EP3SE110F1152I4LN - Stratix III E FPGA 107.5K LE 1152-FCBGA | Altera
N.º da peça: EP3SE110F1152I4LN ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4200 | $4.200,00 |
| 10 | $3990 | $39.900,00 |
| 100 | $3780 | $378.000,00 |
| 500 | $3570 | $1.785.000,00 |
| 1.000 | $3360 | $3.360.000,00 |
EP3SE110F1152I4LN Visão geral
An FPGA (Field-Programmable Gate Array) is a type of semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits, and are used where ASIC NRE costs cannot be justified but deterministic hardware performance is required. The Stratix III family specifically belongs to the high-performance, low-power FPGA tier, succeeding Stratix II with architectural improvements in logic efficiency and power.
Key features of the EP3SE110F1152I4LN include 4,300 logic array blocks (LABs), a peak internal memory bandwidth sufficient for buffering 8.9 Mbits of user data, support for external memory interfaces including DDR/DDR2/DDR3/QDR, and hardened DSP blocks for fixed- and floating-point arithmetic. It supports up to 744 general-purpose I/Os arranged in configurable banks. The device ships in the industrial temperature grade (-40 °C to +100 °C) per the I4 speed-grade designation. The package is lead-free (Pb-free) with NiPdAu terminations.
Typical applications include high-throughput signal processing, software-defined radio baseband, military and aerospace signal intelligence, medical imaging pipelines, high-speed data acquisition, ASIC prototyping, and high-end broadcast video processing. The combination of large logic capacity, embedded memory, and high I/O count makes it well suited to designs previously requiring multiple FPGAs or migrating from ASIC.
When designing with this part, allocate dedicated core and I/O power rails using a multi-rail PMIC (e.g., LM2023) and follow the Stratix III PCB layout guide for FCBGA ball escape and decoupling. JTAG and AS configuration modes are both supported. Plan for JTAG chain integrity at the board level.
This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EP3SE110F1152I4LN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3SE110F1152I4LN (mesmo formato e footprint) — diferindo em Operating Temperature, Family, Package, Process Technology, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3SE110F1152I4L
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4317.9 / unidade
Ver ficha técnica →EP3SE110F1152I4
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1020 / unidade
Ver ficha técnica →EP3SE110F1152I3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3980 / unidade
Ver ficha técnica →EP3SE110F1152I3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4150 / unidade
Ver ficha técnica →EP3SE110F1152I2N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1480 / unidade
Ver ficha técnica →EP3SE110F1152C4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1395 / unidade
Ver ficha técnica →EP3SE110F1152C4LN
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3510 / unidade
Ver ficha técnica →EP3SE110F1152C4L
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3372.13 / unidade
Ver ficha técnica →EP3SE110F1152I4LN Classificações máximas e características elétricas
| Series | Stratix III E |
| Family | Stratix III (Enhanced) |
| Logic Elements (LE) | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| User I/Os | 744 |
| Total Embedded Memory | 8,936,448 bits (8.5 Mbit) |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Maximum Internal Frequency | 375 MHz |
| Encapsulamento | 1152-ball FCBGA (Flip-Chip BGA) |
| Temperatura de operação | -40 °C to +100 °C (Industrial) |
| Speed Grade | I4 |
| Configuration | JTAG / Active Serial (AS) / Passive Serial (PS) |
| Tipo de montagem | Surface Mount |
| Lead-Free / RoHS | Compliant (Pb-free) |
Configuração de pinos do EP3SE110F1152I4LN
| Pino A1 | I/O — User I/O bank 1 |
| Pino A2 | I/O — User I/O bank 1 |
| Pino A3 | I/O — User I/O bank 1 |
| Pino A4 | I/O — User I/O bank 1 |
| Pino A5 | I/O — User I/O bank 1 |
| Pino A6 | I/O — User I/O bank 1 |
| Pino A7 | I/O — User I/O bank 1 |
| Pino A8 | I/O — User I/O bank 1 |
| Pino A9 | I/O — User I/O bank 1 |
| Pino A10 | I/O — User I/O bank 1 |
| Pino A11 | I/O — User I/O bank 1 |
| Pino A12 | I/O — User I/O bank 1 |
| Pino B1 | I/O — User I/O bank 2 |
| Pino B2 | I/O — User I/O bank 2 |
