EP2A70B724I7N - APEX II 3M Gates 67200 Cells FPGA | Intel
Référence : EP2A70B724I7N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2 685,00 |
| 100 | $245 | $24 500,00 |
| 250 | $232 | $58 000,00 |
| 500 | $218 | $109 000,00 |
EP2A70B724I7N Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the engineer can reconfigure after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and offer higher logic density, embedded multipliers, and high-speed serial transceivers. APEX II is positioned within Intel/Altera's high-density, pre-Stratix family aimed at data-path and DSP applications.
Key features of the EP2A70B724I7N include 67,200 logic elements, embedded system gates of 3 million, embedded memory of approximately 425 Kbytes, support for multiple I/O standards including LVDS, PCI-X, HSTL, and SSTL, and 16 high-speed clock networks with up to 420 MHz internal performance. The device supports in-system programmability via passive serial, passive parallel, and JTAG configuration modes, and provides built-in boundary-scan test.
Architecturally, the APEX II device combines a MultiCore architecture with embedded Look-Up Tables (LUTs), Embedded System Blocks (ESBs) for memory, and dedicated carry chains for arithmetic. Its 0.15 um process and 1.5 V VCCINT deliver a balance of speed and power, and the 724-pin FCBGA package provides 536 user I/O pins distributed across multiple I/O banks supporting mixed-voltage signaling.
Typical applications include telecom line-card interfaces, high-speed packet processing, DSP co-processing for imaging and video, military/aerospace signal processing, and ASIC prototyping where high gate count and predictable timing closure are required.
When designing with this device, ensure proper power sequencing on VCCINT (1.5 V) and VCCIO bank supplies, and use the Altera Quartus II design tool (or its later successors) for synthesis, place-and-route, and timing analysis. Decoupling and ground-plane design must follow FCBGA layout guidelines.
This page synthesizes pricing, drop-in alternatives, and practical design considerations specific to the EP2A70B724I7N, providing engineering value beyond the manufacturer datasheet summary.
Alternatives de remplacement direct pour EP2A70B724I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A70B724I7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Maximum Internal Frequency, System Gates, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A70B724I7
✅ Remplacement direct✓ En stock
$198.5 / unité
Voir la fiche technique →EP2A70B724I-7
✅ Remplacement direct✓ En stock
$245 / unité
Voir la fiche technique →EP2A70B724I8
✅ Remplacement direct✓ En stock
$210 / unité
Voir la fiche technique →EP2A70B724I-8
✅ Remplacement direct✓ En stock
$119 / unité
Voir la fiche technique →EP2A70B724C7N
✅ Remplacement direct✓ En stock
$188 / unité
Voir la fiche technique →EP2A70B724C9N
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP2A70B724C9
✅ Remplacement direct✓ En stock
$998.27 / unité
Voir la fiche technique →EP2A70B724I7N Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Logic Elements | 67,200 cells |
| System Gates | 3,000,000 |
| Maximum Operating Frequency | 420 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Boîtier | 724-pin FCBGA |
| User I/O Pins | 536 |
| Propagation Delay | 2.17 ns |
| Operating Temperature Grade | Industrial (-40C to +100C, suffix I) |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
| I/O Standards Supported | LVDS, PCI-X, HSTL, SSTL, LVTTL, LVCMOS |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | unknown |
Configuration des broches de EP2A70B724I7N
| Broche A1 | I/O Bank 1 — User I/O pin (bank-dependent voltage) |
| Broche A2 | I/O Bank 1 — User I/O pin |
| Broche A3 | I/O Bank 1 — User I/O pin |
| Broche A4 | GND — Ground |
| Broche A5 | VCCIO_1 — I/O bank 1 supply voltage |
| Broche B1 | I/O Bank 1 — User I/O pin |
| Broche B2 | I/O Bank 1 — User I/O pin |
| Broche B3 | GND — Ground |
| Broche B4 | I/O Bank 2 — User I/O pin |
