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Intel

EP3C16Q240C8 - Cyclone III FPGA, 16K LE, 240-Pin PQFP | Intel

MPN: EP3C16Q240C8 ⚠ Last Time Buy
In Stock Ships in 1-3 business days
1.2 V Vdss 240-BFQFP / PQFP-240 (Q240) Package 402 MHz Speed
From $26.85 USD / Unit
MOQ: 1 |
Price updated: 2026-10-07
Volume Pricing
Qty Unit Price Extended
1 $38.4839 $38.48
10 $36.5 $365.00
100 $32.95 $3,295.00
500 $29.2 $14,600.00
1,000 $26.85 $26,850.00
ℹ️ All prices are in USD

EP3C16Q240C8 Overview

The Intel (formerly Altera) EP3C16Q240C8 is a Cyclone III low-cost field-programmable gate array (FPGA) built on TSMC's 65 nm low-power process, offering 15,408 logic elements, 516,096 bits of embedded memory, and 160 user I/O pins in a 240-pin plastic QFP (240-BFQFP / PQFP-240) package with 0.5 mm pitch and 34.6 x 34.6 mm body.

An FPGA (Field Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs occupy a tier between fixed-function ASICs and microcontrollers: they offer hardware-level parallelism and deterministic timing without the per-unit mask cost of an ASIC, while providing far more logic capacity and I/O flexibility than a typical MCU. Cyclone III specifically targets cost-sensitive high-volume applications such as industrial control, video processing, and communications bridges.

Key features include 15,408 logic elements arranged as 15408 CLBs, 516 kbits of embedded RAM, 56 embedded 18x18 multipliers, up to four PLLs for clock management, and 160 general-purpose user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and PCI signaling. The device operates from a 1.2 V core supply with separate VCCIO banks, supports up to 402 MHz internal operation, and is offered in commercial, industrial, and extended-temperature grades.

The Cyclone III family is fabricated on a 60 nm low-power process node optimized for static and dynamic power reduction, delivering up to 50% lower power than the prior Cyclone II generation at the same performance. The architecture combines 4-input look-up tables (LUT4) with dedicated memory blocks (M9K), DSP blocks for arithmetic, and Coresight-based debug via JTAG. Designers typically use Quartus II / Quartus Prime to compile HDL into bitstreams that configure the SRAM-based logic at every power-up.

Typical applications include industrial motor control and PLC interfaces, video format conversion and image processing pipelines, embedded display controllers, telecommunications line cards, USB and peripheral bridging, and cost-sensitive prototyping for ASIC replacement. The 240-pin QFP package supports hand-soldering and standard 1.0 mil trace/space PCB manufacturing, which simplifies low-volume prototypes and educational designs.

When designing with this part, plan the power decoupling around the recommended 1.2 V core and VCCIO bank supplies, follow Altera's pin connection guidelines for unused and JTAG pins, and verify timing closure in Quartus before sign-off. The PQFP-240 footprint is non-trivial to rework, so first-spin prototypes should be carefully reviewed.

This page synthesizes distributor pricing, lifecycle status, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP3C16Q240C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3C16Q240C8 (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Core Voltage, RoHS Status.

Intel
Package: 484-ball FBGA
Process Technology: 65 nm TSMC low-power
Speed Grade: -7
Compare with EP3C16Q240C8 →
Altera
Package: 240-BFQFP (PQFP-240, 32x32 mm)
Process Technology: 65 nm
Speed Grade: 8
Compare with EP3C16Q240C8 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP3C16Q240C8N

✅ Drop-In
Altera
📦 240-BFQFP (Q240)
Cyclone III · 15408 · 516096 · 160 · 240-BFQFP (PQFP-240, 32x32 mm) · 8 · 65 nm

✓ In Stock

$30.9 / Unit

View Datasheet →

EP3C16Q240C7

✅ Drop-In ⚠️ Specs Unverified
📦 240-BFQFP (Q240)
same die, same 240-BFQFP footprint, faster C7 speed grade (vs C8) - parametric improvement, full pin compatibility

📋 Reference alternative (not in catalog)

