EP20K600CF672-3X - 600K Gate APEX 20KC FPGA, F672, -3X Speed | Intel / Altera
N.º da peça: EP20K600CF672-3X ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165 | $1.650,00 |
| 100 | $140 | $14.000,00 |
| 500 | $118 | $59.000,00 |
| 1.000 | $98 | $98.000,00 |
EP20K600CF672-3X Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect, all controlled by SRAM-based configuration cells. APEX 20KC devices extend the APEX 20K architecture by adding dedicated CAM (Content-Addressable Memory) blocks and LVDS I/O support, placing the family within the broader hierarchy: programmable logic device -> CPLD/FPGA -> logic IC -> integrated circuit. APEX 20KC devices were widely adopted in telecom, networking, and high-speed data-path designs in the early 2000s.
Key features of the EP20K600CF672-3X include up to 24,480 logic elements, approximately 600,000 typical gates, embedded system blocks (ESBs) configurable as RAM/ROM/CAM, four phase-locked loops (PLLs) for clock management, and multi-standard I/O support including LVTTL, LVCMOS, PCI, SSTL, and LVDS. The FineLine BGA-672 package offers a compact footprint suitable for high-density PCB designs while providing high pin count for wide data buses.
The APEX 20KC architecture combines a MultiCore architecture with a unique combination of look-up-table (LUT)-based logic and dual-port ESBs. The -3X speed grade denotes the fastest commercial-speed bin of the family, enabling higher Fmax for timing-critical paths such as datapath pipelines and memory interfaces. PLLs provide clock multiplication, division, and phase shifting for system-level clock synthesis.
Typical applications of the EP20K600CF672-3X include telecom line-card processing, network switching fabrics, high-speed protocol bridging, custom DSP datapaths, and PCI-based interface controllers. Its large logic capacity makes it suitable for designs that previously required multiple lower-density FPGAs or ASICs.
When designing with this part, engineers should account for its NRND/EOL lifecycle status: Altera announced PCN/EOL notifications for APEX 20K devices, so new production designs should consider Cyclone or Stratix equivalents. Existing designs should perform last-time-buy evaluation and verify supply through authorized distributors.
This page synthesizes lifecycle status, drop-in same-family alternatives, and PCB-layout design guidance that is not aggregated on a single distributor page, giving engineers a concise decision base for sustaining legacy APEX 20KC designs.
Alternativas drop-in para EP20K600CF672-3X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K600CF672-3X (mesmo formato e footprint) — diferindo em Process Technology, Speed Grade, Package, RoHS Status, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K600CF672-3
✅ Drop-In✓ Em estoque
$99.5 / unidade
Ver ficha técnica →EP20K600CF672-2X
✅ Drop-In✓ Em estoque
$138 / unidade
Ver ficha técnica →EP20K600CF672-2
✅ Drop-In✓ Em estoque
$680 / unidade
Ver ficha técnica →EP20K600CF672-1X
✅ Drop-In✓ Em estoque
$95 / unidade
Ver ficha técnica →EP20K600CF672
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP20K600CB672C8
✅ Drop-In✓ Em estoque
$245 / unidade
Ver ficha técnica →EP20K600CF672-3X Classificações máximas e características elétricas
| Series | APEX 20KC |
| Family | APEX 20K (MultiCore) |
| Typical Gates | 600,000 |
| Logic Elements | 24,480 |
| Maximum System Gates | 1,537,000 |
| Embedded System Blocks (ESBs) | 312 |
| Maximum RAM Bits | 311,296 |
| Maximum User I/O Pins | 508 |
| PLLs | 4 |
| Encapsulamento | 672-pin FineLine BGA (F672) |
| Tipo de montagem | Surface Mount (BGA) |
| Speed Grade | -3X (fastest) |
| Temperatura de operação | 0C to +85C (commercial) |
| Process Technology | 0.18 um CMOS, SRAM-based |
| Configuration Method | SRAM, serial/parallel, EPC support |
Guia de Configuração de Pinos do EP20K600CF672-3X 672-pin fineline bga (f672)
Configuração de pinos para EP20K600CF672-3X (pacote 672-pin fineline bga (f672)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP20K600CF672-3X.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP20K600CF672-3X é adequado para 6 aplicaçãos: Telecom Line-Card Processing, Network Switching Fabric Interface, High-Speed Protocol Bridging, Custom DSP Datapath Engine, PCI-Based Interface Controllers, Industrial Test and Measurement Instrumentation.
Telecom Line-Card Processing
The EP20K600CF672-3X delivers 24,480 logic elements and 508 user I/O pins, making it well suited to telecom line-card designs that integrate TDM framers, HDLC controllers, and ATM/AAL2 segmentation engines on a single device. The four on-chip PLLs enable generation of multiple clock domains (T1/E1, E3/DS3, STS-1) from a single reference oscillator, eliminating external clock-generator ICs. The 311 Kbits of embedded RAM support cell-buffer FIFOs and look-up tables for routing tables. The -3X speed grade delivers the highest Fmax in the family, critical for STS-1 / STM-0 line rates and above.
Recomendado
Network Switching Fabric Interface
With 24,480 logic elements, 312 ESBs, and 508 I/O pins, the EP20K600CF672-3X can host a complete switching-fabric interface including MAC controllers, CAM lookup logic, queue managers, and PCI/UTOPIA system-side interfaces. The on-chip CAM blocks via the ESBs accelerate L2/L3 address lookups at wire speed. LVDS I/O support enables direct connection to serializer/deserializer (SERDES) chips for gigabit links. The 672-ball FineLine BGA provides the high pin count needed for 32-bit or 64-bit datapath connections to network processors.