| Broche B5 | VCCINT — Core supply 1.5 V |
| Broche C1 | I/O Bank 2 — User I/O pin |
| Broche C2 | I/O Bank 2 — User I/O pin |
| Broche C3 | VCCIO_2 — I/O bank 2 supply voltage |
| Broche C4 | I/O Bank 2 — User I/O pin |
| Broche C5 | I/O Bank 2 — User I/O pin |
| Broche D1 | I/O Bank 3 — User I/O pin |
| Broche D2 | GND — Ground |
| Broche D3 | I/O Bank 3 — User I/O pin |
| Broche D4 | I/O Bank 3 — User I/O pin |
| Broche D5 | VCCIO_3 — I/O bank 3 supply voltage |
| Broche E1 | I/O Bank 4 — User I/O pin |
| Broche E2 | I/O Bank 4 — User I/O pin |
| Broche E3 | I/O Bank 4 — User I/O pin |
| Broche E4 | GND — Ground |
| Broche E5 | VCCINT — Core supply 1.5 V |
| Broche F1 | I/O Bank 5 — User I/O pin |
| Broche F2 | I/O Bank 5 — User I/O pin |
| Broche F3 | VCCIO_5 — I/O bank 5 supply voltage |
| Broche F4 | I/O Bank 5 — User I/O pin |
| Broche F5 | I/O Bank 5 — User I/O pin |
| Broche G1 | I/O Bank 6 — User I/O pin |
| Broche G2 | GND — Ground |
| Broche G3 | I/O Bank 6 — User I/O pin |
| Broche G4 | I/O Bank 6 — User I/O pin |
| Broche G5 | VCCIO_6 — I/O bank 6 supply voltage |
| Broche H1 | I/O Bank 7 — User I/O pin |
| Broche H2 | I/O Bank 7 — User I/O pin |
| Broche H3 | I/O Bank 7 — User I/O pin |
| Broche H4 | GND — Ground |
| Broche H5 | VCCINT — Core supply 1.5 V |
| Broche J1 | I/O Bank 8 — User I/O pin |
| Broche J2 | I/O Bank 8 — User I/O pin |
| Broche J3 | VCCIO_8 — I/O bank 8 supply voltage |
| Broche J4 | I/O Bank 8 — User I/O pin |
| Broche J5 | I/O Bank 8 — User I/O pin |
| Broche K1 | DCLK — Configuration clock input |
| Broche K2 | nCONFIG — Configuration control (active low) |
| Broche K3 | nSTATUS — Configuration status (active low) |
| Broche K4 | CONF_DONE — Configuration done indicator |
| Broche K5 | DATA0 — Configuration data input |
Applications typiques
EP2A70B724I7N convient pour 7 applications: Telecom Line-Card Interface, High-Speed Packet Processing, DSP Co-Processing for Imaging and Video, ASIC Prototyping and Emulation, Military/Aerospace Signal Processing, Industrial Control and Automation, Medical Imaging Back-End.
Telecom Line-Card Interface
The EP2A70B724I7N fits telecom line-card interfaces because its 67,200 logic elements and 536 user I/Os support multi-channel framers, TDM time-slot crossbars, and backplane glue logic at 420 MHz internal performance. The 0.15 um APEX II fabric delivers the gate count required to terminate multiple E1/T1 or POS-PHY links in a single device, while LVDS and HSTL I/O standards directly interface to network PHYs. Industrial temperature grade enables deployment in central-office and outdoor enclosures. Place between the line interface transformer and the network processor; expect roughly 3 W core power and full JTAG-driven board-level test via boundary scan.
Recommandé
High-Speed Packet Processing
The EP2A70B724I7N's 3 million system gates and embedded memory blocks are well matched to packet classification, lookup, and queuing functions in routers and switches. The 420 MHz fabric sustains wire-speed processing on multi-gigabit pipes when paired with external PHY/MAC devices, and the 724-pin FCBGA exposes 536 user I/Os sufficient for multiple UTOPIA/POS-PHY interfaces. Use the device as a co-processor to a network processor or control plane CPU. Its 1.5 V VCCINT simplifies power tree design, though care is needed to decouple the FCBGA's high transient current demand during fabric activity.
Recommandé
DSP Co-Processing for Imaging and Video
The EP2A70B724I7N's high gate count and 420 MHz internal performance enable real-time video pipeline functions including motion estimation, color-space conversion, and edge filtering for industrial imaging. APEX II embedded memory blocks provide the storage required for line buffers and pixel arrays without external SRAM, simplifying board layout. The industrial temperature grade (-40C to +100C) suits machine-vision cameras deployed on factory floors. Pair the FPGA with an external video ADC/DAC; expect ~2.5 W to 4 W core power depending on utilization and clock rate.
