EP20K600CF672-3X - 600K Gate APEX 20KC FPGA, F672, -3X Speed | Intel / Altera
부품 번호: EP20K600CF672-3X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $140 | $14,000.00 |
| 500 | $118 | $59,000.00 |
| 1,000 | $98 | $98,000.00 |
EP20K600CF672-3X 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect, all controlled by SRAM-based configuration cells. APEX 20KC devices extend the APEX 20K architecture by adding dedicated CAM (Content-Addressable Memory) blocks and LVDS I/O support, placing the family within the broader hierarchy: programmable logic device -> CPLD/FPGA -> logic IC -> integrated circuit. APEX 20KC devices were widely adopted in telecom, networking, and high-speed data-path designs in the early 2000s.
Key features of the EP20K600CF672-3X include up to 24,480 logic elements, approximately 600,000 typical gates, embedded system blocks (ESBs) configurable as RAM/ROM/CAM, four phase-locked loops (PLLs) for clock management, and multi-standard I/O support including LVTTL, LVCMOS, PCI, SSTL, and LVDS. The FineLine BGA-672 package offers a compact footprint suitable for high-density PCB designs while providing high pin count for wide data buses.
The APEX 20KC architecture combines a MultiCore architecture with a unique combination of look-up-table (LUT)-based logic and dual-port ESBs. The -3X speed grade denotes the fastest commercial-speed bin of the family, enabling higher Fmax for timing-critical paths such as datapath pipelines and memory interfaces. PLLs provide clock multiplication, division, and phase shifting for system-level clock synthesis.
Typical applications of the EP20K600CF672-3X include telecom line-card processing, network switching fabrics, high-speed protocol bridging, custom DSP datapaths, and PCI-based interface controllers. Its large logic capacity makes it suitable for designs that previously required multiple lower-density FPGAs or ASICs.
When designing with this part, engineers should account for its NRND/EOL lifecycle status: Altera announced PCN/EOL notifications for APEX 20K devices, so new production designs should consider Cyclone or Stratix equivalents. Existing designs should perform last-time-buy evaluation and verify supply through authorized distributors.
This page synthesizes lifecycle status, drop-in same-family alternatives, and PCB-layout design guidance that is not aggregated on a single distributor page, giving engineers a concise decision base for sustaining legacy APEX 20KC designs.
드롭인 대체품: EP20K600CF672-3X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CF672-3X (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Speed Grade, Package, RoHS Status, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CF672-3
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →EP20K600CF672-2X
✅ 드롭인✓ 재고 있음
$138 / 개
데이터시트 보기 →EP20K600CF672-2
✅ 드롭인✓ 재고 있음
$680 / 개
데이터시트 보기 →EP20K600CF672-1X
✅ 드롭인✓ 재고 있음
$95 / 개
데이터시트 보기 →EP20K600CF672
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP20K600CB672C8
✅ 드롭인✓ 재고 있음
$245 / 개
데이터시트 보기 →EP20K600CF672-3X 최대 정격 & 전기적 특성
| Series | APEX 20KC |
| Family | APEX 20K (MultiCore) |
| Typical Gates | 600,000 |
| Logic Elements | 24,480 |
| Maximum System Gates | 1,537,000 |
| Embedded System Blocks (ESBs) | 312 |
| Maximum RAM Bits | 311,296 |
| Maximum User I/O Pins | 508 |
| PLLs | 4 |
| 패키지 | 672-pin FineLine BGA (F672) |
| 실장 유형 | Surface Mount (BGA) |
| Speed Grade | -3X (fastest) |
| 동작 온도 | 0C to +85C (commercial) |
| Process Technology | 0.18 um CMOS, SRAM-based |
| Configuration Method | SRAM, serial/parallel, EPC support |
EP20K600CF672-3X 672-pin fineline bga (f672) 핀 구성 가이드
EP20K600CF672-3X(672-pin fineline bga (f672) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600CF672-3X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600CF672-3X 적합 용도: 6 애플리케이션s: Telecom Line-Card Processing, Network Switching Fabric Interface, High-Speed Protocol Bridging, Custom DSP Datapath Engine, PCI-Based Interface Controllers, Industrial Test and Measurement Instrumentation.
Telecom Line-Card Processing
The EP20K600CF672-3X delivers 24,480 logic elements and 508 user I/O pins, making it well suited to telecom line-card designs that integrate TDM framers, HDLC controllers, and ATM/AAL2 segmentation engines on a single device. The four on-chip PLLs enable generation of multiple clock domains (T1/E1, E3/DS3, STS-1) from a single reference oscillator, eliminating external clock-generator ICs. The 311 Kbits of embedded RAM support cell-buffer FIFOs and look-up tables for routing tables. The -3X speed grade delivers the highest Fmax in the family, critical for STS-1 / STM-0 line rates and above.
추천
Network Switching Fabric Interface
With 24,480 logic elements, 312 ESBs, and 508 I/O pins, the EP20K600CF672-3X can host a complete switching-fabric interface including MAC controllers, CAM lookup logic, queue managers, and PCI/UTOPIA system-side interfaces. The on-chip CAM blocks via the ESBs accelerate L2/L3 address lookups at wire speed. LVDS I/O support enables direct connection to serializer/deserializer (SERDES) chips for gigabit links. The 672-ball FineLine BGA provides the high pin count needed for 32-bit or 64-bit datapath connections to network processors.
