EP20K600CF1020I9 - APEX 20KC FPGA 600K Gates 1020-BGA | Intel / Altera
Référence : EP20K600CF1020I9 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1 325,00 |
| 100 | $118 | $11 800,00 |
| 250 | $109 | $27 250,00 |
| 500 | $99.5 | $49 750,00 |
EP20K600CF1020I9 Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells into a single semiconductor die. Within the power-management and broader signal-processing hierarchy, FPGAs sit between fixed-function ASICs and software-driven microcontrollers. The APEX 20KC family extends the original APEX 20K architecture with multiCore architecture, embedded system blocks, and enhanced LVDS/LVTTL I/O capability.
Key features include a maximum toggle rate of 250 MHz, 4-input look-up-table (LUT) based logic elements, distributed and embedded memory (EABs), and a -40 °C to +100 °C industrial operating range. The 1020-ball FC-FBGA package uses a 1.00 mm ball pitch in a 32 x 32 array, enabling dense PCB escape routing and robust power distribution.
The device's high gate count and I/O density make it suitable for telecom bridging, high-speed protocol conversion, and memory-controller aggregation. Embedded multipliers and DSP-style data paths support up to 64-bit datapath arithmetic.
Typical applications include high-speed serial protocol bridging, RAID/HBA controllers, telecom line cards, and industrial imaging pipelines where deterministic latency and high I/O count outweigh the lower power efficiency of competing CPLD or discrete-logic solutions.
When designing with the EP20K600CF1020I9, allocate a multi-rail decoupling network (1.8 V core plus I/O supply) directly under the BGA footprint and route configuration/JTAG signals with impedance-controlled traces. Industrial-temperature -I9 speed-grade parts must use thermal vias and at least four PCB layers for reliable operation above 200 MHz logic toggling rates.
This page synthesizes distributor pricing, drop-in FPGA alternatives, and practical PCB layout notes not collected in the original manufacturer datasheet alone.
Alternatives de remplacement direct pour EP20K600CF1020I9 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K600CF1020I9 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Maximum Operating Frequency, Process Technology, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K600CF1020I8
✅ Remplacement direct✓ En stock
$325 / unité
Voir la fiche technique →EP20K600CF1020I7
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP20K600CF1020C9
✅ Remplacement direct✓ En stock
$165 / unité
Voir la fiche technique →EP20K600CF1020C8
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EP20K600CF1020C7
✅ Remplacement direct✓ En stock
$212.4 / unité
Voir la fiche technique →EP20K600CF1020I9 Valeurs maximales et caractéristiques électriques
| Family | APEX 20KC |
| Series | EP20K600 |
| Fonction | Loadable PLD / FPGA |
| Technology | CMOS, 0.15 µm process |
| System Gates | 600,000 |
| Logic Elements / Cells | 24,320 |
| Maximum Operating Frequency | 250 MHz |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Count | 588 user I/O |
| Dedicated Inputs | 580 |
| Boîtier | 1020-ball FC-FBGA |
| Terminal Pitch | 1.00 mm |
| Ball Array | 32 x 32 |
| Température de fonctionnement | -40 °C to +100 °C (Industrial) |
| Speed Grade | I9 (-9 speed grade, industrial) |
| PCI SIG Compliance | PCI Local Bus Specification Revision 2.2 (32/64-bit, 33/66 MHz, 3.3 V) |
| External Memory Support | DDR SDRAM, ZBT SRAM |
Guide de configuration des broches du EP20K600CF1020I9 1020-ball fc-fbga
Configuration des broches du EP20K600CF1020I9 (boîtier 1020-ball fc-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K600CF1020I9.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K600CF1020I9 convient pour 6 applications: Telecom Line-Card Protocol Bridging, High-Speed Memory Controller Aggregation, Industrial Imaging / Video Pipeline, RAID / HBA Storage Controller, Aerospace Avionics Databus Interface, High-Speed Test & Measurement Instrumentation.
Telecom Line-Card Protocol Bridging
The EP20K600CF1020I9 fits telecom line-card protocol bridging because its 600K system gates and 24,320 logic cells provide ample capacity for concurrent serial protocol converters (T1/E1, HDLC, SPI-4.2) and 588 user I/O can directly connect to backplane transceivers and 32/64-bit PCI buses. PCI SIG Revision 2.2 compliance at 66 MHz supports legacy host interface cards. The 1.8 V core keeps per-FPGA power reasonable when eight or more line cards populate a shelf, and 250 MHz internal toggling handles high-speed state-machine arbitration without timing closure issues.
Recommandé
High-Speed Memory Controller Aggregation
The EP20K600CF1020I9's dedicated DDR SDRAM and ZBT SRAM interface circuitry makes it well suited as a memory-controller aggregation point in RAID HBAs or base-station baseband cards. Source-synchronous data-strobe timing and embedded memory blocks (EABs) cut external delay-locked loops and reduce component count. Industrial -40 °C to +100 °C operation supports outdoor cabinet deployments, while 580 dedicated inputs allow multiple DDR channels to fan into the device without external multiplexing.
