10AX090R2F40I2LG - 900K Logic Elements FPGA | Altera | Industrial
N.º da peça: 10AX090R2F40I2LG ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $10266.697 | $10.266,70 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
10AX090R2F40I2LG Visão geral
A field-programmable gate array is an integrated circuit containing configurable logic blocks, programmable interconnects, memory resources, and input/output elements. FPGA devices are semiconductor ICs that can be configured after manufacturing for functions such as digital signal processing, protocol bridging, control logic, and hardware acceleration. Their hierarchy spans FPGA, programmable logic device, configurable integrated circuit, and programmable logic IC. This programmability enables engineering teams to update interfaces or algorithms without replacing the complete hardware platform.
The headline capacity of 900,000 cells supports complex datapaths and high logic density. Its 342 I/O provide extensive connectivity for parallel interfaces, memory controllers, communications links, and control signals. The listed 59,234,304-bit embedded memory capacity is significant for buffering, packet processing, waveform handling, and other memory-intensive designs. The 0.9 V process-family supply information supports power-conscious architectures, while the industrial grade indicates suitability for demanding operating environments.
The part is implemented in 20 nm technology according to the verified FPGAkey listing. This process generation balances high integration and power efficiency for high-performance programmable logic. The 1,517-ball BGA package is a surface-mount, square ball-grid-array design intended for multilayer PCBs with controlled escape routing, continuous power planes, and high-speed signal-integrity analysis. The F40 package code is part of the full ordering designation and should not be changed independently.
Typical applications include industrial automation, communications infrastructure, test and measurement equipment, medical imaging, aerospace and defense electronics, and high-performance computing. A 342-I/O budget can consolidate multiple interface and control functions, while the 59,234,304-bit memory capacity helps reduce reliance on external memory in appropriate data paths. Engineers must still assess transceiver requirements, logic utilization, memory bandwidth, clocking, thermal performance, and power integrity for the exact system implementation.
Design consideration: the 1,517-ball FCBGA requires a strict PCB stack-up, fanout, via, solder-mask, and assembly strategy. Use the manufacturer package guidance and the device's pin assignment to verify bank compatibility, voltage rails, decoupling, and high-speed routing before schematic release. Preliminary design values not explicitly provided by the verified data are intentionally left for datasheet validation.
This page consolidates verified device capacity, memory, I/O, package, grade, and distributor information; it also distinguishes the exact target from related ordering codes. No compliant five-part drop-in set could be proven from the supplied cross-reference evidence, so related Arria 10 devices are not presented as interchangeable substitutes.
Alternativas drop-in para 10AX090R2F40I2LG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10AX090R2F40I2LG (mesmo formato e footprint) — diferindo em Package, Mounting Type, Process Technology, DSP Blocks, Temperature Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10AX090R2F40E2LG
✅ Drop-In✓ Em estoque
$2920 / unidade
Ver ficha técnica →10AX090R2F40E1SG
✅ Drop-In✓ Em estoque
$5750 / unidade
Ver ficha técnica →10AX090R2F40E2SG
✅ Drop-In✓ Em estoque
$4750 / unidade
Ver ficha técnica →10AX090R1F40I1SG
✅ Drop-In✓ Em estoque
$3783 / unidade
Ver ficha técnica →10AX090R1F40E1SG
✅ Drop-In✓ Em estoque
$6700 / unidade
Ver ficha técnica →10AX090R2F40I2LG Classificações máximas e características elétricas
| Device Type | Field Programmable Gate Array (FPGA) |
| Series | Arria 10 GX |
| Logic Capacity | 900000 cells |
| Technology Node | 20 nm |
| Tensão de alimentação | 0.9 V |
| I/O Count | 342 I/O |
| Embedded Memory | 59234304 bit |
| Encapsulamento | 1517-BBGA, FCBGA |
| Terminal Count | 1517 terminals |
| Terminal Form | Ball |
| Package Code | BGA |
| Package Shape | Square |
| Temperature Grade | Industrial |
| Tipo de montagem | Surface Mount |
| Status RoHS | unknown |
| REACH Status | unknown |
Guia de Configuração de Pinos do 10AX090R2F40I2LG square
Configuração de pinos para 10AX090R2F40I2LG (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10AX090R2F40I2LG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10AX090R2F40I2LG é adequado para 6 aplicaçãos: Industrial Automation Controllers, Communications Infrastructure, Test and Measurement Equipment, Medical Imaging Systems, Aerospace and Defense Electronics, High-Performance Computing Accelerators.
