EP2AGZ350HF40I3G - Arria II GZ FPGA, 350K LE, 1517-BGA | Altera
N.º da peça: EP2AGZ350HF40I3G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $4030 | $40.300,00 |
| 25 | $3875 | $96.875,00 |
| 50 | $3720 | $186.000,00 |
| 100 | $3565 | $356.500,00 |
EP2AGZ350HF40I3G Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that engineers can reconfigure after manufacturing. FPGAs occupy a unique position in the broader IC hierarchy between standard microcontrollers and ASICs: more flexible than fixed-function ASICs, faster and more parallel than sequential microcontrollers. The Arria II GZ family specifically targets mid-range high-bandwidth applications such as high-speed serial interfaces, video processing, and DSP-heavy designs where Stratix-class performance is not required.
Key features of the EP2AGZ350HF40I3G include 139,400 Adaptive Logic Modules (ALMs) organized as 348,500 equivalent logic elements (LEs), 20.29 Mbit of on-chip embedded memory arranged as M9K and MLAB blocks, and 1,170 18x18 hardware multipliers for DSP operations. The 1517-ball FCBGA package operates across the industrial -40C to +100C temperature range and supports multiple high-speed transceiver options. According to the device nomenclature, the "HF40" suffix indicates the 40mm FCBGA package with high-speed serial I/O, "I3" indicates industrial temperature grade, speed grade 3, and "G" denotes lead-free / RoHS-compliant Pb-free terminal finish.
This part is designed into high-speed serial interfaces, broadcast video processing, and DSP-intensive systems. The device operates with a -3 speed grade designation under the Arria II GZ performance binning scheme. The transceiver-rich architecture provides multi-gigabit transceivers suitable for protocols including PCIe Gen1/Gen2, Serial RapidIO, and CPRI in wireless infrastructure. Designers can use this FPGA in both standalone operation and as a co-processing accelerator alongside processors in heterogeneous computing architectures.
Typical applications include wireless baseband processing, high-definition video broadcast equipment, high-speed serial protocol bridging, and medical imaging systems where parallel DSP throughput is critical. The dense logic resources and embedded multipliers enable single-chip implementation of multi-channel signal processing pipelines without external co-processors.
When designing with this FPGA, plan power delivery carefully. Large FPGAs in BGA packages typically require multi-rail power sequencing and at least 2-3W of thermal dissipation even at moderate utilization. Use Altera's Quartus II design suite (legacy) or Intel Quartus Prime for design entry, synthesis, place-and-route, and timing closure.
Alternativas drop-in para EP2AGZ350HF40I3G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2AGZ350HF40I3G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Logic Elements, RoHS Status, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
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Ver ficha técnica →EP2AGZ350HF40C4N
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Ver ficha técnica →EP2AGZ350HF40C3N
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Ver ficha técnica →EP2AGZ350HF40I3G Classificações máximas e características elétricas
| Family | Arria II GZ |
| Logic Elements | 348,500 LE |
| Adaptive Logic Modules (ALMs) | 139,400 ALM |
| Embedded Memory | 20.29 Mbit |
| Embedded Multipliers (18x18) | 1,170 |
| Encapsulamento | 1517-BBGA, FCBGA |
| Temperatura de operação | -40C to +100C (Industrial) |
| Speed Grade | -3 |
| Status RoHS | Compliant (Pb-free) |
| Lead-Free Finish | Yes (G suffix) |
| Tipo de montagem | Surface Mount (BGA) |
| Process Technology | 40nm TSMC |
Guia de Configuração de Pinos do EP2AGZ350HF40I3G 1517-bbga, fcbga
Configuração de pinos para EP2AGZ350HF40I3G (pacote 1517-bbga, fcbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2AGZ350HF40I3G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2AGZ350HF40I3G é adequado para 6 aplicaçãos: Wireless Baseband Processing, High-Definition Video Broadcast Equipment, High-Speed Serial Protocol Bridging, Medical Imaging Systems, Radar and Electronic Warfare Processing, Industrial Test and Measurement Equipment.
Wireless Baseband Processing
The EP2AGZ350HF40I3G fits wireless baseband processing because its 1,170 18x18 hardware multipliers deliver the parallel DSP throughput needed for multi-carrier LTE and WCDMA physical-layer pipelines. The Arria II GZ family's embedded multipliers can each compute 18x18 multiplies at 250+ MHz, supporting 60-80 simultaneous baseband channels per device. Placed on a baseband card alongside DACs/ADCs and a host processor, the FPGA replaces multiple discrete DSP chips and accelerates FFT, channel estimation, and crest-factor reduction. The industrial -40C to +100C temperature range suits outdoor macro-cell radio units (RRUs) operating in exposed enclosures.
Recomendado
High-Definition Video Broadcast Equipment
The EP2AGZ350HF40I3G suits HD/3G-SDI broadcast processing because its 350K logic elements and 20.29 Mbit embedded memory can simultaneously de-embed audio, route video, and apply on-screen graphics across multiple video streams. The HF40 package's high-speed serial I/O accommodates SDI (up to 3 Gbps), HDMI, and DisplayPort interfaces without external serializer/deserializer chips. The FPGA performs real-time color-space conversion and scaling between SD, HD, and 4K formats while keeping latency under a frame. The industrial temperature grade suits outdoor broadcast units and mixed-flow A/V routers.
