EP2S130F1020C5ES - Stratix II 132540 LEs FPGA, 1020-BGA | Intel
N.º da peça: EP2S130F1020C5ES ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1725 | $17.250,00 |
| 100 | $1620 | $162.000,00 |
| 500 | $1495 | $747.500,00 |
| 1.000 | $1380 | $1.380.000,00 |
EP2S130F1020C5ES Visão geral
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated hard-IP such as block RAM, DSP multipliers, and high-speed transceivers. FPGAs sit above CPLDs and below ASICs in the programmable-logic taxonomy, and are widely used for prototyping, low-volume production, and applications where post-silicon hardware updates are required. The Stratix II family in particular was positioned by Altera for high-end ASIC-replacement and signal-processing designs in communications, video, and military/aerospace markets.
Key features of the EP2S130F1020C5ES include up to 12 embedded DSP blocks (configurable up to 96 in the family), TriMatrix memory with three block sizes (M512, M4K, M-RAM), embedded multipliers supporting 18x18 multiplication, and high-speed external memory interfaces supporting DDR/DDR2/QDRII SRAM. The device also includes dedicated clock management via up to 12 PLLs and supports source-synchronous and high-speed serial interfaces. According to the manufacturer datasheet, the -5 speed grade targets a core clock frequency near 609.76 MHz.
The 1020-ball FC-FBGA package uses a flip-chip interconnect and requires high-density PCB design with controlled-impedance routing. Power is delivered through multiple VCCINT and VCCIO supply rails with separate core, I/O, PLL, and transceiver supplies; power estimation requires Altera's PowerPlay Early Power Estimator. The flip-chip BGA construction supports high pin density but is not field-reworkable, demanding careful assembly and X-ray inspection post-reflow.
Typical applications include high-performance digital signal processing, ASIC prototyping, telecom baseband and channel-card designs, military radar and electronic warfare, high-end video broadcast equipment, and high-speed data acquisition systems. The device's combination of logic density, embedded memory, and DSP blocks suits any application needing parallel arithmetic throughput. When designing with this FPGA, careful attention to power integrity, multi-rail decoupling, JTAG configuration topology, and thermal management is essential; Altera recommends a 12-layer board stack-up with dedicated power and ground planes for the FC-FBGA package.
Alternativas drop-in para EP2S130F1020C5ES — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2S130F1020C5ES (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Speed Grade, RoHS Status, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2S130F1020C5
✅ Drop-In✓ Em estoque
$4100 / unidade
Ver ficha técnica →EP2S130F1020C5G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP2S130F1020C4N
✅ Drop-In✓ Em estoque
$2850 / unidade
Ver ficha técnica →EP2S130F1020C3N
✅ Drop-In✓ Em estoque
$1095 / unidade
Ver ficha técnica →EP2S130F1020C4RB
✅ Drop-In✓ Em estoque
$1310 / unidade
Ver ficha técnica →EP2S130F1020C3NRB
✅ Drop-In✓ Em estoque
$1245 / unidade
Ver ficha técnica →EP2S130F1020C5ES Classificações máximas e características elétricas
| Family | Stratix II |
| Logic Elements | 132,540 |
| Embedded Memory Bits | 6,747,840 |
| Maximum User I/Os | 742 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Maximum Internal Clock Frequency | 609.76 MHz |
| Speed Grade | -5 |
| Encapsulamento | 1020-ball FC-FBGA (flip-chip BGA) |
| Operating Temperature (Junction) | 0C to 85C (commercial) |
| Logic Array Blocks (LABs) | 6,747 |
| Adaptive Logic Modules (ALMs) | 53,016 |
| Configuration | SRAM-based, JTAG/AS/PS modes |
| Status RoHS | Compliant (lead-free) |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do EP2S130F1020C5ES 1020-ball fc-fbga (flip-chip bga)
Configuração de pinos para EP2S130F1020C5ES (pacote 1020-ball fc-fbga (flip-chip bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2S130F1020C5ES.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2S130F1020C5ES é adequado para 6 aplicaçãos: Telecom Baseband Signal Processing, ASIC Prototyping and Emulation, High-End Video Broadcast Equipment, Military Radar and Electronic Warfare, High-Speed Data Acquisition Systems, Industrial Automation and Machine Vision.