추천
High-Speed Protocol Bridging
Protocol bridges such as SPI-to-PCI, UART-to-USB, or custom serial-to-parallel converters benefit from the EP20K600CF672-3X's large logic capacity and 311 Kbits of dual-port RAM, which allows buffer-based bridge designs with handshaking flow control. The -3X speed grade supports the high clock rates required for SPI peripherals running above 50 MHz and for USB 2.0 full-speed bit-stuffing logic. 508 user I/O lets the bridge expose multiple peripheral interfaces simultaneously without external mux logic.
추천
Custom DSP Datapath Engine
DSP datapath engines for baseband processing, image processing, or custom FIR/IIR filters can leverage the EP20K600CF672-3X's 24,480 logic elements and 311 Kbits of embedded memory to build high-throughput pipelined multipliers and accumulators. The four PLLs support multi-rate sample-clock generation for narrowband and wideband processing paths. The -3X speed grade provides the Fmax headroom needed for 16-bit x 16-bit multiply-accumulate pipelines at sample rates above 100 MHz. 508 user I/O accommodate wide parallel data buses to external ADC/DAC converters.
추천
PCI-Based Interface Controllers
The EP20K600CF672-3X supports the PCI 33 MHz / 66 MHz interface directly via its 5 V-tolerant I/O banks, with built-in compliance to the PCI Local Bus Specification. 24,480 logic elements easily host a PCI Target or Master controller plus DMA engine, command FIFOs, and interrupt logic. The 311 Kbits of embedded memory accommodate scatter-gather descriptor tables and DMA buffers. For multi-slot systems, the 508 user I/O support arbitration signals for multiple PCI devices. The 672-ball FineLine BGA simplifies board routing of the 32-bit PCI bus plus sideband signals.
추천
Industrial Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol analyzers, and ATE pin-electronics benefit from the EP20K600CF672-3X's logic capacity, on-chip memory, and -3X speed grade to handle real-time capture and triggering. The 311 Kbits of dual-port RAM function as deep trace buffers, while the 508 user I/O accept multiple channels of high-speed probes simultaneously. Four PLLs derive multiple internal sampling clocks from a single precision reference. The device's commercial temperature range (0C to 85C) and FineLine BGA package suit benchtop and rack-mount instrument designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K600CF672-3X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CF672-3 | EP20K600CF672-2X | EP20K600CF672-1X | EP20K600CB672C8 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 672-ball FineLine BGA (F672) | 672-ball FineLine BGA (F672) - same | 672-ball FineLine BGA (F672) - same | 672-ball FineLine BGA (F672) - same | 672-ball BGA (B672) - same family |
| Typical Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,480 | 24,480 | 24,480 | 24,480 | 24,480 |
| Maximum User I/O | 508 | 508 | 508 | 508 | 488 |
| Speed Grade | -3X (fastest) | -3 | -2X | -1X | -8 (commercial) |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (1 qty, USD) | $185 | $175-185 | $140-160 | $110-130 | $160-180 |
주요 차별점
- Highest-density APEX 20KC member at -3X speed grade (vs EP20K600CF672-2X)
- Drop-in compatibility with all F672 APEX 20K 600K variants (vs EP20K600CB672C8 (B672 package))
- Four on-chip PLLs for flexible clock synthesis (vs EP20K400FC672-3X)
설계 노트
The EP20K600CF672-3X uses a 1.0 mm-pitch 672-ball FineLine BGA, which requires a multi-layer PCB (typically 8+ layers) with microvia or via-in-pad technology to route signals out of the BGA array. Use the Altera-provided land-pattern and pin-out files as the authoritative source; do not synthesize footprints from package outline alone. Plan for at least one full reference plane layer beneath the BGA for clean power delivery to the core and I/O banks.
Provide separate decoupling for VCCINT (core), VCCIO (I/O banks), VCCP (PCI clamp), and PLL analog supplies (VCCA_PLL, VCCD_PLL). Place 0.1 uF X7R ceramic decoupling caps within 50 mils of every supply ball, and bulk capacitors (10-100 uF) at each power rail entry point. The four PLLs require isolated analog supplies with pi-filter (ferrite bead + caps) to prevent digital switching noise from coupling into PLL loops and causing jitter.
Because the APEX 20KC family uses SRAM-based configuration, the bitstream is volatile and must be reloaded at every power-up from a configuration device (EPC1, EPC2, EPC4, EPC8, EPC16) or a microprocessor. Do not assume the FPGA retains its configuration after a power cycle. For in-system reprogramming, route JTAG (TCK, TMS, TDI, TDO) to a test header or boundary-scan chain. Verify nCONFIG, nSTATUS, and CONF_DONE behavior during board bring-up to detect configuration failures early.
The 672-ball FineLine BGA package concentrates heat in a small area; estimate worst-case junction temperature from total power dissipation multiplied by theta_JA (approximately 8-12 C/W with proper PCB thermal design, depending on copper area and airflow). For sustained operation above 70 percent utilization, plan for a thermal copper pad under the BGA and possibly forced-air cooling to keep Tj below 100 C in commercial temperature range designs.
규정 준수 정보
RoHS and lead-free status depend on date code and assembly lot. Original APEX 20KC family pre-dates RoHS enforcement; later production runs and many authorized aftermarket suppliers provide RoHS-compliant parts with C-of-C documentation. AEC-Q100 not applicable to FPGAs.