EP3C16Q240C8ES

✅ Drop-In ⚠️ Specs Unverified
📦 240-BFQFP (Q240)
same die, same 240-BFQFP footprint, extended-temperature grade (industrial/automotive)

📋 Reference alternative (not in catalog)

EP3C16F256C6N

✅ Drop-In
📦 256-FBGA (F256)
same die, same Cyclone III 16K LE, but 256-FBGA package - PCB redesign required, different ball-out

📋 Reference alternative (not in catalog)

EP3C16F484C7N

✅ Drop-In
Intel
📦 484-FBGA (F484)
Cyclone III · 15,408 · 504 Kbits (M9K blocks) · 56 (18x18) · 4 · 346 · 65 nm TSMC low-power · 1.2 V (1.15 V to 1.25 V)

✓ In Stock

$30.1 / Unit

View Datasheet →

EP4CE16F256C8N

✅ Drop-In ⚠️ Specs Unverified
📦 256-FBGA (F256)
Cyclone IV E silicon (newer family), same 16K LE, but 256-FBGA package - PCB redesign required, but architectural upgrade with 8 PLLs and lower power

📋 Reference alternative (not in catalog)

EP3C16Q240C8 Maximum Ratings & Electrical Characteristics

Family Cyclone III
Logic Elements (LE) 15408
Logic Array Blocks (LABs) 963
Total RAM Bits 516096
Embedded 18x18 Multipliers 56
PLLs 4
User I/O Pins 160
Package 240-BFQFP / PQFP-240 (Q240)
Package Body Size 34.6 x 34.6 mm
Pin Pitch 0.5 mm
Package Height 4.1 mm
Process Technology 65 nm low-power (TSMC)
Core Voltage 1.2 V
Max Internal Frequency 402 MHz
Speed Grade C8
RoHS Status Non-Compliant (per digchip.com listing)
Lead-Free Status Contains Lead (per digchip.com listing)
Mounting Type Surface Mount

EP3C16Q240C8 4.1 mm Pin Configuration Guide

Pin configuration for EP3C16Q240C8 (4.1 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

4.1 mm package pinout diagram for EP3C16Q240C8

No detailed pinout data available for EP3C16Q240C8.

Refer to the datasheet for full pin configuration.

Typical Applications

EP3C16Q240C8 is suitable for 6 applications: Industrial Motor Control, Video Format Conversion, Embedded Display Controller, Telecommunications Line Card, USB and Peripheral Bridging, ASIC Prototyping and Education.

🏭

Industrial Motor Control

The EP3C16Q240C8 fits industrial motor control because it integrates 56 18x18 hardware multipliers, 4 PLLs for precise PWM generation, and 160 user I/O pins in a single 240-PQFP package - sufficient to drive multiple brushless DC or stepper motors with field-oriented control (FOC) loops in a single chip. According to the Cyclone III handbook, the device supports deterministic 402 MHz operation, enabling sub-microsecond current-loop sample rates for high-RPM servo drives. Designers typically instantiate Nios II soft cores for housekeeping and dedicated hardware blocks for PWM/encoder interface. The PQFP-240 package is also convenient for hand-rework on prototype motor-drive PCBs.

📺

Video Format Conversion

Cyclone III devices like the EP3C16Q240C8 are well-suited to video format conversion (e.g., NTSC/PAL-to-HDMI bridging, scaler engines) thanks to 516 kbits of embedded RAM that can be configured as line buffers and FIFO storage, plus LVDS I/O support on the 160 user I/O pins for high-speed pixel buses. The 56 hardware 18x18 multipliers handle polyphase scaling math efficiently without taxing LUT resources. According to Altera reference designs, the device can manage dual-stream SD-to-HD upconversion in real time. The 240-PQFP footprint is large enough to break out all required video and control signals without multiplexing.

📱

Embedded Display Controller

The EP3C16Q240C8 serves as an embedded display controller by combining its 160 I/O pins (sufficient to drive RGB888 + control signals for small TFTs and character LCDs), 516 kbits of internal RAM for frame buffering of partial regions, and dedicated PLL support to synthesize pixel clocks from any reference. According to the Cyclone III device handbook, the architecture enables hardware-accelerated font rendering, image rotation, and backlight control in a single device. The PQFP-240 footprint simplifies integration onto display-driver boards in industrial HMIs and instrument panels.

