer storage without external SRAM. The 1.8 V core keeps thermal dissipation manageable in multi-card server backplanes.
Recomendado
Aerospace Avionics Databus Interface
Avionics LRUs (Line Replaceable Units) for ARINC 429, MIL-STD-1553, or FlexRay bus aggregation benefit from the EP20K600CF1020I9's high I/O count and industrial temperature range (-40 °C to +100 °C). 588 user I/O accept numerous discrete analog discretes and bus transceivers, while 600K gates implement multi-protocol translation in a single device. The 1.8 V core simplifies power architecture in aircraft 28 V-bus systems stepped down through intermediate regulators.
Recomendado
High-Speed Test & Measurement Instrumentation
Logic-analyzer probe heads, protocol analyzers, and high-channel-count oscilloscope acquisition cards can use the EP20K600CF1020I9 as the timing/state-machine aggregation core. Its 250 MHz toggle rate and 24,320 logic cells handle concurrent state tracking across hundreds of channels, and 588 I/O absorb hundreds of probe-tip signals directly. Industrial temperature grade supports bench-to-field portability, while the 1.00 mm BGA allows fan-out routing of hundreds of matched-length LVDS traces on HDI PCBs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K600CF1020I9 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K600CF1020I8 | EP20K600CF1020I7 | EP20K600CF1020C9 | EP20K600CF1020C8 | EP20K600CF1020C7 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Speed Grade | I9 (industrial, -9) | I8 (industrial, -8) | I7 (industrial, -7) | C9 (commercial, -9) | C8 (commercial, -8) | C7 (commercial, -7) |
| Operating Temperature | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Maximum Toggle Frequency | 250 MHz | ~270 MHz (est. from -8 grade) | ~290 MHz (est. from -7 grade) | 250 MHz | ~270 MHz (est. from -8 grade) | ~290 MHz (est. from -7 grade) |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Cells | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| User I/O | 588 | 588 | 588 | 588 | 588 | 588 |
Principais diferenciais
- Industrial temperature grade with -9 speed grade for balanced performance / reliability (vs EP20K600CF1020I8 (industrial -8 speed grade))
- High I/O count (588) for I/O-dense backplane designs (vs EP20K400CB652I9 (652-ball, 400K gates))
- Full PCI SIG 32/64-bit compliance for host bus cards (vs EP20K300EFC672-2 (300K gates, smaller BGA))
Notas de projeto
Estimated: The 1020-ball FC-FBGA at 1.00 mm pitch requires HDI microvia stack-ups. Use a minimum 4-layer PCB with continuous ground plane directly under the BGA, dedicated power islands for 1.8 V VCCINT and per-bank VCCIO supplies, and stitching vias every 3 mm around the BGA perimeter. Power decoupling should include 100 nF ceramic caps every 10 balls and 10 µF bulk caps on each power rail within 5 mm of the device.
Estimated: with all 24,320 logic cells switching at 250 MHz in the -I9 industrial temperature grade, worst-case junction temperature can approach 110-115 °C. Mount at least four thermal vias (0.3 mm drill, 0.5 mm pad) under the central BGA thermal balls and provide a continuous copper pour on inner power planes to spread heat. Use a thermal camera or simulation (FloTHERM/Icepak) to validate your specific design.
Estimated: high-speed differential pairs (LVDS, LVTTL) routed from this 588-I/O device should target 50 Ω ±10 % controlled impedance on the outer microstrip layer, with reference return paths preserved through uninterrupted ground planes below. Keep matched-length skew within 50 ps for DDR SDRAM data-strobe and address/command groups; use Altera's TimeQuest timing analyzer in the Quartus II legacy toolchain for closure.
Do not confuse -I9 industrial temperature with -C9 commercial temperature; the package marking and voltage tolerance differ even though the pin-out is identical. Always verify device decoupling at first power-up with an inrush current probe to detect missing bulk capacitance - simultaneous switching of 588 I/O at 66 MHz can pull VCCINT below 1.71 V if decoupling is undersized. Configure unused I/O as inputs with bus-hold and tie nCONFIG high through a 4.7 kΩ resistor.
Informações de conformidade
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not stated in the verified web data; marked unknown pending datasheet verification. AEC-Q100 not applicable for FPGAs. PCI SIG Revision 2.2 compliance verified per manufacturer datasheet.