Industrial Automation Controllers
Altera 10AX090R2F40I2LG fits industrial automation controllers that require substantial programmable logic, numerous digital interfaces, and deterministic hardware processing. The verified capacity of 900,000 cells can support control state machines, protocol handling, motion sequencing, safety-interface logic, and data preprocessing in one FPGA. Its 342 I/O are useful when a controller must connect many sensors, actuators, encoders, and industrial buses. The listed 59,234,304 bits of embedded memory can buffer conversion results, packet data, or captured waveforms without occupying every operation with external-memory access. The industrial grade makes the device family appropriate for demanding environments, although exact minimum and maximum ambient limits must be confirmed. Engineers should partition the design into control, communications, and timing domains, then verify each assigned I/O bank, clock, and power rail against the exact F40 package documentation.
Recomendado
Communications Infrastructure
The 10AX090R2F40I2LG can serve communications infrastructure requiring parallel packet processing, protocol conversion, traffic management, and hardware-accelerated datapaths. Its listed 900,000 cells provide capacity for multiple packet filters, framing engines, statistics functions, and control processors. The 342 I/O support parallel control-plane buses and high-pin-count data interfaces, while the listed 59,234,304 bits of embedded memory can hold packet descriptors, lookup data, timing information, or short bursts before forwarding. The 20 nm technology listing indicates a modern process generation intended to balance density and power, but actual transceiver count and throughput must be established from the Altera device documentation rather than inferred. Use the FPGA to bridge interface standards, monitor link state, and offload repetitive network functions. Board design must preserve impedance-controlled routes, clean reference planes, clock integrity, and deterministic timing across the 1,517-ball package.
Recomendado
Test and Measurement Equipment
Altera 10AX090R2F40I2LG is suitable for test and measurement platforms that must acquire, condition, analyze, and route many signals in real time. The 900,000-cell capacity supports instrument control, trigger logic, digital filtering, correlation, encoding, and interface management. A listed 342-I/O count allows the FPGA to consolidate front-end control, calibration state, display data, and communications signals, while the verified 59,234,304-bit embedded memory capacity can buffer samples or intermediate results. The programmable architecture allows measurement algorithms and interface protocols to evolve without a complete board redesign. Designers should use deterministic clocking, time-bounded pipelines, and measurement-specific calibration blocks, then validate latency and uncertainty at system level. The 1,517-ball FCBGA places demanding requirements on stack-up, decoupling, power integrity, and routing; the official package files must define exact ball assignments and permitted I/O standards.
Recomendado
Medical Imaging Systems
The 10AX090R2F40I2LG can support medical imaging electronics that require deterministic image acquisition, signal conditioning, frame processing, and multiple control interfaces. Its listed 900,000 cells are appropriate for early designs combining sensor-interface logic, filtering, feature extraction, compression assist, and system control. The 342 I/O help connect image sensors, converters, memory interfaces, control boards, and diagnostic ports. The verified 59,234,304 bits of embedded memory can hold lines, frame segments, coefficients, and processing buffers, reducing the amount of data that must immediately move to external memory. Reprogrammability is valuable when image-processing algorithms or interface requirements change between product versions. Because medical systems demand documented reliability and validation, engineers must not treat the industrial grade alone as medical certification. Validate clocking, latency, fault behavior, thermal margins, and all safety requirements using the exact device documentation and approved system processes.
Recomendado
Aerospace and Defense Electronics
Altera 10AX090R2F40I2LG can be evaluated for aerospace and defense systems that need reconfigurable processing, high I/O integration, and reliable control of sensor and communications data. The 900,000-cell capacity supports waveform processing, protocol adaptation, navigation aids, radar preprocessing, and secure interface control. The listed 342 I/O accommodate parallel data capture, command paths, telemetry, and timing distribution, while the 59,234,304-bit embedded memory supports buffers and fixed-latency data paths. Its programmable logic can accept updated algorithms or interface behavior after deployment. The industrial-grade listing is not equivalent to a space-grade or defense-screening certification, so mission requirements must be evaluated separately. Designers should analyze radiation, temperature, vibration, derating, configuration control, and deterministic timing at equipment level. Exact supported interfaces, transceiver resources, and environmental limits are not included in the supplied data and must be obtained from Altera documentation.
