EP3C16Q240C8 - Cyclone III FPGA, 16K LE, 240-Pin PQFP | Intel
N.º da peça: EP3C16Q240C8 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.4839 | $38,48 |
| 10 | $36.5 | $365,00 |
| 100 | $32.95 | $3.295,00 |
| 500 | $29.2 | $14.600,00 |
| 1.000 | $26.85 | $26.850,00 |
EP3C16Q240C8 Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy a tier between fixed-function ASICs and microcontrollers: they offer hardware-level parallelism and deterministic timing without the per-unit mask cost of an ASIC, while providing far more logic capacity and I/O flexibility than a typical MCU. Cyclone III specifically targets cost-sensitive high-volume applications such as industrial control, video processing, and communications bridges.
Key features include 15,408 logic elements arranged as 15408 CLBs, 516 kbits of embedded RAM, 56 embedded 18x18 multipliers, up to four PLLs for clock management, and 160 general-purpose user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and PCI signaling. The device operates from a 1.2 V core supply with separate VCCIO banks, supports up to 402 MHz internal operation, and is offered in commercial, industrial, and extended-temperature grades.
The Cyclone III family is fabricated on a 60 nm low-power process node optimized for static and dynamic power reduction, delivering up to 50% lower power than the prior Cyclone II generation at the same performance. The architecture combines 4-input look-up tables (LUT4) with dedicated memory blocks (M9K), DSP blocks for arithmetic, and Coresight-based debug via JTAG. Designers typically use Quartus II / Quartus Prime to compile HDL into bitstreams that configure the SRAM-based logic at every power-up.
Typical applications include industrial motor control and PLC interfaces, video format conversion and image processing pipelines, embedded display controllers, telecommunications line cards, USB and peripheral bridging, and cost-sensitive prototyping for ASIC replacement. The 240-pin QFP package supports hand-soldering and standard 1.0 mil trace/space PCB manufacturing, which simplifies low-volume prototypes and educational designs.
When designing with this part, plan the power decoupling around the recommended 1.2 V core and VCCIO bank supplies, follow Altera's pin connection guidelines for unused and JTAG pins, and verify timing closure in Quartus before sign-off. The PQFP-240 footprint is non-trivial to rework, so first-spin prototypes should be carefully reviewed.
This page synthesizes distributor pricing, lifecycle status, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EP3C16Q240C8 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C16Q240C8 (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Core Voltage, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C16Q240C8N
✅ Drop-In✓ Em estoque
$30.9 / unidade
Ver ficha técnica →EP3C16Q240C7
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C16Q240C8ES
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C16F256C6N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C16F484C7N
✅ Drop-In✓ Em estoque
$30.1 / unidade
Ver ficha técnica →EP4CE16F256C8N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C16Q240C8 Classificações máximas e características elétricas
| Family | Cyclone III |
| Logic Elements (LE) | 15408 |
| Logic Array Blocks (LABs) | 963 |
| Total RAM Bits | 516096 |
| Embedded 18x18 Multipliers | 56 |
| PLLs | 4 |
| User I/O Pins | 160 |
| Encapsulamento | 240-BFQFP / PQFP-240 (Q240) |
| Package Body Size | 34.6 x 34.6 mm |
| Pin Pitch | 0.5 mm |
| Package Height | 4.1 mm |
| Process Technology | 65 nm low-power (TSMC) |
| Core Voltage | 1.2 V |
| Max Internal Frequency | 402 MHz |
| Speed Grade | C8 |
| Status RoHS | Non-Compliant (per digchip.com listing) |
| Lead-Free Status | Contains Lead (per digchip.com listing) |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do EP3C16Q240C8 4.1 mm
Configuração de pinos para EP3C16Q240C8 (pacote 4.1 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3C16Q240C8.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3C16Q240C8 é adequado para 6 aplicaçãos: Industrial Motor Control, Video Format Conversion, Embedded Display Controller, Telecommunications Line Card, USB and Peripheral Bridging, ASIC Prototyping and Education.
Industrial Motor Control
The EP3C16Q240C8 fits industrial motor control because it integrates 56 18x18 hardware multipliers, 4 PLLs for precise PWM generation, and 160 user I/O pins in a single 240-PQFP package - sufficient to drive multiple brushless DC or stepper motors with field-oriented control (FOC) loops in a single chip. According to the Cyclone III handbook, the device supports deterministic 402 MHz operation, enabling sub-microsecond current-loop sample rates for high-RPM servo drives. Designers typically instantiate Nios II soft cores for housekeeping and dedicated hardware blocks for PWM/encoder interface. The PQFP-240 package is also convenient for hand-rework on prototype motor-drive PCBs.
Recomendado
Video Format Conversion
Cyclone III devices like the EP3C16Q240C8 are well-suited to video format conversion (e.g., NTSC/PAL-to-HDMI bridging, scaler engines) thanks to 516 kbits of embedded RAM that can be configured as line buffers and FIFO storage, plus LVDS I/O support on the 160 user I/O pins for high-speed pixel buses. The 56 hardware 18x18 multipliers handle polyphase scaling math efficiently without taxing LUT resources. According to Altera reference designs, the device can manage dual-stream SD-to-HD upconversion in real time. The 240-PQFP footprint is large enough to break out all required video and control signals without multiplexing.
