EP2S130F1020C5ES - Stratix II 132540 LEs FPGA, 1020-BGA | Intel
MPN： EP2S130F1020C5ES ✗ 停產EP2S130F1020C5ES 概覽
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated hard-IP such as block RAM, DSP multipliers, and high-speed transceivers. FPGAs sit above CPLDs and below ASICs in the programmable-logic taxonomy, and are widely used for prototyping, low-volume production, and applications where post-silicon hardware updates are required. The Stratix II family in particular was positioned by Altera for high-end ASIC-replacement and signal-processing designs in communications, video, and military/aerospace markets.
Key features of the EP2S130F1020C5ES include up to 12 embedded DSP blocks (configurable up to 96 in the family), TriMatrix memory with three block sizes (M512, M4K, M-RAM), embedded multipliers supporting 18x18 multiplication, and high-speed external memory interfaces supporting DDR/DDR2/QDRII SRAM. The device also includes dedicated clock management via up to 12 PLLs and supports source-synchronous and high-speed serial interfaces. According to the manufacturer datasheet, the -5 speed grade targets a core clock frequency near 609.76 MHz.
The 1020-ball FC-FBGA package uses a flip-chip interconnect and requires high-density PCB design with controlled-impedance routing. Power is delivered through multiple VCCINT and VCCIO supply rails with separate core, I/O, PLL, and transceiver supplies; power estimation requires Altera's PowerPlay Early Power Estimator. The flip-chip BGA construction supports high pin density but is not field-reworkable, demanding careful assembly and X-ray inspection post-reflow.
Typical applications include high-performance digital signal processing, ASIC prototyping, telecom baseband and channel-card designs, military radar and electronic warfare, high-end video broadcast equipment, and high-speed data acquisition systems. The device's combination of logic density, embedded memory, and DSP blocks suits any application needing parallel arithmetic throughput. When designing with this FPGA, careful attention to power integrity, multi-rail decoupling, JTAG configuration topology, and thermal management is essential; Altera recommends a 12-layer board stack-up with dedicated power and ground planes for the FC-FBGA package.
直接替換替代品，適用於 EP2S130F1020C5ES — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2S130F1020C5ES （相同外形與佔位） — 差異在於 Package, Operating Temperature, Speed Grade, RoHS Status, Process Technology.
EP2S130F1020C5
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1020C5G
✅ 直接替換📋 參考替代品（不在目錄中）
EP2S130F1020C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1020C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1020C4RB
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1020C3NRB
✅ 直接替換聯絡詢價
查看資料表 →EP2S130F1020C5ES 最大額定值與電氣特性
| Family | Stratix II |
| Logic Elements | 132,540 |
| Embedded Memory Bits | 6,747,840 |
| Maximum User I/Os | 742 |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Maximum Internal Clock Frequency | 609.76 MHz |
| Speed Grade | -5 |
| 封裝 | 1020-ball FC-FBGA (flip-chip BGA) |
| Operating Temperature (Junction) | 0C to 85C (commercial) |
| Logic Array Blocks (LABs) | 6,747 |
| Adaptive Logic Modules (ALMs) | 53,016 |
| Configuration | SRAM-based, JTAG/AS/PS modes |
| RoHS 狀態 | Compliant (lead-free) |
| 安裝類型 | Surface Mount |
EP2S130F1020C5ES 1020-ball fc-fbga (flip-chip bga) 腳位配置指南
EP2S130F1020C5ES（1020-ball fc-fbga (flip-chip bga) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2S130F1020C5ES.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2S130F1020C5ES 適用於 6 應用s: Telecom Baseband Signal Processing, ASIC Prototyping and Emulation, High-End Video Broadcast Equipment, Military Radar and Electronic Warfare, High-Speed Data Acquisition Systems, Industrial Automation and Machine Vision.
Telecom Baseband Signal Processing
The EP2S130F1020C5ES fits telecom baseband and channel-card designs through its 132,540 logic elements and embedded DSP blocks capable of 18x18 multiplication at 609.76 MHz core clock. Why this part works: the Stratix II ALM architecture delivers roughly 2x the effective logic per area versus first-generation Stratix, allowing high-density QAM/QPSK demodulator and turbo-decoder pipelines to fit in a single device. How it is used: the FPGA receives digitized IF samples from front-end ADCs, performs channel estimation and equalization in DSP blocks, and forwards decoded data to a network processor over DDR2-controlled external memory. The -5 speed grade headroom benefits tight timing margins on source-synchronous LVDS links to ADCs/DACs.
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ASIC Prototyping and Emulation
Why the EP2S130F1020C5ES fits ASIC prototyping: with 132,540 logic elements and 6,747,840 bits of embedded TriMatrix memory, it provides enough capacity to map medium-complexity ASICs of 5-10M ASIC gates into one or two FPGAs. The 1020-ball FC-FBGA package exposes 742 user I/Os, sufficient for full-visibility debug signal breakout. How it is used: designers partition their ASIC RTL into multiple Stratix II FPGAs, use the embedded memory to emulate SRAM/registers, and tap I/O pins for logic-analyzer tracing. The -5 speed grade (609.76 MHz) provides timing-margin headroom for inter-FPGA pin-multiplexing required when emulating wider ASIC datapaths.
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High-End Video Broadcast Equipment
The EP2S130F1020C5ES supports high-end video broadcast pipelines because its embedded DSP blocks and TriMatrix memory can sustain multi-stream HD-SDI processing at 1.5 Gbps. Why this part works: the 90 nm Stratix II architecture packs sufficient multipliers for color-space conversion and DCT/MPEG operations, while the 742 I/Os allow parallel SDI ingest/egress plus 10/100 Ethernet control channels. How it is used: the FPGA receives serialized SDI streams, performs deinterlacing and compression preprocessing in DSP blocks, and forwards compressed video over DDR2-400 external memory. The 1020-ball FC-FBGA package supports the high-I/O bandwidth required by multi-channel broadcast gear.