Telecom Baseband Signal Processing
The EP2S130F1020C5ES fits telecom baseband and channel-card designs through its 132,540 logic elements and embedded DSP blocks capable of 18x18 multiplication at 609.76 MHz core clock. Why this part works: the Stratix II ALM architecture delivers roughly 2x the effective logic per area versus first-generation Stratix, allowing high-density QAM/QPSK demodulator and turbo-decoder pipelines to fit in a single device. How it is used: the FPGA receives digitized IF samples from front-end ADCs, performs channel estimation and equalization in DSP blocks, and forwards decoded data to a network processor over DDR2-controlled external memory. The -5 speed grade headroom benefits tight timing margins on source-synchronous LVDS links to ADCs/DACs.
Recomendado
ASIC Prototyping and Emulation
Why the EP2S130F1020C5ES fits ASIC prototyping: with 132,540 logic elements and 6,747,840 bits of embedded TriMatrix memory, it provides enough capacity to map medium-complexity ASICs of 5-10M ASIC gates into one or two FPGAs. The 1020-ball FC-FBGA package exposes 742 user I/Os, sufficient for full-visibility debug signal breakout. How it is used: designers partition their ASIC RTL into multiple Stratix II FPGAs, use the embedded memory to emulate SRAM/registers, and tap I/O pins for logic-analyzer tracing. The -5 speed grade (609.76 MHz) provides timing-margin headroom for inter-FPGA pin-multiplexing required when emulating wider ASIC datapaths.
Recomendado
High-End Video Broadcast Equipment
The EP2S130F1020C5ES supports high-end video broadcast pipelines because its embedded DSP blocks and TriMatrix memory can sustain multi-stream HD-SDI processing at 1.5 Gbps. Why this part works: the 90 nm Stratix II architecture packs sufficient multipliers for color-space conversion and DCT/MPEG operations, while the 742 I/Os allow parallel SDI ingest/egress plus 10/100 Ethernet control channels. How it is used: the FPGA receives serialized SDI streams, performs deinterlacing and compression preprocessing in DSP blocks, and forwards compressed video over DDR2-400 external memory. The 1020-ball FC-FBGA package supports the high-I/O bandwidth required by multi-channel broadcast gear.
Recomendado
Military Radar and Electronic Warfare
Why the EP2S130F1020C5ES fits military radar/EW: the Stratix II DSP blocks deliver hundreds of 18x18 multiply-accumulates per clock, enabling real-time pulse-Doppler, SAR, and digital-RF processing at radar baseband. How it is used: the FPGA processes I/Q samples from wideband ADCs, performs FFT-based spectral analysis, and forwards detected tracks to a downstream signal processor over high-speed serial links. The high logic density (132,540 LEs) lets one device implement multi-channel beamforming plus adaptive jam-mitigation. C5ES engineering-sample screening is often preferred for defense pre-production builds with controlled configuration.
Recomendado
High-Speed Data Acquisition Systems
Why the EP2S130F1020C5ES fits high-speed DAQ: the 742 user I/Os and LVDS-capable banks support multiple 16-bit ADC channels at 200+ MSPS, while embedded DSP blocks handle real-time filtering and decimation. How it is used: the FPGA receives LVDS-deserialized ADC samples, applies cascaded FIR filters in DSP blocks for anti-aliasing, and stores post-processed data into external DDR2 via the embedded memory controller. The 6,747,840 bits of TriMatrix memory buffer deep captures before transfer to host systems; the -5 speed grade headroom benefits tight ADC-to-FPGA source-synchronous timing at 400+ MHz DDR clocks.
