10CL080YF484C6G - Cyclone 10 LP FPGA 81K LE BGA-484 | Intel
N.º da peça: 10CL080YF484C6G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $178 | $178,00 |
| 10 | $165 | $1.650,00 |
| 100 | $152 | $15.200,00 |
| 500 | $138 | $69.000,00 |
| 1.000 | $124 | $124.000,00 |
10CL080YF484C6G Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated DSP and memory blocks that can be re-programmed after manufacturing to implement custom digital logic, parallel processing pipelines, and hardware-accelerated algorithms. FPGAs occupy the middle ground between general-purpose microcontrollers (sequential, software-defined) and application-specific integrated circuits (ASICs, fixed-function), offering hardware-level parallelism with software-like reconfigurability. Within the broader taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> digital integrated circuit -> semiconductor.
Key features of the 10CL080YF484C6G include up to 347 user I/O pins, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, integrated phase-locked loops (PLLs) for clock management, and embedded 18x18 hardware multipliers that accelerate DSP workloads such as FIR filtering, FFTs, and motor-control loops. The device supports configuration via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes, enabling flexible bootloader design and remote field updates.
Architecturally, the 10CL080YF484C6G delivers an optimal balance of logic density, DSP performance, and static power consumption. The Cyclone 10 LP family achieves static power reductions of up to 50% versus earlier Cyclone generations while maintaining the same Quartus Prime design flow compatibility, allowing existing designs to migrate with minimal tool-chain retraining.
Typical applications include industrial machine vision and motor control, video processing and display bridging, factory automation and protocol bridging (EtherCAT, PROFINET), portable medical instrumentation, and low-cost software-defined radio front-ends. The wide density range of the Cyclone 10 LP family also enables designers to scale a single PCB layout across multiple logic-element counts for platform reuse.
When designing with this device, ensure that the PCB stack-up supports the FineLine BGA-484 footprint with appropriate microvia or via-in-pad construction, and that the Quartus Prime power estimator is run early to validate thermal envelopes against the application profile. The 10CL080YF484C6G pairs naturally with low-cost SDRAM, NOR flash configuration memory, and industrial Ethernet PHYs.
This page synthesizes distributor inventory, drop-in alternatives, and engineering design notes not consolidated on the manufacturer datasheet or any single distributor catalog page.
Alternativas drop-in para 10CL080YF484C6G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10CL080YF484C6G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10CL080YF484C8G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$12.65 / unidade
Ver ficha técnica →10CL080YF484I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$71.95 / unidade
Ver ficha técnica →10CL040YF484C6G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$108.25 / unidade
Ver ficha técnica →10CL080YF484C6G Classificações máximas e características elétricas
| Family | Cyclone 10 LP |
| Logic Elements | 81,264 |
| Embedded Memory | 2,810,880 bits |
| Embedded Multipliers (18x18) | 289 |
| User I/O Pins (maximum) | 347 |
| Encapsulamento | 484-ball FineLine BGA (F484) |
| Process Technology | 60 nm low-power |
| Speed Grade | 6 (commercial) |
| Pin/Package Option | -Y (lead-free / industrial reflow) |
| Configuration Modes | JTAG, AS, PS, FPP |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL |
| PLLs | Yes (integrated) |
| Temperatura de operação | Commercial (0C to +85C junction) |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (BGA) |
| Nível MSL | 3 |
| Programming Toolchain | Intel Quartus Prime |
Guia de Configuração de Pinos do 10CL080YF484C6G -y (lead-free / industrial reflow)
Configuração de pinos para 10CL080YF484C6G (pacote -y (lead-free / industrial reflow)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para 10CL080YF484C6G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
10CL080YF484C6G é adequado para 6 aplicaçãos: Industrial Motor Control and Servo Drive, Machine Vision and Image Pre-Processing, Video Processing and Display Bridging, Factory Automation and Protocol Bridging, Portable Medical Instrumentation, Low-Cost Software-Defined Radio Front-End.
Industrial Motor Control and Servo Drive
The 10CL080YF484C6G fits industrial motor control because its 289 18x18 hardware multipliers implement field-oriented control (FOC) loops and space-vector PWM in deterministic sub-microsecond latency. With up to 347 user I/Os the device can simultaneously drive multi-axis PWM outputs, capture quadrature encoder feedback, and host a real-time EtherCAT or PROFINET slave stack. Designers typically pair it with a TI TMS320 or STMicroelectronics STM32 host microcontroller for safety supervision and housekeeping.
Recomendado
Machine Vision and Image Pre-Processing
The 10CL080YF484C6G's 2.8 Mbit of embedded M9K memory buffers image lines from MIPI-CSI or parallel LVDS sensors while the 18x18 multipliers run Sobel, Laplacian, or convolution kernels in real time. Its 347 I/Os support multiple sensor lanes plus a Gigabit Ethernet or USB 3.0 uplink for processed-frame transport. The low static power profile suits fanless industrial camera housings that demand thermal derating margins.