Recomendado
High-Performance Computing Accelerators
The 10AX090R2F40I2LG is applicable to high-performance computing equipment where repetitive arithmetic, stream processing, and low-latency control are implemented in programmable hardware. The verified 900,000-cell capacity can host parallel datapaths, queue managers, schedulers, transforms, and host-interface logic. Its 342 I/O support high-pin-count host, memory, and control connections, while 59,234,304 bits of embedded memory can hold vectors, lookup tables, temporary blocks, and input/output queues. FPGA acceleration provides deterministic latency and the ability to pipeline work across many operations. The 20 nm technology listing supports a dense implementation, but sustained performance depends on clock rate, DSP and memory resources, data distribution, and routing congestion, none of which is fully specified in the supplied snippets. Use architecture-specific benchmarks and the manufacturer toolchain. Power delivery and thermal design are especially important because the 1,517-ball FCBGA concentrates many high-speed connections and power connections into a compact assembly.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10AX090R2F40I2LG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10AX090R2F40E2LG | 10AX090R2F40E1SG | 10AX090R2F40E2SG | 10AX090R1F40I1SG | 10AX090R1F40E1SG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA |
| Device Family | Arria 10 GX | Arria 10 GX family | Arria 10 family | Arria 10 GX family | Arria 10 family | Arria 10 family |
| Logic Capacity | 900000 cells | 900000 cells (family listing) | 900000 cells (family listing) | 900000 cells (family listing) | 900000 cells (family listing) | 900000 cells (family listing) |
| Temperature or Ordering Identifier | I2LG | E2LG | E1SG | E2SG | R1I1SG | R1E1SG |
| Technology Node | 20 nm | 20 nm (family listing) | 20 nm (family listing) | 20 nm (family listing) | 20 nm (family listing) | 20 nm (family listing) |
| Pin Compatibility Evidence | Exact target | Not established | Not established | Not established | Not established | Not established |
| Qualification for Drop-In Use | Verified target specification | Requires manufacturer validation | Requires manufacturer validation | Requires manufacturer validation | Requires manufacturer validation | Requires manufacturer validation |
Principais diferenciais
- Exact industrial I2LG ordering identity (vs 10AX090R2F40E2LG)
- F40 1517-ball package ordering code (vs 10AX090R2F40E2SG)
- R2 architecture-code position (vs 10AX090R1F40I1SG)
- Verified target capacity and I/O statement (vs 10AX090R1F40E1SG)
Notas de projeto
Treat the 1,517-ball FCBGA as a system-level signal-integrity constraint, not as a conventional fine-pitch BGA. Build the stack-up around the manufacturer's land pattern and then define escape vias, reference planes, impedance targets, via antipads, and fabrication tolerances before placing support components. Keep all balls assigned through the exact F40 package pin-out. The verified data does not provide ball coordinates, stack-up recommendations, impedance values, or via geometry, so obtain those values from Altera before schematic release.
Plan a distributed power-delivery network around the 0.9 V family supply information and every additional rail required by the exact FPGA configuration. Place bulk, local, and high-frequency decoupling according to the manufacturer reference design and connect logic returns through a continuous low-impedance ground structure. Do not treat 0.9 V as a substitute for the complete power table. Confirm rail tolerances, current demand, startup sequencing, monitor outputs, and transceiver supplies from the device datasheet, then validate ripple and transient response with the assembled PCB.
Use the 342 available I/O only after assigning clocks, configuration, memory interfaces, transceivers, and bank voltages. The package supports many signals, but a design can lose usable pins through incompatible voltage standards, reserved functions, or clock-region restrictions. Reserve package pins during schematic floorplanning and follow the Altera pin connection guidelines for unused, pull-up, pull-down, and no-connect requirements. Preserve matched routing for high-speed differential or source-synchronous groups and keep configuration paths away from noisy edges. Exact permitted I/O standards and bank rules are absent from the supplied data.
Estimate heat from the compiled design and board environment rather than from cell count alone. Logic utilization, clock frequency, toggle rate, memory use, transceiver activity, and output loading determine dynamic power, while the 1,517-ball package and PCB copper determine thermal resistance. Use the manufacturer power-analysis tools with realistic activity factors and perform post-route simulation. The verified web data does not provide junction-to-ambient or junction-to-case values, maximum power, or supported ambient temperature, so those values remain datasheet-dependent.
Avoid substituting a related ordering code solely because it contains 10AX090, R2, F40, or 1517. Those characters identify family and package dimensions but do not by themselves prove identical speed grade, temperature grade, pinout, memory, transceiver support, or timing. Related codes such as 10AX090R2F40E2LG, 10AX090R2F40E2SG, 10AX090R1F40I1SG, and 10AX090R1F40E1SG require separate validation. For any proposed change, compare the manufacturer ordering guide, package drawing, device handbook, errata, design files, and pin-level implementation before reusing the PCB.
Informações de conformidade
The official Altera search result mentions trade compliance, material attributes, packaging, and manufacturing information, but the supplied snippet does not provide a definitive RoHS, REACH, lead-free, halogen-free, or conflict-minerals declaration for this exact MPN. AEC-Q100 is not applicable to this industrial FPGA listing, and no automotive qualification is stated.