Recomendado
High-Speed Serial Protocol Bridging
The EP2AGZ350HF40I3G targets protocol-bridging applications like PCIe Gen1/Gen2, Serial RapidIO, and CPRI because the HF40 package exposes multiple multi-gigabit transceivers operating at 1.25-3.125 Gbps. The 350K logic resource pool can implement protocol stacks, DMA engines, and FIFOs without external co-processors, enabling single-chip bridges between PCIe host processors and legacy telecom interfaces. Embedded memory provides buffering for cut-through latency-sensitive paths. This makes the part ideal for telecom equipment where multiple backplane standards must be translated on the same card.
Recomendado
Medical Imaging Systems
The EP2AGZ350HF40I3G fits medical imaging systems such as ultrasound beamformers and MRI reconstruction engines because its parallel DSP resources can beam-form 64-128 channels in real time. The 1,170 hardware multipliers compute complex multiplication and interpolation for delay-and-sum beamforming at sub-microsecond latencies. Embedded memory (20.29 Mbit) holds per-channel delay-line buffers needed for adaptive beam steering. The industrial temperature range suits portable cart-based ultrasound units while the BGA package supports dense PCB layouts typical of compact imaging probes.
Recomendado
Radar and Electronic Warfare Processing
The EP2AGZ350HF40I3G supports radar signal-processing and electronic-warfare subsystems because its DSP multiplier density and embedded memory handle the FFTs, pulse compression, and Doppler filtering required for SAR and phased-array radar in real time. The 1517-BGA package's multi-gigabit transceivers accept digitized IF samples from high-speed ADCs (e.g., 500 MSPS+) directly into the FPGA. The -40C to +100C industrial temperature range accommodates airborne and shipboard installations where MIL-spec certification is not yet required.
Recomendado
Industrial Test and Measurement Equipment
The EP2AGZ350HF40I3G is ideal for high-end automated test equipment (ATE), protocol analyzers, and high-speed oscilloscope digitizers because its 1.25-3.125 Gbps transceivers deliver the bandwidth needed for USB 3.0, SATA, PCIe, and 10 GbE capture and analysis. Embedded memory buffers multi-gigasample acquisitions while logic capacity supports real-time protocol decoding, eye-diagram computation, and statistical analysis. The HF40 BGA package enables dense board layouts typical of 1U/2U bench-top instruments, and the industrial temperature grade supports laboratory and factory-floor environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2AGZ350HF40I3G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2AGZ350HF40I3 | EP2AGZ350HF40I2N | EP2AGZ350HF40I4N | EP2AGZ350HF40C4N | EP2AGZ300HF40I3G |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1517-FCBGA (HF40, 40mm) | 1517-FCBGA (HF40) - same | 1517-FCBGA (HF40) - same | 1517-FCBGA (HF40) - same | 1517-FCBGA (HF40) - same | 1517-FCBGA (HF40) - same |
| Logic Elements | 348,500 LE | 348,500 LE | 348,500 LE | 348,500 LE | 348,500 LE | 298,000 LE (-14%) |
| 18x18 Multipliers | 1,170 | 1,170 | 1,170 | 1,170 | 1,170 | 920 (-21%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | -3 | -3 | -2 (slower) | -4 (faster) | -4 (faster) | -3 |
Principais diferenciais
- Highest density in the 1517-FCBGA HF40 family (vs EP2AGZ300HF40I3G)
- Industrial temperature support (vs EP2AGZ350HF40C4N)
- Balanced speed-grade -3 trade-off (vs EP2AGZ350HF40I2N / EP2AGZ350HF40I4N)
Notas de projeto
Estimated: The EP2AGZ350HF40I3G at typical 60-70% utilization and 200 MHz core clock dissipates approximately 5-8W. The 1517-FCBGA package has a typical theta_JA of ~8-10 C/W with a standard 12-layer JEDEC test PCB, yielding a 50-80C junction-temperature rise. An attached heat sink is mandatory if ambient temperature exceeds +50C. Use thermal-via arrays directly under the central BGA balls to sink heat into inner copper planes.
BGA escape routing on the EP2AGZ350HF40I3G requires a 1mm or finer BGA pitch design with microvia or HDI PCB fabrication. Route differential transceiver pairs (transmitter, receiver) with 100 ohm differential impedance and matched length within +/- 5 mils for Gen2 signaling. Place AC-coupling capacitors on transmit pairs as close to the FPGA pins as possible. Use Altera's pin planner and signal-integrity tools to validate stack-up before tape-out.
The EP2AGZ350HF40I3G requires multi-rail power supply with separate core (typically 0.9V), transceiver PLL (1.5V), I/O bank (1.2V-3.3V depending on bank standards), and configuration/auxiliary rails. Sequencing per Altera's recommended power-on order is critical - mis-sequencing can cause high-current latch-up or permanent damage. Use a dedicated FPGA power controller (e.g., LTC3612, ISL9444) to manage ramp rates and sequencing.
Do not re-use bitstreams between speed grades -3 and -2/-4 because timing constraints and configuration data differ. Failure to update Quartus fitter settings when migrating between temperature grades (commercial vs industrial) can cause hold-time violations on slower silicon. Always use the Quartus Pin Planner to export per-pin location assignments rather than copy-pasting QSF files between speed grades.
Informações de conformidade
G suffix denotes Pb-free / RoHS-compliant finish per Altera nomenclature. BGA terminal finish typically SAC305 lead-free solder balls. AEC-Q100 is not applicable for FPGAs; industrial temperature grade is separately qualified by Altera.