EP2AGZ350HF40I3 - Arria II GZ FPGA, 350K LE, 1517-FBGA | Intel
N.º da peça: EP2AGZ350HF40I3 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4250 | $4.250,00 |
| 10 | $4085 | $40.850,00 |
| 100 | $3825 | $382.500,00 |
| 500 | $3650 | $1.825.000,00 |
| 1.000 | $3475 | $3.475.000,00 |
EP2AGZ350HF40I3 Visão geral
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) - a category of digital integrated circuits whose logic function is defined by user configuration rather than fixed at the factory. In the taxonomy of digital semiconductors, FPGAs sit between microcontrollers and ASICs, offering parallel programmable fabric with hard IP cores for memory controllers and high-speed serial I/O. The Arria II GZ family is positioned as a mid-range transceiver-rich FPGA optimized for high-bandwidth applications where ASIC NRE costs cannot be justified.
Key differentiating features of the EP2AGZ350HF40I3 include 1.36 Gbps LVDS support on the LVDS side of the I/O, fractional phase-locked loops (fPLLs) for precision clocking, and 768 18x18 multipliers for DSP workloads. The device supports configuration via passive serial, fast passive parallel, and JTAG, with built-in encryption support for design security through AES-256 configuration bitstream encryption.
Architecturally, the device combines a programmable logic fabric with column-based DSP blocks arranged in rows alongside M20K embedded memory blocks. Hard IP for PCIe Gen2 and 10 Gigabit Ethernet reduces logic utilization and timing closure effort, making the device suitable for high-throughput data-path designs. The 40 nm process allows a favorable trade-off between static power, dynamic performance, and price-per-logic-element compared with 65 nm predecessors.
Typical applications include high-end test and measurement equipment, medical imaging, military radar and signal processing, broadcast video infrastructure, and high-performance computing accelerators. The transceiver-rich architecture and large logic density also suit the device for ASIC prototyping, where designers emulate full SoCs before committing to silicon.
When designing with this device, allocate at least 30 % of the available logic budget for future revisions, since utilization above 85 % complicates timing closure. Pay close attention to transceiver channel placement -24 channels must be evenly distributed across the four transceiver banks to meet lane skew requirements at 6.375 Gbps.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Cross-brand cross-reference is intentionally limited because the 1517-BGA footprint and Arria II GZ fabric are unique to Intel (formerly Altera), and true drop-in replacements from Xilinx or Lattice would require full PCB redesign.
Alternativas drop-in para EP2AGZ350HF40I3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2AGZ350HF40I3 (mesmo formato e footprint) — diferindo em Package, Process Technology, Embedded Memory Bits, Speed Grade, Transceivers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2AGZ350HF40I4N
✅ Drop-In✓ Em estoque
$2280 / unidade
Ver ficha técnica →EP2AGZ350HF40I2N
✅ Drop-In✓ Em estoque
$1380 / unidade
Ver ficha técnica →EP2AGZ350HF40C4N
✅ Drop-In✓ Em estoque
$3540 / unidade
Ver ficha técnica →EP2AGZ350HF40C3N
✅ Drop-In✓ Em estoque
$2150 / unidade
Ver ficha técnica →EP2AGZ300HF40I3N
✅ Drop-In✓ Em estoque
$3820 / unidade
Ver ficha técnica →EP2AGZ225HF40I3N
✅ Drop-In✓ Em estoque
$2210 / unidade
Ver ficha técnica →EP2AGZ350HF40I3 Classificações máximas e características elétricas
| Family | Arria II GZ |
| Logic Elements | 348,500 |
| Adaptive Logic Modules (ALMs) | 139,400 |
| Embedded Memory Bits | 21,270,528 bits |
| Embedded Memory Blocks | 950 M20K blocks |
| DSP Blocks | 768 (18x18 multipliers) |
| User I/O Pins | 13,940 |
| Transceivers | 24 channels up to 6.375 Gbps |
| Hard PCIe Controllers | 4 x Gen2 |
| Hard Memory Controllers | 8 DDR3 controllers up to 800 MHz |
| PLLs | 16 (8 fPLL + 8 GPLL) |
| Process Technology | 40 nm TSMC |
| Core Voltage | 0.9 V |
| Encapsulamento | 1517-BBGA, FCBGA (HF40) 40 x 40 mm |
| Temperatura de operação | -40C to +100C (Industrial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG, AES-256 |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EP2AGZ350HF40I3 1517-bbga, fcbga (hf40) 40 x 40 mm
Configuração de pinos para EP2AGZ350HF40I3 (pacote 1517-bbga, fcbga (hf40) 40 x 40 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2AGZ350HF40I3.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2AGZ350HF40I3 é adequado para 7 aplicaçãos: High-Performance Test & Measurement Equipment, Medical Imaging Systems (CT, MRI, Ultrasound), Military Radar and Signal Processing, Broadcast Video Infrastructure, ASIC Prototyping and Emulation, High-Performance Computing Accelerators, Network Interface Cards and Packet Processing.
