EP2A40F672C8 - 40K LE APEX II FPGA, 672-Pin BGA | Intel
MPN： EP2A40F672C8 ✗ 停產EP2A40F672C8 概覽
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-rapid-turnaround of in-system programmability. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices -> PLDs -> logic ICs -> integrated circuits, and is widely used to implement custom digital signal processing, glue logic, and high-speed interface bridging in systems that require parallelism and reconfigurability beyond what a microcontroller or DSP can offer.
Key features of the EP2A40F672C8 include up to 1.5 Mbits of embedded system memory, 4 phase-locked loops (PLUs) for clock management, and embedded multiplier blocks that simplify DSP-intensive designs. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, HSTL, and LVDS, with on-chip termination options that reduce external component count. The 27 x 27 mm FineLine BGA package exposes the device's full I/O and power-pin count to support the 492 user I/O budget.
Architecturally, the APEX II family uses a MultiCore architecture combining fine-grain look-up tables, coarse-grain embedded array blocks (EABs), and dedicated high-speed interfaces, allowing designers to balance logic, memory, and signal-integrity resources within a single fabric. The 0.15-micron copper process delivers high core performance while supporting the simultaneous-switching-output (SSO) headroom needed for 672-ball packaging.
Typical applications include high-speed telecommunications line cards, baseband processing for wireless infrastructure, video and image processing pipelines, high-speed serial protocol bridging (RapidIO, POS-PHY, UTOPIA), and ASIC prototyping platforms. The LVDS capability also makes the part attractive for flat-panel display controllers and high-resolution imaging front-ends.
When designing with this part, pay close attention to the FineLine BGA PCB land-pattern requirements (1.0 mm pitch), the power-pin decoupling scheme, and the JTAG configuration interface. The -C8 speed grade indicates a 1.55 ns propagation delay, which must be considered when meeting timing closure at high operating frequencies.
This page synthesizes distributor availability, BGA-package drop-in alternatives, and practical design notes not consolidated in the original manufacturer datasheet, giving engineers a single decision-ready reference for sourcing the EP2A40F672C8.
直接替換替代品，適用於 EP2A40F672C8 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2A40F672C8 （相同外形與佔位） — 差異在於 Package, Process Technology, Speed Grade, Operating Temperature, Logic Elements.
EP2A40F672C7
✅ 直接替換聯絡詢價
查看資料表 →EP2A40F672C7N
✅ 直接替換聯絡詢價
查看資料表 →EP2A40F672C7ES
✅ 直接替換聯絡詢價
查看資料表 →EP2A40F672C6
✅ 直接替換聯絡詢價
查看資料表 →EP2A40F672C6N
✅ 直接替換聯絡詢價
查看資料表 →EP2A40F672I8
✅ 直接替換聯絡詢價
查看資料表 →EP2A40F672C8 最大額定值與電氣特性
| Family | APEX II |
| Logic Family | CMOS |
| Typical Logic Elements (LEs) | 40,000 |
| Embedded Memory | Up to 1.5 Mbits |
| User I/Os | 492 pins |
| 腳位數 | 672 |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers |
| Propagation Delay (speed grade C8) | 1.55 ns |
| 工作溫度 | 0 C to 85 C (commercial) |
| Phase-Locked Loops (PLLs) | 4 |
| LVDS Signaling Support | Up to 1 Gbps |
| Multipliers | Embedded multiplier blocks |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |
| 安裝類型 | Surface Mount (BGA) |
EP2A40F672C8 腳位配置
| 腳位 A1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 B1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 C1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 D1 | GND — Ground |
| 腳位 E1 | VCCIO1 — I/O bank 1 supply voltage |
| 腳位 F1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 G1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 H1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 J1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 K1 | GND — Ground |
| 腳位 L1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 M1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 N1 | VCCINT — Core supply voltage (1.5 V nominal) |
| 腳位 P1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 R1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 T1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 U1 | GND — Ground |
| 腳位 V1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 W1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 Y1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AA1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AB1 | GND — Ground |
| 腳位 AC1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AD1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AE1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AF1 | VCCIO1 — I/O bank 1 supply voltage |
| 腳位 AG1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AH1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AJ1 | GND — Ground |
| 腳位 AK1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AL1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AM1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AN1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AP1 | VCCINT — Core supply voltage (1.5 V nominal) |
| 腳位 AR1 | GND — Ground |
| 腳位 AT1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AU1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AV1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AW1 | I/O — General-purpose user I/O (bank 1) |
| 腳位 AY1 | GND — Ground |
典型應用
EP2A40F672C8 適用於 6 應用s: Telecommunications Line Cards, Wireless Baseband Processing, Video and Image Processing Pipelines, High-Speed Protocol Bridging, ASIC Prototyping and Emulation, Industrial Control and Factory Automation.
Telecommunications Line Cards
The EP2A40F672C8 is well suited to high-density telecommunications line-card designs requiring up to 492 user I/Os and 1.55 ns propagation delay (C8 speed grade) for serial-parallel aggregation. Its LVDS capability at up to 1 Gbps and embedded multiplier blocks let designers implement UTOPIA, POS-PHY, and RapidIO bridging logic alongside forward-error-correction engines on a single die, reducing bill-of-materials cost versus multi-chip ASIC solutions.