Recomendado
Industrial Automation and Machine Vision
Why the EP2S130F1020C5ES fits industrial machine-vision systems: the 132,540 logic elements support multi-camera pipeline processing, while embedded memory and DSP blocks handle Bayer demosaicing, color correction, and edge detection in real time. How it is used: the FPGA interfaces to Camera Link or GigE Vision cameras over LVDS, performs image preprocessing in DSP blocks, and forwards feature data to an external CPU/GPU for higher-level inspection. The -5 speed grade allows tight timing on multi-tap LVDS camera inputs at 80 MHz DDR per tap; the 1020-ball FC-BGA gives sufficient I/Os for 4-8 simultaneous camera streams.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2S130F1020C5ES — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2S130F1020C5 | EP2S130F1020C5G | EP2S130F1020C4N | EP2S130F1020C3N | EP2S130F1020C4RB | EP2S130F1020C3NRB |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | -5 | -5 | -5 | -4 | -3 | -4 | -3 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| RoHS / Pb-Free | Compliant | Compliant | Compliant (Green) | Compliant | Compliant | Compliant (RB) | Compliant (RB) |
| Maximum User I/Os | 742 | 742 | 742 | 742 | 742 | 742 | 742 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Highest logic density at 1020-ball FC-FBGA (vs EP2S90F1020C5 (smaller 90k LE variant))
- Production-grade C5 variant available as drop-in (vs EP2S130F1020C5 (production vs C5ES engineering-sample))
- RoHS-compliant G variant with same footprint (vs EP2S130F1020C5G (Pb-free/Green))
- Speed-grade options for cost/power optimization (vs EP2S130F1020C3N (-3 speed grade))
Notas de projeto
The Stratix II family requires multiple supply rails: VCCINT (1.2 V core), VCCIO (I/O banks, typically 1.5/1.8/2.5/3.3 V), VCCPD (pre-driver, typically 2.5/3.3 V), VCC_PLL (PLL analog supply), and VCC_BATT (battery-backed RAM). Bulk-decouple each rail with 100 uF tantalum or polymer + multiple 0.1 uF/10 uF ceramic caps near each supply pin. Per Altera's Stratix II handbook, estimate dynamic current using the PowerPlay Early Power Estimator before final board design - estimated dynamic current at 132k LEs with 50% toggle and 250 MHz can exceed 8 A on VCCINT alone.
The 1020-ball FC-FBGA requires high-density PCB design with controlled-impedance routing for LVDS/clock signals. Altera recommends a 12-layer stack-up with dedicated power and ground planes for this package. Use 0.4 mm or 0.5 mm BGA pitch breakout with microvia-in-pad or staggered-via construction; full-stack buried vias are commonly required. Per Altera's layout guidelines, matched-length traces (within 50 mil) are mandatory for source-synchronous DDR2 interfaces, and differential pairs should be length-matched within 25 mil.
Estimated: at the -5 speed grade with 132,540 LEs at 60% utilization toggling at 200 MHz, total power can reach 15-20 W. The FC-FBGA package has a theta_JA around 8-12 C/W with adequate PCB copper and airflow, yielding 120-240 C/W x W junction-temperature rise - mandates heatsink or forced-air cooling in most applications. Use the manufacturer's thermal models and verify with on-board thermocouples during prototype characterization. Industrial/military temperature grades require derating above 70C ambient.
Do not apply power to VCCIO before VCCINT is stable - this can damage I/O structures. Ensure all JTAG TCK/TMS/TDO/TDI pins have proper pull-ups per the configuration guidelines. Configuration modes (AS, PS, JTAG) require specific MSEL pin strapping; the wrong setting causes configuration failure. Per the manufacturer datasheet, all unused I/O pins should be left floating or driven to a defined state to reduce quiescent current. The C5ES engineering-sample screening has different lead-time and lot-traceability requirements than the production C5 variant.
Informações de conformidade
RoHS compliant per Altera/Intel product page. C5ES engineering-sample screening is process-identical to production C5 variant; for green/Pb-free verification use EP2S130F1020C5G. Not AEC-Q100 qualified - this is a logic IC not an automotive analog part.