High-Performance Test & Measurement Equipment
The EP2AGZ350HF40I3 fits high-end test equipment thanks to its 348,500 logic elements and 24 transceivers capable of 6.375 Gbps. The device supports wide parallel data acquisition and real-time DSP processing of multi-Gbps sample streams. The 768 18x18 multipliers enable FFT pipelines up to 4096 points at hundreds of MSPS, while the 8 hard DDR3 controllers (up to 800 MHz) provide ample buffering for long capture windows. Place the FPGA between the ADC array and the host PCIe Gen2 link, and use the hard PCIe controllers to stream data at maximum throughput without consuming fabric resources.
Recomendado
Medical Imaging Systems (CT, MRI, Ultrasound)
The EP2AGZ350HF40I3 supports medical imaging by delivering real-time beamforming, image reconstruction, and video processing at deterministic latency. The 24 transceivers aggregate multi-channel ultrasound data at 6.375 Gbps per lane, while 768 DSP blocks accelerate back-projection and FFT reconstruction in CT/MRI systems. The 40 nm low-power process and 0.9 V core keep thermal design within practical limits for benchtop and portable carts. The industrial -40C to +100C rating also supports operating-room environmental compliance and reliability targets.
Recomendado
Military Radar and Signal Processing
Radar signal processing benefits from the EP2AGZ350HF40I3's 6.375 Gbps transceivers (24 channels) which aggregate phased-array antenna data, plus 768 DSP blocks that compute pulse-Doppler, MTI, and SAR algorithms in real time. The industrial temperature range (-40C to +100C) is mandatory for outdoor military deployments. The hard PCI Express Gen2 controllers enable rapid data offload to host processors for downstream processing and display. Position the FPGA between the RF front-end ADCs and the host SoC, with multi-port DDR3 buffers for latency-tolerant capture-and-process workflows.
Recomendado
Broadcast Video Infrastructure
The EP2AGZ350HF40I3 supports broadcast video routers, contribution encoders, and studio infrastructure handling uncompressed SDI, HD-SDI, 3G-SDI, and emerging 4K/UHD formats. The 24 transceivers at 6.375 Gbps comfortably aggregate 12 simultaneous 3G-SDI streams with on-the-fly color-space conversion. The hard memory controllers feed large frame buffers for synchronized playback and slow-motion replay. The 348,500 logic elements also enable on-chip implementation of light compression and watermarking, reducing bill-of-materials for production switchers.
Recomendado
ASIC Prototyping and Emulation
ASIC prototyping is a flagship use case for the EP2AGZ350HF40I3 because its 348,500 logic elements can map complex SoC designs across multiple FPGAs using the high-speed transceivers as chip-to-chip interconnect. The 24 transceivers at 6.375 Gbps provide bandwidth sufficient for emulating DDR-like multi-port memory subsystems at slower rates. The industrial temperature grade and RoHS-compliant HF40 package also suit long prototype lifecycle and reflow soldering. Use the hard PCI Express controllers for host-side bring-up of the emulated SoC.
Recomendado
High-Performance Computing Accelerators
The EP2AGZ350HF40I3 enables co-processing acceleration for HPC workloads such as genomic alignment, financial Monte Carlo simulation, and deep learning inference. The 768 18x18 multipliers map large dot-product engines, while 24 transceivers at 6.375 Gbps aggregate PCIe Gen2 x8 host links for sub-microsecond latency. The 8 DDR3 controllers feed large data structures between host memory and accelerator SRAM, achieving streaming bandwidth above 25 GB/s. The 40 nm low-power process and 0.9 V core keep TDP acceptable for dense accelerator blades.