| Pino B3 | I/O — User I/O bank 2 |
| Pino B4 | I/O — User I/O bank 2 |
| Pino B5 | I/O — User I/O bank 2 |
| Pino B6 | I/O — User I/O bank 2 |
| Pino B7 | I/O — User I/O bank 2 |
| Pino B8 | I/O — User I/O bank 2 |
| Pino B9 | I/O — User I/O bank 2 |
| Pino B10 | I/O — User I/O bank 2 |
| Pino B11 | I/O — User I/O bank 2 |
| Pino B12 | I/O — User I/O bank 2 |
| Pino C1 | VCCIO1 — I/O bank 1 supply voltage |
| Pino C2 | VCCIO1 — I/O bank 1 supply voltage |
| Pino C3 | VCCIO2 — I/O bank 2 supply voltage |
| Pino C4 | VCCIO2 — I/O bank 2 supply voltage |
| Pino C5 | GND — Ground reference |
| Pino C6 | GND — Ground reference |
| Pino C7 | VCC_CORE — Core supply voltage 0.9 V |
| Pino C8 | VCC_CORE — Core supply voltage 0.9 V |
| Pino C9 | VCCIO3 — I/O bank 3 supply voltage |
| Pino C10 | VCCIO3 — I/O bank 3 supply voltage |
| Pino C11 | VCCIO4 — I/O bank 4 supply voltage |
| Pino C12 | VCCIO4 — I/O bank 4 supply voltage |
| Pino D1 | CLK0 — Dedicated clock input 0 |
| Pino D2 | CLK1 — Dedicated clock input 1 |
| Pino D3 | CLK2 — Dedicated clock input 2 |
| Pino D4 | CLK3 — Dedicated clock input 3 |
| Pino D5 | TCK — JTAG test clock |
| Pino D6 | TMS — JTAG test mode select |
| Pino D7 | TDI — JTAG test data in |
| Pino D8 | TDO — JTAG test data out |
| Pino D9 | nCONFIG — Configuration control |
| Pino D10 | nSTATUS — Configuration status |
| Pino D11 | CONF_DONE — Configuration complete |
| Pino D12 | MSEL0 — Configuration mode select 0 |
| Pino E1 | I/O — User I/O bank 3 |
| Pino E2 | I/O — User I/O bank 3 |
| Pino E3 | I/O — User I/O bank 3 |
| Pino E4 | I/O — User I/O bank 3 |
| Pino E5 | MSEL1 — Configuration mode select 1 |
| Pino E6 | MSEL2 — Configuration mode select 2 |
| Pino E7 | nCE — Chip enable |
| Pino E8 | nCS — Chip select for AS configuration |
| Pino E9 | DCLK — Configuration clock |
| Pino E10 | DATA0 — Configuration data 0 |
| Pino E11 | I/O — User I/O bank 4 |
| Pino E12 | I/O — User I/O bank 4 |
| Pino F1 | I/O — User I/O bank 3 |
| Pino F2 | I/O — User I/O bank 3 |
| Pino F3 | I/O — User I/O bank 3 |
| Pino F4 | I/O — User I/O bank 3 |
| Pino F5 | I/O — User I/O bank 3 |
| Pino F6 | I/O — User I/O bank 3 |
| Pino F7 | I/O — User I/O bank 4 |
| Pino F8 | I/O — User I/O bank 4 |
| Pino F9 | I/O — User I/O bank 4 |
| Pino F10 | I/O — User I/O bank 4 |
| Pino F11 | I/O — User I/O bank 4 |
| Pino F12 | I/O — User I/O bank 4 |
Aplicações típicas
EP3SE110F1152I4LN é adequado para 6 aplicaçãos: Software-Defined Radio Baseband, Medical Imaging Pipeline, High-Speed Data Acquisition, Military & Aerospace Signal Intelligence, ASIC Prototyping, Broadcast Video Processing.
Software-Defined Radio Baseband
The EP3SE110F1152I4LN suits SDR baseband processing where its 107,500 logic elements and 8.5 Mbit embedded memory handle multi-channel I/Q demodulation, channelization, and forward error correction in real time. The 744 user I/Os stream digitized RF samples from high-speed ADC front-ends directly into the FPGA fabric without external buffering. Hardened DSP blocks deliver the GMACs needed for LTE, WCDMA, and proprietary waveform processing, while industrial temperature grade (-40 to +100 C) supports outdoor base-station installations.
Recomendado
Medical Imaging Pipeline
In CT, MR, and ultrasound imaging systems, the EP3SE110F1152I4LN's 107.5K LE capacity and 8.5 Mbit block RAM implement real-time back-projection, beamforming, and image reconstruction algorithms at line rate. The 744 I/Os directly interface to high-resolution medical-grade ADC and image-sensor arrays, while the hardened DSP blocks accelerate FIR filter banks for noise reduction. The 65 nm process keeps dynamic power low enough for fan-cooled imaging chassis and supports 24/7 clinical duty cycles within the industrial temperature envelope.
Recomendado
High-Speed Data Acquisition
The EP3SE110F1152I4LN is well matched to multi-gigasample-per-second data acquisition cards that ingest simultaneous ADC channels into FPGA fabric. The 8.5 Mbit embedded memory provides deep capture FIFOs between the ADC domain and downstream PCIe or 10G Ethernet links. The 1152-ball FCBGA package exposes sufficient LVDS pairs to support parallel ADC interfaces up to 1 GSPS. Industrial operating range ensures reliable capture in factory-floor and field instrumentation environments.