Recomendado
High-Speed Protocol Bridging
Protocol bridges such as SPI-to-PCI, UART-to-USB, or custom serial-to-parallel converters benefit from the EP20K600CF672-3X's large logic capacity and 311 Kbits of dual-port RAM, which allows buffer-based bridge designs with handshaking flow control. The -3X speed grade supports the high clock rates required for SPI peripherals running above 50 MHz and for USB 2.0 full-speed bit-stuffing logic. 508 user I/O lets the bridge expose multiple peripheral interfaces simultaneously without external mux logic.
Recomendado
Custom DSP Datapath Engine
DSP datapath engines for baseband processing, image processing, or custom FIR/IIR filters can leverage the EP20K600CF672-3X's 24,480 logic elements and 311 Kbits of embedded memory to build high-throughput pipelined multipliers and accumulators. The four PLLs support multi-rate sample-clock generation for narrowband and wideband processing paths. The -3X speed grade provides the Fmax headroom needed for 16-bit x 16-bit multiply-accumulate pipelines at sample rates above 100 MHz. 508 user I/O accommodate wide parallel data buses to external ADC/DAC converters.
Recomendado
PCI-Based Interface Controllers
The EP20K600CF672-3X supports the PCI 33 MHz / 66 MHz interface directly via its 5 V-tolerant I/O banks, with built-in compliance to the PCI Local Bus Specification. 24,480 logic elements easily host a PCI Target or Master controller plus DMA engine, command FIFOs, and interrupt logic. The 311 Kbits of embedded memory accommodate scatter-gather descriptor tables and DMA buffers. For multi-slot systems, the 508 user I/O support arbitration signals for multiple PCI devices. The 672-ball FineLine BGA simplifies board routing of the 32-bit PCI bus plus sideband signals.
Recomendado
Industrial Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol analyzers, and ATE pin-electronics benefit from the EP20K600CF672-3X's logic capacity, on-chip memory, and -3X speed grade to handle real-time capture and triggering. The 311 Kbits of dual-port RAM function as deep trace buffers, while the 508 user I/O accept multiple channels of high-speed probes simultaneously. Four PLLs derive multiple internal sampling clocks from a single precision reference. The device's commercial temperature range (0C to 85C) and FineLine BGA package suit benchtop and rack-mount instrument designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K600CF672-3X — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K600CF672-3 | EP20K600CF672-2X | EP20K600CF672-1X | EP20K600CB672C8 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 672-ball FineLine BGA (F672) | 672-ball FineLine BGA (F672) - same | 672-ball FineLine BGA (F672) - same | 672-ball FineLine BGA (F672) - same | 672-ball BGA (B672) - same family |
| Typical Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,480 | 24,480 | 24,480 | 24,480 | 24,480 |
| Maximum User I/O | 508 | 508 | 508 | 508 | 488 |
| Speed Grade | -3X (fastest) | -3 | -2X | -1X | -8 (commercial) |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (1 qty, USD) | $185 | $175-185 | $140-160 | $110-130 | $160-180 |
Principais diferenciais
- Highest-density APEX 20KC member at -3X speed grade (vs EP20K600CF672-2X)
- Drop-in compatibility with all F672 APEX 20K 600K variants (vs EP20K600CB672C8 (B672 package))
- Four on-chip PLLs for flexible clock synthesis (vs EP20K400FC672-3X)
Notas de projeto
The EP20K600CF672-3X uses a 1.0 mm-pitch 672-ball FineLine BGA, which requires a multi-layer PCB (typically 8+ layers) with microvia or via-in-pad technology to route signals out of the BGA array. Use the Altera-provided land-pattern and pin-out files as the authoritative source; do not synthesize footprints from package outline alone. Plan for at least one full reference plane layer beneath the BGA for clean power delivery to the core and I/O banks.
Provide separate decoupling for VCCINT (core), VCCIO (I/O banks), VCCP (PCI clamp), and PLL analog supplies (VCCA_PLL, VCCD_PLL). Place 0.1 uF X7R ceramic decoupling caps within 50 mils of every supply ball, and bulk capacitors (10-100 uF) at each power rail entry point. The four PLLs require isolated analog supplies with pi-filter (ferrite bead + caps) to prevent digital switching noise from coupling into PLL loops and causing jitter.
Because the APEX 20KC family uses SRAM-based configuration, the bitstream is volatile and must be reloaded at every power-up from a configuration device (EPC1, EPC2, EPC4, EPC8, EPC16) or a microprocessor. Do not assume the FPGA retains its configuration after a power cycle. For in-system reprogramming, route JTAG (TCK, TMS, TDI, TDO) to a test header or boundary-scan chain. Verify nCONFIG, nSTATUS, and CONF_DONE behavior during board bring-up to detect configuration failures early.
The 672-ball FineLine BGA package concentrates heat in a small area; estimate worst-case junction temperature from total power dissipation multiplied by theta_JA (approximately 8-12 C/W with proper PCB thermal design, depending on copper area and airflow). For sustained operation above 70 percent utilization, plan for a thermal copper pad under the BGA and possibly forced-air cooling to keep Tj below 100 C in commercial temperature range designs.
Informações de conformidade
RoHS and lead-free status depend on date code and assembly lot. Original APEX 20KC family pre-dates RoHS enforcement; later production runs and many authorized aftermarket suppliers provide RoHS-compliant parts with C-of-C documentation. AEC-Q100 not applicable to FPGAs.