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Military Radar and Electronic Warfare
Why the EP2S130F1020C5ES fits military radar/EW: the Stratix II DSP blocks deliver hundreds of 18x18 multiply-accumulates per clock, enabling real-time pulse-Doppler, SAR, and digital-RF processing at radar baseband. How it is used: the FPGA processes I/Q samples from wideband ADCs, performs FFT-based spectral analysis, and forwards detected tracks to a downstream signal processor over high-speed serial links. The high logic density (132,540 LEs) lets one device implement multi-channel beamforming plus adaptive jam-mitigation. C5ES engineering-sample screening is often preferred for defense pre-production builds with controlled configuration.
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High-Speed Data Acquisition Systems
Why the EP2S130F1020C5ES fits high-speed DAQ: the 742 user I/Os and LVDS-capable banks support multiple 16-bit ADC channels at 200+ MSPS, while embedded DSP blocks handle real-time filtering and decimation. How it is used: the FPGA receives LVDS-deserialized ADC samples, applies cascaded FIR filters in DSP blocks for anti-aliasing, and stores post-processed data into external DDR2 via the embedded memory controller. The 6,747,840 bits of TriMatrix memory buffer deep captures before transfer to host systems; the -5 speed grade headroom benefits tight ADC-to-FPGA source-synchronous timing at 400+ MHz DDR clocks.
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Industrial Automation and Machine Vision
Why the EP2S130F1020C5ES fits industrial machine-vision systems: the 132,540 logic elements support multi-camera pipeline processing, while embedded memory and DSP blocks handle Bayer demosaicing, color correction, and edge detection in real time. How it is used: the FPGA interfaces to Camera Link or GigE Vision cameras over LVDS, performs image preprocessing in DSP blocks, and forwards feature data to an external CPU/GPU for higher-level inspection. The -5 speed grade allows tight timing on multi-tap LVDS camera inputs at 80 MHz DDR per tap; the 1020-ball FC-BGA gives sufficient I/Os for 4-8 simultaneous camera streams.
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推薦產品摘要
工程參考資料，適用於 EP2S130F1020C5ES — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2S130F1020C5 | EP2S130F1020C5G | EP2S130F1020C4N | EP2S130F1020C3N | EP2S130F1020C4RB | EP2S130F1020C3NRB |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | -5 | -5 | -5 | -4 | -3 | -4 | -3 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| RoHS / Pb-Free | Compliant | Compliant | Compliant (Green) | Compliant | Compliant | Compliant (RB) | Compliant (RB) |
| Maximum User I/Os | 742 | 742 | 742 | 742 | 742 | 742 | 742 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Highest logic density at 1020-ball FC-FBGA (對比EP2S90F1020C5 (smaller 90k LE variant))
- Production-grade C5 variant available as drop-in (對比EP2S130F1020C5 (production vs C5ES engineering-sample))
- RoHS-compliant G variant with same footprint (對比EP2S130F1020C5G (Pb-free/Green))
- Speed-grade options for cost/power optimization (對比EP2S130F1020C3N (-3 speed grade))
設計說明
The Stratix II family requires multiple supply rails: VCCINT (1.2 V core), VCCIO (I/O banks, typically 1.5/1.8/2.5/3.3 V), VCCPD (pre-driver, typically 2.5/3.3 V), VCC_PLL (PLL analog supply), and VCC_BATT (battery-backed RAM). Bulk-decouple each rail with 100 uF tantalum or polymer + multiple 0.1 uF/10 uF ceramic caps near each supply pin. Per Altera's Stratix II handbook, estimate dynamic current using the PowerPlay Early Power Estimator before final board design - estimated dynamic current at 132k LEs with 50% toggle and 250 MHz can exceed 8 A on VCCINT alone.
The 1020-ball FC-FBGA requires high-density PCB design with controlled-impedance routing for LVDS/clock signals. Altera recommends a 12-layer stack-up with dedicated power and ground planes for this package. Use 0.4 mm or 0.5 mm BGA pitch breakout with microvia-in-pad or staggered-via construction; full-stack buried vias are commonly required. Per Altera's layout guidelines, matched-length traces (within 50 mil) are mandatory for source-synchronous DDR2 interfaces, and differential pairs should be length-matched within 25 mil.
Estimated: at the -5 speed grade with 132,540 LEs at 60% utilization toggling at 200 MHz, total power can reach 15-20 W. The FC-FBGA package has a theta_JA around 8-12 C/W with adequate PCB copper and airflow, yielding 120-240 C/W x W junction-temperature rise - mandates heatsink or forced-air cooling in most applications. Use the manufacturer's thermal models and verify with on-board thermocouples during prototype characterization. Industrial/military temperature grades require derating above 70C ambient.
Do not apply power to VCCIO before VCCINT is stable - this can damage I/O structures. Ensure all JTAG TCK/TMS/TDO/TDI pins have proper pull-ups per the configuration guidelines. Configuration modes (AS, PS, JTAG) require specific MSEL pin strapping; the wrong setting causes configuration failure. Per the manufacturer datasheet, all unused I/O pins should be left floating or driven to a defined state to reduce quiescent current. The C5ES engineering-sample screening has different lead-time and lot-traceability requirements than the production C5 variant.
合規資訊
RoHS compliant per Altera/Intel product page. C5ES engineering-sample screening is process-identical to production C5 variant; for green/Pb-free verification use EP2S130F1020C5G. Not AEC-Q100 qualified - this is a logic IC not an automotive analog part.