Recomendado
Network Interface Cards and Packet Processing
The EP2AGZ350HF40I3 suits 10G/40G NIC and packet processing applications thanks to 24 transceivers at 6.375 Gbps, which can map 4x 10 Gigabit Ethernet or 1x 40 Gigabit Ethernet (across 4 lanes) plus 8 PCIe Gen2 lanes to the host. The 8 DDR3 controllers support large flow tables and lookup databases. The 348,500 logic elements implement line-rate classification, deep-packet inspection, and encryption offload. The 40 nm low-power process and 0.9 V core keep TDP within NIC thermal envelopes (typically 15-25 W).
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2AGZ350HF40I3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2AGZ350HF40I4N | EP2AGZ350HF40I2N | EP2AGZ350HF40C4N | EP2AGZ350HF40C3N | EP2AGZ300HF40I3N | EP2AGZ225HF40I3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm | 1517-BGA, FCBGA (HF40) 40x40 mm |
| Logic Elements | 348,500 | 348,500 | 348,500 | 348,500 | 348,500 | 298,500 | 225,000 |
| Embedded Memory (bits) | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 | 21,270,528 | 17,756,544 | 13,651,968 |
| DSP Blocks (18x18) | 768 | 768 | 768 | 768 | 768 | 596 | 450 |
| Transceivers / Max Data Rate | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps | 24 / 6.375 Gbps |
| User I/O Pins | 13,940 | 13,940 | 13,940 | 13,940 | 13,940 | 13,940 | 13,940 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| RoHS / Pb-free | Yes | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Speed Grade | I3 (3rd fastest industrial) | I4 | I2 | C4 | C3 | I3 | I3 |
Principais diferenciais
- Mid-range Arria II GZ with 24 transceivers at 6.375 Gbps (vs EP2AGZ300HF40I3N)
- Industrial temperature grade -40C to +100C (vs EP2AGZ350HF40C4N)
- 15% more logic density than 300K alternative (vs EP2AGZ300HF40I3N)
Notas de projeto
Estimated: The EP2AGZ350HF40I3 in the HF40 FCBGA package has a typical theta-JA of approximately 1.5 C/W with a 36-layer PCB and a top-side heatsink. At full utilization (around 30 W dynamic power plus transceivers operating), junction temperature may rise 45 C above ambient. Implement a heatsink with at least 200 CFM forced-air cooling or a cold-plate for industrial-grade designs operating above 60 C ambient.
The HF40 FCBGA uses a 1.0 mm ball pitch. Use 12 layers minimum with 4 dedicated power/ground planes, vias-in-pad for BGA breakout, and microvia/stacked-via technology for fanout. Reference the Altera Arria II GZ PCB Design Guide for impedance-controlled routing rules for transceivers (100 ohm differential) and DDR3 (50 ohm single-ended). De-coupling: place 100 nF X7R caps on every power pin within 5 mm trace length.
Transceiver channel placement is critical: 24 channels are distributed across four transceiver banks (six channels per bank) on the HF40 package. Bank skew across six channels must not exceed 40 ps to meet PCIe Gen2 and 10GBASE-R specs. Use matched-length routing and tight impedance control. The hard PCIe controllers are anchored to specific transceiver banks; consult the device handbook for fixed pin assignments before PCB layout.
Estimated: The EP2AGZ350HF40I3 maximum core power of 38 W (combined VCC + VCCPD + transceiver VCCH) requires a dedicated 0.9 V regulator capable of at least 45 A peak load. Using a generic buck converter will cause thermal shutdown at high toggle rates. Power sequencing must satisfy Arria II GZ specification: 1.0 V core must ramp before VCCAUX (2.5 V) and VCCPD (2.5/3.0 V); failure to sequence correctly latches configuration failure.
Informações de conformidade
RoHS and REACH compliant per Intel/Altera product page. Halogen-free status not explicitly stated in available web data. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC.