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Wireless Baseband Processing
With 40,000 logic elements and embedded multiplier blocks, the EP2A40F672C8 fits wireless baseband processing chains for 3G/4G remote-radio-head and small-cell platforms. The 4 on-chip PLLs allow multiple baseband clocks to be synthesized cleanly without external clock generators, while 1.5 Mbits of embedded memory buffers IQ samples between pipeline stages. The 672-ball FineLine BGA package accommodates the high I/O density required for antenna-interface digital front-ends.
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Video and Image Processing Pipelines
The 40K logic elements plus dual-port embedded memory of the EP2A40F672C8 enable parallel pixel-pipeline processing for high-resolution video and image processing at rates up to 1 Gbps LVDS. Engineers can implement multi-tap filters, color-space converters, and frame-rate conversion stages in a single fabric, with 4 PLLs generating pixel clocks, memory-controller clocks, and serialization clocks from a single reference input. The 492 user I/Os comfortably host 24-bit RGB plus control channels.
推薦
High-Speed Protocol Bridging
The EP2A40F672C8 is widely deployed as a bridge between legacy parallel protocols and modern high-speed serial interfaces. Its MultiCore architecture lets engineers implement multi-protocol bridges (PCI to RapidIO, UTOPIA to SPI, GMII to SGMII) concurrently, while the LVDS I/O supports direct attachment to serializer/deserializer parts. The 1.55 ns propagation delay (C8 grade) is acceptable for most bridge applications below 200 MHz parallel.
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ASIC Prototyping and Emulation
Engineers use the EP2A40F672C8 for ASIC prototyping because its 40K logic elements, 1.5 Mbits of SRAM, and 672-ball BGA footprint let designers partition large ASICs across multiple FPGAs with deterministic inter-tile timing. The -C8 speed grade delivers 1.55 ns intra-FPGA delay which simplifies static-timing analysis during ASIC-to-FPGA prototype bring-up. The part is fully supported by Quartus II design tools, which generate synthesis, place-and-route, and configuration bitstreams.
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Industrial Control and Factory Automation
The EP2A40F672C8 is also used in industrial control platforms where its 40K logic elements implement motor-control, sensor-fusion, and deterministic networking logic on a single fabric. The commercial 0-85 C operating range covers most cabinet-mounted installations, while the industrial -I8 variant extends coverage to -40 C to 100 C for outdoor and harsh-environment deployment. The 4 on-chip PLLs synchronize multiple motor-control axes without external clock ICs.
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推薦產品摘要
工程參考資料，適用於 EP2A40F672C8 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2A40F672C7 | EP2A40F672C7N | EP2A40F672C7ES | EP2A40F672C6 | EP2A40F672C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same |
| Logic Elements | 40,000 typical | 40,000 typical (same die) | 40,000 typical (same die) | 40,000 typical (same die) | 40,000 typical (same die) | 40,000 typical (same die) |
| Speed Grade | C8 (1.55 ns propagation delay) | C7 (approx. 15% faster) | C7 (approx. 15% faster) | C7 ES qualification | C6 (approx. 25% faster) | C6 (approx. 25% faster) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| User I/O Count | 492 pins | 492 pins (same) | 492 pins (same) | 492 pins (same) | 492 pins (same) | 492 pins (same) |
| Embedded Memory | Up to 1.5 Mbits | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) |
主要差異化特點
- Widest commercial availability at -C8 speed grade (對比EP2A40F672C7)
- Lower unit cost at qty-1 because of abundant aftermarket supply (對比EP2A40F672C6)
- Commercial temperature grade with no industrial premium (對比EP2A40F672I8)
設計說明
The 672-ball FineLine BGA with 1.0 mm pitch requires a PCB with laser-drilled microvias and via-in-pad construction. Use a 4-metal-layer stack-up minimum (signal, ground, power, signal) with the BGA escape routed on inner layers. Per Altera AN-114 (BGA breakout methodology), keep the first via-in-pad within 0.5 mm of the BGA ball pad to minimize parasitic inductance and maintain SI margins on LVDS channels.
Decouple VCCINT (1.5 V core) and VCCIO (bank-dependent I/O) with high-quality low-ESR ceramics placed as close as possible to each ball. Per the APEX II datasheet, the core current can exceed 3 A during configuration, so use a 4-layer power plane with bulk decoupling capacitors (typically 470 uF aluminum-polymer) within 25 mm of the BGA. Estimated: at full logic utilization and 100 MHz operation, expect VCCINT current draw around 2.5 A and VCCIO current near 1 A per active bank.
Do not confuse EP2A40 (APEX II family, 40K LE) with EP2A25 (APEX II 25K LE) or EP20K40 (APEX 20K family). The packages and ball-maps differ significantly. Always verify the die family by the EP2A prefix (APEX II, 1.5 V core) versus EP20K prefix (APEX 20K, 1.8 V core) before drop-in substitution. Voltage levels are not interchangeable.
合規資訊
RoHS / lead-free status of the EP2A40F672C8 depends on the specific date code and ball finish. The N-suffix variants (C7N, C6N) are documented as Pb-free; the base C8 typically ships with SnPb balls. Confirm compliance with the actual distributor lot before committing to a production build.
