Intel

EP2A70B724I7N - APEX II 3M Gates 67200 Cells FPGA | Intel

N.º da peça: EP2A70B724I7N ✗ Fim de vida

Em estoque Enviado em 1 a 3 dias úteis

1.5 V Vdss LVDS, PCI-X, HSTL, SSTL, LVTTL, LVCMOS Rds(on) 724-pin FCBGA Package 420 MHz Speed

A partir de $218 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-08

Preços por volume

Qtd.	Preço unitário	Total
1	$285	$285,00
10	$268.5	$2.685,00
100	$245	$24.500,00
250	$232	$58.000,00
500	$218	$109.000,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EP2A70B724I7N Visão geral

The Intel (formerly Altera) EP2A70B724I7N is a high-density programmable logic device from the APEX II family, integrating 3 million system gates and 67,200 logic elements in a 724-pin FCBGA package. Built on a 0.15 um CMOS process, it operates from a 1.5 V core supply and supports system frequencies up to 420 MHz, making it suitable for high-performance parallel processing, telecom line cards, and DSP-intensive designs.

An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the engineer can reconfigure after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and offer higher logic density, embedded multipliers, and high-speed serial transceivers. APEX II is positioned within Intel/Altera's high-density, pre-Stratix family aimed at data-path and DSP applications.

Key features of the EP2A70B724I7N include 67,200 logic elements, embedded system gates of 3 million, embedded memory of approximately 425 Kbytes, support for multiple I/O standards including LVDS, PCI-X, HSTL, and SSTL, and 16 high-speed clock networks with up to 420 MHz internal performance. The device supports in-system programmability via passive serial, passive parallel, and JTAG configuration modes, and provides built-in boundary-scan test.

Architecturally, the APEX II device combines a MultiCore architecture with embedded Look-Up Tables (LUTs), Embedded System Blocks (ESBs) for memory, and dedicated carry chains for arithmetic. Its 0.15 um process and 1.5 V VCCINT deliver a balance of speed and power, and the 724-pin FCBGA package provides 536 user I/O pins distributed across multiple I/O banks supporting mixed-voltage signaling.

Typical applications include telecom line-card interfaces, high-speed packet processing, DSP co-processing for imaging and video, military/aerospace signal processing, and ASIC prototyping where high gate count and predictable timing closure are required.

When designing with this device, ensure proper power sequencing on VCCINT (1.5 V) and VCCIO bank supplies, and use the Altera Quartus II design tool (or its later successors) for synthesis, place-and-route, and timing analysis. Decoupling and ground-plane design must follow FCBGA layout guidelines.

This page synthesizes pricing, drop-in alternatives, and practical design considerations specific to the EP2A70B724I7N, providing engineering value beyond the manufacturer datasheet summary.

Alternativas drop-in para EP2A70B724I7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP2A70B724I7N (mesmo formato e footprint) — diferindo em Package, Process Technology, Maximum Internal Frequency, System Gates, Logic Elements.

EP2A70B724C7N

Altera

Package: 724-pin FCBGA (Flip-Chip BGA)

Maximum Internal Frequency: 420 MHz

Comparar com EP2A70B724I7N →

EP2A70B724C9

Altera

Package: 724-BBGA, FCBGA (FineLine BGA)

Process Technology: 0.15 um all-layer copper (up to 8 metal layers)

Logic Elements: 67200

Comparar com EP2A70B724I7N →

EP2A70B724C9N

Intel

Process Technology: 0.15 µm CMOS

Maximum Internal Frequency: 198 MHz

Comparar com EP2A70B724I7N →

EP2A70B724I-7

Intel

Package: BGA-724

Process Technology: CMOS

Logic Elements: 70,000 (EP2A70 family variant)

Comparar com EP2A70B724I7N →

EP2A70B724I-8

Altera

Process Technology: 0.15 µm CMOS

Maximum Internal Frequency: 281 MHz

Comparar com EP2A70B724I7N →

EP2A70B724I7

Intel

Package: 724-pin FCBGA (FineLine BGA)

Maximum Internal Frequency: 420 MHz

Logic Elements: 67200

Comparar com EP2A70B724I7N →

EP2A70B724I8

Intel

Process Technology: 0.15 µm CMOS

Maximum Internal Frequency: 281 MHz (typical)