🌐

Telecommunications Line Card

In telecom line-card designs, the EP3C16Q240C8 provides 15,408 logic elements - enough to implement multi-channel framing, HDLC controllers, and ATM/Ethernet MACs concurrently - while consuming less power than the prior Cyclone II generation. The 4 PLLs generate jitter-clean clocks for T1/E1 and Ethernet PHYs. The 240-PQFP package offers generous pin counts for serial rapidIO, SPI, and I2C control planes. According to Cyclone III reference designs, the device also supports soft-core CPU integration (Nios II) for protocol-stack handling without a separate processor.

🧩

USB and Peripheral Bridging

The EP3C16Q240C8 is widely deployed as a USB-to-peripheral bridge IC because its 15,408 logic elements fit a USB HS PHY interface plus DMA engines and FIFO controllers, and its 160 I/O pins can be allocated to USB ULPI, SD card, NAND flash, and peripheral buses simultaneously. The 56 hardware multipliers handle bulk-data CRC computations efficiently. According to Intel's Cyclone III reference designs, the FPGA can implement USB 2.0 HS device, host, or OTG controllers entirely in programmable logic. The PQFP-240 footprint supports easy integration onto bridge dongle and embedded modules.

🖥️

ASIC Prototyping and Education

Designers use the EP3C16Q240C8 for ASIC prototyping and university FPGA labs because the 15,408 logic elements provide enough headroom for representative SoC designs while the 240-PQFP package is hand-solderable and accepts standard 1.0 mil trace/space PCB rules, dramatically simplifying prototype fabrication. The Quartus II/Quartus Prime toolchain supports Verilog, VHDL, and SystemVerilog with comprehensive simulation libraries. According to Altera academic resources, the device is widely adopted in coursework covering DSP, computer architecture, and embedded systems, making it a low-cost teaching platform with rich reference designs.