Recomendado
Video Processing and Display Bridging
The 10CL080YF484C6G bridges between HDMI, MIPI-DSI, LVDS, and RGB display interfaces using its LVDS/LVCMOS/SSTL/HSTL I/O support and abundant multipliers for chroma resampling. The 2.8 Mbit embedded memory is sufficient to buffer one full HD scan-line for color-space conversion. Quartus Prime reference IP for HDMI 1.4 and MIPI-DSI shortens integration time versus ASIC implementations.
Recomendado
Factory Automation and Protocol Bridging
The 10CL080YF484C6G hosts soft IP cores for EtherCAT, PROFINET, Modbus TCP, and CC-Link industrial Ethernet protocols without offloading to a separate ASIC, using the 81K LEs for the protocol state machines and the multipliers for CRC32 / checksum engines. The 484-ball BGA exposes enough I/O for redundant Ethernet ports plus isolated RS-485 fieldbuses, while Quartus Prime supports industrial-grade IP safety packages.
Recomendado
Portable Medical Instrumentation
The 10CL080YF484C6G's low static power on the 60 nm process enables battery-powered medical devices such as handheld ultrasound probes, patient monitors, and point-of-care analyzers. Hardware DSP blocks accelerate finite-impulse-response (FIR) filters and biquad IIR stages needed for bio-signal conditioning. The 347 I/Os interface to high-precision ADCs and battery-management ICs while meeting IEC 60601 noise margins when paired with a quiet LDO supply.
Recomendado
Low-Cost Software-Defined Radio Front-End
The 10CL080YF484C6G implements digital down-conversion (DDC), digital up-conversion (DUC), and FIR pulse-shaping filters for sub-6 GHz software-defined radio platforms in the amateur-radio, public-safety, and small-cell basestation markets. Its 18x18 multipliers handle 16-bit complex arithmetic at sufficient sample rates for narrowband channels, while the embedded memory absorbs data bursts between Ethernet or USB 3.0 transfers. The Cyclone 10 LP power profile suits fanless SDR enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10CL080YF484C6G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10CL080YF484C8G | 10CL080YF484I7G | 10CL040YF484C6G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | BGA-484 | BGA-484 - same | BGA-484 - same | BGA-484 - same |
| Logic Elements | 81,264 | 81,264 (same die) | 81,264 (same die) | 40,000 (-51%) |
| Embedded Memory | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 1,134,000 bits (-60%) |
| 18x18 Multipliers | 289 | 289 | 289 | 144 (-50%) |
| Maximum User I/O | 347 | 347 | 347 | 347 (same footprint) |
| Speed Grade | 6 (commercial) | 8 (slower) | 7 (industrial) | 6 (commercial) |
| Operating Temperature | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
Principais diferenciais
- Mid-density Cyclone 10 LP with full 347 I/O budget in BGA-484 (vs 10CL040YF484C6G)
- Lowest commercial speed grade in the 81K BGA-484 footprint (vs 10CL080YF484C8G)
- Industrial temperature option shares exact BGA-484 footprint (vs 10CL080YF484I7G)
Notas de projeto
The 484-ball FineLine BGA requires a PCB stack-up with microvia or via-in-pad capability to escape the 0.8 mm pitch ball array without dog-bone fan-outs that would exceed board area. Estimated: with 4 routing layers and standard 0.1 mm microvias on a 1.6 mm PCB, full BGA-484 breakout fits inside a 22x22 mm keep-out zone. Use Intel's Cyclone 10 LP pin connection guidelines to assign JTAG, configuration, and clock pins to outer balls for ease of test access.
Estimated: at typical 50% utilization and 100 MHz clock tree, the 10CL080YF484C6G dissipates approximately 1.5-2.5 W; at 80% utilization with high toggle rate, dissipation can reach 3.5 W. The BGA-484 package relies on thermal balls and a minimum 4-layer PCB thermal via array under the die to keep the junction below the 85C commercial limit. Run the Quartus Prime Early Power Estimator with the actual toggle-rate profile before finalizing the heatsink decision.
Do not substitute a 60 nm Cyclone 10 LP design's configuration flash with a Cyclone IV / Cyclone V image; bit-stream formats are incompatible. Verify the EPCQ or QSPI flash device is on the Intel-supported configuration memory list. Leaving JTAG TCK floating can lock the device at power-up - always pull TCK to ground through 1 kohm or tie to a defined logic level via the host processor.
Informações de conformidade
RoHS compliant per Intel ordering code -Y suffix (lead-free finish). Not AEC-Q100 qualified - this is a commercial/industrial-grade FPGA, not automotive grade.