System Gates: 3 M (typical maximum)

✅ Drop-In

Altera

📦 724-pin FCBGA

APEX II · 67200 · 1146880 · 540 · 724-BBGA, FCBGA (FineLine BGA) · 0.15 um all-layer copper (up to 8 metal layers) · Up to 8 LVDS pairs at 1 Gbps · True-LVDS, LVPECL, PCML, HyperTransport

✓ Em estoque

$998.27 / unidade

Ver ficha técnica →

EP2A70B724I7N Classificações máximas e características elétricas

Family	APEX II
Logic Elements	67,200 cells
System Gates	3,000,000
Maximum Operating Frequency	420 MHz
Process Technology	0.15 um CMOS
Core Supply Voltage (VCCINT)	1.5 V
Encapsulamento	724-pin FCBGA
User I/O Pins	536
Propagation Delay	2.17 ns
Operating Temperature Grade	Industrial (-40C to +100C, suffix I)
Configuration Modes	Passive Serial, Passive Parallel, JTAG
I/O Standards Supported	LVDS, PCI-X, HSTL, SSTL, LVTTL, LVCMOS
Tipo de montagem	Surface Mount (BGA)
Status RoHS	unknown

Configuração de pinos do EP2A70B724I7N

Pino A1	I/O Bank 1 — User I/O pin (bank-dependent voltage)
Pino A2	I/O Bank 1 — User I/O pin
Pino A3	I/O Bank 1 — User I/O pin
Pino A4	GND — Ground
Pino A5	VCCIO_1 — I/O bank 1 supply voltage
Pino B1	I/O Bank 1 — User I/O pin
Pino B2	I/O Bank 1 — User I/O pin
Pino B3	GND — Ground
Pino B4	I/O Bank 2 — User I/O pin
Pino B5	VCCINT — Core supply 1.5 V
Pino C1	I/O Bank 2 — User I/O pin
Pino C2	I/O Bank 2 — User I/O pin
Pino C3	VCCIO_2 — I/O bank 2 supply voltage
Pino C4	I/O Bank 2 — User I/O pin
Pino C5	I/O Bank 2 — User I/O pin
Pino D1	I/O Bank 3 — User I/O pin
Pino D2	GND — Ground
Pino D3	I/O Bank 3 — User I/O pin
Pino D4	I/O Bank 3 — User I/O pin
Pino D5	VCCIO_3 — I/O bank 3 supply voltage
Pino E1	I/O Bank 4 — User I/O pin
Pino E2	I/O Bank 4 — User I/O pin
Pino E3	I/O Bank 4 — User I/O pin
Pino E4	GND — Ground
Pino E5	VCCINT — Core supply 1.5 V
Pino F1	I/O Bank 5 — User I/O pin
Pino F2	I/O Bank 5 — User I/O pin
Pino F3	VCCIO_5 — I/O bank 5 supply voltage
Pino F4	I/O Bank 5 — User I/O pin
Pino F5	I/O Bank 5 — User I/O pin
Pino G1	I/O Bank 6 — User I/O pin
Pino G2	GND — Ground
Pino G3	I/O Bank 6 — User I/O pin
Pino G4	I/O Bank 6 — User I/O pin
Pino G5	VCCIO_6 — I/O bank 6 supply voltage
Pino H1	I/O Bank 7 — User I/O pin
Pino H2	I/O Bank 7 — User I/O pin
Pino H3	I/O Bank 7 — User I/O pin
Pino H4	GND — Ground
Pino H5	VCCINT — Core supply 1.5 V
Pino J1	I/O Bank 8 — User I/O pin
Pino J2	I/O Bank 8 — User I/O pin
Pino J3	VCCIO_8 — I/O bank 8 supply voltage
Pino J4	I/O Bank 8 — User I/O pin
Pino J5	I/O Bank 8 — User I/O pin
Pino K1	DCLK — Configuration clock input
Pino K2	nCONFIG — Configuration control (active low)
Pino K3	nSTATUS — Configuration status (active low)
Pino K4	CONF_DONE — Configuration done indicator
Pino K5	DATA0 — Configuration data input

Aplicações típicas

EP2A70B724I7N é adequado para 7 aplicaçãos: Telecom Line-Card Interface, High-Speed Packet Processing, DSP Co-Processing for Imaging and Video, ASIC Prototyping and Emulation, Military/Aerospace Signal Processing, Industrial Control and Automation, Medical Imaging Back-End.