Recommandé
Industrial Imaging / Video Pipeline
For machine-vision, medical imaging, or video-broadcast frame buffers, the EP20K600CF1020I9 offers high logic density at a moderate 250 MHz internal rate, which is sufficient to capture LVDS camera-link data at 80 MHz, store frames in DDR SDRAM, and pipe them to a processing ASIC. 588 user I/O handle multi-tap sensor interfaces, and the 1.00 mm-pitch FC-FBGA package routes cleanly on 4-6 layer HDI boards commonly used in camera electronics. Industrial temperature grade ensures reliability in factory-floor or outdoor environments.
Recommandé
RAID / HBA Storage Controller
Storage controllers for RAID 5/6 HBAs and SAS/SATA aggregators use the EP20K600CF1020I9 because of its high logic density and 580 dedicated inputs, which can ingest multiple SAS PHY data channels simultaneously. The 32/64-bit PCI bus at 33/66 MHz interfaces directly to host chipsets, and embedded EABs deliver parity-buffer storage without external SRAM. The 1.8 V core keeps thermal dissipation manageable in multi-card server backplanes.
Recommandé
Aerospace Avionics Databus Interface
Avionics LRUs (Line Replaceable Units) for ARINC 429, MIL-STD-1553, or FlexRay bus aggregation benefit from the EP20K600CF1020I9's high I/O count and industrial temperature range (-40 °C to +100 °C). 588 user I/O accept numerous discrete analog discretes and bus transceivers, while 600K gates implement multi-protocol translation in a single device. The 1.8 V core simplifies power architecture in aircraft 28 V-bus systems stepped down through intermediate regulators.
Recommandé
High-Speed Test & Measurement Instrumentation
Logic-analyzer probe heads, protocol analyzers, and high-channel-count oscilloscope acquisition cards can use the EP20K600CF1020I9 as the timing/state-machine aggregation core. Its 250 MHz toggle rate and 24,320 logic cells handle concurrent state tracking across hundreds of channels, and 588 I/O absorb hundreds of probe-tip signals directly. Industrial temperature grade supports bench-to-field portability, while the 1.00 mm BGA allows fan-out routing of hundreds of matched-length LVDS traces on HDI PCBs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K600CF1020I9 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K600CF1020I8 | EP20K600CF1020I7 | EP20K600CF1020C9 | EP20K600CF1020C8 | EP20K600CF1020C7 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Speed Grade | I9 (industrial, -9) | I8 (industrial, -8) | I7 (industrial, -7) | C9 (commercial, -9) | C8 (commercial, -8) | C7 (commercial, -7) |
| Operating Temperature | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Maximum Toggle Frequency | 250 MHz | ~270 MHz (est. from -8 grade) | ~290 MHz (est. from -7 grade) | 250 MHz | ~270 MHz (est. from -8 grade) | ~290 MHz (est. from -7 grade) |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Cells | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| User I/O | 588 | 588 | 588 | 588 | 588 | 588 |
Principaux différenciateurs
- Industrial temperature grade with -9 speed grade for balanced performance / reliability (vs EP20K600CF1020I8 (industrial -8 speed grade))
- High I/O count (588) for I/O-dense backplane designs (vs EP20K400CB652I9 (652-ball, 400K gates))
- Full PCI SIG 32/64-bit compliance for host bus cards (vs EP20K300EFC672-2 (300K gates, smaller BGA))
Notes de conception
Estimated: The 1020-ball FC-FBGA at 1.00 mm pitch requires HDI microvia stack-ups. Use a minimum 4-layer PCB with continuous ground plane directly under the BGA, dedicated power islands for 1.8 V VCCINT and per-bank VCCIO supplies, and stitching vias every 3 mm around the BGA perimeter. Power decoupling should include 100 nF ceramic caps every 10 balls and 10 µF bulk caps on each power rail within 5 mm of the device.
Estimated: with all 24,320 logic cells switching at 250 MHz in the -I9 industrial temperature grade, worst-case junction temperature can approach 110-115 °C. Mount at least four thermal vias (0.3 mm drill, 0.5 mm pad) under the central BGA thermal balls and provide a continuous copper pour on inner power planes to spread heat. Use a thermal camera or simulation (FloTHERM/Icepak) to validate your specific design.
Estimated: high-speed differential pairs (LVDS, LVTTL) routed from this 588-I/O device should target 50 Ω ±10 % controlled impedance on the outer microstrip layer, with reference return paths preserved through uninterrupted ground planes below. Keep matched-length skew within 50 ps for DDR SDRAM data-strobe and address/command groups; use Altera's TimeQuest timing analyzer in the Quartus II legacy toolchain for closure.
Do not confuse -I9 industrial temperature with -C9 commercial temperature; the package marking and voltage tolerance differ even though the pin-out is identical. Always verify device decoupling at first power-up with an inrush current probe to detect missing bulk capacitance - simultaneous switching of 588 I/O at 66 MHz can pull VCCINT below 1.71 V if decoupling is undersized. Configure unused I/O as inputs with bus-hold and tie nCONFIG high through a 4.7 kΩ resistor.
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not stated in the verified web data; marked unknown pending datasheet verification. AEC-Q100 not applicable for FPGAs. PCI SIG Revision 2.2 compliance verified per manufacturer datasheet.