Recommandé
ASIC Prototyping and Emulation
The EP2A70B724I7N with 3 million system gates provides the density to host large ASIC prototypes on a single FPGA, including CPU subsystems, peripherals, and interconnect fabrics. Multiple devices can be chained for multi-FPGA emulation using JTAG or passive parallel configuration. Industrial temperature grade supports bring-up in thermally diverse lab and field environments. Quartus II place-and-route delivers timing closure for ASIC RTL mapped to APEX II primitives, though legacy migration to newer Stratix devices is preferred for new projects.
Recommandé
Military/Aerospace Signal Processing
The EP2A70B724I7N's industrial temperature range and high gate count suit legacy military and aerospace signal-processing designs where the part has been qualified into existing programs. APEX II devices have been used in radar front-end preprocessing, electronic-warfare subsystems, and satellite communication payloads. Designers should verify MIL-STD or aerospace screening per program requirements and source from authorized distributors with full traceability documentation. Pair with radiation-hardened companion devices when deployed in space environments.
Recommandé
Industrial Control and Automation
The EP2A70B724I7N delivers the I/O count and logic density required for multi-axis motor control, encoder interfacing, and deterministic real-time industrial control. Its 536 user I/Os accept TTL, LVDS, and differential signals from encoders, sensors, and drives, while embedded memory buffers high-speed feedback loops. Industrial temperature grade supports deployment in factory automation cabinets and outdoor industrial sites. Use Quartus II to implement proprietary control IP and protect it via the device's in-system programmability, which simplifies field updates.
Recommandé
Medical Imaging Back-End
The EP2A70B724I7N supports medical imaging back-end processing including ultrasound beamforming, CT image reconstruction pre-processing, and MRI data acquisition where high logic density and deterministic latency are critical. APEX II embedded memory absorbs raw pixel or sample streams, and 536 user I/Os accommodate multiple data converters. Industrial temperature grade suits controlled clinical environments. Pair the FPGA with high-speed ADCs and a host processor for image reconstruction. Validate design per IEC 60601 and applicable FDA guidance for production deployment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A70B724I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A70B724I7 | EP2A70B724I-7 | EP2A70B724I8 | EP2A70B724C7N | EP2A70B724C9N |
|---|---|---|---|---|---|---|
| Package | 724-pin FCBGA | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same | 724-pin FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 67,200 cells | 67,200 cells | 67,200 cells | 67,200 cells | 67,200 cells | |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | |
| Speed Grade | -7 | -7 | -7 | -8 (faster) | -7 | -9 (slower) |
| Operating Temperature | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest-density APEX II in 724-pin FCBGA (vs EP2A25B724C7)
- Industrial temperature grade option (vs EP2A70B724C7N)
- -7 speed grade balances Fmax and cost (vs EP2A70B724I8)
Notes de conception
Power the EP2A70B724I7N from a low-noise 1.5 V regulator with at least 3 A capability for VCCINT, plus separate 2.5 V or 3.3 V rails for each VCCIO bank depending on I/O standard. Decoupling follows FCBGA guidelines: at least one bulk 220 uF capacitor plus ten 10 uF ceramic, 100 nF, and 10 nF capacitors distributed across the package footprint. Estimated core power at typical utilization is 2-4 W; high-utilization designs with frequent toggling may exceed 5 W and require thermal vias or heat-spreader attachment to the FCBGA substrate.
The 724-pin FCBGA package requires a multilayer PCB with controlled-impedance traces, microvia or via-in-pad technology for the inner-row balls, and a continuous ground plane beneath the device. Escape routing from the inner balls typically uses 4 mil traces on a high-density interconnect stack-up; signal integrity analysis is required for LVDS and HSTL interfaces operating above 200 MHz. Place configuration memory (typically an EPC16 or EPCS device) within 2 inches of the DCLK/DATA0/nCONFIG pins to avoid setup/hold violations.
Do not confuse the I7N suffix (industrial, lead-free) with the I8 (industrial, faster) or C7N (commercial) variants - these are not interchangeable for high-temperature or timing-critical designs. Ensure JTAG chain integrity by including 4.7 kohm pull-ups on TCK, TMS, TDI, and TDO. Configuration data must match the device ID read back via JTAG; otherwise CONF_DONE stays low and the device does not enter user mode. When migrating from the EP2A70B724I7N to a newer Stratix or Cyclone family, the bitstream is not compatible and the entire PCB toolchain (Quartus II vs Quartus Prime) must be re-validated.
Informations de conformité
Lead-free (suffix N) per Altera ordering convention. RoHS, REACH, and conflict-minerals status not explicitly stated in verified web data; confirm with Intel or distributor documentation.