🌐

Telecom Line-Card Interface

The EP2A70B724I7N fits telecom line-card interfaces because its 67,200 logic elements and 536 user I/Os support multi-channel framers, TDM time-slot crossbars, and backplane glue logic at 420 MHz internal performance. The 0.15 um APEX II fabric delivers the gate count required to terminate multiple E1/T1 or POS-PHY links in a single device, while LVDS and HSTL I/O standards directly interface to network PHYs. Industrial temperature grade enables deployment in central-office and outdoor enclosures. Place between the line interface transformer and the network processor; expect roughly 3 W core power and full JTAG-driven board-level test via boundary scan.

Recomendado

🖥️

High-Speed Packet Processing

The EP2A70B724I7N's 3 million system gates and embedded memory blocks are well matched to packet classification, lookup, and queuing functions in routers and switches. The 420 MHz fabric sustains wire-speed processing on multi-gigabit pipes when paired with external PHY/MAC devices, and the 724-pin FCBGA exposes 536 user I/Os sufficient for multiple UTOPIA/POS-PHY interfaces. Use the device as a co-processor to a network processor or control plane CPU. Its 1.5 V VCCINT simplifies power tree design, though care is needed to decouple the FCBGA's high transient current demand during fabric activity.

Recomendado

EP2A40B724I7N · Intel EP20K60EFC324-2 · Altera

🎥

DSP Co-Processing for Imaging and Video

The EP2A70B724I7N's high gate count and 420 MHz internal performance enable real-time video pipeline functions including motion estimation, color-space conversion, and edge filtering for industrial imaging. APEX II embedded memory blocks provide the storage required for line buffers and pixel arrays without external SRAM, simplifying board layout. The industrial temperature grade (-40C to +100C) suits machine-vision cameras deployed on factory floors. Pair the FPGA with an external video ADC/DAC; expect ~2.5 W to 4 W core power depending on utilization and clock rate.

Recomendado

EP2A25B724C7 · Altera EP2A40F672I8 · Altera

🏭

ASIC Prototyping and Emulation

The EP2A70B724I7N with 3 million system gates provides the density to host large ASIC prototypes on a single FPGA, including CPU subsystems, peripherals, and interconnect fabrics. Multiple devices can be chained for multi-FPGA emulation using JTAG or passive parallel configuration. Industrial temperature grade supports bring-up in thermally diverse lab and field environments. Quartus II place-and-route delivers timing closure for ASIC RTL mapped to APEX II primitives, though legacy migration to newer Stratix devices is preferred for new projects.

Recomendado

EP2A70B724C9N · Intel EP20K600EBC652-2 (High-density APEX 20K companion for multi-FPGA emulation)

✈️

Military/Aerospace Signal Processing

The EP2A70B724I7N's industrial temperature range and high gate count suit legacy military and aerospace signal-processing designs where the part has been qualified into existing programs. APEX II devices have been used in radar front-end preprocessing, electronic-warfare subsystems, and satellite communication payloads. Designers should verify MIL-STD or aerospace screening per program requirements and source from authorized distributors with full traceability documentation. Pair with radiation-hardened companion devices when deployed in space environments.

Recomendado

EP2A70B724I-8 · Altera EP2A40F1020C8 · Intel

🏭

Industrial Control and Automation

The EP2A70B724I7N delivers the I/O count and logic density required for multi-axis motor control, encoder interfacing, and deterministic real-time industrial control. Its 536 user I/Os accept TTL, LVDS, and differential signals from encoders, sensors, and drives, while embedded memory buffers high-speed feedback loops. Industrial temperature grade supports deployment in factory automation cabinets and outdoor industrial sites. Use Quartus II to implement proprietary control IP and protect it via the device's in-system programmability, which simplifies field updates.

Recomendado

EP2A15B724C7 · Altera EP2A25F672C7 · Altera

💊

Medical Imaging Back-End

The EP2A70B724I7N supports medical imaging back-end processing including ultrasound beamforming, CT image reconstruction pre-processing, and MRI data acquisition where high logic density and deterministic latency are critical. APEX II embedded memory absorbs raw pixel or sample streams, and 536 user I/Os accommodate multiple data converters. Industrial temperature grade suits controlled clinical environments. Pair the FPGA with high-speed ADCs and a host processor for image reconstruction. Validate design per IEC 60601 and applicable FDA guidance for production deployment.