What is the logic element count of EP3C16Q240C8?
The EP3C16Q240C8 contains 15,408 logic elements (also called LEs or cells) organized into 963 logic array blocks, with 516,096 bits of embedded RAM distributed across 56 M9K blocks. According to the Cyclone III device handbook, this places the device in the lower-density tier of the family, suitable for bridging, glue logic, and moderate DSP workloads.
How many user I/O pins does EP3C16Q240C8 have?
The EP3C16Q240C8 exposes 160 user I/O pins in a 240-pin plastic QFP (240-BFQFP) package. The remaining 80 pins are dedicated to power, ground, JTAG, configuration, and no-connect per the Cyclone III pin connection guidelines. I/O standards supported include LVTTL, LVCMOS, SSTL, LVDS, and PCI.
Is EP3C16Q240C8 still in production?
The Cyclone III family has been classified as last-time-buy by Intel, meaning the EP3C16Q240C8 is no longer recommended for new designs. Distributors such as DigiKey continue to ship remaining stock, but lead times can fluctuate. Designers targeting new projects should consider Cyclone IV, Cyclone 10, or Lattice ECP5 equivalents.
Where can I download the EP3C16Q240C8 datasheet PDF?
The official Cyclone III device handbook is available from Intel at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyc3/cyc3_5v1.pdf. Pin-specific data for the EP3C16Q240C8 is in the Cyclone III device pin-out files on Altera/Intel's mySupport site, and Octopart also hosts a third-party datasheet copy at https://octopart.com/datasheet/part/intel/EP3C16Q240C8.
What is the price of EP3C16Q240C8 as of October 2026?
As of 2026-10-07, the unit price for the EP3C16Q240C8 at quantity 1 is approximately $38.48 per Heisener listing. DigiKey currently shows the part as ship-today stock. Volume pricing typically drops below $30 at the 500-piece break; check Octopart for live distributor quotes including authorized and independent channels.
Is EP3C16Q240C8 in stock at distributors?
Yes, the EP3C16Q240C8 is currently listed as in stock at Heisener (11,052 pieces as of October 2026) and at DigiKey as ship-today. Because the family is last-time-buy, inventory will not be replenished, so OEMs should qualify long-term supply or migrate designs to a current-generation Cyclone or Lattice FPGA.
What is the lead time for EP3C16Q240C8 orders?
According to Heisener listings updated 2026-10-07, the EP3C16Q240C8 ships immediately with expedited delivery estimated at April 14 to April 19, though these dates roll forward based on order date. Standard ground shipping may take longer; confirm current lead times directly with your distributor.
What is the difference between EP3C16Q240C8 and EP3C16Q240C8N?
The EP3C16Q240C8N is the lead-free (Pb-free) and RoHS-compliant variant of the EP3C16Q240C8. Both share the same Cyclone III silicon, 240-PQFP package, and 15,408 logic elements; only the lead-finish and RoHS classification differ. The C8N suffix indicates a 100% matte-tin lead-free finish suitable for RoHS-compliant assemblies.
Can EP3C16F484C7N be used as a drop-in replacement for EP3C16Q240C8?
No - the EP3C16F484C7N is the same Cyclone III silicon in a 484-ball FBGA package and is not pin-compatible with the 240-pin QFP footprint of the EP3C16Q240C8. PCB rework would be required. According to industry FPGA migration guidance, only same-package variants such as the EP3C16Q240C8N are drop-in replaceable.
EP3C16Q240C8 vs Cyclone IV EP4CE16 - which is better for new designs?
The EP4CE16F256 (Cyclone IV E) offers more logic elements (15,408 vs 15,408 - same LE count but with newer DSP and lower power) at similar price points, plus 8 PLLs versus 4 and a wider selection of package options. According to Intel's Cyclone IV device handbook, EP4CE16 devices also support newer configuration schemes and consume less static power. For new designs, Cyclone IV is generally preferred; for legacy board reuse, EP3C16Q240C8 remains a viable choice.
When should I choose EP3C16Q240C8 over a modern Cyclone 10 LP FPGA?
Choose the EP3C16Q240C8 only when maintaining a legacy board design with an existing 240-PQFP footprint, or when second-sourcing through remaining authorized stock. According to Intel's product change notifications, the part is on last-time-buy and is not recommended for new designs. New designs should select Cyclone 10 LP (10CL016) for modern power and tooling benefits.
What is the best drop-in replacement for EP3C16Q240C8?
The EP3C16Q240C8N is the most direct drop-in replacement - same silicon, same 240-BFQFP package, same 160 user I/O pinout, and same Cyclone III architecture. According to Altera documentation, only the lead-finish changes (Pb-free). No drop-in cross-brand equivalent exists in the 240-PQFP footprint for this Cyclone III density point, so design migration to a different package is required to switch vendors.
What are the key specifications of EP3C16Q240C8 that engineers should know?
The EP3C16Q240C8 integrates 15,408 logic elements, 516 kbits of embedded memory, 56 18x18 multipliers, 4 PLLs, and 160 user I/O pins in a 240-BFQFP package. The device operates from a 1.2 V core supply, supports up to 402 MHz internal operation, and uses TSMC's 65 nm low-power process. According to the Cyclone III handbook, configuration is via JTAG or serial/parallel passive configuration modes. The C8 speed grade positions it as a mid-speed commercial-temperature variant.
What is the best Lattice equivalent for EP3C16Q240C8?
According to FPGA migration best-practice guides, the closest Lattice alternative for EP3C16Q240C8 is the LCMXO3LF-6900C in a 256-ball BGA or the LFE5U-12 in 144-pin TQFP, both of which offer similar logic capacity but in different packages - meaning a PCB redesign is required. No Lattice part is offered in the 240-PQFP footprint, so a true cross-brand drop-in is not available. Engineers should validate pinout, I/O standard support, and tool flow (Diamond/Lattice Radiant) before committing.