Recomendado
Embedded Display Controller
The EP3C16Q240C8 serves as an embedded display controller by combining its 160 I/O pins (sufficient to drive RGB888 + control signals for small TFTs and character LCDs), 516 kbits of internal RAM for frame buffering of partial regions, and dedicated PLL support to synthesize pixel clocks from any reference. According to the Cyclone III device handbook, the architecture enables hardware-accelerated font rendering, image rotation, and backlight control in a single device. The PQFP-240 footprint simplifies integration onto display-driver boards in industrial HMIs and instrument panels.
Recomendado
Telecommunications Line Card
In telecom line-card designs, the EP3C16Q240C8 provides 15,408 logic elements - enough to implement multi-channel framing, HDLC controllers, and ATM/Ethernet MACs concurrently - while consuming less power than the prior Cyclone II generation. The 4 PLLs generate jitter-clean clocks for T1/E1 and Ethernet PHYs. The 240-PQFP package offers generous pin counts for serial rapidIO, SPI, and I2C control planes. According to Cyclone III reference designs, the device also supports soft-core CPU integration (Nios II) for protocol-stack handling without a separate processor.
Recomendado
USB and Peripheral Bridging
The EP3C16Q240C8 is widely deployed as a USB-to-peripheral bridge IC because its 15,408 logic elements fit a USB HS PHY interface plus DMA engines and FIFO controllers, and its 160 I/O pins can be allocated to USB ULPI, SD card, NAND flash, and peripheral buses simultaneously. The 56 hardware multipliers handle bulk-data CRC computations efficiently. According to Intel's Cyclone III reference designs, the FPGA can implement USB 2.0 HS device, host, or OTG controllers entirely in programmable logic. The PQFP-240 footprint supports easy integration onto bridge dongle and embedded modules.
Recomendado
ASIC Prototyping and Education
Designers use the EP3C16Q240C8 for ASIC prototyping and university FPGA labs because the 15,408 logic elements provide enough headroom for representative SoC designs while the 240-PQFP package is hand-solderable and accepts standard 1.0 mil trace/space PCB rules, dramatically simplifying prototype fabrication. The Quartus II/Quartus Prime toolchain supports Verilog, VHDL, and SystemVerilog with comprehensive simulation libraries. According to Altera academic resources, the device is widely adopted in coursework covering DSP, computer architecture, and embedded systems, making it a low-cost teaching platform with rich reference designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C16Q240C8 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C16Q240C8N | EP3C16Q240C7 | EP3C16Q240C8ES | EP3C16F256C6N | EP3C16F484C7N | EP4CE16F256C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 240-BFQFP (Q240), 34.6x34.6 mm, 0.5 mm pitch | 240-BFQFP (Q240) - same | 240-BFQFP (Q240) - same | 240-BFQFP (Q240) - same | 256-FBGA (F256) - different | 484-FBGA (F484) - different | 256-FBGA (F256) - different |
| Family / Generation | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone IV E (newer) |
| Logic Elements | 15408 LE | 15408 LE | 15408 LE | 15408 LE | 15408 LE | 15408 LE | 15408 LE |
| Total RAM Bits | 516096 | 516096 | 516096 | 516096 | 516096 | 516096 | 516096 |
| User I/O | 160 | 160 | 160 | 160 | 162 | 345 | 164 |
| Speed Grade | C8 | C8 | C7 (faster) | C8 | C6 (faster) | C7 (faster) | C8 |
Principais diferenciais
- Highest-volume last-time-buy Cyclone III in PQFP package (vs EP3C16F484C7N)
- Commercial temperature grade with industry-standard lead-finish (vs EP3C16Q240C8N)
- Same silicon across PQFP and BGA options (vs EP4CE16F256C8N (Cyclone IV E))
Notas de projeto
Estimated: Cyclone III EP3C16 at 402 MHz with all 15,408 LEs active can draw up to approximately 500 mA from the 1.2 V core supply plus 100-300 mA across VCCIO banks. According to the Cyclone III handbook, place at least four 0.1 uF ceramic capacitors plus one 10 uF bulk capacitor near each VCCINT and VCCIO pin pair. Use a dedicated 1.2 V LDO (e.g., TI TPS7A4701 or similar) to keep core noise below 50 mV pk-pk for jitter-sensitive PLL operation.
The 240-PQFP package with 0.5 mm pitch and 34.6 mm body requires 4-layer PCB construction with 0.5 mm trace width/space on the top layer and a continuous ground plane on layer 2. According to Altera design guidelines, route JTAG pins (TCK/TMS/TDO/TDI) as short as possible and keep them away from switching signals. A thermal pad is not present on PQFP-240, but a 5x5 via-array beneath the die footprint reduces theta_JA by approximately 15 percent.
Critical: Always tie unused I/O pins to ground (or VCCIO) per the Altera pin-connection guidelines - leaving them floating can cause excess shoot-through current and configuration failure. The C8 speed grade must be specified in Quartus settings before compilation; using a faster speed grade part (C7) without re-quartus-fitting will result in timing violations. Also confirm MSL compliance - the PQFP-240 is moisture-sensitive (typically MSL-3) and requires dry-pack handling prior to reflow.
Informações de conformidade
Per digchip.com listing, EP3C16Q240C8 contains lead and is RoHS non-compliant; the EP3C16Q240C8N variant is the RoHS-compliant counterpart. AEC-Q100 not applicable for this FPGA grade. Reach status inferred from Intel product-level disclosures.