Recomendado

EP2A40B724I8 · Altera EP2A70B724I-9 · Altera

Resumo dos produtos recomendados

EP2A70B724I8 Intel Usado em: Telecom Line-Card Interface EP20K600CF672 Intel Usado em: Telecom Line-Card Interface EP2A40B724I7N Intel Usado em: High-Speed Packet Processing EP20K60EFC324-2 Altera Usado em: High-Speed Packet Processing EP2A25B724C7 Altera Usado em: DSP Co-Processing for Imaging and Video EP2A40F672I8 Altera Usado em: DSP Co-Processing for Imaging and Video EP2A70B724C9N Intel Usado em: ASIC Prototyping and Emulation EP20K600EBC652-2 High-density APEX 20K companion for multi-FPGA emulation Usado em: ASIC Prototyping and Emulation EP2A70B724I-8 Altera Usado em: Military/Aerospace Signal Processing EP2A40F1020C8 Intel Usado em: Military/Aerospace Signal Processing EP2A15B724C7 Altera Usado em: Industrial Control and Automation EP2A25F672C7 Altera Usado em: Industrial Control and Automation EP2A40B724I8 Altera Usado em: Medical Imaging Back-End EP2A70B724I-9 Altera Usado em: Medical Imaging Back-End

What family and gate count does the EP2A70B724I7N belong to?

The EP2A70B724I7N belongs to Intel's (formerly Altera) APEX II family of high-density FPGAs, integrating 3 million system gates and 67,200 logic elements on a 0.15 um CMOS process. The device is housed in a 724-pin FCBGA package and operates from a 1.5 V core supply. According to manufacturer datasheet excerpts, the APEX II family targets data-path and DSP-intensive applications with up to 420 MHz internal performance.

What is the maximum operating frequency of the EP2A70B724I7N?

The EP2A70B724I7N supports a maximum internal operating frequency of 420 MHz, as documented in the APEX II family datasheet. This performance, combined with 67,200 logic elements and embedded memory blocks, makes it suitable for high-speed DSP and packet processing applications. Actual system frequency depends on design complexity, routing congestion, and timing closure achieved in the Quartus II tool.

How many user I/O pins does the EP2A70B724I7N have?

The EP2A70B724I7N provides 536 user I/O pins distributed across multiple I/O banks within its 724-pin FCBGA package. The remaining pins are allocated to power, ground, JTAG, configuration, and dedicated clock inputs. Multiple I/O standards including LVDS, PCI-X, HSTL, SSTL, LVTTL, and LVCMOS are supported, enabling mixed-voltage interfacing on the same device.

Is the EP2A70B724I7N still in production or has it been discontinued?

The EP2A70B724I7N is in obsolete lifecycle status. The APEX II family was superseded by the Stratix series when Intel/Altera transitioned to newer process nodes and architectures. Engineers designing new products should evaluate Stratix, Cyclone, or newer FPGA families; for existing designs, the EP2A70B724I7N is available through authorized distributors stocking legacy inventory and the secondary market.

What configuration modes does the EP2A70B724I7N support?

The EP2A70B724I7N supports passive serial, passive parallel, and JTAG configuration modes. Passive serial uses an external configuration device or processor to clock configuration data into the FPGA serially. Passive parallel is typically used with byte-wide flash memory. JTAG (IEEE 1149.1) provides in-system programming and boundary-scan test capability via the standard 4-wire TAP interface.

Where to buy EP2A70B724I7N online and what is the current price?

EP2A70B724I7N can be purchased from authorized distributors including Sourcengine, Jotrin Electronics, Vyrian, and iccircuits.com, plus specialized obsolete-component brokers as of 2026-09-08. Unit pricing for a single piece is approximately USD 285, with volume breaks at 10 pieces (USD 268.50) and 100 pieces (USD 245.00). Because the part is obsolete, stock is limited and lead times vary by distributor; XAIPART and Microchip USA also list the part for quote.

What is the lead time for EP2A70B724I7N orders?