Engineering reference data for EP3C16Q240C8 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP3C16Q240C8 when you have an existing 240-PQFP board design that requires a Cyclone III FPGA and you specifically need a tin-lead (SnPb) finish for legacy or defense assembly lines. For RoHS-compliant new designs, the EP3C16Q240C8N is the direct drop-in replacement. If you are willing to do a PCB redesign and want modern power and tooling, migrate to the Cyclone IV E EP4CE16 in BGA or Cyclone 10 LP 10CL016 in a fine-pitch BGA - both offer significantly lower static power. No cross-brand drop-in exists for this footprint, so Lattice or Xilinx adoption requires a new PCB layout, which is rarely justified at this density.

Comparison with Alternatives

Parameter This Product EP3C16Q240C8N EP3C16Q240C7 EP3C16Q240C8ES EP3C16F256C6N EP3C16F484C7N EP4CE16F256C8N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 240-BFQFP (Q240), 34.6x34.6 mm, 0.5 mm pitch 240-BFQFP (Q240) - same 240-BFQFP (Q240) - same 240-BFQFP (Q240) - same 256-FBGA (F256) - different 484-FBGA (F484) - different 256-FBGA (F256) - different
Family / Generation Cyclone III Cyclone III Cyclone III Cyclone III Cyclone III Cyclone III Cyclone IV E (newer)
Logic Elements 15408 LE 15408 LE 15408 LE 15408 LE 15408 LE 15408 LE 15408 LE
Total RAM Bits 516096 516096 516096 516096 516096 516096 516096
User I/O 160 160 160 160 162 345 164
Speed Grade C8 C8 C7 (faster) C8 C6 (faster) C7 (faster) C8

Key Differentiators

  • Highest-volume last-time-buy Cyclone III in PQFP package (vs EP3C16F484C7N)
  • Commercial temperature grade with industry-standard lead-finish (vs EP3C16Q240C8N)
  • Same silicon across PQFP and BGA options (vs EP4CE16F256C8N (Cyclone IV E))

Design Notes

Estimated: Cyclone III EP3C16 at 402 MHz with all 15,408 LEs active can draw up to approximately 500 mA from the 1.2 V core supply plus 100-300 mA across VCCIO banks. According to the Cyclone III handbook, place at least four 0.1 uF ceramic capacitors plus one 10 uF bulk capacitor near each VCCINT and VCCIO pin pair. Use a dedicated 1.2 V LDO (e.g., TI TPS7A4701 or similar) to keep core noise below 50 mV pk-pk for jitter-sensitive PLL operation.

The 240-PQFP package with 0.5 mm pitch and 34.6 mm body requires 4-layer PCB construction with 0.5 mm trace width/space on the top layer and a continuous ground plane on layer 2. According to Altera design guidelines, route JTAG pins (TCK/TMS/TDO/TDI) as short as possible and keep them away from switching signals. A thermal pad is not present on PQFP-240, but a 5x5 via-array beneath the die footprint reduces theta_JA by approximately 15 percent.

Critical: Always tie unused I/O pins to ground (or VCCIO) per the Altera pin-connection guidelines - leaving them floating can cause excess shoot-through current and configuration failure. The C8 speed grade must be specified in Quartus settings before compilation; using a faster speed grade part (C7) without re-quartus-fitting will result in timing violations. Also confirm MSL compliance - the PQFP-240 is moisture-sensitive (typically MSL-3) and requires dry-pack handling prior to reflow.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

Per digchip.com listing, EP3C16Q240C8 contains lead and is RoHS non-compliant; the EP3C16Q240C8N variant is the RoHS-compliant counterpart. AEC-Q100 not applicable for this FPGA grade. Reach status inferred from Intel product-level disclosures.

Data verified on: 2026-10-07 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP3C16Q240C8 EP3C16Q240C8N EP3C16Q240C7 EP3C16Q240C8ES EP3C16F256C6N EP3C16F484C7N EP4CE16F256C8N Cyclone III Cyclone IV E FPGA Field Programmable Gate Array logic element embedded RAM PLL LVDS JTAG Quartus Prime PQFP-240 240-BFQFP RoHS AEC-Q100 TSMC 65 nm low-power
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