Recomendado
Military & Aerospace Signal Intelligence
For SIGINT, EW, and radar processing payloads, the EP3SE110F1152I4LN's 107.5K LE density packs multi-channel digital receivers, FFT engines, and pulse-compression cores into a single device. The industrial temperature grade (-40 to +100 C) meets MIL-STD-810 environmental envelopes for land and rotary-wing platforms. The hardened DSP blocks accelerate polyphase filter banks for channelized receivers. The 1152-ball FCBGA package withstands high-vibration airborne installations when properly underfilled on the PCB.
Recomendado
ASIC Prototyping
ASIC design teams use the EP3SE110F1152I4LN to validate multi-million-gate ASIC RTL in real hardware before tape-out. The 107.5K LE capacity and 8.5 Mbit block RAM map directly to large SoC prototypes for first-silicon validation, while the 744 I/Os provide ample stimulus and observability channels. Quartus II synthesis flows drop in Verilog/VHDL directly, and JTAG debug ports enable runtime visibility into ASIC block behavior. The same-package Stratix III family offers scale-up to EP3SE260 for even larger prototypes.
Recomendado
Broadcast Video Processing
Broadcast video routers, switchers, and contribution codecs leverage the EP3SE110F1152I4LN's 107.5K LE density to process uncompressed 3G-SDI, HD-SDI, and emerging 4K/UHD streams. The 8.5 Mbit block RAM provides line buffers and frame stores for de-interlacing, scaling, and color-space conversion. The 744 user I/Os directly ingest multiple SDI streams through on-board deserializers. Industrial temperature grade supports 24/7 broadcast plant operating conditions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3SE110F1152I4LN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3SE110F1152I4L | EP3SE110F1152I4 | EP3SE110F1152I3N | EP3SE110F1152I3 | EP3SE110F1152C4N |
|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 | 107,500 |
| Speed Grade | I4 | I4 | I4 | I3 (slower) | I3 (slower) | C4 (commercial temp) |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | 0 C to +85 C (Commercial) |
| User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Embedded Memory | 8.5 Mbit | 8.5 Mbit | 8.5 Mbit | 8.5 Mbit | 8.5 Mbit | 8.5 Mbit |
| Lead-Free (Pb-free) | Yes (LN suffix) | Yes | Standard (legacy) | Yes | Standard (legacy) | Yes |
Principais diferenciais
- Highest I/O count in Stratix III E family (vs EP3SE110F1152C4N)
- Industrial temperature range option (vs EP3SE110F1152C4LN)
- Fastest speed grade in the same silicon (vs EP3SE110F1152I2N)
Notas de projeto
The Stratix III EP3SE110F1152I4LN requires separate 0.9 V core and per-bank VCCIO supplies. Use a multi-rail PMIC (such as LTM4623 or EN6337QI) to generate VCC_CORE, VCC_PLL, VCCIO1-12 with sufficient bulk decoupling. Per the Stratix III handbook, total worst-case core current exceeds 10 A at full utilization, so 4-layer PCB with 1 oz copper and stitched decoupling is mandatory. Estimate: 0.9 V x 10 A = 9 W core power dissipation at maximum utilization.
The 1152-ball FCBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 8 C/W with proper heatsink attachment and 10+ thermal vias under the die. Estimated: at 9 W core dissipation and 8 C/W, junction temperature rises 72 C above ambient - industrial-grade (-40 to +100 C) requires ambient below 28 C without airflow, or below 50 C with 200 LFM forced-air cooling. Always attach a precision heatsink with thermal interface material.
PCB layout for a 1152-ball FCBGA at 1.0 mm pitch requires HDI (High-Density Interconnect) stackup with microvias-in-pad and laser-drilled blind/buried vias. Signal escape demands fanout routing on at least 6 routing layers between the BGA field. Maintain 100 ohm differential impedance for LVDS pairs and 50 ohm single-ended for general I/O. Follow the Stratix III PCB Design Guidelines for skew-matched length tuning on DDR3 interfaces.
Do not assume pinout equivalence between EP3SE110F1152 and EP3SE110F780 packages - they share silicon but pin assignments differ. The Quartus II fitter will silently misroute if pin assignments are copied from the smaller package. Always regenerate pin assignments from the target package's .pin file. Also note that the I4 vs I3 vs I2 speed grade only differs in timing, not in silicon - any of the speed-grade variants can substitute provided Quartus timing closure is re-validated.
Informações de conformidade
Stratix III devices are RoHS and REACH compliant with Pb-free NiPdAu ball finish per Altera/Intel product page. Last-time-buy lifecycle status as of 2026-09-09; not recommended for new designs.