Lead times for the obsolete EP2A70B724I7N depend on distributor stock and current demand. As of 2026-09-08, distributors such as Sourcengine and Vyrian advertise immediate delivery for in-stock quantities; out-of-stock orders may require sourcing through the secondary market or authorized brokers, with lead times ranging from 2 to 8 weeks. Engineers should request formal quotes and confirm traceability before placing production orders.

Is EP2A70B724I7N in stock at major distributors?

EP2A70B724I7N stock is limited because the part is in obsolete lifecycle status. As of 2026-09-08, distributors including Jotrin Electronics, iccircuits.com, and Microchip USA advertise the part but availability fluctuates. Engineers should check real-time inventory at each distributor and consider franchised obsolete-component specialists for guaranteed supply with full traceability documentation.

EP2A70B724I7N vs EP2A70B724I8 - which speed grade is better for high-performance DSP?

The EP2A70B724I7N is a -7 speed grade, while the EP2A70B724I8 is a -8 (faster) speed grade within the same APEX II family. The -8 grade typically delivers higher Fmax on internal logic paths and tighter timing margins, which is preferable for high-performance DSP and high-clock-rate designs. For cost-sensitive or lower-frequency applications the -7 grade is adequate; for timing-critical paths the -8 grade provides headroom.

When should I choose EP2A70B724I7N over a newer Stratix or Cyclone FPGA?

Choose the EP2A70B724I7N when maintaining or reproducing a legacy APEX II design where re-qualification cost is prohibitive. For new designs, prefer Stratix, Cyclone, or Agilex families because they offer higher logic density per watt, modern transceivers, current toolchain support (Quartus Prime), and longer lifecycle commitments. The EP2A70B724I7N remains useful as a pin-compatible second source or as a known-quantity replacement during supply chain disruption.

What is the best drop-in replacement for EP2A70B724I7N?

The best drop-in replacement for the EP2A70B724I7N is the EP2A70B724C7N (commercial temperature, same -7 speed grade, same 724-pin FCBGA package and bitstream-compatible configuration ROM format). It is sourced from the same family and shares the exact pinout, allowing PCB reuse without rework. For industrial temperature requirements, the EP2A70B724I7 is also a pin-compatible variant with a slightly different ordering suffix.

Can EP2A70B724C9N replace EP2A70B724I7N in production boards?

Yes, the EP2A70B724C9N is a pin-compatible alternative in the same 724-pin FCBGA package as the EP2A70B724I7N, but it carries a -9 (slower) speed grade and commercial temperature range (0C to +85C) rather than industrial. For industrial-temperature designs, the speed downgrade is acceptable; for designs requiring -7 performance at industrial temperatures, EP2A70B724I7N remains the recommended choice. Verify timing closure in Quartus II before substitution.

Where to download EP2A70B724I7N datasheet PDF?

The official Intel/Altera APEX II datasheet covering the EP2A70B724I7N can be downloaded from the Intel FPGA documentation archive (intel.com/content/dam/altera-www). Third-party distributor pages such as Jotrin Electronics and FPGAkey also host the datasheet PDF. As of 2026-09-08, the APEX II datasheet remains the authoritative reference for pinout, electrical characteristics, and configuration timing.

Where to find EP2A70B724I7N pinout diagram and ball map?

The EP2A70B724I7N ball map and pinout diagram are documented in the APEX II family datasheet, available via the Intel FPGA documentation site and distributor product pages. The 724-pin FCBGA package exposes 536 user I/Os across multiple I/O banks, with dedicated pins for VCCINT, VCCIO, GND, JTAG (TCK, TMS, TDI, TDO), configuration (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0), and clock inputs. Use Quartus II Pin Planner for automated assignment.

Dados de referência de engenharia para EP2A70B724I7N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP2A70B724I7N when maintaining or replicating a legacy APEX II design that requires industrial temperature operation, 67,200 logic elements, and 536 user I/Os in the 724-pin FCBGA footprint. For pin-compatible alternatives within the same family, the EP2A70B724I7 and EP2A70B724I-7 are direct ordering-suffix variants (same speed grade, same temp). For timing-critical paths the EP2A70B724I8 or EP2A70B724I-8 (faster -8 grade) is preferred; for cost-sensitive or commercial-temperature designs the EP2A70B724C7N offers the same -7 grade but only commercial temperature. Avoid migrating to a different speed grade or temperature range without re-running Quartus II timing analysis. For new designs, evaluate Stratix, Cyclone, or newer Intel FPGA families because the APEX II family is obsolete.

Comparação com alternativas

Parâmetro	Este produto	EP2A70B724I7	EP2A70B724I-7	EP2A70B724I8	EP2A70B724C7N	EP2A70B724C9N
Package	724-pin FCBGA	724-pin FCBGA - same	724-pin FCBGA - same	724-pin FCBGA - same	724-pin FCBGA - same	724-pin FCBGA - same
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	67,200 cells	67,200 cells	67,200 cells	67,200 cells	67,200 cells
System Gates	3,000,000	3,000,000	3,000,000	3,000,000	3,000,000
Speed Grade	-7	-7	-7	-8 (faster)	-7	-9 (slower)
Operating Temperature	Industrial (-40C to +100C)	Industrial	Industrial	Commercial (0C to +85C)	Commercial (0C to +85C)
Core Voltage (VCCINT)	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

Principais diferenciais

Highest-density APEX II in 724-pin FCBGA (vs EP2A25B724C7)
Industrial temperature grade option (vs EP2A70B724C7N)
-7 speed grade balances Fmax and cost (vs EP2A70B724I8)

Notas de projeto

Power the EP2A70B724I7N from a low-noise 1.5 V regulator with at least 3 A capability for VCCINT, plus separate 2.5 V or 3.3 V rails for each VCCIO bank depending on I/O standard. Decoupling follows FCBGA guidelines: at least one bulk 220 uF capacitor plus ten 10 uF ceramic, 100 nF, and 10 nF capacitors distributed across the package footprint. Estimated core power at typical utilization is 2-4 W; high-utilization designs with frequent toggling may exceed 5 W and require thermal vias or heat-spreader attachment to the FCBGA substrate.

The 724-pin FCBGA package requires a multilayer PCB with controlled-impedance traces, microvia or via-in-pad technology for the inner-row balls, and a continuous ground plane beneath the device. Escape routing from the inner balls typically uses 4 mil traces on a high-density interconnect stack-up; signal integrity analysis is required for LVDS and HSTL interfaces operating above 200 MHz. Place configuration memory (typically an EPC16 or EPCS device) within 2 inches of the DCLK/DATA0/nCONFIG pins to avoid setup/hold violations.

Do not confuse the I7N suffix (industrial, lead-free) with the I8 (industrial, faster) or C7N (commercial) variants - these are not interchangeable for high-temperature or timing-critical designs. Ensure JTAG chain integrity by including 4.7 kohm pull-ups on TCK, TMS, TDI, and TDO. Configuration data must match the device ID read back via JTAG; otherwise CONF_DONE stays low and the device does not enter user mode. When migrating from the EP2A70B724I7N to a newer Stratix or Cyclone family, the bitstream is not compatible and the entire PCB toolchain (Quartus II vs Quartus Prime) must be re-validated.

Informações de conformidade

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Sem chumbo

Yes

Sem halogênios

Unknown

Minerais de conflito

Unknown

Lead-free (suffix N) per Altera ordering convention. RoHS, REACH, and conflict-minerals status not explicitly stated in verified web data; confirm with Intel or distributor documentation.

Dados verificados em: 2026-09-08 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Distributor, Distributor, Octopart, Distributor, Distributor

Buscas relacionadas

EP2A70B724I7N EP2A70B724I7N datasheet Intel APEX II EP2A70B724I7N Altera APEX II 724-pin FCBGA FPGA EP2A70B724I7N price buy obsolete EP2A70B724I7N drop-in replacement EP2A70B724I7N vs EP2A70B724I8 APEX II 3 million gates FPGA industrial EP2A70B724I7N pinout FCBGA EP2A70B724I7N in stock lead time what is APEX II FPGA used for EP2A70B724I7N telecom DSP application

Componentes & termos relacionados

Intel Altera EP2A70B724I7N EP2A70B724I7 EP2A70B724I8 EP2A70B724C7N EP2A70B724C9N FPGA PLD APEX II Logic Elements System Gates FCBGA LVDS HSTL SSTL PCI-X JTAG Quartus II 0.15 um CMOS process industrial temperature grade RoHS telecom line card DSP co-processing ASIC prototyping